WO2010060420A1

WO2010060420A1 - Optoelectronic lamp

Info

Publication number: WO2010060420A1
Application number: PCT/DE2009/001696
Authority: WO
Inventors: Kurt-Jürgen Lang; Hagen Luckner
Original assignee: Osram Opto Semiconductors Gmbh
Priority date: 2008-11-28
Filing date: 2009-11-26
Publication date: 2010-06-03
Also published as: DE102008059468A1

Abstract

An optoelectronic lamp is disclosed that comprises an LED unit and an electrical connecting unit which is connected to the LED unit. The LED unit has a support plate as well as at least one electrical connecting surface and at least one LED chip on a front side of the support plate. The electrical connecting unit has a printed circuit board which encompasses at least one second electrical connecting surface on a rear side and at least one strip conductor that is connected in an electrically conducting manner to the second electrical connecting surface.

Description

description

Optoelectronic lamp

This patent application claims the priority of German Patent Application 102008059468.7, the disclosure of which is hereby incorporated by reference.

The present application relates to an optoelectronic lamp having at least one LED chip.

In WO 2006/012842 optoelectronic modules are disclosed in which an optoelectronic component is arranged with a plurality of LED chips on a module carrier. On the module carrier, for example, a mating connector can be mounted next to the optoelectronic component with which the optoelectronic module can be electrically connected by means of a suitable electrical connector.

It is an object to provide an optoelectronic lamp which can be realized cost-effectively, which offers more possibilities, technically simpler and more cost-effective, with regard to the design of details and the implementation of possible additional functions than comparable conventional optoelectronic lamps.

An opto-electronic lamp is provided with an LED unit and an electrical connection unit connected to the LED unit.

The LED unit has a carrier plate and on a front side of the carrier plate at least a first electrical pad and at least one LED chip or at least two LED chips on.

The electrical connection unit has a printed circuit board which comprises at least one second electrical connection area on a rear side and at least one conductor track connected in an electrically conductive manner to the second electrical connection area.

The circuit board is applied with its rear side on the front side of the support plate of the LED unit such that the first and the second electrical connection surface overlap laterally, wherein the first and the second electrical connection surface are electrically conductively and mechanically interconnected by means of an electrically conductive connection means.

The structure of the optoelectronic lamp with an LED unit and an electrical connection unit with a printed circuit board offers a variety of design options for the lamp, which can be implemented in a technically simple manner. The LED unit can advantageously be standardized and used in combination with the electrical connection unit for a variety of differently designed optoelectronic lamps.

The printed circuit board of the electrical connection unit can be produced particularly inexpensively. While the support plate of LED units often has properties such as high thermal conductivity, which is why the choice of usable materials is relatively limited, the electrical connection unit and in particular its printed circuit board, regardless of the LED unit with inexpensive standard materials are produced, for which the material restriction of the support plate of the LED unit is not necessarily valid.

According to one embodiment, the printed circuit board has at least one mounting region for an electrical component. In particular, a plurality of mounting areas for a plurality of electrical components on the printed circuit board can be realized in a technically simple manner. For example, the printed circuit board has 2, 3, 4 or 5 of such mounting areas. In this case, in the case of the optoelectronic lamp, not every one of the mounting areas actually has to be provided with an electrical component. The circuit board of the electrical connection unit can in principle be designed so that it is provided for a plurality of different optoelectronic lamps with a different number and / or with a different type of electrical components.

Additionally or alternatively, the terminal unit according to a further embodiment, at least one element from the group consisting of Codierbauelement, mating connector for an electrical connector, electrical resistance and temperature sensor, which is applied to the circuit board. A coding component is a component which carries electronically readable information regarding at least one detail of the optoelectronic lamp and / or can be implemented or input into the electronically readable information with respect to at least one detail of the optoelectronic lamp.

In a further embodiment of the optoelectronic lamp is the with the second electrical connection surface electrically conductive interconnect either completely formed on a front side opposite the back of the circuit board or arranged. Alternatively, it has at least one partial section which is formed or arranged on the rear side of the printed circuit board. As a result, at least one partial section of the conductor track is formed on the same side of the optoelectronic lamp on which the at least one LED chip is also arranged. The conductor track or the subsection of the conductor track is thereby particularly easily accessible in many applications and embodiments of the optoelectronic lamp.

