WO2009043649A2 - Structure de porte-circuit électronique tridimensionnelle, porte-circuit de base présentant la structure de porte-circuit en tant que composant fonctionnel, et circuiterie tridimensionnelle composée d'au moins deux structures de porte-circuit tridimensionnelles de ce type - Google Patents

Structure de porte-circuit électronique tridimensionnelle, porte-circuit de base présentant la structure de porte-circuit en tant que composant fonctionnel, et circuiterie tridimensionnelle composée d'au moins deux structures de porte-circuit tridimensionnelles de ce type Download PDF

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Publication number
WO2009043649A2
WO2009043649A2 PCT/EP2008/061346 EP2008061346W WO2009043649A2 WO 2009043649 A2 WO2009043649 A2 WO 2009043649A2 EP 2008061346 W EP2008061346 W EP 2008061346W WO 2009043649 A2 WO2009043649 A2 WO 2009043649A2
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WO
WIPO (PCT)
Prior art keywords
circuit
dimensional
substrate plate
carrier structure
circuit carrier
Prior art date
Application number
PCT/EP2008/061346
Other languages
German (de)
English (en)
Other versions
WO2009043649A3 (fr
Inventor
Andreas Bernhardt
Ulrich Deml
Carsten GÖTTE
Angelika Schingale
Original Assignee
Continental Automotive Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Continental Automotive Gmbh filed Critical Continental Automotive Gmbh
Publication of WO2009043649A2 publication Critical patent/WO2009043649A2/fr
Publication of WO2009043649A3 publication Critical patent/WO2009043649A3/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/046—Planar parts of folded PCBs making an angle relative to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/047—Box-like arrangements of PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/048—Second PCB mounted on first PCB by inserting in window or holes of the first PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09172—Notches between edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09181—Notches in edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10401—Eyelets, i.e. rings inserted into a hole through a circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10446—Mounted on an edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof

Definitions

  • circuit base carrier comprising the circuit carrier construction as a functional component and three-dimensional circuit arrangement consisting of at least two such three-dimensional circuit carrier structures
  • the invention relates to a three-dimensional circuit carrier structure in which at least two interconnected, planar two-dimensional substrate plates such as printed circuit boards, ceramic circuit carriers (LTCC, DCB, thick film), partially flexible circuit carriers or the like having contacting elements and are equipped at least on one side with electronic components, ⁇ 180 ° angled, in particular 90 ° to each other angled, in particular on adjacent edges, are composed.
  • the invention further relates to a heat dissipation device for power losses of components of this circuit carrier structure, as well as a circuit base carrier having at least one such three-dimensional circuit carrier structure as a functional component.
  • the invention relates to a three-dimensional circuit arrangement, which consists of at least two such three-dimensional circuit carrier structures.
  • multilayer circuit substrate to run as a multilayer circuit boards in which individual, consisting of insulating substrate material and provided with electrical components and conductors and the like layers are bonded together via prepregs. The electrical contacting of the individual layers of the carrier material with one another takes place, for example, via plated-through holes.
  • DE 44 27 516 A1 discloses surface-saving, three-dimensional multilayer circuit arrangements of conventional design, in which at least two substrate plates, each comprising electronic components and contacting elements such as printed conductors, plated-through holes, pads and the like, are arranged one above the other. Due to the high packing density, increased heat occurs due to power dissipation, which is to be carried away by metal surfaces arranged between adjacent substrates, the metal surfaces being soldered together in addition to the mechanical connection of the substrate plates.
  • Such three-dimensional, multilayer circuit arrangements require complex manufacturing processes and elaborate vias to be made from substrate plate to substrate plate (DE 44 27 515 C1, DE 44 00 985 C1). In addition, the heat dissipation is not sufficient because the metal surfaces, which must also serve for the mechanical connection between adjacent substrate plates, can not be optimally adjusted to the heat dissipation.
