WO2009065543A1 - Substrat flexible pour circuits électriques, et son procédé de fabrication - Google Patents

Substrat flexible pour circuits électriques, et son procédé de fabrication Download PDF

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Publication number
WO2009065543A1
WO2009065543A1 PCT/EP2008/009716 EP2008009716W WO2009065543A1 WO 2009065543 A1 WO2009065543 A1 WO 2009065543A1 EP 2008009716 W EP2008009716 W EP 2008009716W WO 2009065543 A1 WO2009065543 A1 WO 2009065543A1
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WO
WIPO (PCT)
Prior art keywords
plastic film
film layer
metallic
flexible circuit
circuit substrate
Prior art date
Application number
PCT/EP2008/009716
Other languages
German (de)
English (en)
Inventor
Heinz Kueck
Horst Richter
Original Assignee
Hahn-Schickard-Gesellschaft für angewandte Forschung e.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hahn-Schickard-Gesellschaft für angewandte Forschung e.V. filed Critical Hahn-Schickard-Gesellschaft für angewandte Forschung e.V.
Priority to DE112008002766T priority Critical patent/DE112008002766A5/de
Publication of WO2009065543A1 publication Critical patent/WO2009065543A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4632—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards

Definitions

  • the present invention relates to a flexible circuit substrate for electrical circuits, as used, for example, in the control consoles of automobiles, for the signal feeds in the printhead of an inkjet printer or a steering wheel. Furthermore, the invention relates to a method for manufacturing a flexible circuit substrate for electrical circuits, wherein the flexible circuit substrate may comprise electrical circuit elements or connect electrical components with each other.
  • Printed circuits based on flexible plastic circuit carriers are used to electrically connect spatially separated electronic assemblies with each other.
  • circuits with and without permanent dynamic load There are essentially two types of flexible circuits: circuits with and without permanent dynamic load. Circuits without dynamic stress are installed once at the destination, for example in the control panel of an automobile and remain there without change in shape for a long period of time. Dynamic stress circuits are subject to a continuous change in shape during operation of a device. An example of this is flexible circuit carriers for the signal feed in the printhead of an inkjet printer or the steering wheel.
  • interconnect structures Today, flexible circuits are mostly produced on the basis of polyimide films, since these are very good thermal conductors. see and have dielectric properties.
  • the production of interconnect structures is usually carried out via a metallic starting layer, which by vacuum metallization, lithographic and wet chemical processes, such. B. chemical and / or galvanic metallization and etching techniques is applied.
  • the finished electrical circuit is then generally provided with a Abdecklack, which spares only the contact points to the interconnect structures.
  • the circuits thus produced usually consist of a polyimide layer, that is to say a dielectric, as well as a metallization plane or, in the case of a double-sided flexible circuit, a metallization plane on a front and rear side with plated through holes.
  • Polyimide-based flexible circuits can be made in almost any shape and size, and provided with very fine tracks as needed.
  • polyimide-based flexible circuits have the disadvantage that their production is relatively complicated and therefore expensive. Due to the required manufacturing facilities and the corresponding knowledge of process engineering, their production is practically possible only in appropriately equipped factories for printed circuit board production.
  • hot stamping An inexpensive and fast method for producing the printed circuit traces is hot stamping. This technique is also used, for example, for producing molded interconnect devices (MID).
  • MID molded interconnect devices
  • Hot stamping a special, often copper-based film is pressed onto a thermoplastic material under pressure and heat via a heated embossing tool on which the circuit layout is located.
  • the copper foil is punched out during the embossing process and connects with its roughened rear side with the melting plastic.
  • the conductor layout is transferred directly from the die to a thermoplastic circuit substrate, with high adhesions of the conductors are achieved on the plastic substrate.
  • Hot stamping is thus a very fast and inexpensive process for the production of printed conductors and metal surfaces on a wide range of thermoplastics without the immediate use of chemical or galvanic processes in their own production.
  • the thermoplastics are plastics that can easily be deformed within a certain temperature range.
  • This process is reversible, ie it can after cooling and reheating to the molten Condition can be repeated as often as long as not using thermal decomposition of the material by overheating.
  • a major advantage of the hot stamping technique is the fact that the copper foils are commercially available and can be processed with this method a variety of filled and unfilled thermoplastics. However, their application has so far been limited to rigid circuit carriers.
  • the present invention provides a flexible circuit substrate for electrical circuits based on a flexible multilayer film having at least two different plastic film layers, wherein the melting temperature of the first plastic film layer is higher than the melting temperature of the second plastic film layer.
  • the flexible circuit substrate further comprises a metallic layer which is embedded in the second plastic film. layer is arranged, wherein a surface of the metallic layer is in communication with the second plastic film layer.
