WO2010060420A1 - Lampe optoélectronique - Google Patents

Lampe optoélectronique Download PDF

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Publication number
WO2010060420A1
WO2010060420A1 PCT/DE2009/001696 DE2009001696W WO2010060420A1 WO 2010060420 A1 WO2010060420 A1 WO 2010060420A1 DE 2009001696 W DE2009001696 W DE 2009001696W WO 2010060420 A1 WO2010060420 A1 WO 2010060420A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
electrical connection
lamp according
electrical
Prior art date
Application number
PCT/DE2009/001696
Other languages
German (de)
English (en)
Inventor
Kurt-Jürgen Lang
Hagen Luckner
Original Assignee
Osram Opto Semiconductors Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors Gmbh filed Critical Osram Opto Semiconductors Gmbh
Publication of WO2010060420A1 publication Critical patent/WO2010060420A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/048—Second PCB mounted on first PCB by inserting in window or holes of the first PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10113—Lamp

Definitions

  • the present application relates to an optoelectronic lamp having at least one LED chip.
  • optoelectronic modules are disclosed in which an optoelectronic component is arranged with a plurality of LED chips on a module carrier.
  • a mating connector can be mounted next to the optoelectronic component with which the optoelectronic module can be electrically connected by means of a suitable electrical connector.
  • An opto-electronic lamp is provided with an LED unit and an electrical connection unit connected to the LED unit.
  • the LED unit has a carrier plate and on a front side of the carrier plate at least a first electrical pad and at least one LED chip or at least two LED chips on.
  • the electrical connection unit has a printed circuit board which comprises at least one second electrical connection area on a rear side and at least one conductor track connected in an electrically conductive manner to the second electrical connection area.
  • the circuit board is applied with its rear side on the front side of the support plate of the LED unit such that the first and the second electrical connection surface overlap laterally, wherein the first and the second electrical connection surface are electrically conductively and mechanically interconnected by means of an electrically conductive connection means.
  • the structure of the optoelectronic lamp with an LED unit and an electrical connection unit with a printed circuit board offers a variety of design options for the lamp, which can be implemented in a technically simple manner.
  • the LED unit can advantageously be standardized and used in combination with the electrical connection unit for a variety of differently designed optoelectronic lamps.
  • the printed circuit board of the electrical connection unit can be produced particularly inexpensively. While the support plate of LED units often has properties such as high thermal conductivity, which is why the choice of usable materials is relatively limited, the electrical connection unit and in particular its printed circuit board, regardless of the LED unit with inexpensive standard materials are produced, for which the material restriction of the support plate of the LED unit is not necessarily valid.
  • the printed circuit board has at least one mounting region for an electrical component.
  • a plurality of mounting areas for a plurality of electrical components on the printed circuit board can be realized in a technically simple manner.
  • the printed circuit board has 2, 3, 4 or 5 of such mounting areas.
  • the circuit board of the electrical connection unit can in principle be designed so that it is provided for a plurality of different optoelectronic lamps with a different number and / or with a different type of electrical components.
  • the terminal unit according to a further embodiment, at least one element from the group consisting of Codierbauelement, mating connector for an electrical connector, electrical resistance and temperature sensor, which is applied to the circuit board.
  • a coding component is a component which carries electronically readable information regarding at least one detail of the optoelectronic lamp and / or can be implemented or input into the electronically readable information with respect to at least one detail of the optoelectronic lamp.
  • the optoelectronic lamp is the with the second electrical connection surface electrically conductive interconnect either completely formed on a front side opposite the back of the circuit board or arranged.
  • it has at least one partial section which is formed or arranged on the rear side of the printed circuit board.
  • at least one partial section of the conductor track is formed on the same side of the optoelectronic lamp on which the at least one LED chip is also arranged.
  • the conductor track or the subsection of the conductor track is thereby particularly easily accessible in many applications and embodiments of the optoelectronic lamp.
  • a further embodiment of the optoelectronic lamp provides that the second electrical connection area adjoins at least one opening which extends through the circuit board.
  • a thermal or electrical accessibility of the second electrical connection area can advantageously be improved from a front side of the circuit board.
  • the at least one breakthrough is enclosed in plan view of the circuit board, for example, by an outer contour of the second electrical connection surface.
  • the breakthrough can be filled in particular with the electrically conductive connection means.
