EP1946625A1 - Electronic circuit arrangement and method for producing an electronic circuit arrangement - Google Patents

Electronic circuit arrangement and method for producing an electronic circuit arrangement

Info

Publication number
EP1946625A1
EP1946625A1 EP20060807009 EP06807009A EP1946625A1 EP 1946625 A1 EP1946625 A1 EP 1946625A1 EP 20060807009 EP20060807009 EP 20060807009 EP 06807009 A EP06807009 A EP 06807009A EP 1946625 A1 EP1946625 A1 EP 1946625A1
Authority
EP
Grant status
Application
Patent type
Prior art keywords
circuit
heat sink
carrier
circuit arrangement
arrangement according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP20060807009
Other languages
German (de)
French (fr)
Inventor
Daniela Wolf
Andreas Rekofsky
Robert Ingenbleek
Erik Jung
Alfred Kolb
Roland Schöllhorn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Continental Automotive GmbH
ZF Friedrichshafen AG
Original Assignee
Continental Automotive GmbH
ZF Friedrichshafen AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203Cooling of mounted components
    • H05K1/021Components thermally connected to metal substrates or heat-sinks by insert mounting
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of H01L27/00 - H01L49/00 and H01L51/00, e.g. forming hybrid circuits
    • H01L25/162Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of H01L27/00 - H01L49/00 and H01L51/00, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/142Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554External layer
    • H01L2224/0555Shape
    • H01L2224/05552Shape in top view
    • H01L2224/05554Shape in top view being square
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/4912Layout
    • H01L2224/49175Parallel arrangements
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01079Gold [Au]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701Low temperature co-fired ceramic [LTCC]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/14Integrated circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/141One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/182Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. IMC (insert mounted components)
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/1056Metal over component, i.e. metal plate over component mounted on or embedded in PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621Components characterised by their electrical contacts
    • H05K2201/10674Flip chip
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04Soldering or other types of metallurgic bonding
    • H05K2203/049Wire bonding
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0058Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.

Abstract

The inventive electronic circuit arrangement (10) comprises a heat sink (12) and a first circuit carrier (16) which is thermally coupled to the heat sink (12), lies flat on the latter and is intended to wire electronic components of the circuit arrangement. Provided for at least one electronic component (34-1) is a special arrangement which is associated with a considerably increased heat dissipation capability for the relevant component (34-1) and, in addition, also affords further advantages in connection with changes in the population and/or line routing which might occur in practice. The important factor for this is that the component (34-1) is arranged under a second circuit carrier (18-1) which is held in a recess (24-1) in the first circuit carrier (16), said recess passing through to the top side (14) of the heat sink (12).

Description

An electronic circuit arrangement and method of manufacturing an electronic circuit arrangement

The present invention relates to an electronic sound ¬ processing arrangement and a method for producing an e- lektronischen circuit arrangement, in particular for use in motor vehicle electronics.

It is known in the design of electronic units comprising (etc. z. B. printed circuit board, ceramic, flex foil) forward watch a equipped with at least one electronic component circuit carrier best possible removal of heat, the unavoidable electronic and thermal power loss in the operation of produced components. The heat dissipation prolongs the life of the components and thus he ¬ höht the reliability of the thus formed electric ¬ nikeinrichtungen.

Previous approaches to improve the heat dissipation exist primarily to improve the thermal bonding of the electronic component in its environment, for example by providing Wärmeableitpfaden having high thermal conductivity within a circuit carrier (z. B. "horizontal heat spreading") and / or by the mounting of a specially provided heat sink in good thermal contact with the component.

The known measures to improve the heat dissipation are often associated with considerable effort, particularly if the relevant circuit arrangement produces a very high power loss and / or to operate in an environment with comparatively high ambient temperature, as occurs for example in electronic control units in the field of automotive technology , Such there Einhei ¬ th are increasingly being arranged in the area of vehicle components at elevated temperature, such as engine, gearbox o- brakes. Moreover hinder special Wärmeableitungsmaß ¬ took often a space-saving layout of conductive traces of the circuit board used.