  • the present invention further provides a method of manufacturing a flexible circuit substrate for electric circuits, comprising a step of embossing a portion of a metallic embossing film in a second plastic film layer of a flexible multilayer film having two different plastic film layers, wherein the melting temperature of the second plastic film layer is lower than that Melting temperature of the first plastic film layer.
  • the embossing is done by applying force and heat to the portion such that a surface of the metallic layer is in communication with the second plastic film layer.
  • Exemplary embodiments of the present invention offer, inter alia, the advantage that a cost-effective and easily produced flexible circuit carrier with a printed electrical circuit is represented or a method for producing the same.
  • a multilayer plastic film as it is available on the market can be used.
  • the multilayer plastic film consists of at least two layers, a temperature-resistant layer with a higher melting temperature, which simultaneously serves as a carrier film, and a second, frequently amorphous layer, which has a lower melting temperature.
  • z By a suitable selection of the plastic multilayer film and the metallic stamping foil, z.
  • the second, melting at a lower temperature layer practically acts as a thermoplastic adhesive, while the melting at a higher temperature layer the flexible substrate, the required mechanical strength and significantly determines the thermal mechanical properties.
  • FIG. 1 shows the schematic cross section of a flexible circuit substrate for electrical circuits according to an embodiment of the present invention
  • Fig. 2 shows another embodiment of a flexible circuit substrate for electrical circuits according to the present invention with two metallic layers with roughened underside;
  • Fig. 3 is a schematic side view of a flexible circuit substrate for electrical circuits, wherein the metallic layers or interconnects are embedded in a flexible composite of three plastic film layers;
  • the flexible circuit substrate for electrical circuits is constructed of four plastic film layers and has two metal layers;
  • FIG. 5 shows a further embodiment of the present invention, wherein the two metal layers of the embodiment in Figure 4 are electrically connected via contact holes, which have a conductive material.
  • FIG. 6 shows a flexible circuit substrate for electrical circuits, which has five plastic film layers in which two metallic layers _
  • FIG. 7 shows a further exemplary embodiment according to the present invention, in which two metal layers or conductor track structures of a four-layer plastic film according to a further exemplary embodiment of the present invention are electrically conductively connected via metallic pins or rivets;
  • FIG. 8a, b schematically show the steps for manufacturing the flexible circuit substrate of FIG. 1 according to an exemplary embodiment of the method for manufacturing a flexible circuit substrate for electrical circuits;
  • FIG. 10a, b show, in schematic individual images, the production steps for producing the flexible circuit substrate from FIG. 3 according to a further exemplary embodiment of the method for producing a flexible circuit substrate for electrical circuits;
  • FIGS. 11a-d schematically show the steps for producing a flexible circuit substrate according to FIG. 4 with two metallization levels
  • FIGS. 2a-d schematically show the steps for producing a flexible circuit substrate according to FIG. 5, in which the two metallization levels are electrically conductively connected via a contact hole filled with conductive material;
  • Fig.l3a-h an embodiment for producing the flexible circuit substrate in Fig. 6;
  • FIG. 14a, b show a further exemplary embodiment for producing the flexible circuit substrate in FIG. 7.
  • the flexible circuit substrate 100 is composed of a flexible multilayer film 1 having at least two different plastic film layers, wherein the melting temperature of the first plastic film layer 2 is higher than the melting temperature of the second plastic film layer 4.
  • the flexible circuit substrate 100 for electric circuits has a metallic layer 6 which may, for example, constitute a conductor track and which is arranged in the second plastic film layer 4, wherein a surface 6a of the metallic layer 6 is in connection with the second plastic film layer 4.
  • a one-sided flexible circuit or a flexible circuit substrate can therefore be a dielectric plane 2, that is to say the first plastic film layer which has a higher melting temperature than the second plastic film layer 4, hereinafter also referred to as conductor plane.
  • the second plastic film layer 4 or conductor plane is not a conductive plastic film layer but the layer in which the metallic layer 6, that is to say, for example, the printed conductor structure, is arranged.
  • the dielectric layer 2 may consist of a temperature-resistant plastic film layer which has a high melting temperature and gives the flexible circuit substrate the required mechanical strength and determines its thermal mechanical properties.
  • the second plastic film layer 4 of the flexible multilayer film 1 may have an amorphous structure, that is an amorphous plastic layer having a lower melting temperature than the plastic film layer 2.
  • the melting temperature of the first plastic film layer for example, 170 0 C and the second at 13O 0 C.
  • the plastic film layers 4, 2 may, for example, be thermoplastic plastic film layers which can be welded upon exposure to heat and pressure.
  • the plastic films to be welded can be heated beyond their melting temperature and brought into a flowable state. On cooling, the thermoplastics are then welded together.
  • typical thermoplastics include polyimide (PI), polycarbonate (PC), polystyrene (PS), polyvinyl chloride (PVC), polyamide (PA), acrylonitrile butadiene (ABS), polymethyl methacrylate (PMMA) and polyethylene terephthalate (PET).
