WO2015071311A1 - Ensemble de supports et système optoélectronique - Google Patents

Ensemble de supports et système optoélectronique Download PDF

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Publication number
WO2015071311A1
WO2015071311A1 PCT/EP2014/074377 EP2014074377W WO2015071311A1 WO 2015071311 A1 WO2015071311 A1 WO 2015071311A1 EP 2014074377 W EP2014074377 W EP 2014074377W WO 2015071311 A1 WO2015071311 A1 WO 2015071311A1
Authority
WO
WIPO (PCT)
Prior art keywords
holder
optoelectronic
assembly
circuit board
arrangement
Prior art date
Application number
PCT/EP2014/074377
Other languages
German (de)
English (en)
Inventor
Ralph Bertram
Alexander Wilm
Alfons Siedersbeck
Original Assignee
Osram Opto Semiconductors Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors Gmbh filed Critical Osram Opto Semiconductors Gmbh
Publication of WO2015071311A1 publication Critical patent/WO2015071311A1/fr

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate

Definitions

  • Holder assembly and optoelectronic assembly The present invention relates to a holder assembly according to claim 1 and to an optoelectronic assembly according to claim 4.
  • An object of the present invention is to provide a holder assembly. This object is achieved by a holder composite with the features of claim 1. Another object of the present invention is to provide an optoelectronic device. This object is achieved by an optoelectronic device having the features of claim 4.
  • a holder assembly comprises a first holder, which is provided for receiving a first printed circuit board with at least one first optoelectronic semiconductor chip, and a second holder which is provided for receiving a second printed circuit board with at least one second optoelectronic semiconductor chip. In this case, the first holder and the second holder are connected to each other.
  • this holder assembly can be arranged as a whole in a lamp or at ei ⁇ nem other place, whereby a single fastening of the first holder and the second holder is not required.
  • the connection between the first holder and the second holder of the holder assembly can advantageously also facilitate an electrical connection of a first circuit board arranged in the first holder with a second circuit board arranged in the second holder.
  • the first holder and the second holder are connected to one another in a material-coherent manner.
  • the holder composite can thereby be produced in a particularly simple and cost-effective manner.
  • the material unitarily integrally formed holder composite is advantageously mechanically particularly stable, which allows a simple attachment of the holder ⁇ composite.
  • a predetermined breaking point is formed between the first holder and the second holder.
  • the first holder and the second holder can be separated from one another by breaking at the predetermined breaking point.
  • this makes it possible to adjust the size of the holder composite, ie the number of encompassed by the holder composite individual holder before mounting the holder of the holder connections with PCBs thereon ⁇ arranged optoelectronic semiconductor chips to a gegebe- nen application.
  • the holder composite can be used for different applications.
  • An optoelectronic arrangement comprises a first holder, in which a first printed circuit board is held with at least one first optoelectronic semiconductor chip, and a second holder, in which a second printed circuit board is held with at least one second optoelectronic semiconductor chip.
  • the first holder and the second holder mitei ⁇ connected to each other.
  • the interconnected holders of this optoelectronic device can be mounted together in a luminaire or in another location, which simplifies the assembly of the optoelectronic device.
  • connection of the first holder of the opto ⁇ electronic device with the second holder of the optoelectronic device can advantageously also be a production of an electrical connection between the first holder arranged in the first printed circuit board and arranged in the second holder second printed circuit board of the optoelectronic device.
  • this comprises an electrical connection element which produces an electrically conductive connection between the first printed circuit board and the second printed circuit board.
  • an electrical connection element which produces an electrically conductive connection between the first printed circuit board and the second printed circuit board.
  • the electrical connection element is electrically conductively connected to the first circuit board via a press contact.
  • the arrangement and electrical contacting of the first printed circuit board in the first holder of the optoelectronic arrangement is thereby made particularly easy.
  • the electrical connection element comprises a wire bridge o- the one contact spring, which is arranged in the first holder and / or the second holder.