A further embodiment of the optoelectronic lamp provides that the second electrical connection area adjoins at least one opening which extends through the circuit board. With such a breakthrough, for example, a thermal or electrical accessibility of the second electrical connection area can advantageously be improved from a front side of the circuit board. The at least one breakthrough is enclosed in plan view of the circuit board, for example, by an outer contour of the second electrical connection surface. The breakthrough can be filled in particular with the electrically conductive connection means.

In one configuration of the optoelectronic lamp, the electrical connection unit has an electrical through-connection from the second electrical connection surface to a front side opposite the rear side. The via extends through the aperture adjacent the second electrical pad. A further embodiment additionally or alternatively provides that the electrically conductive connection means extends from the first electrical connection surface of the LED unit into the opening of the printed circuit board of the electrical connection unit. As a result, in particular, the mechanical connection between the first and the second electrical connection surface and, in addition, also the electrical connection between the connection surfaces can be reinforced and improved.

In a further embodiment, the second electrical connection surface adjoins at least two, at least four, at least eight or at least twelve openings, which each extend through the printed circuit board. Each of the apertures extends according to an embodiment, in particular vertically through the circuit board.

In the context of the present application, a vertical direction is to be understood as meaning a direction which runs perpendicular to a main extension plane of the carrier plate and / or the printed circuit board. Accordingly, a lateral direction is to be understood as a direction which runs parallel to a main extension plane of the carrier plate and / or the printed circuit board.

In the presence of a plurality of apertures, according to one embodiment, there may be a plurality of electrical feedthroughs each extending through an aperture and leading from the second electrical pad to the front of the printed circuit board. In this case, not every breakthrough material must have a via, at least one of Breakthroughs or multiple breakthroughs can also be free of material of an electrical feedthrough. However, it may be appropriate that all openings are provided with material of electrical feedthroughs.

Likewise, according to an additional embodiment, it is possible for a plurality of openings that the electrically conductive connection means extends into a plurality of openings. Again, it is not essential that the connecting means extends into each opening. At least one of the apertures or more of the apertures may be free of the connecting means. However, it may be expedient that all openings are partially filled by the electrically conductive connection means.

In a further embodiment, the at least one breakthrough or the plurality of openings is completely filled with material of an electrical feedthrough, at least in one subsection. In other words, the breakthrough is clogged or closed by material of the electrical feedthrough. Alternatively, it can be advantageously provided that the opening has a volume which is continuous from the front side to the rear side of the printed circuit board and which is free of material of the electrical feedthrough. The electrically conductive connection means does not apply as a material of the electrical feedthrough.

In a further embodiment of the lamp, the circuit board of the electrical connection unit has a recess which overlaps laterally with the LED chip. In the case of multiple LED chips, the recess overlaps with at least part of the LED chips or with all the LED chips of the LED unit. A recess is to be understood as meaning a region which is free of material of the printed circuit board and laterally adjoins material of the printed circuit board on at least two sides. According to one embodiment, the recess laterally adjoins at least three sides of material of the printed circuit board or the recess is completely surrounded laterally by the material of the printed circuit board. In the case that the recess laterally adjoins at least three sides, two of these sides are opposite each other with respect to the recess. For example, the third side may connect the two opposite sides with each other. The recess extends in particular through the entire thickness of the circuit board.

The largest possible lateral overlap between the printed circuit board of the electrical connection unit and the carrier plate of the LED unit can be realized by the recess, without the LED chip (s) being covered by the printed circuit board.

In a further embodiment of the optoelectronic lamp, the printed circuit board of the electrical connection unit has a part which overlaps vertically with the carrier plate of the LED unit. The circuit board may in particular be designed such that it surrounds or framed the LED unit laterally. Such a LED unit laterally encompassing or framing part can be used to align the LED unit in a technically simple manner to the electrical connection unit.