  • the metallic layer 6 disposed in the second plastic film layer 4 may include, for example, copper, nickel, tin, gold or aluminum. Of course, it is also conceivable that the metallic layer 6 has other conductive materials.
  • parts of the surface 6a of the metallic layer 6 are in contact with the second plastic film, while other parts 6b are exposed or not in contact with the second plastic film layer 4.
  • the metallic layer 6 can be completely embedded in the second plastic layer 4. That is, the entire surface of the metallic layer 6 is electrically conductive surrounding insulating material of the second plastic film layer 4.
  • the flexible circuit substrate 100 again consists of a flexible multilayer film 1 which has two different plastic film layers 2 and 4.
  • the plastic film layer 4 again has a lower melting temperature than the first plastic film layer 2.
  • two metallic interconnect structures 6 are embedded in the lower-melting plastic film layer 4, wherein parts of the surface 6b of the interconnect structure 6 are not in contact with the second plastic film layer 4, while a surface 6a (in this example, the lower surface of the wiring patterns) has a high roughness or roughness, and therefore the connection with the second plastic film layer 4 is particularly intimate. That is, the wiring patterns 6 may have high adhesion to the plastic film layer 4.
  • the surface roughness or the roughness of the metallic layer which is in contact with the plastic film layer may, for example, have an average roughness (average roughness R z ) of more than 10 ⁇ m or better, of more than 20 ⁇ m.
  • the average roughness R z of another metallic layer can be greater than 5 ⁇ m, for example 7 ⁇ m.
  • the average roughness Ra of the metallic layer may be about one order of magnitude smaller than the average roughness R 2 .
  • the average roughness of the metallic layer, which is in contact with the plastic film layer can therefore be, for example, greater than 1 ⁇ m or better, greater than 2 ⁇ m.
  • the surface roughness of the other surfaces 6b which are not in contact with the second plastic film layer 4 are generally much smaller, but may also correspond to the surface roughness of the surface 6a of the metallic layer.
  • at least the thickness of the roughened metallic layer 6a may be embedded in the second plastic film layer 4.
  • the metallic layer is completely embedded in the thermoplastic synthetic film layer 4, which has a lower melting temperature than the thermoplastic film layer 2.
  • FIG. 3 shows a conductor track structure 6 which is completely embedded in the second plastic film layer 4.
  • the flexible multilayer film 1 consists in this embodiment of three plastic film layers 2, 4 and 8, wherein the low-melting plastic film layer 4 between two higher-melting plastic films 2 and 8 is embedded. That is, the low-melting plastic film layer 4 directly contacts on one side a higher-melting plastic film layer and on the other side the other higher-melting plastic film layer.
  • the plastic film layer 4 which has a lower melting temperature in comparison with the plastic films 8 and 2, the printed conductor structures 6 are also completely embedded.
  • the conductor track structures 6 may in this case again have a surface 6a which has a greater surface roughness than other surfaces 6b, which in this exemplary embodiment are also in contact with the plastic film layer 4.
  • the flexible multilayer film 1 has a third plastic film layer 8 which is arranged so that the second plastic film layer 4 lies between the first plastic film layer 2 and the third plastic film layer 8, the melting temperature of the third plastic film layer 8 being higher than the melting temperature of the second plastic film layer 4.
  • the third 8 and the first 2 plastic film layer can be identical plastic film layers, ie plastic film layers of the same material.
  • plastic film layers of a different material in which case, for example, the melting temperature of the third plastic film layer 8 and the first plastic film layer 2 may be different. However, both melting temperatures are higher than the melting temperature of the second plastic film layer 4.
  • the flexible circuit substrate 100 therefore has a composite which consists of a first dielectric plane 2, a conductor plane 4 with the embedded interconnect structure 6, and a second dielectric plane 8.
  • the material constituting the second plastic film layer 4 may be structurally molten and cooled at the point where the plastic film layer 4 contacts the surface of the metallic layer 6, or may have a higher density than parts of the second plastic film layer 4, for example. which are not in contact with the metallic layer. It is also conceivable that the second plastic film layer 4, where it touches the surface of the metallic layer 6, is converted from an amorphous to a semi-crystalline state.
  • Another exemplary embodiment of the present invention is designed, for example, such that the conductor track structures 6 are not completely embedded by a specific cutting of the third plastic film 8, so that conductor or contact connections to the conductor track structures 6 remain uncovered.
  • the flexible circuit substrate may have at these uncovered locations a metallic solder with, for example, lead-free solder, to which an electrical component may be connected to the flexible circuit. can be connected electrically conductive substrate.
  • the multilayer flexible film 1 has a fourth plastic film layer 12 arranged such that the third plastic film layer 8 is interposed between the second plastic film layer 4 and the fourth plastic film layer 12, the fourth plastic film layer 12 having a lower melting temperature than the third plastic film layer 8.
