DE102008059468A1 - Optoelektronische Lampe - Google Patents

Optoelektronische Lampe Download PDF

Info

Publication number
DE102008059468A1
DE102008059468A1 DE102008059468A DE102008059468A DE102008059468A1 DE 102008059468 A1 DE102008059468 A1 DE 102008059468A1 DE 102008059468 A DE102008059468 A DE 102008059468A DE 102008059468 A DE102008059468 A DE 102008059468A DE 102008059468 A1 DE102008059468 A1 DE 102008059468A1
Authority
DE
Germany
Prior art keywords
circuit board
electrical
electrical connection
lamp according
optoelectronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102008059468A
Other languages
German (de)
English (en)
Inventor
Kurt-Jürgen Lang
Hagen Luckner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Priority to DE102008059468A priority Critical patent/DE102008059468A1/de
Priority to PCT/DE2009/001696 priority patent/WO2010060420A1/fr
Publication of DE102008059468A1 publication Critical patent/DE102008059468A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/141One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/142Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04Assemblies of printed circuits
    • H05K2201/048Second PCB mounted on first PCB by inserting in window or holes of the first PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10106Light emitting diode [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10113Lamp

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Led Device Packages (AREA)
DE102008059468A 2008-11-28 2008-11-28 Optoelektronische Lampe Withdrawn DE102008059468A1 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE102008059468A DE102008059468A1 (de) 2008-11-28 2008-11-28 Optoelektronische Lampe
PCT/DE2009/001696 WO2010060420A1 (fr) 2008-11-28 2009-11-26 Lampe optoélectronique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102008059468A DE102008059468A1 (de) 2008-11-28 2008-11-28 Optoelektronische Lampe

Publications (1)

Publication Number Publication Date
DE102008059468A1 true DE102008059468A1 (de) 2010-06-24

Family

ID=42104435

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102008059468A Withdrawn DE102008059468A1 (de) 2008-11-28 2008-11-28 Optoelektronische Lampe

Country Status (2)

Country Link
DE (1) DE102008059468A1 (fr)
WO (1) WO2010060420A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010043220A1 (de) * 2010-11-02 2012-05-03 Osram Ag Leuchtvorrichtung und Verfahren zum Zusammenbauen einer Leuchtvorrichtung
DE102012110397A1 (de) * 2012-10-30 2014-04-30 Epcos Ag Leuchtdiodenanordnung, Modul und Verfahren zur Herstellung einer Leuchtdiodenanordnung
WO2018091274A1 (fr) * 2016-11-18 2018-05-24 Vishay Semiconductor Gmbh Élément à del à mélange de couleurs et son procédé de fabrication

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010048661B4 (de) * 2010-10-15 2012-05-10 Automotive Lighting Reutlingen Gmbh Beleuchtungseinrichtung für ein Kraftfahrzeug
EP2702830A1 (fr) 2011-04-26 2014-03-05 Koninklijke Philips N.V. Connecteur pourvu d'une structure de protection contre les surtensions
WO2013017984A1 (fr) * 2011-08-02 2013-02-07 Koninklijke Philips Electronics N.V. Partie d'adaptation d'ensemble d'éclairage modulaire
DE102012101818B4 (de) * 2012-03-05 2018-11-08 Osram Opto Semiconductors Gmbh Optoelektronisches Modul mit einem Kodierelement in einer Aussparung, Beleuchtungseinrichtung mit diesem Modul und Verfahren zu seiner Herstellung
EP3133332B1 (fr) * 2015-07-29 2018-09-12 Tridonic Jennersdorf GmbH Module de del intégré à un substrat ims
US10670250B2 (en) 2017-12-22 2020-06-02 Lumileds Llc Chip-on-board modular lighting system and method of manufacture
US20220369459A1 (en) * 2019-11-25 2022-11-17 Electronic Theatre Controls, Inc. Light module aperture for printed circuit board integration