  • the electrical connection ⁇ element can be inserted, for example, in the first holder and / or the second holder of the optoelectronic device.
  • the electrical ⁇ specific connection element allows a customized to a specific application ⁇ case of interconnection arranged on the first printed circuit board first optoelectronic semiconductor chip and arranged on the second printed circuit board second optoelectronic semiconductor chips.
  • the electrical connecting element integrated in the first holder and / or the second holder simplifies an electrical contact of the optoelectronic device from the outside.
  • the first holder and the second holder are connected to one another by a plug connection.
  • the connector can simultaneously produce a mechanical and an electrically conductive connection between the first holder and the second holder of the optoelectronic device.
  • the connection of the first holder and the second holder of the optoelectronic assembly by means of the plug connection also advantageously allows for individu ⁇ elle configuration of the size and geometry of the optoelectronic arrangement, see.
  • the first holder and the second holder are material unit ⁇ Lich coherently interconnected.
  • the optoelectronic arrangement can thereby be made particularly compact.
  • the same material contiguous formation of the first holder and the second Hal ⁇ ters also allows a particularly simple and cost-effective production ⁇ the holder of the optoelectronic arrangement of. Due to the coherence of the material-uniform configuration of the holder of the optoelectronic device, these are also advantageously particularly mechanically stable, which an attachment of the holder of the optoelectronic device simplified.
  • an optical lens is attached to the first holder and / or the second holder.
  • the optical lens can effect beam shaping of an electromagnetic radiation emitted by the at least one first optoelectronic semiconductor chip and / or the at least one second optoelectronic semiconductor chip.
  • the optical lens is ⁇ Untitled buildin means of a bayonet connection.
  • this allows a simple and releasable attachment of the optical lens to the first holder and / or the second holder of the optoelectronic device.
  • the optical lens is connected to the first holder in a material-coherent manner.
  • the entire first holder may have an optically transparent material.
  • the first holder and the second holder each have an upper side and a side surface that is not oriented perpendicular to the upper side.
  • the side surface of the one holder can thereby be held or anchored below the side surface of the other holder, which facilitates the attachment of the holder of the optoelectronic device in a luminaire or in another location.
  • a center of the first holder from a center ⁇ point of the second holder has a distance between 15 mm and 50 mm, preferably a distance between 20 mm and 30 mm.
  • the first holder and the two ⁇ te holder of the optoelectronic assembly are characterized for holding circuit boards with a size of, for example, 9 mm to 25 mm.
  • the holder of the optoelectronic assembly can thereby be equipped with optical lenses which have a diameter of for example 15 mm to 50 mm aufwei ⁇ sen.
  • optical lenses which have a diameter of for example 15 mm to 50 mm aufwei ⁇ sen.
  • this comprises at least one further holder.
  • the first holder, the second holder and the at least one white ⁇ tere holders are arranged in a regular grid.
  • the holders of the optoelectronic arrangement can be arranged, for example, in a rectangular grid or in a hexagonal grid.
  • this results in a com ⁇ pact embodiment of the optoelectronic device.
  • this comprises at least one further holder, in which a further printed circuit board is held with an electronic control component.
  • the electronic control device may be from ⁇ play for driving the on the first printed circuit board arranged at least one first optoelectronic semiconductor chips and / or for driving the disposed on the second printed circuit board are at least one second opto electro ⁇ African semiconductor chips.
  • this results in a particularly compact design of the opto ⁇ electronic device.
  • the integrated into the optoelectronic device electronic control device also may facilitate control of the opto electro ⁇ African arrangement advantageously.
  • FIG. 1 shows a holder for mounting a printed circuit board.
  • FIG. 2 shows a first holder assembly formed from a plurality of holders
  • Fig. 5 shows a part of the third holder assembly with internal electrical connection elements
  • FIG. 6 shows part of the third holder assembly with external terminal members
  • Fig. 8 is a sectional view of a holder with an op ⁇ table lens.
  • FIG. 1 shows a schematic perspective view of a holder 100.