Another disadvantage of known circuit arrangements is their often lack flexibility regarding small ¬ rer changes concerning the placement of electronic and / or the wiring between these components. An example: The circuit board designed for an engine control unit in a motor vehicle and equipped among others with a micro-chip must usually be largely redesigned or redeveloped when the engine control unit for a future series with a modern ¬ ren microcontroller chip to be provided , Over the preceding gangene development effort will be worthless in large part because the former circuit carrier can not be used for the new series.

It is an object of the present invention to eliminate the above-ER-mentioned drawbacks and to provide in particular a elekt ¬ tronic circuit arrangement and a method for manufacturing such a circuit arrangement, in which a good heat dissipation capability with a high degree of flexibility regarding in practice occurring scarf - processing of technical changes can be combined.

This object is achieved by an electronic sound ¬ processing arrangement according to claim 1 and a method for manufacturing development of an electronic circuit arrangement according to claim

Advantageous 15. The dependent claims relate to further ¬ the invention formations.

In the invention, first, to the extent a per se known, cost-effective and with respect to the heat dissipation taken very advantageous concept as a Schaltungsträ ¬ ger (hereinafter referred to as "first circuit carrier") is thermally coupled lying flat with an upper surface of a heat sink.

For at least one electronic component of the circuit ¬ arrangement, however, a special integration or arrangement is provided according to the invention, which is associated with a significantly increased heat dissipation for that Bauele ¬ ment and beyond, surprisingly, other benefits associated with in practice possible occurring provides changes to the placement and / or routing. this is essentially the provision wenigs- least a further circuit carrier, hereinafter also referred to as "second circuit carrier", by means of which an in practice very easily adapted or adaptable assembly electrical contact of the or the respective components is realized. Moreover, the second formwork has tung carrier importance in connection with an optimal

Heat dissipation from the component or components concerned to the heat sink. These advantages are explained in more detail below.

The heat sink z. B. can also form a part of a housing ei ¬ ner respective electronic unit is preferential ¬ made of a material with high thermal conductivity gebil ¬ det (z. B. as a metal plate). For a simple construction of the circuit arrangement, and in particular for a simple and efficient to realize ther ¬ mix coupling between the first circuit substrate and the heat sink, it is convenient if the heat sink has a planar O- berseite. In particular, if the first shawl ¬ tung carrier is plate-shaped with a flat bottom, so the thermal coupling in simp ¬ cher manner, can. accomplish, by the interposition of a heat-conducting film or a thermally conductive adhesive.

At the side remote from the heat sink side of the first circuit substrate in a known manner can be populated with electronic components of the circuit arrangement can be hen provided for, which are corresponding to the electrical layout of circuit traces on and / or electrically connected together in the circuit carrier.

In view of the particularly inte- ressierende in the invention using the circuit arrangement in the region of the motor vehicle electronics and the associated increased requirements for efficient heat dissipation from as many parts is provided in one embodiment that the first circuit carrier is designed as a ceramic or is formed a conventional PCB (= "printed circuit board".

In one embodiment, it is provided that the second circuit carrier is plate-shaped, for example as sentlichen essen- rectangular plate. In a preferred embodiment, the second circuit carrier is designed as a so-called LTCC substrate (LTCC = "low temperature co-fired ceramic").

For a simple electrical connection between the first circuit substrate and the second circuit carrier provided for this purpose the arrangement comprises a bonding wire ¬ arrangement and / or a (z. B. glued) may include, for example printed circuit film. It is favorable in this connection if the electrically to be connected to one another or connected to one another upper-side contact points ( "pads") of the first circuit substrate and second circuit substrate are about the same height. If both the first forming excluded respectively as a flat plate and the second circuit carrier is, this means that the thickness of the second

The circuit carrier is roughly equivalent to the reduced to the corresponding Bauele ¬ ment thick plate thickness of the first Schaltungsträ ¬ gers. In principle, however, it is not out Schlos ¬ sen that the second circuit carrier is thicker or thinner and thus upward out of the recess stands (only partially stabilized in the recess is added) is or lowered in the recess. One then resulting height difference can easily z. B. be bridged by bonding wires.