  • z. B power semiconductors stocked planar, ie plate-shaped substrates, eg. As printed circuit boards, the circuit board directly on a heat sink, z. B. to laminate a metal plate, so that discrete heat sink can be omitted.
  • the object of the present invention is to provide three-dimensional electrical circuit carrier assemblies which can be produced easily and which also enable effective and simple thermal management.
  • an object of the present invention is to provide a plate-shaped circuit carrier with high component density, which is simple and inexpensive to produce, and is flexibly adaptable to different requirements.
  • circuit carrier assembly according to claim 1 and a circuit base carrier with the
  • the invention provides a new configuration of three-dimensional circuit arrangements or circuit board structures in which planar or plate-shaped, or plate-shaped, electronic components bearing and contacting elements, such as printed conductors, vertical vias Pads od.
  • Elements comprising two-dimensional substrates, in particular substrate plates, not in layers to each other (so-called stacks), but in angled arrangements as a substrate plate walls with each other. The angles are ⁇ 180 ° and, for example, 60, 90 or 120 °, so that different spatial shaped bodies are formed, wherein free spaces between the substrate plates are expediently filled with a heat-conducting, electrically insulating filling material (Thermais Interface Material) at least partially.
  • a heat-conducting, electrically insulating filling material Thermais Interface Material
  • Contacting elements are provided which can conduct electrical current from one substrate plate wall to the adjacent substrate plate wall.
  • the substrate plates are expediently joined together or arranged at an angle to one another via their edges, with regular or irregular three-dimensional bodies, in particular hollow bodies, being formed.
  • the invention further provides, according to a preferred embodiment, a spatial combination of the means for mechanical fixation with the means of electrical connection to the adjacent edges of the substrate plates.
  • the inventive plate-shaped circuit base support with high component density has as a functional component on his
  • Fig. 2 A cross-shaped substrate configuration for
  • Fig. 3 In cross section a cuboid circuit arrangement according to the invention
  • FIGS. 4a to d Schematic and perspective examples of fastening devices according to the invention between two substrate plates of a three-dimensional circuit carrier structure according to the invention
  • FIGS. 6a to c show schematically in cross section a plurality of circuit base carriers according to the invention with a parallelepiped-shaped circuit carrier structure according to the invention which is open at the end side according to further embodiments
  • FIG. 7 shows a schematic side view of a circuit base carrier according to the invention with a parallelepiped circuit carrier structure according to a further embodiment
  • FIG. 8 shows a top view of the circuit base carrier according to FIG. 7
  • Fig. 9 Schematically a perspective view of a portion of a contact rail with plugged cuboid circuit carrier structure
  • Fig. 10a / b Schematically each edge region of the section along the line A-A in Fig. 7 without
  • Fig. 11 Schematically two connection possibilities of a contact rail to the circuit base support
  • 1 a and 1 b each show two substrate plates, namely a base substrate plate as a substrate plate bottom wall 1 and an attached or angled substrate plate as a substrate plate side wall 2, which are perpendicular, ie 90 ° to each other, with free spaces 3 or interiors between see adjacent Substrate plate walls 1; 2 remain. Even acute angles (not shown) may equally be provided.
  • the components and the Kunststofftechniksele- elements that z. B. in particular on both sides of the substrate plate walls 1; 2 are applied or arranged, are not shown in the illustrated in FIGS. Ia to Ih Kunststoffformbeiard reasons of simplification.
  • the components also called components or components in the subject area, are for example integrated circuits (ICTs), sensor / actuator arrangements and / or passive components and / or plugs and / or optical components.
  • ICTs integrated circuits
  • sensor / actuator arrangements and / or passive components and / or plugs and / or optical components.
  • Planar or planar or two-dimensional substrate plates in the context of the invention are z. B.
  • printed circuit boards of insulating support material preferably from impregnated with phenolic resin paper fibers (FRl or FR2) and / or impregnated with epoxy resin paper fibers (FR3) and / or impregnated with epoxy glass fiber mats (FR4 or FR5) and / or polyamide / polyimide Fibers and / or Kevlar Fiber mats and / or ceramic and / or Teflon, or LCP (liquid crystalline polymers).