  • the fourth plastic film layer 4 can thus touch the third plastic film layer 8 directly.
  • the flexible circuit substrate also has a further metallic layer 10 in the fourth plastic film layer 12, wherein a surface 10 a of the further metallic layer 10 is in connection with the fourth plastic film layer 12.
  • the surface 10a of the further metal layer 10 may in turn, analogously to the metal layer 6 described above, have a surface roughness which is greater than other surfaces 10b of the further metallic layer 10.
  • the two metallic layers 6, 10 may be disposed in the flexible circuit substrate so as to have overlapping portions separated by the layers therebetween.
  • the second metallic layer 10 which may likewise be formed as a conductor track or conductor track structure, which has been mentioned in connection with the metallic layer 6.
  • the conductor track structures or the metallic layers 10 can have a high adhesion in the fourth plastic film layer 12.
  • the adhesion may be 1.4 N / mm.
  • the low-melting plastic film layers 12 and 4 may be identical plastic film layers, ie the plastic film layers may be made of one and the same material. However, it is also conceivable that they are different materials, wherein the melting temperature of the fourth plastic film layer is lower than that of the third plastic film layer 8.
  • the melting temperature of the second plastic film layer 4 is in turn lower than the melting temperatures of the first 2 and third 8 plastic film layer.
  • the flexible circuit substrate thus represents a composite in which a first dielectric layer 2 is in contact with a dielectric conductor plane 4, in which a first metallic conductor track structure or layer 6 is embedded.
  • a second dielectric plane 8 adjoins this first conductor plane 4, on which a second conductor plane 12 is arranged, wherein a second metallic layer or conductor track structure 10 is at least partially in connection with the second conductor plane 12.
  • the flexible circuit substrate as shown in Fig. 4, additionally contact holes 14 in the third plastic film 8 and partially in the second 4 and 4 12 plastic film having, with a conductive material 16, are filled.
  • the conductive material may be, for example, a polymer conductive paste 16.
  • By filled with a conductive material 16 contact hole 14 so an electrically conductive connection between the metallic layer 6 and the other metal layer 10 is prepared. In this way, therefore, several metallization levels can be generated with electrically conductive vias.
  • the contact hole 14 may be formed so that the conductor tracks or the two metallic layers 6 and 10 are electrically conductively connected to one another via a conductive material introduced into the contact hole.
  • the electrically conductive material 16 located in the contact hole is thus in contact with a part of the surface of the metallic layer 6 and a part of the surface of the further metallic layer 10, whereby an electrically conductive path between the further metal layer 10 and the metal layer 6 results.
  • the contact hole between the metallization layers 10, 6 does not have to be formed vertically, but may also take on a different shape, as long as a conductive connection between the metallization planes is produced by a conductive material introduced into the contact hole.
  • Fig. 6 shows another embodiment of a flexible circuit substrate for electrical circuits.
  • the flexible circuit substrate has five plastic film layers, wherein the first four plastic film layers are constructed and arranged as described in connection with the exemplary embodiment in FIG. 5, so that no further description of these layers takes place here.
  • the fifth plastic film layer 24 is arranged on the fourth plastic film layer 12 in this exemplary embodiment. It can therefore be in direct contact with the fourth plastic film layer, or touch it directly.
  • the fifth plastic film layer 24 has a higher melting temperature than the fourth plastic film layer 12.
  • the further metallic layer 10 is embedded in the fourth plastic film layer 12 and a contact hole 14 has a metallically strong connection between the metallic layer 6 and the further metallic layer 10, wherein the metallic connection 18 in the Contact hole 14 may consist of a different metallic material than the metallic layer 6 and the another metallic layer 10.
  • the metallic connection 18 may be, for example, a soldered or welded connection between the two metallic layers 6 and 10.
  • a flexible circuit substrate in which a metallic layer 6 in the second plastic film layer 4 and the further metallic layer 10, which is arranged in the fourth plastic film layer 12, via a metallic connection 18 in a contact hole 14th formed in the third plastic film layer 8 and partly in the second 4 and the fourth plastic film layer 12 are fixed metallically and electrically conductively connected.
  • the metallic compounds may be soldered or welded compounds of corresponding metallic materials.
  • the further metallic layer 10 can be completely embedded in the fourth plastic film layer, the low-melting plastic film layer 12.
  • An electrically conductive connection as shown in another embodiment in Fig. 7, for example, by metallic conductive micro-pins 20, which are inserted into a flexible circuit substrate 100 that they both a metallic layer 6 and another metal layer 10th penetrate and thereby produces an electrically conductive contact between the two metallic layers 6 and 10.
  • the metallic layers 6 and 10 may again be printed circuit patterns, and as shown in FIG. 7, the flexible circuit substrate 100 may have, for example, four plastic film layers formed as described in connection with the description of FIG. 4.