  • the holder 100 is used to hold a Lei ⁇ terplatte 170, on the upper side at least one optoelectron ⁇ ronic semiconductor chip 180 is arranged.
  • the arrangement of printed circuit board 170 and optoelectronic semiconductor chip 180 may also be referred to as a chip-on-board arrangement.
  • the holder 100 serves to hold the chip-on-board arrangement.
  • the circuit board 170 may comprise, for example, a ceramic or metal core. At the top of the circuit board 170 are electrically conductive traces and electrical con ⁇ tact surfaces arranged.
  • the one or more optoelectronic semiconductor chips 180 are fixed to the top of the circuit ⁇ plate 170, for example by solder joints, and electrically conductively connected via the electrical conductor tracks to each other and to external electrical contact pads of the circuit board 170th In the illustrated example, a multiplicity of optoelectronic semiconductor chips 180 are arranged in a regular matrix arrangement on the upper side of the printed circuit board 170.
  • the optoelectronic semiconductor chips 180 are to be ⁇ forms, electromagnetic radiation, for example sichtba ⁇ res light to emit.
  • the optoelectronic semiconductor chips 180 may be, for example, light-emitting diode chips (LED chips).
  • the assembly formed of the circuit board 170 and the optoelectronic semiconductor ⁇ semiconductor chip 180 may comprise a Konvertermateri- al, which is designed to convert a wavelength of the light emitted by the optoelectronic semiconductor chip 180 electromagnetic radiation.
  • the converter material can be provided, for example, for emitting electromagnetic radiation emitted by the optoelectronic semiconductor chips 180 with a wavelength from the blue one
  • the optoelectronic semiconductor chips 180 arranged on the upper side of the printed circuit board 170 may for example be embedded in the Kon ⁇ vertermaterial.
  • the holder 100 has an electrically insulating material, preferably a plastic material.
  • the holder 100 may be made by, for example, a molding method.
  • the material of the holder 100 may be optically transparent or optically opaque.
  • the holder 100 has an upper side 110 and a plurality of side surfaces 120 oriented perpendicular to the upper side.
  • the top 110 of the holder 100 is formed quad ⁇ ratisch.
  • the top 110 of the holder 100 could also be rectangular, hexagonal or otherwise shaped.
  • the upper side 110 of the holder 100 has a recess 111. In the area of the recess 111, the upper side of the printed circuit board 170 arranged in the holder 100 with the optoelectronic semiconductor chips 180 arranged thereon is exposed. Electromagnetic radiation emitted by the optoelectronic semiconductor chips 180 can be emitted through the recess 111 on the top side 110 of the holder 100.
  • the recess 111 a circular failed ⁇ benförmigen cross-section, but this is not necessarily erfor ⁇ sary.
  • the border formed by the material of the holder 100 of the recess 111 widens in the illustrated
  • Example of the top 110 of the holder 100 towards conical is also not mandatory.
  • the bores 112 are further accessible in the illustrated example.
  • the bores 112 are arranged in the example shown in two opposite corners of the top 110 outside the Ausspa ⁇ tion 111. However, it is also possible to provide a different number of holes 112 and to arrange these at other positions.
  • the holes 112 can also be completely eliminated.
  • the bores 112 extend from the upper side 110 in the direction perpendicular to the upper side 110 into the holder 100.
  • the holes 112 can completely penetrate the holder 100 and serve, for example, for fastening the holder 100 with screws. However, the bores 112 can not extend completely as blind holes through the holder 100.
  • the holder 100 can be connected to other similar holders 100 to a holder composite.
  • Fig. 2 shows a specific ⁇ matic perspective view of a first optoelekt ⁇ tronic assembly 10 having a first bracket assembly 11 comprising four Holder 100.
  • the holders 100 are in the first Holder assembly 11 arranged in a rectangular arrangement of 2x2 holders 100.
  • this arrangement and number of holders 100 is chosen only as an example.
  • the first holder assembly 11 can also be formed with a different number of holders 100 and with a different arrangement of the holder 100.