  • FRl or FR2 phenolic resin paper fibers
  • FR3 epoxy resin paper fibers
  • FR4 or FR5 epoxy glass fiber mats
  • polyamide / polyimide Fibers and / or Kevlar Fiber mats and / or ceramic and / or Teflon, or LCP (liquid crystalline polymers liquid crystalline polymers.
  • multilayer printed circuit boards which consist of several, preferably two to six, arranged parallel to each other and superimposed inner layers of the insulating support material, by means of interposed adhesive layers, in
  • a substrate plate can expediently be fastened as a covering substrate plate cover wall 4, so that a cylinder which is open on the end side is formed (FIG. 1 d), wherein further sidewall substrate plates 2 according to FIG. 1 c can also be present in the interior (not shown).
  • a generally closed moldings is constructed, which in addition to a substrate plate bottom wall 1, substrate plate side walls 2 and a substrate plate top wall 4 substrate plate end walls 5 and z.
  • B. cuboid or cube-shaped (Fig. Ie) is.
  • the substrate plate walls 1; 2; 4; 5 each arranged at right angles or parallel to each other. It is within the scope of the invention to use substrate plate walls 1, 2, 4, 5, in particular substrate plate side walls 2 with obtuse or acute angles. to set or zuwinke each other and to attach to each other, from which z.
  • a variety of other configurations can be put together without departing from the spirit of the invention, such as tetrahedra, octahedra, etc.
  • the device Conveniently carries at least one Substratplatten- wall 1; 2; 4; 5 at least one component inside, d. H. the device is on the inside surface of the substrate plate wall 1; 2; 4; 5 attached. Preferably carries at least one wall 1; 2; 4; 5 also at least one component outside.
  • the schematically depicted spatial forms are regular and symmetrical bodies. It is within the scope of the invention, irregular and asymmetrical body of Substratplatten- walls 1; 2; 4; 5 to form, with components inside and preferably also arranged on the outside.
  • the structure of the three-dimensional molded body according to the invention can be achieved by assembling individual substrate plate walls 1; 2; 4; 5 done.
  • the shaped bodies can also be formed from one-piece substrate plates (blanks) by bending on predetermined bending lines.
  • An example shows the Fig. 2.
  • the substrate base plate 6 is bent in such a way that a cube-shaped molded body is created from the substrate base plate 6.
  • Others can use this technology as well one-piece moldings, such as open and closed cylinders are created from appropriate circuit boards.
  • it is thinned out in the region of the bending lines 7 in each case or is partially designed as a flexible strip conductor (rigid-flex design).
  • the circuit carrier structure according to the invention can be designed to save space.
  • the high component density leads in particular in the interior of the body with appropriate use to excessive heating with the known disadvantages such as influencing the life of the components by thermal effects or hot spots.
  • an effective Entracermungsvel with thermal interfaces in the interior of the moldings is provided according to the invention, especially if components with power losses in the interior on the substrate plate walls 1; 2; 4; 5 of the moldings are arranged.
  • the invention provides to fill the free space 3 of the moldings with a heat-conducting, electrically insulating material and this material with at least one with respect to the room molding outside lying active or passive heat sink, for. B. made of metal, for. B. from a metal plate, to contact. It is expedient if the heat sink forms a substrate plate side wall 2 of the room shaped body.
  • Thermally conductive and electrically insulating materials of this type are known in the art as a thermal interface material in different compositions, eg. B. as films, gels, pastes, polymers, silicones or TIM (Thermal Interface Material) known. Likewise, those skilled in the active and passive heat sinks are known.
  • the free spaces 3 which in the outwardly open space moldings, for. B. the examples of FIG. Ia, Ib, Ic between the substrate plate walls 1; 2 are formed.
  • the heat-conducting and electrically insulating material for discharging heat generated by the components is also expediently introduced into these spaces (not shown).