An additional embodiment provides that the circuit board in the region of the second electrical Pad has a thickness which is less than its maximum thickness. In other words, the printed circuit board is thinner, at least in the area of the electrical connection area, than in other areas, for example 0.5 times as thick as the maximum thickness or thinner. This can be advantageous, inter alia, for a thermal and / or electrical accessibility of the second electrical connection surface from a front side of the printed circuit board.

In one embodiment of the optoelectronic lamp, the printed circuit board has a printed circuit board substrate which contains at least two interconnected substrate layers. Thereby, the circuit board can be designed in a technically simple manner such that a part of one of the substrate layers laterally protrudes from the other substrate layer. In other words, the circuit board can be formed in a technically simple manner with areas of maximum thickness and areas of lesser thickness.

In one embodiment of the optoelectronic lamp, the printed circuit board overlaps laterally with the LED unit only with a part of the layers of the printed circuit substrate. The other part of the layers is arranged laterally next to the LED unit. For example, a substrate layer overlaps with the LED unit in plan view of the printed circuit board, while a further substrate layer laterally surrounds the LED unit at least in places, without overlapping with the LED unit.

A further embodiment of the lamp provides that the LED unit has at least one adjusting element, which cooperates with an adjusting element of the connecting unit, which can also be referred to as a connecting unit. One of the adjustment elements is a recess, a depression or a breakthrough, which is formed in the LED unit or in the connection unit. In the recess, the recess or the opening into a projection of the other adjusting element extends. The projection may protrude laterally or vertically from a part of the LED unit or the terminal unit. By means of such adjusting elements, the most accurate possible alignment of the LED unit and the connection unit to each other can be realized in a technically simple manner.

In a further embodiment, a rear side of the carrier plate of the LED unit, which is opposite the front side of the carrier plate, is formed over the whole area or with a large part of its surface as a thermal connection area of the LED unit. The thermal connection surface is formed by a thermally highly conductive material - for example, a metal and / or a ceramic material - and in particular free of electrically insulating material, such as plastic.

In an additional embodiment, the optoelectronic lamp is a lamp for a headlight, in particular for a motor vehicle headlight. In addition or as an alternative, the lamp can basically also be used for applications such as the backlighting of an optical conductor.

A further embodiment provides that the printed circuit board of the electrical connection unit has on its front side a metallization which overlaps laterally with the second electrical connection surface. In particular, the metallization has an extension that is significantly larger as the width of an electrical conductor layer or conductor track of the printed circuit board. For example, the metallization has a lateral extension that is at least twice or at least three times as large as a width of a conductor layer of the printed circuit board.

An additional embodiment of the lamp comprises two or more separate LED units, which are connected to the electrical connection unit, in particular are mechanically stable and electrically conductively connected.

Further advantages, preferred embodiments and further developments of the optoelectronic lamp will become apparent from the embodiments explained below in conjunction with the figures.

Show it:

1 shows a perspective front view of the optoelectronic lamp according to an embodiment;

Figure 2 is a perspective rear view of the optoelectronic lamp shown in Figure 1;

Figure 3 is a perspective front sectional view of a portion of the optoelectronic lamp shown in Figure 1;

Figure 4 is a plan view of the front of the electrical connection unit of the optoelectronic lamp shown in Figure 1; Figure 5 is a rear plan view of the electrical connection unit shown in Figure 4;

Figure 6 is a front plan view of the LED unit of the optoelectronic lamp shown in Figure 1;

Figure 7 is a rear plan view of the LED unit of the optoelectronic lamp shown in Figure 1;

Figure 8 is a front plan view of an electrical connection unit according to a second embodiment;

Figure 9 is a rear plan view of the electrical connection unit shown in Figure 8; and

Figure 10 is a front plan view of an LED unit for use with the electrical connection unit shown in Figures 8 and 9.

The optoelectronic lamp shown in FIG. 1 has an LED unit 1 and an electrical connection unit 5. The LED unit 1 has, for example, four LED chips 4, which are applied to a front side of a support plate 2 of the LED unit. A chip carrier 41 is arranged between the LED chips 4 and the carrier plate 2, see FIG. 3 or FIG. 6. The LED chips 4 are laterally surrounded, for example, by a chip frame 42, see FIG. 3 or FIG.