The intended for receiving the second circuit carrier recess may be provided on the edge of the first circuit carrier, in principle, which can be advantageous in certain cases. In view of a stable as possible arrangement of the second circuit substrate, however, it is generally preferred that the recess is provided in a central region of the first circuit carrier. In the ¬ sem case, a mechanically stable support of the second circuit carrier can often already by a ¬ rings extending around and / or covering the second circuit board electrical connection assembly to ensure or improve further.

In a preferred embodiment, which is arranged between the second circuit substrate and the heat sink e- lectronic component is a bare die (microelectronic component, in particular integrated Schaltungsanord- voltage). This results in a certain amount of space savings and represents ¬ over, a further advantage in terms of dissipation of heat (not above a housing) can be discharged to the heat sink out immediately in this case.

A particularly good thermal coupling between the Bauele ¬ element and the heat sink results, for example when the bottom of the device with the top of the heat sink ¬ is lying flat thermally coupled. Here, that such should not be excluded. As a thin wärmeleiten- de adhesive layer is interposed.

In one embodiment, it is provided that the arranged between the second circuit substrate and the heat sink electronic component is ground on its underside. Such loops can provide a whole series of ADVANTAGES ¬ len, particularly when the underside of the component comes into contact with the upper surface of the heat sink. So thus can first of the heat dissipating path (or an intermediate layer) of the electrically ak ¬ tive portions of the device to the heat sink shortened back and / or the heat transfer resistance between the component and the top of the heat sink ¬ be reduced. Further, thus, the height of the construction ¬ elements are brought to a desired degree, it is to ensure a predetermined height of the composite of the second circuit carrier and the component or to adapt the device thickness to the thickness of one or more further components, the second between the same circuit support and the heat sink are disposed.

In one embodiment, it is provided that the arranged between the second circuit substrate and the heat sink electronic component via a heat-conducting Füllmateri- al, for example, a thermally conductive adhesive layer is coupled to the top of the heat sink. The same Füllma ¬ TERIAL or another filler material may also be USAGE ¬ det, for otherwise air-filled areas of the interim ¬ rule space between the second circuit carrier and the heat mesenke. Aufzu example, in order to increase the heat dissipation capability ¬ fill. Such a filler material such. B. can also have elasti ¬ specific properties, can also improve the vibration resistance in some applications.

The production of a circuit arrangement according to the invention may for example comprise the steps of:

Providing a first composite from a heat sink for dissipating heat and a lying flat thermally coupled to an upper surface of the heat sink first circuit carrier for wiring electronic components of the circuit arrangement, said first circuit substrate has a back through the top of the heat sink recess (The first Schaltungsträ- eng may occur before, during, or fitted by its connection to the heat sink devices. Furthermore, the first circuit substrate may be provided with several such recesses), providing a second composite comprising a second circuit carrier and an electronic component of which component leads with lower-side contact are filters of the second circuit carrier is electrically connected (this may also be a plurality of devices to be connected at the second circuit carrier and / or a plurality of such second networks in the manner ¬ ser prepared are tgestellt)

Inserting the second cluster (or the second networks) in the recess (es) of the first composite, such that the underside of the electronic component in thermi ¬ rule makes contact with the upper surface of the heat sink, z. For example, by surface contact, either directly or indirectly via an intermediate thermally conductive layer (The recess may also be at least partially filled with a good heat conducting material, before the insertion of the second cluster, z. B. a hardenable sealing compound), and

electrically connecting the upper-side contact points of the first circuit substrate with upper-side contact of the ¬ or second circuit carrier.