  • the first optoelectronic arrangement 10 can be provided, for example, to be arranged in a luminaire.
  • the first optoelectronic device 10 may be provided for placement in a street lamp.
  • the first optoelectronic device 10 may have a large number of individual optoelectronic semiconductor chips 180 and thereby be suitable for emitting high-power electromagnetic radiation.
  • the holders 100 of the first holder assembly 11 of the first opto ⁇ electronic device 10 are mechanically connected to each other by mechanical fasteners 150.
  • the mechanical connecting elements 150 of the holders 100 comprise
  • Plug 130 and with the plugs 130 corresponding Buch ⁇ sen 140 At each two mutually perpendicular side surfaces 120 of each holder 100 is a plug 130 each arranged. At the other two mutually perpendicular side surfaces 120 of each holder 100 is a respective bushing 140 is formed.
  • the plugs 130 and bushings 140 in the holder assembly 11 of adjacent holders 100 are each plugged together.
  • the first retainer assembly 11 can be formed for example, by the holder, 100 of the first support composite 11 first row are put together and then are joined together so gebil ⁇ Deten lines of the first holder composite. 11
  • Each of the holders 100 of the first holder assembly 11 has a center point 190.
  • the centers 190 of two adjacent holders 100 of the first holder assembly 11 have a distance 195 from each other.
  • the distance 195 may be, for example, between 15 mm and 50 mm.
  • the stood 195 between the centers 190 of two adjacent holders 100 between 20 mm and 30 mm.
  • the mechanical connecting elements 150 of the holders 100 have integrated electrical connecting elements 160.
  • the electrical connection elements 160 of the holder 100 of the holder ers ⁇ th interconnection 11 electrically establish conductive connections between the circuit boards 111 of the holder 100 of the first support composite.
  • 11 Elements via the electrical kausele- 160, the PCB 170 of each holder 100 of the first holder can interconnection 11 may be arranged for example in a Se ⁇ rien- and / or parallel connection.
  • Electrical connection elements 160 include electrically conductive contact bridges, wires, conductors or the like, which are integrated in or attached to the plugs 130 and sockets 140 of the mechanical connection elements 150. Depending on the desired interconnection of the circuit boards 170 of the individual holders 100 of the first holder assembly 11, not all plugs 130 and sockets 140 of all holders 100 must have electrical connection elements 160. Electrically conductive connections between the electrical connection elements 160 and electrical contact surfaces arranged on the printed circuit boards 170 can be produced, for example, by soldered connections or preferably by press-fit connections.
  • the individual holders 100 of the first holder assembly 11 of the first optoelectronic device 10 are preferably produced separately from one another.
  • the electrical connection elements 160 can already be provided during the production of the holder 100. However, it is also possible to individually equip the individual holders 100 with the electrical connection elements 160 only after their production. Subsequently, the holders 100 can be connected to the first holder assembly 11 before the circuit boards 170 are arranged with the optoelectronic semiconductor chips 180 in the holders 100. Alternatively, however, the circuit boards 170 may even before connecting the holder 100 to the first holder assembly 11 in the holders 100 are arranged.
  • FIG 3 shows a schematic perspective view of a second optoelectronic device 20 with a second holder assembly 21.
  • the second holder assembly 21 includes ei ⁇ ne plurality of holders 200.
  • the second holder assembly 21 comprises a total of 16 holder 200, in a square arrangement of 4x4 holders 200 are arranged. This number and arrangement, however, is unmarried ⁇ Lich chosen as an example.
  • the second optoelectronic arrangement 20 with the second holder assembly 21 from holders 200 has correspondences with the first optoelectronic arrangement 10 with the first one
  • the second holder assembly 21 of the second optoelectronic device 20 differs from the first holder assembly 11 of the first optoelectronic device 10 in that the holders 200 of the second holder assembly 21 do not overlap
  • Plug connections are connected to each other, but are integrally formed integrally materially.