  • the electrical connection unit has an electrical through-connection from the second electrical connection surface to a front side opposite the rear side.
  • the via extends through the aperture adjacent the second electrical pad.
  • a further embodiment additionally or alternatively provides that the electrically conductive connection means extends from the first electrical connection surface of the LED unit into the opening of the printed circuit board of the electrical connection unit.
  • the second electrical connection surface adjoins at least two, at least four, at least eight or at least twelve openings, which each extend through the printed circuit board.
  • Each of the apertures extends according to an embodiment, in particular vertically through the circuit board.
  • a vertical direction is to be understood as meaning a direction which runs perpendicular to a main extension plane of the carrier plate and / or the printed circuit board.
  • a lateral direction is to be understood as a direction which runs parallel to a main extension plane of the carrier plate and / or the printed circuit board.
  • each extending through an aperture and leading from the second electrical pad to the front of the printed circuit board there may be a plurality of electrical feedthroughs each extending through an aperture and leading from the second electrical pad to the front of the printed circuit board.
  • at least one of Breakthroughs or multiple breakthroughs can also be free of material of an electrical feedthrough.
  • the electrically conductive connection means extends into a plurality of openings. Again, it is not essential that the connecting means extends into each opening. At least one of the apertures or more of the apertures may be free of the connecting means. However, it may be expedient that all openings are partially filled by the electrically conductive connection means.
  • the at least one breakthrough or the plurality of openings is completely filled with material of an electrical feedthrough, at least in one subsection.
  • the breakthrough is clogged or closed by material of the electrical feedthrough.
  • the opening has a volume which is continuous from the front side to the rear side of the printed circuit board and which is free of material of the electrical feedthrough.
  • the electrically conductive connection means does not apply as a material of the electrical feedthrough.
  • the circuit board of the electrical connection unit has a recess which overlaps laterally with the LED chip.
  • the recess overlaps with at least part of the LED chips or with all the LED chips of the LED unit.
  • a recess is to be understood as meaning a region which is free of material of the printed circuit board and laterally adjoins material of the printed circuit board on at least two sides.
  • the recess laterally adjoins at least three sides of material of the printed circuit board or the recess is completely surrounded laterally by the material of the printed circuit board.
  • two of these sides are opposite each other with respect to the recess.
  • the third side may connect the two opposite sides with each other.
  • the recess extends in particular through the entire thickness of the circuit board.
  • the largest possible lateral overlap between the printed circuit board of the electrical connection unit and the carrier plate of the LED unit can be realized by the recess, without the LED chip (s) being covered by the printed circuit board.
  • the printed circuit board of the electrical connection unit has a part which overlaps vertically with the carrier plate of the LED unit.
  • the circuit board may in particular be designed such that it surrounds or framed the LED unit laterally. Such a LED unit laterally encompassing or framing part can be used to align the LED unit in a technically simple manner to the electrical connection unit.
  • circuit board in the region of the second electrical Pad has a thickness which is less than its maximum thickness.
  • the printed circuit board is thinner, at least in the area of the electrical connection area, than in other areas, for example 0.5 times as thick as the maximum thickness or thinner. This can be advantageous, inter alia, for a thermal and / or electrical accessibility of the second electrical connection surface from a front side of the printed circuit board.
  • the printed circuit board has a printed circuit board substrate which contains at least two interconnected substrate layers.
  • the circuit board can be designed in a technically simple manner such that a part of one of the substrate layers laterally protrudes from the other substrate layer.
  • the circuit board can be formed in a technically simple manner with areas of maximum thickness and areas of lesser thickness.
  • the printed circuit board overlaps laterally with the LED unit only with a part of the layers of the printed circuit substrate.
  • the other part of the layers is arranged laterally next to the LED unit.
  • a substrate layer overlaps with the LED unit in plan view of the printed circuit board, while a further substrate layer laterally surrounds the LED unit at least in places, without overlapping with the LED unit.
  • a further embodiment of the lamp provides that the LED unit has at least one adjusting element, which cooperates with an adjusting element of the connecting unit, which can also be referred to as a connecting unit.
  • One of the adjustment elements is a recess, a depression or a breakthrough, which is formed in the LED unit or in the connection unit.
  • the recess the recess or the opening into a projection of the other adjusting element extends.
  • the projection may protrude laterally or vertically from a part of the LED unit or the terminal unit.