The LED chips are arranged along a line, for example along a straight line. Instead, the chips could, for example, a compact arrangement with two Lines and two columns can be arranged. In addition, for example, more than four chips could be included in the LED unit 1. Alternatively, only one LED chip can be contained in an LED unit.

The support plate 2 of the LED unit has, for example, a metal plate. The carrier plate 2 is, for example, a metal core board. It has mounting holes 21. For example, four mounting holes 21 are present, of which two are the same size. The mounting holes 21 are adapted to mount the optoelectronic lamp. For example, the optoelectronic lamp can be screwed by means of at least two of the mounting holes 21 to a thermally highly conductive material.

The side facing away from the LED chips 4 side of the support plate 2 is the back of the support plate and the LED unit 1. The surface of the back of the support plate 2 is formed for example by a metal of the support plate and forms a thermal connection surface of the LED unit and the optoelectronic Lamp for heat dissipation of the heat generated by the LED chips 4 during their operation. Thus, the LED unit 1 can be firmly connected and mounted on a heat sink in a technically simple and efficient manner.

The electrical connection unit 5 has a printed circuit board 6. The printed circuit board 6 is applied with its rear side on the LED unit 1. It covers only a part of the LED unit 1. The remaining part of the LED unit 1, which comprises the LED chips 4 and the mounting holes 21, overlaps laterally with a recess 63 of the circuit board 6 of the electrical connection unit 5. Thus, the electromagnetic Radiation of the LED chips during their operation without hindrance be emitted through the circuit board 5. In addition, the mounting holes 21 are still freely accessible even when the LED unit 1 is firmly connected to the electrical connection unit 5.

As shown in the rear-side plan view of the electrical connection unit 5 in FIG. 5, the printed circuit board 6 of the electrical connection unit 5 has a plurality of electrical connection surfaces 71, 72, 73, 74 on its rear side. In the case of the optoelectronic lamp, the electrical connection unit 5 is applied to the LED unit 1 in such a way that the second electrical connection surfaces

71, 72, 73, 74 of the electrical connection unit laterally overlap with first electrical connection surfaces 31, 32, 33, 34 of the LED unit 1. The second electrical connection surfaces 71, 72, 73, 74 of the electrical connection unit and the first electrical connection surfaces 31, 32, 33, 34 of the LED unit 1 are electrically conductively and mechanically connected to one another by means of an electrically conductive connection means 79, see FIG electrically conductive connection means 79 is for example a solder or an electrically conductive adhesive or it has at least one of these means.

The reference numerals of the pairs of first and second electrical pads electrically conductively and mechanically connected to each other are 31 and 71, 32 and

72, 33 and 73 and 34 and 74. Basically, a connection between only a pair of electrical connection pads would be sufficient. The more first electrical connection surfaces 31, 32, 33, 34 of the LED unit 1 are each connected to a second electrical connection surface 71, 72, 73, 74 of the electrical connection unit 5, the stronger and more reliable is the mechanical connection between the LED unit 1 and the electrical connection unit 5.

The second electrical connection surfaces 71, 72, 73, 74 of the electrical connection unit 5 respectively adjoin a plurality of openings 9. In other words, the printed circuit board 6 has a plurality of apertures 9 which extend through the printed circuit board and which terminate on the back in each case in a region of the second electrical connection surfaces 71, 72, 73, 74, so that their rear ends laterally from Surrounded material of the second electrical connection surfaces, in particular are enclosed.

The openings 9 have, for example, inner walls, which are covered with electrically conductive material. The electrically conductive material connects the second electrical connection surfaces 71, 72, 73, 74 in an electrically conductive manner to metallizations 75, 76, 77, 78, which are arranged on the front side of the circuit board 6 with respect to the second electrical connection surfaces 71, 72, 73, 74. The metallizations overlap laterally with the second electrical pads.

Alternatively, the openings 9 may also be filled, for example, completely with electrically conductive material of electrical feedthroughs. Preferably, however, remains in the openings 9 in addition to the material for the electrical feedthroughs still a volume into which the electrically conductive connecting means 79 extends. See the sectional view of Figure 3, in which the electrically conductive connecting means 79th is shown as an example in one of the visible openings 9.