  • a predetermined breaking point 22 is arranged between adjacent holders 200 of the second holder assembly 21, which makes it possible to separate the holders 200 adjoining the predetermined breaking point 22 by breaking the second holder assembly 21 at the respective predetermined breaking point 22.
  • the predetermined breaking points 22 are formed in the example shown as arranged on the upper side 110 of the holder 200 groove-shaped recesses.
  • the holders 200 of the second holder assembly 21 have been made together and integrally connected.
  • the second holder assembly 21 may initially have a larger size during manufacture. have increased number of holders 200 have included.
  • the holders 200 of the second holder assembly 21 shown in FIG. 3 were separated from the other holders 200 by breakage at break points 22, by cutting or sawing along a score edge or otherwise.
  • a printed circuit board 170 with opto ⁇ electronic semiconductor chips 180 arranged thereon was arranged in each holder 200 of the second holder assembly 21 in order to form the second optoelectronic arrangement 20.
  • Fig. 4 shows a schematic perspective view of a third optoelectronic assembly 30 with a third holder composite 31.
  • the third holder composite 31 comprises egg ⁇ ne plurality of holders 300 and at least one holder 310.
  • the illustrated example comprises the third Hal ⁇ terverbund 31 eight holder 300 and another holder 310, which are arranged in a square 3 ⁇ 3 arrangement.
  • the further holder 310 is arranged centrally between the holders 300.
  • this number of holders 300 and other holders 310 and this arrangement is chosen only by way of example.
  • the third optoelectronic arrangement 30 with the third holder assembly 31 consisting of holders 300 and further holders 310 has great similarities with the second optoelectronic arrangement 20 with the second holder assembly 21 made of holders 200. Corresponding components are given the same reference numerals in FIG. 4 as in FIG. 3 and will not be described again in detail below.
  • the holder 300 and the further holder 310 may be identical.
  • the holder 300 and the further holder 310 of the third holder assembly 31 of the third optoelectronic device 30 are integrally connected to one another in a material-uniform manner.
  • the third holder 31 of the third composite optoelekt ⁇ tronic assembly 30 differs from the second composite holder 21 of the second optoelectronic assembly 20 in that no predetermined breaking points are present in the third holder assembly 31. However, such predetermined breaking points could also be provided in the third holder assembly 31.
  • Circuit board 320 has been arranged, which carries at least one elekt ⁇ ronic control component 330.
  • the electronic control ⁇ component 330 may be provided, for example to drive the optoelectronic semiconductor chip 180 on the arranged in the holders 300 PCBs 170th
  • the electronic control component 330 may also be provided to take over other or other control or regulatory tasks of the third optoelectronic device 30.
  • the further printed circuit board 320 held in the further holder 310 of the third holder composite 31 is suitable for this purpose
  • Fig. 5 shows a schematic and partially opened arrival sees a portion of the third holder composite 31 of the third opto-electronic device 30. Illustrated are the other holder 310, and two of the other holder 310 adjacent Hal ⁇ ter 300 of the third holder composite 31.
  • Fig. 5 shows that the circuit boards 170, 320 each be ⁇ nachbarter holder 310 of the third bracket 31 of the composite drit ⁇ th optoelectronic device 30 are electrically conductively connected to one another via electrical connection elements 340th
  • the electrical connection elements 340 each extend from a bracket 300, 310 of the third Hal ⁇ terverbunds 31 to an adjacent holder 300, 310 of the third holder composite 31.
  • the electrical connectors 340 may be formed beispielswei ⁇ se as contact bridges, jumpers, contact springs or contact clamps.
  • the electrical connecting elements 340 may have been embedded 310 of the third Hal ⁇ terverbunds 31 already during manufacture of the composite drit ⁇ th holder 31 in the holder 300.
  • the holders 300, 310 of the third holder assembly 31 can also be designed such that the electrical connection elements 340 can be inserted into the holders 300, 310 after the third holder assembly 31 has been manufactured and removed from the holders 300, 310. This allows an individual adaptation of the interconnection of the printed circuit boards 170, 320 held in the holders 300, 310 of the third holder assembly 31 of the third optoelectronic device 30.