  • the invention provides according to a particular embodiment, in the thermal interface material, a further heat sink z. B. in the form of a passive, thermally conductive body, for. B. metal body, or in the form of an active heat sink (heat pipe) to be arranged, in particular, the metal body is contacted with a provided on a Form redesignwandung heat sink.
  • the two heat sinks may be integrally formed.
  • z. B. working with water cooling heat sink embedded in the thermal interface material heat sink may be sufficient, so that more politicianssenkeanssenen can be omitted.
  • the cuboid 10 has a substrate plate bottom wall or base wall 1, two substrate plate side walls 2, two substrate plate end walls, not shown, and one covering substrate plate. Ceiling wall 4 on.
  • the substrate plate side walls 2 and in particular also the substrate plate end walls bear outside electrical components or components 13 and on the inside electrical components or components 14.
  • the contacting elements such as printed conductors, printed circuit boards, plated-through holes, solder pins, plug-in contacts od. Like. are not shown, so as not to disturb the clarity.
  • the inside components 14 are embedded in a thermal interface material (TIM) 15, which expediently fills the free interior of the cuboid 10.
  • TIM thermal interface material
  • the thermal interface material 15 protrudes as a heat sink, in particular a metallic body 16 which is in communication with the substrate plate top wall 4, wherein the substrate plate top wall 4 is also acting as a heat sink metal plate, which also thermal interface Material 15 contacted electrically conductive.
  • a first embodiment of the invention provides a fixing mechanical so-called toothed corner connection between a first substrate plate wall 11 and a second substrate plate wall 12, in which the substrate plate at the two adjacent edges to be joined.
  • Walls 11; 12 spatially matched to each other, z. B. cuboid prongs or teeth 20, 21 and tooth gaps 20a, 21a are arranged between the teeth.
  • the teeth 20 of the first substrate plate wall 11 z. B. in the tooth gaps 21a of the second substrate plate wall 12 and the teeth 21 of the second Substratplatten- wall 12 in the tooth gaps 20a of the first Substratplatten- wall 11.
  • At least one tooth pair 20, 21 is at least one electrically conductive, for example, by edge metallization deposited metal layer 22 is provided, which provides an electrical connection between the substrate plate walls 11; 12 can produce.
  • edge metallization deposited metal layer 22 is provided, which provides an electrical connection between the substrate plate walls 11; 12 can produce.
  • the metal layer 22 may be unilaterally, multiply or alligitig in the space between the teeth 20; 21 and the tooth spaces 20a; 21a, as FIG. 4 illustrates. It is expedient, in each case a metal layer 22 on opposite flanks of adjacent teeth 20; 21 to arrange and for fixing the two substrate plates 11; 12 to solder the metal layers 22 together, to adhere electrically conductive or together by pressing fit together. In addition, it is expedient, even opposing, non-metallized edges with each other z. B. by gluing or press-fit to connect.
  • Fig. 4a shows various possibilities of metallization on the tooth flanks. Instead of a pictured Fingerzinkung z. As well as a trapezoidal zincation or open zincing can be used.
  • FIG. 4b shows three examples B1, B2 and B3 for the realization of the electrical edge contact between two substrate plate walls 11; 12 using the metal layers 22.
  • the metal layer 22 is on the one hand with an arranged on the second substrate plate wall 12 conductor 23 in electrically conductive connection.
  • an electrical connection to the metal layer 22 is ensured by an electrically conductive, cylindrical, seated in a recess 25 of a tooth 20 of the first substrate plate wall 11 mass 24, which is connected to the metal layer 22 by at least one laser welding point (not shown).
  • the metal layer 22 is connected to an existing on the substrate plate wall 12 conductor 23 in connection, to which an arranged on the substrate plate wall 12 electrical component 28 is connected.