The circuit arrangement according to the invention ensures a good way, as a more or less direct heat dissipation from the or the contacted on the second circuit board components to the heat sink. With the second Schaltungsträ ¬ ger a so-called disengagement of the construction element can be advantageously connections, which are in direct electrical contact with the lower-side contact points of the second circuit substrate and passing through the second Schaltungsträ ¬ ger to upper-side contact points. Depending on the chosen for the second circuit carrier technology (z. B. LTCC) can further electronic components or electronic functionalities may be integrated on or in said circuit carrier still, for instance for adaptation to a "peripheral electronics" of the first circuit carrier, together with its mounting is formed. Particularly for such an adjustment can also be provided that the second circuit carrier is equipped on its side facing away from the heat sink having at least one component. Such placement z can. B. occur simultaneously with the production of the second composite mentioned above, or even later. Note here is that the Wärmeablei ¬ processing capability is relatively poor for such additional components on the second circuit carrier, so that this mounting point is particularly suitable for components which produce a much lower thermal loss Leis ¬ tung than or the second under the circuit carrier arranged components.

Advantageously, a certain amount of Mo ¬ dularisierung the overall structure is obtained according to the invention in that one or more electronic components (together with the second circuit carrier) are module-like included in the circuit arrangement. This has for the respective circuit components evident advantages in terms of repairability of the circuit arrangement (by replacement of modules) as well as with respect to any subsequent changes occurring in practice, the circuit arrangement (insertion variants). In the latter case, the modularti- ge structure may allow the re-use of the peripheral electronics (first circuit substrate with population) in conjunction with one or more modified modules (second circuit carrier complete with population). The invention is explained in detail below with reference of an exemplary embodiment with reference to the accompanying drawings. , In which:

Fig. 1 is a schematic plan view of a scarf ¬ processing arrangement, and

Fig. 2 is a sectional view taken along line II-II in FIG. 1.

Fig. 1 shows a circuit arrangement 10 contained in a motor vehicle gearbox control device comprising a heat sink 12 (which in the embodiment shown here, a part of a control unit housing forms), a lying flat thermally coupled to an upper surface 14 of the heat sink first circuit member 16 and second circuit carrier 18- 1 , 18-2, 18-3 and 18-4.

The heat sink 12 is formed in a simple and efficient manner from a flat aluminum die-cast plate of uniform thickness that a bottom of the circuit arrangement of the female housing (not shown) is formed. The thickness of the heat sink 12 is substantially greater than the thickness by the derailleur support sixteenth

The first circuit substrate 16 is formed as a thick film ceramic. Gerplatten is a common material for forming Keramikträ ¬ z. Example Al 2 O 3. Such thick film ceramics are well known experts in the field of high-temperature electronics and therefore require no further explanation. Further, the circuit arrangement 10 comprises a plurality of electronic components which are arranged to form a part in a known manner on top of the first circuit substrate 16 and wired means of the same. Of diesel sem some of the components merely by way of example in a so-called flip-chip technology applied, unpackaged integrated circuit 20 and a housed integrated circuit 22 are shown in the figure.

More generally, the Ver ¬ bond is not produced at the flip chip as the chip 20 to the circuit substrate by bonding, but by direct bonding or solder joints between the contact pads of the chip and the circuit carrier. Thus, the flip-chip technology allows the unbundling of connections through the circuit board without bonding connections. A particular variant of this technology for miniaturization ¬ tion of electronic devices are so-called "bail-grid arrays" (BGA) in which takes place instead of peripheral Bau ¬ element terminals of the electric contact via electrically conductive, arranged in a dot matrix spheres.

For these ball arrangement advantageously two dimensions available, so a greater number of contacts can be implemented to save space.

Another part of the components of the circuit assembly 10 (here, in flip-chip technology, alternatively, for example, BGA) is by contrast located at the bottom of the second circuit substrate 18, the through each case in a top surface 14 of the Wär ¬ mesenke 12 toward recess 24-1, 24-2 and 24-3 are added.

