WO2009060927A1 - 半導体用接着シート及びダイシングテープ一体型半導体用接着シート - Google Patents

半導体用接着シート及びダイシングテープ一体型半導体用接着シート Download PDF

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Publication number
WO2009060927A1
WO2009060927A1 PCT/JP2008/070268 JP2008070268W WO2009060927A1 WO 2009060927 A1 WO2009060927 A1 WO 2009060927A1 JP 2008070268 W JP2008070268 W JP 2008070268W WO 2009060927 A1 WO2009060927 A1 WO 2009060927A1
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WIPO (PCT)
Prior art keywords
adhesive sheet
semiconductor
dicing tape
tape integrated
curing
Prior art date
Application number
PCT/JP2008/070268
Other languages
English (en)
French (fr)
Inventor
Masaki Yamada
Michio Mashino
Original Assignee
Hitachi Chemical Company, Ltd.
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Filing date
Publication date
Application filed by Hitachi Chemical Company, Ltd. filed Critical Hitachi Chemical Company, Ltd.
Priority to EP08847953A priority Critical patent/EP2219212A4/en
Priority to JP2009540093A priority patent/JP5287725B2/ja
Priority to CN2008801114549A priority patent/CN101821841B/zh
Priority to US12/741,117 priority patent/US9969909B2/en
Publication of WO2009060927A1 publication Critical patent/WO2009060927A1/ja

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    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
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    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
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  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)

Abstract

　エキスパンドによる切断性が良好で個片化が可能であり、且つモールド時に配線基板の凹凸への埋め込み性が優れる半導体用接着シート及びダイシング一体型半導体用接着シートを提供する。高分子量成分及びフィラーを含有する樹脂組成物からなる半導体用接着シートであって、硬化前の接着シートの０°Cにおける破断伸度が４０％以下であり、硬化後の接着シートの１７５°Cにおける弾性率が０．１～１０ＭＰａであることを特徴とする半導体用接着シート。
PCT/JP2008/070268 2007-11-08 2008-11-07 半導体用接着シート及びダイシングテープ一体型半導体用接着シート WO2009060927A1 (ja)

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EP08847953A EP2219212A4 (en) 2007-11-08 2008-11-07 ADHESIVE FILM FOR A SEMICONDUCTOR AND SAW FILM STRIP WITH THE SHEET FOR A SEMICONDUCTOR
JP2009540093A JP5287725B2 (ja) 2007-11-08 2008-11-07 半導体用接着シート及びダイシングテープ一体型半導体用接着シート
CN2008801114549A CN101821841B (zh) 2007-11-08 2008-11-07 半导体用粘接片及切割带一体型半导体用粘接片
US12/741,117 US9969909B2 (en) 2007-11-08 2008-11-07 Adhesive sheet for semiconductor, and dicing tape integrated adhesive sheet for semiconductor

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JP2007290680 2007-11-08
JP2007-290680 2007-11-08

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JP2013006899A (ja) * 2011-06-22 2013-01-10 Hitachi Chemical Co Ltd 接着フィルム及びこれを用いた半導体装置
WO2013005470A1 (ja) * 2011-07-01 2013-01-10 古河電気工業株式会社 接着フィルム、並びにダイシングダイボンディングフィルム及びそれを用いた半導体加工方法
JP2015021062A (ja) * 2013-07-19 2015-02-02 住友ベークライト株式会社 樹脂組成物、接着フィルム、接着シート、ダイシングテープ一体型接着シートおよび電子部品

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JP6128043B2 (ja) * 2014-03-31 2017-05-17 住友ベークライト株式会社 半導体用ウエハ加工用粘着テープ
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JP6876540B2 (ja) * 2017-06-27 2021-05-26 日東電工株式会社 ダイシングテープ一体型接着性シート
CN111987007A (zh) * 2020-08-31 2020-11-24 维信诺科技股份有限公司 显示装置的压合方法和显示装置

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JP2010100840A (ja) * 2008-09-24 2010-05-06 Hitachi Chem Co Ltd 接着剤フィルム及び回路接続材料
CN102382585A (zh) * 2010-07-28 2012-03-21 日东电工株式会社 倒装芯片型半导体背面用膜、半导体背面用条状膜的生产方法和倒装芯片型半导体器件
CN102382586A (zh) * 2010-07-28 2012-03-21 日东电工株式会社 倒装芯片型半导体背面用膜
JP2013006899A (ja) * 2011-06-22 2013-01-10 Hitachi Chemical Co Ltd 接着フィルム及びこれを用いた半導体装置
WO2013005470A1 (ja) * 2011-07-01 2013-01-10 古河電気工業株式会社 接着フィルム、並びにダイシングダイボンディングフィルム及びそれを用いた半導体加工方法
JP2015021062A (ja) * 2013-07-19 2015-02-02 住友ベークライト株式会社 樹脂組成物、接着フィルム、接着シート、ダイシングテープ一体型接着シートおよび電子部品

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US9969909B2 (en) 2018-05-15
JP5287725B2 (ja) 2013-09-11
US20100266842A1 (en) 2010-10-21
KR101557171B1 (ko) 2015-10-02
MY151971A (en) 2014-07-31
TW200933722A (en) 2009-08-01
CN102543809B (zh) 2015-11-04
KR20100085035A (ko) 2010-07-28
EP2219212A4 (en) 2012-07-11
JPWO2009060927A1 (ja) 2011-03-24
CN102543809A (zh) 2012-07-04
EP2219212A1 (en) 2010-08-18
CN101821841A (zh) 2010-09-01
TWI390621B (zh) 2013-03-21
SG185968A1 (en) 2012-12-28
CN101821841B (zh) 2013-05-08

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