  • Example B3 on the right side of FIG. 4b shows a triangular edge metallization provided on both the tooth 20 of the first substrate plate wall 11 and the tooth space 21a of the second substrate plate wall 12 and an electrical connection between one on the second substrate plate -Wandung 12 arranged conductor 23 and one arranged on the first substrate plate wall 11 conductor 23a ensures, said conductor 23a an arranged on the first substrate plate wall 11 electronic component 28 contacted.
  • Further combinations according to the invention of a fixing mechanical connection with an electrical connection can be seen from the examples B1, B2 and B3 of FIG. 4c, wherein on the left side two embodiments in section (example Bl, B2) and on the right side an embodiment in the view (example B3) are shown.
  • inner layer pads 29 are provided in the second substrate plate wall 12 in the edge region, which are in contact with inner layers of conductor tracks 30 for electrical connections on the second substrate plate wall 12.
  • At least one metallized sleeve 31 expediently opens in a pedestal
  • the embodiment according to example B2 of FIG. 4c corresponds to the embodiment according to example B1, wherein, instead of the inner layer pad, a metal path 34 projects into the sleeve 31, which is contacted with the wire or the bolt or the screw 33.
  • the metal path 34 leads to a conductor track 23 on the second substrate plate wall 12, the conductor track 23 contacting an electrical component 28.
  • the conductor track 23 a on the first substrate plate wall 11 is connected to an electrical component 28.
  • FIG. 4 d shows three examples B 1, B 2, B 3 of electrical angle plug-in connectors, which comprise both the fixing mechanical connection of the substrate plate walls 11; 12 as well as the electrical connection between the substrate plate walls 11; 12 ensure.
  • a kind of connector housing 40 made of insulating material, for. B. plastic, which has a first metallized slot 41 for the first substrate plate wall 11 and at right angles to a second metallized slot 42 for the second Substratplatten- wall 12.
  • the grooves 41, 42 are connected to each other in the interior of the connector housing 40 via an electrical conductor 43.
  • individual metallized plug holes may be provided in the at the edges of the substrate plate walls 11; 12 arranged correspondingly shaped, possibly provided with contacting elements or metallized teeth 20, 21 and projections of the Substratplatten- walls 11; 12 intervene.
  • an angle connector 45 which has plug-in pins 44 which engage in corresponding edges in the region of the substrate plate walls 11; 12 arranged, z. B. metallized plug holes z. B. with press-fit or soldered or welded, with the pins 44, which engage in the first substrate plate wall 11, with the pins 44, which engage in the two substrate plate wall 12, are integrally formed or electrically conductively connected. Also in this embodiment, the angle connector ensures the fixing fixing the substrate plate walls 11; 12 together.
  • Example B3 in Figure 4d shows a mechanical and electrical connection of the two substrate plate walls 11; 12, after which a folding connection 70 is provided.
  • the folding joint 70 comprises substrate sheet material which is thinned, in particular deep-milled or free-milled in this region, or a flexible strip conductor as part of a rigid-flex plate.
  • the circuit base support 50 is plate-shaped and has a carrier plate upper side 51 and a carrier plate underside 52 which is preferably parallel thereto.
  • the circuit base support 50 is, for example, a multilayer printed circuit board (not shown) which consists of several, preferably two to six, inner layers arranged parallel to one another and above one another, which are connected to one another by means of adhesive layers, in particular prepregs, arranged therebetween to a simple circuit board.
  • a multilayer printed circuit board (not shown) which consists of several, preferably two to six, inner layers arranged parallel to one another and above one another, which are connected to one another by means of adhesive layers, in particular prepregs, arranged therebetween to a simple circuit board.
  • the inner layers or the printed circuit board consist of insulating carrier material, preferably of paper fibers impregnated with phenolic resin (FR1 or FR2) and / or of paper fibers (FR3) impregnated with epoxy resin and / or of glass fiber mats (FR4 or FR5) impregnated with epoxy resin and / or of polyamide / polyimide fibers and / or Kevlar fiber mats and / or ceramic and / or Teflon.
  • the prepregs known per se are each a semi-finished product consisting of continuous fibers and an uncured thermoset material. see plastic matrix, wherein the continuous fibers, for example, as knitted fabric or scrim present.