The second circuit substrate 18 are constructed as LTCC. Such multilayer ceramic support plates made in hybrid or hybrid micro-technology are known per se and allow wiring in addition to their function and the integration of other components in a three-dimensional structure.

Each second circuit substrate 18 has on its upper side contact point ( "pads") 26, which are electrically connected with either sol ¬ chen contact points 26 of an immediately adjacent arranged in the same recess 24 second circuit substrate 18 or with the top side contact pads 28 of the first circuit substrate sixteenth

In the illustrated embodiment, the second shawl ¬ tung carrier are received 18-2 and 18-3 together side by side in a recess provided in a central region of the first circuit substrate 16 recess 24-2.

In contrast, the second circuit carrier are 18-1 and 18-4 in men aufgenom- separately provided recesses 24-1 and 24-3, from which the recess 24-3 provided on the edge of the first circuit substrate sixteenth

Deviating from the illustrated embodiment could be a provided for receiving one or more second circuit substrate 18 recess 24 may be provided 16 as a space between two laterally spaced to one another the first circuit carriers.

The electrical connection between the second circuitry inert 18-1, 18-2 and 18-3 on the one hand and the first shawl ¬ tung carrier 16 is realized in the illustrated embodiment by bonding wires 30 to the pads 26, 28, whereas the connection between the second circuit carrier is 18-4 and the first circuit substrate 16 here formed by a glued-flex circuit 32 with corresponding conductor tracks. After the bonding process, the bonding wires 30 still ver ¬ cast (mechanical protection and improvement of the vibration resistance).

Arranged on the lower sides of the second circuit board 18 components are be characterized ¬ in the figure 34-1 to 34-5. In the embodiment shown it is, these components 34 to unpackaged integrated circuits ( "bare dies"), of which component leads are electrically ver ¬ connected with the lower-side contact points of the second circuit carrier 18 in question into a flip-chip technology and its bottom with the top 14 the heat sink 12 are thermally coupled lying flat.

This very advantageous for the components 34 for heat dissipation assembly is the example of the component 34-1 in the sectional view of Fig. 2 particularly well visible. The underside of the chip 34-1 is directly or via an intermediate thermally conductive layer (eg. B. adhesive layer is not detected ¬) over the entire surface on the upper side 14 of the heat sink 12 at. Be ¬ find the electrically active regions of the component 34-1 on the upper portion thereof, where the immediate re electrical contacting takes place for the second circuit substrate 18 1 side. Advantageously, there is only slight ther ¬ mix resistances between the thermally active area of the component 34-1 and the heat sink 12. The thermally active Be ¬ rich of the component 34-1 is therefore optimally coupled with the heat sink 12th This is associated with the evaluation of the application area of ​​the relevant electronics to higher ambient temperatures and / or higher power losses. Unlike conventional flip chip constructions, the heat dissipation of the device does not take place on the circuit board.

Rather, the device is brought into optimal thermal Verbin ¬ dung with a large area and relatively thick heat sink.

Arrangement of more than one component 34 beneath the circuit carrier (components 34-3 and 34-4) shown in the second to the circuit substrate 18-3 in Fig. 1 may height differences of these components back by a potting compound, a conductive adhesive or the like, or by

Grinding the respective components are compensated.

The second circuit carrier 18-1 provides an electrical Ver ¬ wiring from its lower-side contact point to its upper-side contact points 26 provided through which the above-described additional point (here: the contact points 28 of the first circuit substrate 16). The same is true for the not visible in Fig. 2 circuit substrate 18-2, 18-3 and 18-4.