By means of the electrical plated-through holes through the apertures 9, the second electrical connection surfaces 71, 72, 73, 74 and the opposing metallizations 75, 76, 77, 78 are not only electrically conductive, but also thermally well connected to one another. In a .Herstellungsverfahren for the optoelectronic device can advantageously a solder for connecting the second. electrical pads and the metallizations are used.

The solder can in each case be arranged between one of the second electrical connection surfaces 71, 72, 73, 74 and the first electrical connection surfaces 31, 32, 33, 34 of the LED unit 1. Soldering can be effected from the front side of the printed circuit board by, for example, pressing a soldering punch onto the metallizations 75, 76, 77, 78, from which the heat flows through the electrical plated-through holes of the openings to the second electrical connection surfaces 71, 72, 73 , 74 extends and thus the solder melts efficiently. As a soldering method, e.g. a soldering process such as so-called reflow soldering or remelting soldering. For this, e.g. a soldering iron or a soldering punch can be used. Alternatively, e.g. Also, a laser soldering method usable in which the solder is melted by means of a laser beam.

In principle, however, other electrically conductive connecting means can be used as solder. In particular, the use of an electrically conductive adhesive is conceivable. The metallizations 75, 16, 77, 78 are respectively indirectly or directly electrically conductively connected to at least one conductor track 81, 82, 83, 84 of the printed circuit board 6. The conductor tracks are preferably arranged on the front side of the printed circuit board 6.

Alternatively, it is also possible to arrange the conductor tracks on the back of the circuit board. In this case, the tracks could be e.g. be electrically connected directly to the second electrical connection surfaces 71, 72, 73, 74.

As a further alternative, it is possible to form tracks on both the front and on the back of the circuit board. This would further increase the functionality of the circuit board 6 and its uses.

The printed circuit board 6 also has, for example, a first and a second mounting region 11, 12 for an electrical component. The first mounting area 11 has two electrical mounting surfaces 111, 112. Accordingly, for example, the second mounting portion 12 has electrical mounting surfaces 121, 122.

Furthermore, the printed circuit board comprises e.g. a mounting portion for a mating connector, which is suitable for electrically connecting the printed circuit board and thus the optoelectronic lamp by means of a suitable plug.

In the illustrated in Figure 1 optoelectronic lamp electrical components 13 and a mating connector 14 are mounted on the circuit board 6. In the electrical Components are, for example, electrical resistors and / or varistors. They serve, for example, for the electrical control of the LED chips 4. Additionally or alternatively, the circuit board 6 may also be equipped with different types of electrical components, for example with a temperature sensor.

In the case of the optoelectronic lamp illustrated in FIG. 1, a coding component 16 is additionally arranged on the electrical connection unit, for example. In principle, the use of at least one coding resistor or several coding resistors or, for example, the use of an RFID element is suitable as a coding component. RFID stands for "radio frequency identification" in English, which in German means "identification by means of electromagnetic waves with radio frequency". Coding elements do not necessarily have to be electrically connected to conductor tracks of the printed circuit board 6.

The coding element 16 shown in Figure 1 is e.g. around an RFID element.

In the case of the LED unit 1, the LED chips 4 are interconnected, for example, in series with one another and can be electrically connected via the electrical connection surfaces 43, 44, which are applied to the chip carrier 41, for example. The electrical connection surfaces 43, 44 are electrically conductively connected to the electrically conductive connection of the LED chips 4 with strip conductors 35, 36 which are formed on the carrier plate 2, for example by means of an electrically conductive adhesive or a solder. The interconnects are in turn electrically conductive with each two first electrical pads 31, 32, 33, 34 of the LED unit 1 connected.

The conductor tracks 35, 36 of the support plate 2 are electrically insulated from the metal plate of the support plate and thus also electrically isolated from each other, for example by means of a plastic or by means of a paint.

Of course, the LED chips 4 do not have to be connected in series. At least some of the chips can also be connected in parallel. For example, it is possible to interconnect only half of the chips in series with one another and to electrically connect these halves of the chips independently of one another or together in parallel. It is also possible that all LED chips 4 are connected in parallel with each other.