  • the circuit base support 50 on the support plate bottom side 52 and on the support plate top 51 arranged electrical components (not shown).
  • the components are, for example, per se known wired and / or applied by means of thick film technology and / or surface mounted devices (surface mount devices) and / or printed components.
  • the components are in particular ICs (integrated circuits) and / or transistors and / or diodes and / or resistors and / or capacitors.
  • the circuit base carrier 50 has conductor tracks (not shown), which are known per se on the carrier plate underside 52 and / or on the carrier plate top side 51, in the form of metallizations or plated-through vias.
  • the printed conductors and components are preferably also provided on inner layer upper and / or lower sides (not shown) of the circuit substrate 50 parallel to one another and to the upper side 51 of the carrier plate.
  • the circuit base support 50 comprises at least one circuit carrier structure according to the invention, e.g. in the form of a cuboid 10 as a functional component.
  • SMT Surface-Mounting Technology
  • THT Through Hole Technology
  • FIGS. 5a-c press fit technology
  • the circuit base support 50 running parallelepiped 10 on its bottom wall outside or bottom electrical contact surfaces 53, in particular solder pads in the form of metallization or adhesive pads of conductive adhesive, on and the circuit base support 50 has on its support plate top 51
  • Gegenmas- surfaces 54 in particular solder pads or adhesive pads on (Fig. 5a).
  • the contact surfaces 53 and the mating contact surfaces 54 are each connected by soldering or adhesive technology.
  • BGA ball grid array
  • PGA Pin Grid Array
  • the cuboid 10 within a in the Siegplattenober- or -Schseite 51; 52, in particular a cuboid-shaped recess 58, in particular a trough-like depression, preferably a cutout, to be arranged (FIGS. 6a and 6b).
  • the cuboid 10 is, for example, electrically conductively connected to one of the techniques described above at a bottom 59 of the recess 58 and mechanically driven. nically fixed (Fig. 6a).
  • FIG. 6a Furthermore, according to a preferred embodiment (FIG.
  • the cuboid has additional contact surfaces 53 on the outside at its substrate plate side walls 2, and the circuit base carrier 50 has corresponding mating contact surfaces 54 on side walls 60 of the recess 58.
  • the cuboid 10 is inserted into the recess 58 in such a form-fitting manner that the lateral contact surfaces 53 make contact with the lateral mating contact surfaces 54 and are connected to them, for example, by soldering or adhesively bonding.
  • the cuboid 10 is merely pressed into the recess 58, so that no more solder or adhesive is necessary for secure contact.
  • the cutout 58 can also be a cutout 58 passing through from the carrier plate upper side 51 to the carrier plate lower side 52 (FIG.
  • the cuboid 10 in which the cuboid 10 is received in a form-fitting manner and the, preferably roughened, lateral contact surfaces 53, preferably roughened , side mating contact surfaces 54 or the cuboid 10 may be laterally disposed between a plurality of circuit substrates 50 and contact side contact surfaces of the other circuit substrates with its contact surfaces 53 (not shown).
  • the pressing in of the cuboid 10 causes it to be additionally stabilized laterally and thus withstands mechanical stresses, in particular vibrations, to which the circuit base support 50 is exposed during operation.
  • An advantage of the recess 58 is that more surface, namely additionally the side walls 60, is available for electrical connection.
  • a better heat dissipation from the circuit base support 50 due to the thinning of the circuit substrate 50 in the region of the recess 58 is possible.
  • the circuit base support 50 has four contact rails 61 for the mechanical and electrically conductive connection of the cuboid 10.
  • the elongated contact rails 61 extend perpendicularly to the carrier plate upper side 51 and / or to the carrier plate underside 52 away from these and are mechanically fixed to the support plate top 51 and / or the support plate bottom 52 and electrically connected.