Another type of electrical connection between the first circuit substrate and one of the second circuit carrier is shown in Fig. 1 for the second circuit carrier 18-4. There is the connection between the pads 26, 28 with- means of the glued printed circuit film 32 realized which performs the same conductor paths to the other upper-side pads 36 of the first circuit substrate 16 to the Schaltungsan ¬ proper 10 with an external line connection and / or other circuit carriers or bind to comparable circuitry that in the same electronic unit (ECU) un ¬ are accommodated. Although the mentioned in the embodiment described technologies for the implementation of the circuit carrier are to be considered 16 and 18, as preferred, each of these circuit carriers can in principle be manufactured in any other suitable technology, which allows an assembly and electrical ¬ specific wiring of components. For the second circuit substrate 18, the so-called HTCC technology is here in particular into consideration (HTCC = "high temperature-ture co-fired ceramics").

For the preparation of the circuit assembly 10, a first composite of the heat sink 12 and the first shawl ¬ tung carrier 16 is first manufactured, wherein the circuit substrate 16 is fitted before or after the components provided thereon (20, 22 etc.). In addition, second composites are gefer ¬ Untitled, each consisting of one of the second circuit substrate 18 and the one or more components disposed thereon (34). These second networks or modules are then inserted with the components above in the recesses 24 of the first carrier of circuitry 16, which is provided for fastening and / or better Wärmekontaktierung a highly thermally conductive adhesive material or a suitable sealing compound. Finally, the upper-side contact points of the first circuit substrate 16 with the adjacent upper-side contact points of the second circuit substrate 18 are electrically connected, in the above embodiment partially through the bonding wires 30 and partially through the printed circuit film 32nd

In summary, 34 superior decision-heating in the circuit arrangement 10 for more or less directly to the heat sink toward thermally coupled components. The special design with regard to the arrangement of the components 34 is particularly suitable for both stan- dard chips as well as specially prepared flip chips. In one embodiment, it is provided that at least one of these devices 34, a power block (for example., ASIC or switching transistor), or a microcontroller chip. In addition, these components can 34 together with the associated second circuit substrates 18 in practice useful as the passage of time varying electronic modules in the otherwise unchanged, peripheral electronics integrated ¬ to which was created stückung from the first circuit substrate 16 together with the loading , Also worth mentioning is the advantage that a so-called rewiring of complex microelectronic circuits (z. B. controllers the aforementioned micro or other microprocessor devices) no longer has to take place at the wafer level to adapt to a peripheral electronics or technology, but, if necessary, by the can take place second circuit carrier 18 in question.