The LED chips are conventional light-emitting diode chips. The LED chips 4 are not limited to light emitting diodes that emit visible electromagnetic radiation. Instead, the LED chips can also emit invisible electromagnetic radiation, for example ultraviolet light or infrared radiation. Such LED chips are basically known to the person skilled in the art.

The LED chips can be provided with a luminescence conversion material which has at least one phosphor. The phosphor is capable of being excited by the electromagnetic radiation emitted by the LED chip 4 and of converting this electromagnetic radiation into radiation of a higher wavelength. The printed circuit board 6 has a printed circuit board substrate which has a thickness in a region around the recess 63 which is less than its maximum thickness. With this region of lesser thickness, the printed circuit board is located, for example, on the LED unit 1, that is, with this thin region, the printed circuit board 6 overlaps laterally with the LED unit 1.

In particular, the second electrical connection surfaces 71, 72, 73, 74 of the electrical connection unit 5 and the metallizations 75, 76, 77, 78 and the openings 9 are formed in the thin region of the printed circuit board.

As can be seen in the sectional view of Figure 3, a recess in the circuit board 6 is formed by the thinner portion of the circuit board, so that the circuit board is partially slipped over the support plate 2 of the LED unit 1. The areas of the circuit board 6 with maximum thickness thus overlap vertically with the LED unit 1 or with the support plate 2 of the LED unit 1. In this case, any material that is disposed between the LED chips 4 and the support plate 2, such as Chip carrier 41, not counted to the support plate 2.

The printed circuit board substrate of the printed circuit board 6 has, for example, a first substrate layer 61 and a second substrate layer 62, which are connected to one another. In principle, further substrate layers may be present. Such a multi-layered structure of the printed circuit board substrate allows a technically simple production of the printed circuit board 6 with thinner and thicker areas. By way of example, the printed circuit board 6 in the region in which it overlaps laterally with the carrier plate 2 of the LED unit 1 is free of one of the substrate layers, for example free of the second substrate layer 62. In this region, for example, it has only the first substrate layer 61 ,

The first substrate layer 61 may be at least half as thick as the second substrate layer 62. In one embodiment, the first substrate layer 61 is significantly thinner than the second substrate layer 62. For example, the first substrate layer 61 is at most half as thick as the second substrate layer 62. Generally the thickness in the areas of the circuit board 6 that laterally overlap with the LED unit 1, for example 0.5 times the maximum thickness of the circuit board or less, 0.4 times the maximum thickness of the circuit board or less, or the 0 , 3 times the maximum thickness of the circuit board or less.

Suitable materials for the printed circuit substrate are, for example, plastic or resin-based materials reinforced with glass fibers. By way of example, the printed circuit board substrate comprises glass-fiber-reinforced epoxy resin or consists of glass-fiber-reinforced epoxy resin, for example a material known by the name "FR4". Alternatively, other materials for the printed circuit board substrate are conceivable, for example paper laminate.

The printed circuit board 6 may also have an integrally formed printed circuit board substrate. In this case, areas of lesser thickness may be produced by ablation of material, for example by etching. Alternatively, however, it is also possible that the printed circuit board, for example has a substantially constant thickness, without thinner areas.

It is possible, by means of the presented modular construction with an electrical connection unit, to realize an optoelectronic lamp which has at least two or more separate LED units. These LED units are, for example, each electrically conductively and mechanically connected to a single electrical connection unit and thus integrated in a single lamp.

FIGS. 8 and 9 show an exemplary electrical connection unit 5, in which the circuit board 6 has a recess 63 which is open to one side. That is, the recess does not laterally abut the material of the printed circuit board 6 on one side. Instead, the recess 63 is surrounded only on three sides laterally from the material of the circuit board.

On the back, the circuit board 6, for example, two adjusting elements 64, 65. The adjusting elements 64, 65 of the printed circuit board are formed in the form of projections which, for example, have a triangular shape. However, they can also have any other shape, for example a rectangular shape.