  • the contact rails 61 preferably have an angle profile with two rail legs 62, which enclose an angle of 90 ° with each other. For fixing and contacting the cuboid 10 is inserted into the contact rails 61 such that it is guided with its edge regions between the two rail limbs 62, in particular form-fitting, and is thus mechanically fixed in these.
  • electrical contact surfaces 64 for the electrically conductive connection of the cuboid 10 to the contact rails 61, these also have on their inside guide surfaces 63, so the side surfaces facing the cuboid 10, where the cuboid 10 is guided, electrical contact surfaces 64, in particular solder pads in the form of metallizations or adhesive pads of conductive adhesive (FIGS. 9, 10a, b).
  • the contact surfaces 64 are electrically conductively connected to electrical lines 65, in particular conductor tracks, pins, lead frames (lead frames), metal rails and / or plated-through holes, which run in the interior of the contact rails 61 and lead to further contact surfaces 64 and / or outer conductor tracks 69 ,
  • the cuboid 10 is arranged in the contact rails 61 in such a way that outer corner surfaces of the cuboid 10 (not shown) provided in the edge region contact the contact surfaces 64 of the rails 61 and are connected to them, for example, by soldering or adhesive technology.
  • the cuboid 10 is merely pressed into the contact rails 61 in such a way that no solder or adhesive is required for secure contacting.
  • the corner contact surfaces of the cuboid 10 and the contact surfaces 64 of the contact rails 61 are roughened.
  • a known laminating film which is arranged between the contact rails 61 and the cuboid 10 and is recessed at the areas where the contact surfaces 64 are located ,
  • the contact rails 61 are also preferably made of synthetic material and / or ceramic.
  • the contact rails 61 are e.g. attached directly to the support plate top 51 and / or the support plate bottom 52 and connected electrically conductive or inserted positively into a recess in the support plate top 51 and / or in the support plate bottom 52.
  • the attachment to the carrier plate upper side 51 and / or the carrier plate underside 52 is preferably carried out by means of an electrically conductive binder 66, in particular solder and / or conductive adhesive, e.g. using surface mounting technology.
  • the inserted contact rails 61 have electrical contact surfaces 67 on the outside, in particular solder pads in the form of metallizations or conductor tracks or adhesive pads of conductive adhesive (FIG. 9, 10a, b), which contact the contact surfaces 68 provided in the recess.
  • the contact rails 61 provide a very easy-to-install way of connecting the cuboid 10 to the circuit base support 50. In addition, they can additionally depending on the course of the conductors 65 for electrically conductive and mechanical connection of two substrate plate walls 1; 2; 4; 5 of the cuboid 10 with one another (FIGS. 9, 10, b). Due to the positive guidance of the cuboid 10 in the contact rails 61, it is sufficient if the individual Substratplatten- walls 1; 2; 4; 5 are merely inserted into one another by means of grooves (FIG. 10 a) or only adjoining one another (FIG. 10 b).
  • the contact rails 61 can also be used for other three-dimensional circuit carrier construction.
  • the number of contact rails 61 and the angular orientation of the rail legs 62 to each other only needs to be adapted in each case so that the circuit carrier structure is mounted positively and firmly in the contact rails 61.
  • a high component density is achieved on a space-saving three-dimensional circuit carrier, in particular because the substrate plate walls are equipped both on its inside and on its outside with components.
  • an equal number of two-dimensionally built components can be installed more space saving using the third dimension.
  • the use of a three-dimensional circuit carrier concept can increase the total surface area of the component Integration density can be achieved. This saves total area. The two-sided assembly costs are saved.
  • suitable component arrangement can hot spots in the Geo- metry interior for z. B. active heat dissipation. As a result, other hot spots on the overall circuit carrier structure can be avoided, which has a positive effect on the overall reliability.
  • the circuit base according to the invention is simple in construction and has a high component density due to the highly integrated three-dimensional circuit carrier structures.
  • An inventive three-dimensional circuit carrier structure is a highly integrated functional component, ie a self-contained module on which a specific, well-defined function is realized.