  • a rear side of the carrier plate of the LED unit which is opposite the front side of the carrier plate, is formed over the whole area or with a large part of its surface as a thermal connection area of the LED unit.
  • the thermal connection surface is formed by a thermally highly conductive material - for example, a metal and / or a ceramic material - and in particular free of electrically insulating material, such as plastic.
  • the optoelectronic lamp is a lamp for a headlight, in particular for a motor vehicle headlight.
  • the lamp can basically also be used for applications such as the backlighting of an optical conductor.
  • a further embodiment provides that the printed circuit board of the electrical connection unit has on its front side a metallization which overlaps laterally with the second electrical connection surface.
  • the metallization has an extension that is significantly larger as the width of an electrical conductor layer or conductor track of the printed circuit board.
  • the metallization has a lateral extension that is at least twice or at least three times as large as a width of a conductor layer of the printed circuit board.
  • An additional embodiment of the lamp comprises two or more separate LED units, which are connected to the electrical connection unit, in particular are mechanically stable and electrically conductively connected.
  • FIG. 1 shows a perspective front view of the optoelectronic lamp according to an embodiment
  • Figure 2 is a perspective rear view of the optoelectronic lamp shown in Figure 1;
  • Figure 3 is a perspective front sectional view of a portion of the optoelectronic lamp shown in Figure 1;
  • Figure 4 is a plan view of the front of the electrical connection unit of the optoelectronic lamp shown in Figure 1;
  • Figure 5 is a rear plan view of the electrical connection unit shown in Figure 4;
  • Figure 6 is a front plan view of the LED unit of the optoelectronic lamp shown in Figure 1;
  • Figure 7 is a rear plan view of the LED unit of the optoelectronic lamp shown in Figure 1;
  • Figure 8 is a front plan view of an electrical connection unit according to a second embodiment
  • Figure 9 is a rear plan view of the electrical connection unit shown in Figure 8.
  • Figure 10 is a front plan view of an LED unit for use with the electrical connection unit shown in Figures 8 and 9.
  • the optoelectronic lamp shown in FIG. 1 has an LED unit 1 and an electrical connection unit 5.
  • the LED unit 1 has, for example, four LED chips 4, which are applied to a front side of a support plate 2 of the LED unit.
  • a chip carrier 41 is arranged between the LED chips 4 and the carrier plate 2, see FIG. 3 or FIG. 6.
  • the LED chips 4 are laterally surrounded, for example, by a chip frame 42, see FIG. 3 or FIG.
  • the LED chips are arranged along a line, for example along a straight line.
  • the chips could, for example, a compact arrangement with two Lines and two columns can be arranged.
  • more than four chips could be included in the LED unit 1.
  • only one LED chip can be contained in an LED unit.
  • the support plate 2 of the LED unit has, for example, a metal plate.
  • the carrier plate 2 is, for example, a metal core board. It has mounting holes 21.
  • mounting holes 21 For example, four mounting holes 21 are present, of which two are the same size.
  • the mounting holes 21 are adapted to mount the optoelectronic lamp.
  • the optoelectronic lamp can be screwed by means of at least two of the mounting holes 21 to a thermally highly conductive material.
  • the side facing away from the LED chips 4 side of the support plate 2 is the back of the support plate and the LED unit 1.
  • the surface of the back of the support plate 2 is formed for example by a metal of the support plate and forms a thermal connection surface of the LED unit and the optoelectronic Lamp for heat dissipation of the heat generated by the LED chips 4 during their operation.
  • the LED unit 1 can be firmly connected and mounted on a heat sink in a technically simple and efficient manner.
  • the electrical connection unit 5 has a printed circuit board 6.
  • the printed circuit board 6 is applied with its rear side on the LED unit 1. It covers only a part of the LED unit 1.
  • the electromagnetic Radiation of the LED chips during their operation without hindrance be emitted through the circuit board 5.
  • the mounting holes 21 are still freely accessible even when the LED unit 1 is firmly connected to the electrical connection unit 5.
  • the printed circuit board 6 of the electrical connection unit 5 has a plurality of electrical connection surfaces 71, 72, 73, 74 on its rear side.
  • the electrical connection unit 5 is applied to the LED unit 1 in such a way that the second electrical connection surfaces
  • the second electrical connection surfaces 71, 72, 73, 74 of the electrical connection unit and the first electrical connection surfaces 31, 32, 33, 34 of the LED unit 1 are electrically conductively and mechanically connected to one another by means of an electrically conductive connection means 79, see FIG electrically conductive connection means 79 is for example a solder or an electrically conductive adhesive or it has at least one of these means.
  • the reference numerals of the pairs of first and second electrical pads electrically conductively and mechanically connected to each other are 31 and 71, 32 and
  • the second electrical connection surfaces 71, 72, 73, 74 of the electrical connection unit 5 respectively adjoin a plurality of openings 9.