Claims

claims
1. Electronic circuit arrangement comprising
- a heat sink (12) for dissipating heat,
a on an upper side (14) of the heat sink (12) thermally coupled lying flat first circuit carrier (16) for wiring electronic devices see (20, 22, 34) of the circuit arrangement,
a second circuit carrier (18) which is received in a the top side (14) of the heat sink (12) out through recess (24) of the first circuit substrate (16), wherein a connecting arrangement (30, 32) is provided, by means of which upper-side contact points (28) of the first circuit substrate (16) with the upper-side contact points (26) of the second circuit carrier (18) are electrically connected together, and
a between the second circuit carrier (18) and the heat sink (12) disposed electronic construction element (34) from which the component leads with the lower-side contact points of the second circuit carrier (18) are electrically connected, and whose underside with the upper side (14) of the heat sink ( 12) is thermally coupled.
2. A circuit arrangement according to claim 1, wherein the heat sink (12) is formed by a metal plate.
3. Circuit arrangement according to one of the preceding claims, wherein the heat sink (12) has a flat upper surface (14).
4. Circuit arrangement according to one of the preceding claims, wherein the first circuit support (16) is plate-shaped.
5. A circuit arrangement according to one of the preceding che Ansprü-, wherein the first circuit support (16) is designed as a thick-layer ceramic ¬.
6. Circuit arrangement according to one of the preceding claims, wherein said second circuit carrier (18) is plate-shaped.
7. Circuit arrangement according to one of the preceding claims, wherein said second circuit carrier (18) as a HTCC or LTCC is formed.
8. Circuit arrangement according to one of the preceding claims, wherein the connecting arrangement (30, 32) between the first circuit support (16) and the second circuit carrier (18) comprises a bonding wire assembly (30).
9. Circuit arrangement according to one of the preceding claims, wherein the connecting arrangement (30, 32) between the first circuit substrate and the second circuit carrier
(18) comprises a printed circuit film (32).
10. The circuit arrangement according to one of the preceding claims, wherein the electrically interconnected top-side contact points (28) of the first circuit support (16) and said second circuit carrier (18) are located approximately at the same height.
11. Circuit arrangement according to one of the preceding Ansprü- surface, wherein the second circuit for receiving the carrier
(18) provided recess (24) in a central region of the first circuit support (16) is provided.
12. Circuit arrangement according to one of the preceding Ansprü- surface, wherein the second circuit between the carrier (18) and the heat sink (12) arranged electronic Bauele ¬ ment (34) is an unpackaged chip.
13. Circuit arrangement according to one of the preceding che Ansprü-, wherein between said second circuit carrier (18) and the heat sink (12) arranged electronic Bauele ¬ ment (34) is ground at its base.
14. Circuit arrangement according to one of the preceding Ansprü- che, wherein between said second circuit carrier (18) and the heat sink (12) arranged electronic Bauele ¬ element (34) via a heat conductive filler, insbeson ¬ particular a thermally conductive adhesive layer to the upper ¬ side of the heat sink is coupled.
15. A method for manufacturing an electronic circuit arrangement (10), comprising the steps of:
Providing a first assembly (12, 16) from a heat sink (12) for dissipating heat and a on an upper side (14) of the heat sink (12) elements lying flat thermally coupled first circuit carrier (16) for wiring electronic components (20, 22, 34) of the circuit arrangement (10), wherein the first circuit support (16) has a to top (14) of the heat sink (12) out through from ¬ saving (24)
Providing a second assembly (18, 34) from ei ¬ nem second circuit carrier (18) and an electronic component (34) from which the component leads with the lower-side contact points of the second circuit carrier (18) are electrically connected,
Inserting the second cluster (18, 34) in the Ausspa ¬ tion (24) of the first assembly (12, 16), such that the underside of the electronic component (34) Depression in thermal contact with the top surface (14) of the heat ¬ (12) occurs, and
electrically connecting upper-side contact Stel ¬ len (28) of the first circuit support (16) with the upper-side contact points (26) of the second circuit carrier (18).
EP20060807009 2005-11-11 2006-10-05 Electronic circuit arrangement and method for producing an electronic circuit arrangement Withdrawn EP1946625A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE200510053974 DE102005053974B3 (en) 2005-11-11 2005-11-11 Electrical circuit arrangement has heat sink thermally coupled to a circuit carrier for electronic components and a second carrier within the first having an electronic component between it and the heat sink
PCT/EP2006/067101 WO2007054409A1 (en) 2005-11-11 2006-10-05 Electronic circuit arrangement and method for producing an electronic circuit arrangement

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EP1946625A1 true true EP1946625A1 (en) 2008-07-23

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EP (1) EP1946625A1 (en)
CN (1) CN101356862B (en)
DE (1) DE102005053974B3 (en)
WO (1) WO2007054409A1 (en)

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JP2010267954A (en) * 2009-04-15 2010-11-25 Panasonic Corp Electronic device
DE102010003678A1 (en) * 2010-04-07 2011-10-13 Zf Friedrichshafen Ag Method for manufacturing control module for transmission control of motor car, involves providing recess in printed circuit board, and pressing functional printed circuit board module into recess
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US9504157B2 (en) * 2013-09-03 2016-11-22 Raytheon Company Hybrid circuit assembly
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Also Published As

Publication number Publication date Type
CN101356862A (en) 2009-01-28 application
US20090161319A1 (en) 2009-06-25 application
DE102005053974B3 (en) 2007-03-01 grant
WO2007054409A1 (en) 2007-05-18 application
CN101356862B (en) 2010-11-17 grant
US7911051B2 (en) 2011-03-22 grant

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