  • the circuit base carrier can be adapted to the respective requirements in a simple manner by standardizing the interfaces by exchanging or omitting individual three-dimensional circuit carrier assemblies.
  • the three-dimensional circuit arrangements are also very flexible, e.g. Substrate plates of various technologies, e.g.
  • PCB Thick-film and printed circuit board technology
  • LTCC low-temperature co-fired ceramic
  • DCB direct copper bonding
  • a three-dimensional circuit arrangement which has at least two of the three-dimensional circuit carrier structures according to the invention as functional components, wherein the circuit carrier structures are electrically conductive and mechanical, in particular by means of surface mounting technology (SMT) and / or throughput.
  • SMT surface mounting technology
  • THT Through-Hole Technology
  • Pressfit technology are interconnected.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

L'invention concerne une structure de porte-circuit électrique tridimensionnelle comportant au moins deux plaques de substrat bidimensionnelles, planes, se trouvant en contact mutuel, présentant des éléments de contact et de préférence pourvues de composants électroniques sur les deux côtés. Les plaques de substrat forment des parois disposées à un angle < 180° l'une par rapport à l'autre de manière à constituer un corps spatial tridimensionnel présentant des espaces libres entre les parois. Ladite structure comporte, à des fins fonctionnelles, des conducteurs électriques guidant le courant d'une paroi vers une paroi adjacente. L'invention concerne également un porte-circuit de base présentant une telle structure de porte-circuit électrique, et une circuiterie tridimensionnelle composée d'au moins deux structures de porte-circuit tridimensionnelles de ce type.
PCT/EP2008/061346 2007-09-28 2008-08-28 Structure de porte-circuit électronique tridimensionnelle, porte-circuit de base présentant la structure de porte-circuit en tant que composant fonctionnel, et circuiterie tridimensionnelle composée d'au moins deux structures de porte-circuit tridimensionnelles de ce type WO2009043649A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007046493A DE102007046493A1 (de) 2007-09-28 2007-09-28 Dreidimensionaler elektronischer Schaltungsträgeraufbau, sowie Schaltungsgrundträger aufweisend den Schaltungsträgeraufbau als Funktionsbauteil und dreidimensionale Schaltungsanordnung bestehend aus zumindest zwei derartigen dreidimensionalen Schaltungsträgeraufbauten
DE102007046493.4 2007-09-28

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WO2009043649A2 true WO2009043649A2 (fr) 2009-04-09
WO2009043649A3 WO2009043649A3 (fr) 2009-10-29

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JP7057957B1 (ja) 2021-07-12 2022-04-21 太陽インキ製造株式会社 接続型立体成型回路部品及び回路接続構造
US20220322532A1 (en) * 2021-04-05 2022-10-06 Indiana Integrated Circuits, LLC Three-Dimensional Printed Circuit Substrate Assembly
CN115413115A (zh) * 2022-09-27 2022-11-29 荣成歌尔微电子有限公司 封装结构、封装结构的制备方法及电子产品

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KR102337901B1 (ko) 2018-08-28 2021-12-08 주식회사 엘지에너지솔루션 인쇄회로기판 어셈블리 및 그것을 제조하는 제조방법
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RU2688581C1 (ru) * 2018-06-18 2019-05-21 Юрий Борисович Соколов Способ изготовления трехмерного электронного модуля с высокой плотностью размещения компонентов и устройство
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US20220322532A1 (en) * 2021-04-05 2022-10-06 Indiana Integrated Circuits, LLC Three-Dimensional Printed Circuit Substrate Assembly
JP7057957B1 (ja) 2021-07-12 2022-04-21 太陽インキ製造株式会社 接続型立体成型回路部品及び回路接続構造
JP2023011455A (ja) * 2021-07-12 2023-01-24 太陽インキ製造株式会社 接続型立体成型回路部品及び回路接続構造
CN115413115A (zh) * 2022-09-27 2022-11-29 荣成歌尔微电子有限公司 封装结构、封装结构的制备方法及电子产品

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