  • the printed circuit board 6 has a plurality of apertures 9 which extend through the printed circuit board and which terminate on the back in each case in a region of the second electrical connection surfaces 71, 72, 73, 74, so that their rear ends laterally from Surrounded material of the second electrical connection surfaces, in particular are enclosed.
  • the openings 9 have, for example, inner walls, which are covered with electrically conductive material.
  • the electrically conductive material connects the second electrical connection surfaces 71, 72, 73, 74 in an electrically conductive manner to metallizations 75, 76, 77, 78, which are arranged on the front side of the circuit board 6 with respect to the second electrical connection surfaces 71, 72, 73, 74.
  • the metallizations overlap laterally with the second electrical pads.
  • the openings 9 may also be filled, for example, completely with electrically conductive material of electrical feedthroughs. Preferably, however, remains in the openings 9 in addition to the material for the electrical feedthroughs still a volume into which the electrically conductive connecting means 79 extends. See the sectional view of Figure 3, in which the electrically conductive connecting means 79th is shown as an example in one of the visible openings 9.
  • the second electrical connection surfaces 71, 72, 73, 74 and the opposing metallizations 75, 76, 77, 78 are not only electrically conductive, but also thermally well connected to one another.
  • a .Hergoris vide for the optoelectronic device can advantageously a solder for connecting the second. electrical pads and the metallizations are used.
  • solder can in each case be arranged between one of the second electrical connection surfaces 71, 72, 73, 74 and the first electrical connection surfaces 31, 32, 33, 34 of the LED unit 1.
  • Soldering can be effected from the front side of the printed circuit board by, for example, pressing a soldering punch onto the metallizations 75, 76, 77, 78, from which the heat flows through the electrical plated-through holes of the openings to the second electrical connection surfaces 71, 72, 73 , 74 extends and thus the solder melts efficiently.
  • a soldering method e.g. a soldering process such as so-called reflow soldering or remelting soldering.
  • a soldering iron or a soldering punch can be used.
  • a laser soldering method usable in which the solder is melted by means of a laser beam.
  • the metallizations 75, 16, 77, 78 are respectively indirectly or directly electrically conductively connected to at least one conductor track 81, 82, 83, 84 of the printed circuit board 6.
  • the conductor tracks are preferably arranged on the front side of the printed circuit board 6.
  • the conductor tracks could be e.g. be electrically connected directly to the second electrical connection surfaces 71, 72, 73, 74.
  • the printed circuit board 6 also has, for example, a first and a second mounting region 11, 12 for an electrical component.
  • the first mounting area 11 has two electrical mounting surfaces 111, 112.
  • the second mounting portion 12 has electrical mounting surfaces 121, 122.
  • the printed circuit board comprises e.g. a mounting portion for a mating connector, which is suitable for electrically connecting the printed circuit board and thus the optoelectronic lamp by means of a suitable plug.
  • optoelectronic lamp electrical components 13 and a mating connector 14 are mounted on the circuit board 6.
  • electrical Components are, for example, electrical resistors and / or varistors. They serve, for example, for the electrical control of the LED chips 4.
  • the circuit board 6 may also be equipped with different types of electrical components, for example with a temperature sensor.
  • a coding component 16 is additionally arranged on the electrical connection unit, for example.
  • the use of at least one coding resistor or several coding resistors or, for example, the use of an RFID element is suitable as a coding component.
  • RFID stands for "radio frequency identification” in English, which in German means “identification by means of electromagnetic waves with radio frequency”. Coding elements do not necessarily have to be electrically connected to conductor tracks of the printed circuit board 6.
  • the coding element 16 shown in Figure 1 is e.g. around an RFID element.
  • the LED chips 4 are interconnected, for example, in series with one another and can be electrically connected via the electrical connection surfaces 43, 44, which are applied to the chip carrier 41, for example.
  • the electrical connection surfaces 43, 44 are electrically conductively connected to the electrically conductive connection of the LED chips 4 with strip conductors 35, 36 which are formed on the carrier plate 2, for example by means of an electrically conductive adhesive or a solder.
  • the interconnects are in turn electrically conductive with each two first electrical pads 31, 32, 33, 34 of the LED unit 1 connected.
  • the conductor tracks 35, 36 of the support plate 2 are electrically insulated from the metal plate of the support plate and thus also electrically isolated from each other, for example by means of a plastic or by means of a paint.
  • the LED chips 4 do not have to be connected in series. At least some of the chips can also be connected in parallel. For example, it is possible to interconnect only half of the chips in series with one another and to electrically connect these halves of the chips independently of one another or together in parallel. It is also possible that all LED chips 4 are connected in parallel with each other.
  • the LED chips are conventional light-emitting diode chips.