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050024834A1 (en) * 2003-07-28 2005-02-03 Newby Theodore A. Heatsinking electronic devices
WO2006012842A2 (fr) 2004-07-26 2006-02-09 Osram Opto Semiconductors Gmbh Element optoelectronique emettant un rayonnement electromagnetique et module lumineux
DE102005023864A1 (de) * 2005-05-24 2006-11-30 Chin-Sung Lin LED-Lampenanordnung
DE102005034166A1 (de) * 2005-07-21 2007-02-01 Osram Opto Semiconductors Gmbh Gehäuse für ein elektromagnetische Strahlung emittierendes optoelektronisches Bauelement, elektromagnetische Strahlung emittierendes Bauelement und Verfahren zum Herstellen eines Gehäuses oder eines Bauelements
EP1832804A2 (fr) * 2006-03-06 2007-09-12 Koito Manufacturing Co., Ltd Module de source lumineuse et dispositif lumineux pour véhicule
EP1965128A1 (fr) * 2005-12-22 2008-09-03 Matsushita Electric Works, Ltd. Instrument d'éclairage utilisant des diodes led

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006105644A1 (fr) * 2005-04-05 2006-10-12 Tir Systems Ltd. Ensemble de montage pour des dispositifs optoelectroniques
DE102005058884A1 (de) * 2005-12-09 2007-06-14 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Leuchtdiodenmodul, Verfahren zur Herstellung eines Leuchtdiodenmoduls und optische Projektionsvorrichtung
DE102007024390A1 (de) * 2006-11-16 2008-05-21 Robert Bosch Gmbh LED-Modul mit integrierter Ansteuerung
DE102007044567A1 (de) * 2007-09-07 2009-03-12 Arnold & Richter Cine Technik Gmbh & Co. Betriebs Kg Beleuchtungseinrichtung mit mehreren steuerbaren Leuchtdioden

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050024834A1 (en) * 2003-07-28 2005-02-03 Newby Theodore A. Heatsinking electronic devices
WO2006012842A2 (fr) 2004-07-26 2006-02-09 Osram Opto Semiconductors Gmbh Element optoelectronique emettant un rayonnement electromagnetique et module lumineux
DE102005023864A1 (de) * 2005-05-24 2006-11-30 Chin-Sung Lin LED-Lampenanordnung
DE102005034166A1 (de) * 2005-07-21 2007-02-01 Osram Opto Semiconductors Gmbh Gehäuse für ein elektromagnetische Strahlung emittierendes optoelektronisches Bauelement, elektromagnetische Strahlung emittierendes Bauelement und Verfahren zum Herstellen eines Gehäuses oder eines Bauelements
EP1965128A1 (fr) * 2005-12-22 2008-09-03 Matsushita Electric Works, Ltd. Instrument d'éclairage utilisant des diodes led
EP1832804A2 (fr) * 2006-03-06 2007-09-12 Koito Manufacturing Co., Ltd Module de source lumineuse et dispositif lumineux pour véhicule

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010043220A1 (de) * 2010-11-02 2012-05-03 Osram Ag Leuchtvorrichtung und Verfahren zum Zusammenbauen einer Leuchtvorrichtung
WO2012059364A1 (fr) * 2010-11-02 2012-05-10 Osram Ag Dispositif d'éclairage et procédé d'assemblage d'un dispositif d'éclairage
DE102012110397A1 (de) * 2012-10-30 2014-04-30 Epcos Ag Leuchtdiodenanordnung, Modul und Verfahren zur Herstellung einer Leuchtdiodenanordnung
US9287247B2 (en) 2012-10-30 2016-03-15 Epcos Ag Light-emitting diode arrangement, module, and method for producing a light-emitting diode arrangement
WO2018091274A1 (fr) * 2016-11-18 2018-05-24 Vishay Semiconductor Gmbh Élément à del à mélange de couleurs et son procédé de fabrication
US10785840B2 (en) 2016-11-18 2020-09-22 Vishay Semiconductor Gmbh Color-mixing LED component and method of production therefor

Also Published As

Publication number Publication date
WO2010060420A1 (fr) 2010-06-03

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Legal Events

Date Code Title Description
OM8 Search report available as to paragraph 43 lit. 1 sentence 1 patent law
R005 Application deemed withdrawn due to failure to request examination