The LED unit 1, which is shown in FIG. 10, has, for example, two adjusting elements 22, 23, which are designed as counterparts for the adjusting elements 64, 65 of the printed circuit board. They are formed for example in the form of recesses or depressions, which are shaped and positioned so that the adjusting elements 64, 65 of the circuit board can engage in this. The adjusting elements 64, 65, 22, 23 of the circuit board and the support plate allow a technically simple and precise alignment of the LED unit 1 and the electrical connection unit 5 to each other.

In the illustrated example, the adjustment elements 64, 65 of the printed circuit board 6 have a substantially lateral main extension direction. However, it is also possible for them to be a substantially vertical one

Have main extension direction. For example, they may be formed in the form of mounting pins which engage in recesses or holes of the LED unit 1.

In addition, it is also possible that the adjusting elements are designed in the form of projections in the LED unit 1 and the counterparts of the adjusting elements in the form of recesses, recesses or holes in the printed circuit board 6 are formed.

The electrical connection unit 5 can be generally used e.g. Also positioning and / or fasteners for optics that can be applied to the lamp have.

The invention is not limited by the description of the invention based on the embodiments of these. Rather, the invention encompasses any novel feature as well as any combination of features, including in particular any combination of features in the claims, even if this feature or combination itself is not explicitly stated in the patent claims or exemplary embodiments.

Claims

claims

1. An optoelectronic lamp having an LED unit, which has a carrier plate and on a front side of the carrier plate at least a first electrical connection pad and at least one LED chip, and an electrical connection unit which has a printed circuit board with at least one second electrical connection pad on a back of the Printed circuit board and at least one electrically conductive connected to the second electrical connection surface conductor track, wherein the printed circuit board is applied with its rear side on the front side of the support plate of the LED unit such that the first and the second electrical connection surface overlap laterally; and the first and the second electrical connection surface are electrically conductively and mechanically connected to one another by means of an electrically conductive connection means.

2. Optoelectronic lamp according to the preceding claim, wherein the electrically conductive to the second electrical connection surface connected conductor track is arranged at least in a partial section on a front side of the printed circuit board opposite the rear side.

3. The optoelectronic lamp according to claim 1, wherein the second electrical connection area adjoins at least one opening which extends through the circuit board.

4. An optoelectronic lamp according to claim 3, wherein an electrical through-connection from the second electrical connection pad to one of. Rear side opposite front side of the circuit board is included, which extends through the opening.

5. Opto-electronic lamp according to claim 3 or 4, wherein the electrically conductive connecting means extends from the first electrical connection surface in the breakthrough.

6. Optoelectronic lamp according to one of claims 3 to 5, wherein the second electrical connection surface is adjacent to at least two, at least four, at least eight or at least twelve apertures extending through the printed circuit board.

7. Optoelectronic lamp according to one of the preceding claims, wherein the circuit board of the electrical connection unit has a recess which laterally overlaps with the LED chip.

8. The optoelectronic lamp according to claim 7, wherein the recess is laterally adjacent to at least three sides of material of the printed circuit board or completely laterally surrounded by the material of the printed circuit board.

9. Optoelectronic lamp according to one of the preceding claims, wherein a part of the printed circuit board overlaps vertically with the support plate of the LED unit.

10. Optoelectronic lamp according to one of the preceding claims, wherein the circuit board in the region of the second

■ electrical pad has a thickness that is less than its maximum thickness.

11. Optoelectronic lamp according to one of the preceding claims, wherein the printed circuit board has a printed circuit substrate with at least two interconnected substrate layers.

12. An optoelectronic lamp according to one of the preceding claims, wherein the printed circuit board overlaps laterally with the LED unit only with a part of the layers of the printed circuit substrate.

13. Optoelectronic lamp according to one of the preceding claims, wherein the LED unit has at least one adjusting element which cooperates with an adjusting element of the connection unit, and one of the adjusting elements has a recess, a recess or an opening, in which a projection of the other adjusting element extends ,

-14. Optoelectronic lamp according to one of the preceding claims, wherein the circuit board has at least one mounting region for an electrical component.

15. Optoelectronic lamp according to one of the preceding claims, wherein the connection unit comprises at least one element from the group consisting of Kodierbauelement, mating connector for an electrical connector, electrical resistance and temperature sensor, which is • applied to the circuit board.