  • the electrically conductive micro-pins 20 may completely or at least partially penetrate the flexible circuit substrate 100, so that an electrical contact between the different metallization layers may occur. tion levels can be produced.
  • the electrically conductive pins 20 may be, for example, metallic micro-pins, such as.
  • the metallic micro-pins 20 may be fixedly and immovably mounted in the flexible circuit substrate.
  • the micro-pins 20, screws or nails corresponding to a head 20a and at its other end 20b also have a widening 20b, so that the micro-pins 20 are fixedly arranged in the flexible circuit substrate.
  • the electrically conductive pin 20 so penetrates in this embodiment, the first to fourth plastic film layer 2,4,8,12, and the metallic layer 6 and the other metallic layer 10th
  • a flexible circuit substrate for electrical circuits can have further layers or plastic film layers or other flexible intermediate layers, without deviating from the idea of the device and the method represented in this invention.
  • a flexible circuit substrate with more than two conductor planes or conductor track structure planes, the printed conductors being arranged completely in or at least partially each in a plastic film layer having a melting temperature that is lower or lower, as the melting temperatures of the plastic film layers, between which the plastic film layer is arranged with thenatibahnstruk- tures.
  • the flexible circuit substrate 100 for electrical circuits may be configured to further include, in accordance with another embodiment, an electrical circuit element electrically connected to one of the metallic layers 6, 10.
  • the electrical circuit element may be, for example, a capacitive, an inductive or a resistive circuit element l ⁇
  • the flexible circuit substrate can connect electrical devices via its metal layers 6, 10 so that they can exchange uni-directional or bidirectional electrical signals.
  • the method of manufacturing a flexible circuit substrate for electrical circuits comprises impressing 55 a portion 6 of a metallic stamping foil 5 into a second plastic film layer 4 of a flexible multilayer film 1 comprising two different plastic film layers wherein the melting temperature of the second plastic film layer 4 is lower than the melting temperature of a first plastic film layer 1.
  • the embossing 55 is effected with the application of force and heat to the section 6, the embossing film 5, so that at least one surface 6a of the metallic layer 6 in Connection with the second plastic film layer 4 is.
  • the embossing 55 can take place with an embossing stamp 60 whose stamping shape corresponds to a shape of the section 6.
  • the step of embossing 55 may thus include pressing an embossing die 60 whose embossing shape corresponds to a shape of the section 6 onto the metallic embossing foil 5, thereby punching out the ab - Section 6 from the metallic stamping foil 5 is performed. At the same time, at least one surface 6a of the metallic layer 6 is brought into contact with the second plastic film layer 4 by the application of force and heat to the section 6.
  • the embossing 55 of a section a metallic stamping foil be performed as a hot stamping. That is, by means of a hot stamping technique, a portion of a metallic stamping foil may be applied to a second low melting plastic film layer 4 such that at least one surface of the metallic layer is in communication with the second plastic film layer 4.
  • the compound which can be achieved in this case can be distinguished by a high adhesive force of the metallic layer or the printed conductor on the plastic film layer.
  • a flexible circuit substrate for example, as shown in Fig. 1, are prepared.
  • FIGS. 9a to 9b A further possibility for producing a flexible circuit substrate is illustrated in FIGS. 9a to 9b.
  • a copper hot stamping foil 5 which consists of a copper layer 5b and a Haftgol.
  • An adhesive layer 5a having a high roughness is heat-embossed onto a multilayer film 1 having a first plastic film layer 2 serving as a support layer made of a heat-resistant polymer such as polyethylene terephthalate (PET) and a fusible polymer layer 4.
  • PET polyethylene terephthalate
  • a structured embossing stamp a correspondingly structured printed conductor layout, as known in hot stamping technology, can be punched out of the copper hot stamping foil 5 and transferred to the multilayer film 1.
  • the structured die is not shown in FIGS. 9a to 9b.
  • the embossing temperature which is dependent on the melting temperature of the polymer layer 4, for example, 13O 0 C at the hot stamping die, the embossing force is dependent on the surface of the transferred layout.
  • the flexible multilayer film 1 is virtually unchanged after the embossing process in its shape and there is a flexible circuit substrate 100, as shown in Fig. 9b.
  • the embossed Printed conductor structures 6 have a high adhesion to the second plastic film layer 4.
  • the section of the metallic stamping foil 6 can have a roughened surface 6a, so that intimate contact between the metallic layer and the second plastic foil layer 4 can be achieved during stamping.
  • the embossing 55 can thus be carried out in such a way that a roughened surface 6a of a section of a metallic stamping foil which has a greater surface roughness than other surfaces of the section of a metallic stamping foil is in intimate connection with the second Plastic film layer is brought while the other surfaces are not in contact with the second plastic film layer.