  • the LED chips 4 are not limited to light emitting diodes that emit visible electromagnetic radiation. Instead, the LED chips can also emit invisible electromagnetic radiation, for example ultraviolet light or infrared radiation. Such LED chips are basically known to the person skilled in the art.
  • the LED chips can be provided with a luminescence conversion material which has at least one phosphor.
  • the phosphor is capable of being excited by the electromagnetic radiation emitted by the LED chip 4 and of converting this electromagnetic radiation into radiation of a higher wavelength.
  • the printed circuit board 6 has a printed circuit board substrate which has a thickness in a region around the recess 63 which is less than its maximum thickness. With this region of lesser thickness, the printed circuit board is located, for example, on the LED unit 1, that is, with this thin region, the printed circuit board 6 overlaps laterally with the LED unit 1.
  • the second electrical connection surfaces 71, 72, 73, 74 of the electrical connection unit 5 and the metallizations 75, 76, 77, 78 and the openings 9 are formed in the thin region of the printed circuit board.
  • a recess in the circuit board 6 is formed by the thinner portion of the circuit board, so that the circuit board is partially slipped over the support plate 2 of the LED unit 1.
  • the areas of the circuit board 6 with maximum thickness thus overlap vertically with the LED unit 1 or with the support plate 2 of the LED unit 1.
  • the printed circuit board substrate of the printed circuit board 6 has, for example, a first substrate layer 61 and a second substrate layer 62, which are connected to one another. In principle, further substrate layers may be present.
  • Such a multi-layered structure of the printed circuit board substrate allows a technically simple production of the printed circuit board 6 with thinner and thicker areas.
  • the printed circuit board 6 in the region in which it overlaps laterally with the carrier plate 2 of the LED unit 1 is free of one of the substrate layers, for example free of the second substrate layer 62. In this region, for example, it has only the first substrate layer 61 ,
  • the first substrate layer 61 may be at least half as thick as the second substrate layer 62. In one embodiment, the first substrate layer 61 is significantly thinner than the second substrate layer 62. For example, the first substrate layer 61 is at most half as thick as the second substrate layer 62. Generally the thickness in the areas of the circuit board 6 that laterally overlap with the LED unit 1, for example 0.5 times the maximum thickness of the circuit board or less, 0.4 times the maximum thickness of the circuit board or less, or the 0 , 3 times the maximum thickness of the circuit board or less.
  • Suitable materials for the printed circuit substrate are, for example, plastic or resin-based materials reinforced with glass fibers.
  • the printed circuit board substrate comprises glass-fiber-reinforced epoxy resin or consists of glass-fiber-reinforced epoxy resin, for example a material known by the name "FR4".
  • FR4 glass-fiber-reinforced epoxy resin
  • other materials for the printed circuit board substrate are conceivable, for example paper laminate.
  • the printed circuit board 6 may also have an integrally formed printed circuit board substrate. In this case, areas of lesser thickness may be produced by ablation of material, for example by etching. Alternatively, however, it is also possible that the printed circuit board, for example has a substantially constant thickness, without thinner areas.
  • LED units are, for example, each electrically conductively and mechanically connected to a single electrical connection unit and thus integrated in a single lamp.
  • FIGS. 8 and 9 show an exemplary electrical connection unit 5, in which the circuit board 6 has a recess 63 which is open to one side. That is, the recess does not laterally abut the material of the printed circuit board 6 on one side. Instead, the recess 63 is surrounded only on three sides laterally from the material of the circuit board.
  • the circuit board 6 for example, two adjusting elements 64, 65.
  • the adjusting elements 64, 65 of the printed circuit board are formed in the form of projections which, for example, have a triangular shape. However, they can also have any other shape, for example a rectangular shape.
  • the LED unit 1 which is shown in FIG. 10, has, for example, two adjusting elements 22, 23, which are designed as counterparts for the adjusting elements 64, 65 of the printed circuit board. They are formed for example in the form of recesses or depressions, which are shaped and positioned so that the adjusting elements 64, 65 of the circuit board can engage in this.
  • the adjusting elements 64, 65, 22, 23 of the circuit board and the support plate allow a technically simple and precise alignment of the LED unit 1 and the electrical connection unit 5 to each other.
  • the adjustment elements 64, 65 of the printed circuit board 6 have a substantially lateral main extension direction. However, it is also possible for them to be a substantially vertical one
  • Have main extension direction may be formed in the form of mounting pins which engage in recesses or holes of the LED unit 1.
  • the adjusting elements are designed in the form of projections in the LED unit 1 and the counterparts of the adjusting elements in the form of recesses, recesses or holes in the printed circuit board 6 are formed.
  • the electrical connection unit 5 can be generally used e.g. Also positioning and / or fasteners for optics that can be applied to the lamp have.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