  • corresponding electrical connection elements may be provided.
  • one of the holders 100, 200 of the first holder assembly 11 or of the second holder assembly 21 can, instead of a printed circuit board 170 with optoelectronic semiconductor chips 180, have a further printed circuit board 320 with at least one electric circuit. record control component 330.
  • Fig. 6 shows a further schematic representation of a portion of the third holder composite 31 of the third opto-electro ⁇ African assembly 30.
  • the perspective view of Fig. 6 is partially cut. Shown is one of the hal ⁇ ter 300 of the third holder assembly 31 with a side surface 120 of the holder 300, which is arranged on an outer edge of the third Hal ⁇ terverbunds 31.
  • On the side surface 120 of the holder 300 of the third holder ⁇ composite 31 two electrical connection elements 350 of the holder 300 are accessible.
  • the electrical connection elements 350 are used for external electrical contacting of the third opto-electronic device 30.
  • the electrical connection members 350 can be electrically contacted, for example, by stripping ⁇ ter wires 355th The electrical connection elements 350 then produce electrically conductive connections between the wires 355 and the circuit board 170 held by the holder 300.
  • the electrical connection elements 350 may be formed as Steckerkon ⁇ contacts or otherwise however.
  • the connection between the electrical connection elements 350 and electrical contact surfaces formed on the printed circuit board 170 can in turn be produced, for example, via press contacts or solder contacts.
  • first holder assembly 11 of the first optoelectronic device 10 and the second holder assembly 21 of the second optoelectronic device 20 may have external electrical connection elements 350, which are formed as shown in Fig. 6 Darge ⁇ presented electrical connection elements 350 of the third optoelectronic device 30.
  • FIG. 7 shows a schematic perspective illustration of a fourth optoelectronic arrangement 40 with a fourth holder assembly 41 with a plurality of holders 400.
  • the fourth optoelectronic arrangement 40 with the fourth holder assembly 41 with holders 400 has great agreement with the first optoelectronic arrangement 10 the first holder assembly 11 with holders 100 on.
  • Components corresponding ⁇ th are therefore provided in FIG. 7 by the same reference numerals as in Figures 1 and 2 and will not be described again in detail.
  • the fourth holder assembly 41 of the fourth optoelectronic device 40 comprises four holders 400 which are arranged in a square see 2 x2 arrangement are arranged. However, this number and Anord ⁇ voltage is merely exemplary and can be chosen differently.
  • the holders 400 of the fourth holder assembly 41 of the fourth optoelectronic assembly 40 differ from the holders 100 of the first holder assembly 11 of the first opto ⁇ electronic device 10 in that instead of the oriented perpendicular to the top 110 side surfaces positively inclined side surfaces 410 and negatively inclined side surfaces 420 exist are.
  • Each holder 400 has two positively inclined side surfaces 410 and two negatively inclined soflä ⁇ Chen 420.
  • the positively inclined side surfaces 410 include an obtuse angle with the top 110 of the respective holder 400.
  • the slopes of the positively sloped side surfaces 410 and the negatively inclined side faces 420 are matched such that a positively sloped side face 410 of a holder 400 may sur fa ⁇ chig abut a negatively sloped side face 420 of an adjacent holder 400th
  • the fourth holder assembly 41 of the fourth optoelectronic assembly 40 can be fastened by means of screws 430 at a desired mounting position.
  • the screws 430 thereby extend through the holes 112 of the holder 400 of the fourth holder composite 41.
  • 400 adjacent corner can, for example, in a positively sloped on two side surfaces of a holder 410 to dispense with a bolt 430 when the two inclined ⁇ positive ge side surfaces 410 of the holder 400 each other holders 400 of the fourth holder 41 adjacent.
  • the sloped side surfaces 410, 420 of the holders 400 may additionally include steps, corrugations, or other structures to enhance contact and mutual support between the holders 400. Such structures may also be provided instead of the slopes of the side surfaces 410, 420.