  • the embossing can, for example, be carried out in such a way that a force and heat effect is effected in a targeted manner such that at least the thickness of the roughened metallic layer 6a is introduced into the second plastic film layer 4 which melts at lower temperatures.
  • the hot stamping 55 may be performed so that the embossing die and / or the embossing hot stamping foil have a temperature that is less than the melting temperature of the first plastic film layer 2 and greater than or equal to the melting temperature of the second plastic film layer 4th
  • FIGS. 10a, b A further exemplary embodiment of the method for producing a flexible circuit substrate is shown schematically in FIGS. 10a, b.
  • a flexible circuit carrier or a flexible circuit substrate 100a with Printed circuit patterns 6 are produced as described in connection with FIG. 9.
  • another flexible multilayer film 1a is laminated such that a fusible plastic film layer 4b points to the conductor plane or to the fusible layer 4a of the flexible circuit substrate 100a.
  • the flexible multilayer film 1a has a first plastic film layer 8 having a higher melting temperature than the second plastic film layer 4b.
  • the flexible multi-layer film Ia may then be connected to the flexible circuit board 100a, for example, with a plan, so unstructured, hot stamper for example, a die temperature of 130 0 C and a temperature of the circuitry carrier are pressed 100a of likewise 130 0 C or welded or laminated.
  • a solid composite is obtained, consisting of a first plastic film layer or dielectric layer 2, a second plastic film layer 4, which emerges from the plastic film layers 4a and 4b of the flexible circuit substrate 100a or the flexible multilayer film 1a.
  • this second plastic film layer 4 now has the conductor layer or metallic layer 6 completely embedded in this layer.
  • the third plastic film layer 8 is in connection with the second plastic film layer 4.
  • the plastic film layers 8 and 2 have a higher melting point than the second plastic film layer 4.
  • the method for producing this flexible circuit substrate again takes advantage of the fact that the flexible circuit carrier 100a and the flexible multi-layer film Ia are respectively welded together via their low-melting plastic film layers 4a and 4b, while the higher-melting plastic films 8 and 2 ensure the mechanical stability of the flexible circuit substrate.
  • FIGS. 11a to 11d show a further possibility for producing a flexible circuit substrate.
  • the carrier layer 8 that is to say the plastic film layer with the higher melting temperature, points towards the conductor plane 4 or the second plastic film layer 4 of the flexible circuit substrate.
  • the compression of the flexible multilayer film Ia and the flexible circuit substrate 100 is carried out again with a planar heat stamp, wherein the stamp temperature is for example 17O 0 C and the temperature of a circuit carrier receptacle (not shown in FIG.
  • a lower temperature of for example 130 0 C has.
  • a composite 100b of four plastic film layers 2, 4, 8, 12 is obtained, a metallic layer 6 or a section of a metallic embossing film in the second low-melting plastic film layer 4 located.
  • the multilayer film composite 100b now has, on one of its surfaces, the fourth low-temperature melting plastic film layer 12.
  • a corresponding printed-circuit layout can now be punched out of a copper hot-stamping foil 5 with its roughened surface 5a or with its adhesive layer 5a and onto the foil composite by a structured embossing die, similar to that shown in connection with FIGS. 9a, b 100b imprinted become. That is, another metallic layer 10 or another portion of a metallic stamping foil can be introduced into the fourth plastic foil layer 12, which has a lower melting temperature than the underlying third plastic foil layer 8, with the application of force and heat.
  • the embossing temperature which is dependent on the melting temperature of the polymer layer 12, may be for example the hot stamper 130 0 C.
  • the stamping force in turn depends on the area of the printed conductor layout to be transferred from the stamping die to the fourth plastic film layer 12.
  • the printed conductor structures 10 also have high adhesion in the fourth plastic film layer 12, which may amount to 1.4 N / mm, for example.
  • FIGS. 12a to 12d Another possibility for producing a flexible circuit substrate for electrical circuits is shown schematically in FIGS. 12a to 12d.
  • contact holes 14 are formed.
  • openings are introduced into the plastic in the first plastic film layer 8 and partly in the second plastic film layer 12 up to the printed conductor structures 10.
  • these openings 14 or contact holes extend as far as the side introduced into the plastic film layer of the metallic conductor structure 10.
  • the contact holes or openings 14 can be generated, for example, by means of a (UV) laser emitting in the ultraviolet spectral range, wherein its energy input can be selected in that the material removal in the plastic films automatically stops when the metallic conductor track structure 10 is reached.
  • UV ultraviolet
  • a Polymerleitpaste 16 are introduced in such a way so that the filling is approximately flush or slightly protruding with the back of the film composite 100a, ie with the higher melting plastic film layer 8, concludes.
  • the Polymerleitpaste can then be cured at a temperature of for example 120 0 C for one hour.