L'invention concerne une lampe optoélectronique comportant une unité DEL et une unité de raccordement électrique reliée à l'unité DEL. L'unité DEL comporte une plaque support et, sur une face avant de la plaque support, au moins une première surface de raccordement électrique et au moins une puce DEL. L'unité de raccordement électrique présente une carte de circuit imprimé qui comporte au moins une deuxième surface de raccordement électrique sur la face arrière et au moins une piste électriquement conductrice reliée à la deuxième surface de raccordement électrique.
PCT/DE2009/001696 2008-11-28 2009-11-26 Lampe optoélectronique WO2010060420A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008059468.7 2008-11-28
DE102008059468A DE102008059468A1 (de) 2008-11-28 2008-11-28 Optoelektronische Lampe

Publications (1)

Publication Number Publication Date
WO2010060420A1 true WO2010060420A1 (fr) 2010-06-03

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2009/001696 WO2010060420A1 (fr) 2008-11-28 2009-11-26 Lampe optoélectronique

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DE (1) DE102008059468A1 (fr)
WO (1) WO2010060420A1 (fr)

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EP2441619A1 (fr) * 2010-10-15 2012-04-18 Automotive Lighting Reutlingen GmbH Dispositif d'éclairage pour un véhicule automobile
WO2012147005A1 (fr) * 2011-04-26 2012-11-01 Koninklijke Philips Electronics N.V. Connecteur pourvu d'une structure de protection contre les surtensions
WO2013017984A1 (fr) * 2011-08-02 2013-02-07 Koninklijke Philips Electronics N.V. Partie d'adaptation d'ensemble d'éclairage modulaire
WO2013131854A1 (fr) * 2012-03-05 2013-09-12 Osram Opto Semiconductors Gmbh Module optoélectronique et procédé de fabrication d'un module optoélectronique
WO2017016863A1 (fr) * 2015-07-29 2017-02-02 Tridonic Jennersdorf Gmbh Module à del intégré avec substrat ims
US10670250B2 (en) 2017-12-22 2020-06-02 Lumileds Llc Chip-on-board modular lighting system and method of manufacture
WO2021108463A1 (fr) * 2019-11-25 2021-06-03 Electronic Theatre Controls, Inc. Ouverture de module lumineux pour intégration de carte de circuit imprimé

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