  • the film composite 100a prepared in this way is then, as shown in FIG. 12c, pressed with a further flexible circuit substrate 100b 72 such that the openings or contact holes 14 filled with the polymer conductive paste are positioned on parts of the conductor track structure 6.
  • the compression 72 of the flexible circuit substrate 100a with the flexible circuit substrate 100b takes place in this case with a flat hot stamp at a stamping temperature of for example 170 0 C and a temperature of 130 0 C, which a receiving device for the flexible circuit substrate 100b (not shown in FIG. 12a to 12d).
  • the flexible circuit carrier 100 thus has a structure of the form of the first dielectric / first conductor level / second dielectric / second conductor level, in which the individual conductor levels are connected in an electrically conductive manner by means of through-connections 14.
  • the joining of the flexible circuit substrates 100 a and 100 b to the flexible circuit substrate 100 is carried out under force and heat with a flat embossing stamp, so that a portion of a metallic embossing film 6 is pressed into the second plastic film layer 4 so that these embedded in the second plastic film layer 4 That is, the conductor track structure 6 or the metallic layer 6 can be completely surrounded by the material of the plastic film 4, except at the points where the printed conductor structure 6 is in electrical contact with the electrically conductive material 16, via which an electrically conductive connection to the printed conductor structure 10 is produced.
  • a flexible circuit substrate is represented after each of the individual method steps for producing the flexible circuit substrate.
  • a flexible circuit substrate 100a which has been produced, for example, as explained in detail in connection with FIGS. 8a, b or 9a, b, is welded to a further flexible multilayer film 1a.
  • the application 64 or welding or lamination takes place in such a way that the heat-resistant carrier layer 8 points to the conductor level or the low-melting plastic layer 4 of the flexible circuit substrate 100a.
  • the flexible multi-layer film Ia and the flexible circuit substrate 100a are then, as already explained in connection with FIG.
  • the film composite 100 b has four plastic film layers, wherein in the second plastic film layer 4 the metallic layer 6 is completely filled. is permanently embedded, and wherein the uppermost layer of the film composite 100b forms the fourth plastic film layer 12, which melts at a lower temperature than the third plastic film layer 8.
  • a further step 68 as shown in Fig. 13c, from the top of Foil composite openings or contact holes 14 in the fourth, third and partially introduced into the second plastic film layer, so exposed through the contact hole parts of a surface 6a of the metallic layer or the conductor track structure 6.
  • openings 14 can be generated for example by a UV laser, wherein the energy input can be selected again so that the material removal of the plastic film layers 12,8,4 automatically stops when reaching the surface 6a of the metallic interconnect structure 6.
  • a further printed conductor layout can now be punched out of a copper hot stamping foil 5 by a structured hot stamping die and imprinted on the foil composite 100b such that the openings of the contact holes 14 in the fourth plastic foil layer 12 are stamped be closed by another metallic layer 10, as shown in Fig. 13e. That is, the flexible film composite 100c has four plastic film layers at this stage of manufacture, as well as two metallization layers 6 and 10, between which there are contact holes 14 which are not filled at this stage of manufacture.
  • the metallic layers or conductor structures 10 and 6 can be connected to one another by the formation of a metallic connection 18.
  • This connection 18 is a metallic fixed connection between the conductor track structures 6 and 10, which can be made, for example, by means of
  • welding process can be made. Analogous to the procedure described in connection with FIG. 10, it is then possible to apply to the film composite 100c another flexible multiple layer film Ib are so applied 62 that the conductor structure 10 is completely embedded in the fourth plastic film layer 12 and above a fifth 24, at a higher temperature than the fourth plastic film layer 12 melting plastic film layer is disposed.
  • the application 62 can be done again by hot stamping with a flat die.
  • FIGS. 14a to 14b A further exemplary embodiment of the method for producing a flexible circuit substrate for electrical circuits is shown in FIGS. 14a to 14b.
  • a flexible circuit carrier 100 the production of which has been explained in connection with the description of FIGS. 11a to 11d, two metallic layers or conductor track structures 6 and 10 are electrically conductively connected.
  • metallic micro-pins 20 At the points where the conductor track structure 6 in the first conductor level 4 and the conductor track structure 10 in the second conductor level 12 are to be electrically connected to each other, metallic micro-pins 20, such. As pop rivets, pressed into the flexible circuit substrate 100.
  • the micro-pins 20 are immovably fixed after being pressed in and constitute the electrically conductive connection between the conductor track structures 6 of the first conductor plane 4 (insulating, low-melting second plastic film layer) and the conductor track structure 10 in the second conductor plane 12 (fourth insulating, low-melting plastic film layer) ,
  • the metallic micro-pins 20 may be, for example, rivets or other pins of an electrically conductive material, so that an electrically conductive connection between the conductor track structures 6 and 10 can be produced.
  • the method of fabricating a flexible circuit substrate may include piercing 78 the flexible circuit substrate such that electrically conductive pins piercing the flexible circuit substrate are stationary Zo
  • the flexible circuit substrate are arranged, wherein an electrically conductive connection between the conductor track structures 6 and 10 can be produced by the electrically conductive pins 20.
  • the micro-pins can, for example, have heads 20a or extensions 20b, so that a stationary connection of the electrically conductive pins to the flexible circuit substrate is ensured.
  • further flexible circuit substrates can be produced with electrical circuits, if correspondingly further conductor track planes or plastic film layers are added.
  • the flexible circuit substrate is configured to electrically interconnect electrical components that are in electrical contact with a wiring pattern of the flexible circuit substrate via conductive traces embedded in the flexible circuit substrate.
  • the production of printed flexible circuits by hot stamping technique can be very versatile.
  • one-way flexible circuits having a dielectric plane and a conductor plane may be fabricated.
  • the layer structure of the flexible circuit carrier can therefore have a dielectric plane and a conductor plane.
  • a conductor plane having a metallic wiring pattern is sandwiched between two dielectric layers.
  • the flexible circuit substrate thus has a structure: first dielectric plane / conductor plane / second dielectric plane.
  • only the connection contacts to the conductor plane in one of the dielectric layers are recessed, so that an electrical connection to an external, not in the flexible circuit Carrier arranged electrical component can be easily manufactured. This can be done, for example, in such a way that on a film composite, which has a dielectric layer and a conductor plane, another pre-cut or pre-punched dielectric layer is laminated with an unstructured hot stamp under heat and pressure.
  • the flexible circuit substrate or flexible circuit substrate has a layer structure of the form: first dielectric plane / first conductor plane / second dielectric plane / second conductor plane. That is, in embodiments of the present invention, the production of flexible multi-layer circuit carriers is shown, as they can be used for example in the form of multilayer printed circuit boards. The implementation of this construction can be effected in such a way that, on the previously described structure of the form: first dielectric plane / conductor plane / second dielectric plane, a further metallization layer is impressed by means of hot stamping technology. If an electrically conductive connection between the two conductor planes, which comprise the printed conductor structures, is required, this can be achieved in various ways.
  • the interconnected plane first dielectric plane / first conductor plane and the interconnected plane second dielectric plane / second conductor plane may initially be produced separately.
  • the openings in the dielectric plane can then be filled with polymer conductive paste, for example.
  • the first dielectric plane / first conductor plane and second dielectric plane / second conductor plane composites are pressed together with an unstructured hot stamping die under heat and pressure.
  • first and second conductor level of a four-layer structure can be electrically connected to one another after its completion by pins or rivets. This can be done, for example, by pressing fine contacting pins into the composite or into the flexible circuit substrate at the locations where the two conductor planes or interconnect structures are to be connected.
  • the conductor tracks can be connected to one another by means of welding or soldering methods.
  • 4a is another second plastic film layer
  • third plastic film layer 10 further metallic layer or further portion of the metallic stamping foil
  • stamping dies 62 applying a flexible multilayer film to a flexible circuit substrate 64 further applying a flexible multilayer film to a flexible circuit substrate

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

L'invention concerne un substrat flexible pour circuits électriques, et son procédé de fabrication. Le substrat flexible pour circuits électriques présente un film flexible multicouche qui présente au moins deux couches de film plastique différentes, sachant que la température de fusion de la première couche de film plastique est supérieure à la température de fusion de la deuxième couche de film plastique. De plus, une couche métallique est disposée dans la deuxième couche de film plastique, sachant qu'une surface de la couche métallique se trouve en liaison avec la deuxième couche de film plastique.
PCT/EP2008/009716 2007-11-20 2008-11-17 Substrat flexible pour circuits électriques, et son procédé de fabrication WO2009065543A1 (fr)

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DE200710055275 DE102007055275A1 (de) 2007-11-20 2007-11-20 Flexibles Schaltungssubstrat für elektrische Schaltungen und Verfahren zur Herstellung desselben
DE102007055275.2 2007-11-20

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JPWO2021025073A1 (fr) * 2019-08-08 2021-02-11

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DE102011055117A1 (de) * 2011-11-08 2013-05-08 Harting Kgaa Verfahren und Lösung zur Metallisierung von Polymeroberflächen
DE102014102519A1 (de) * 2014-02-26 2015-08-27 Schreiner Group Gmbh & Co. Kg Folienverbund mit elektrischer Funktionalität zum Aufbringen auf ein Substrat
DE102019107177B4 (de) * 2019-03-20 2022-08-18 Raiffeisendruckerei Gmbh Verfahren zur Herstellung von Sichteffekten auf einem Bedruckstoff

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JPWO2020071473A1 (ja) * 2018-10-04 2021-09-02 株式会社村田製作所 積層体及びその製造方法
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