  • the holders 400 of the fourth holder assembly 41 of the fourth optoelectronic device 40 may be connected via mechanical connecting elements 150 and electrical connecting elements 160, which are formed as in the holders 100 of the first holder assembly 11 of the first optoelectronic device 10.
  • the printed circuit boards 170 held by the holders 400 of the fourth holder assembly 41 of the fourth optoelectronic device 40 may, however, also be connected via electrical connecting elements 340, as illustrated by the third optoelectronic device 30 in FIG. 5.
  • the fourth holder assembly 41 of the fourth optoelectronic device 40 may also have external electrical connection elements 350 which correspond to those of the third holder system 31 shown in FIG. 6 of the third optoelectronic device 30.
  • FIGS. 1 to 7 shows a schematic sectional side view of a holder 500.
  • the holder 500 shown only schematically may be formed like one of the holders 100, 200, 300, 400 of FIGS. 1 to 7 and may be part of a holder assembly which, like the first holder assembly 11 , the second holder assembly 21, the third holder assembly 31 or the fourth holder assembly 41 is formed.
  • the holder 500 has on its upper side 110 a blind hole 510 and a pin 520.
  • the blind hole 510 extends from the upper side 110 of the holder 500 into the holder 500.
  • the Zap ⁇ fen 520 is in the vertical direction from the top 110 of the holder 500 from.
  • an optical lens 600 is arranged over the upper side 110 of the holder 500.
  • the optical lens 600 includes a material that is optically transparent for electromag netic ⁇ radiation substantially emitted by the optoelectronic semiconductor chip 180 on the circuit board held in the holder 500 170th
  • the optical lens 600 serves for beam shaping of the electromagnetic radiation emitted by the optoelectronic semiconductor chips 180.
  • the optical lens 600 can be formed, for example, as a converging lens.
  • the optical lens 600 may comprise, for example, a plastic material.
  • the optical lens 600 may have in the direction pa ⁇ rallel to the top 110 of the holder 500 has a diameter, for example, between 15 mm and 50 mm.
  • the optical lens 600 has its side facing the holder 500 supplied ⁇ side toward a pin 610th
  • the pin 610 is arranged in the blind hole 510 of the holder 500.
  • the optical lens 600 has on its top 110 of the holder
  • the optical lens 600 is detachably held on the holder 500.
  • the optical lens 600 could ever ⁇ but also be secured in another way at the top 110 of the holder 500th
  • the optical lens 600 may be formed as part of a lens composite having a plurality of similar optical
  • Lenses 600 includes. This lens composite can be arranged in such a way over egg ⁇ nem the holder 500 and a plurality of other similar holder 500 comprehensive Garrverbund that over each holder 500, an optical lens 600 is arranged.
  • the holder 500 and the optical lens 600 may also be formed in one piece einstü ⁇ .
  • the holder 500 and the optical lens 600 both preferably have an optically trans- parent material.
  • the recess 111 of the holder 500 is omitted in this case preferred.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Led Device Packages (AREA)

Abstract

L'invention concerne un ensemble de supports comprenant un premier support destiné à recevoir un circuit imprimé portant au moins une première puce de semi-conducteur optoélectronique et un deuxième support destiné à recevoir un deuxième circuit imprimé portant au moins une deuxième puce de semi-conducteur optoélectronique. Le premier et le deuxième support sont reliés l'un à l'autre.
PCT/EP2014/074377 2013-11-15 2014-11-12 Ensemble de supports et système optoélectronique WO2015071311A1 (fr)

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DE102013223412.0 2013-11-15
DE102013223412.0A DE102013223412A1 (de) 2013-11-15 2013-11-15 Halterverbund und optoelektronische Anordnung

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DE202015103290U1 (de) * 2015-04-29 2016-08-01 Tridonic Jennersdorf Gmbh LED-Linse mit integrierter Verbindungstechnik
NL2021776B1 (en) * 2018-10-08 2020-05-13 Schreder Sa Modular lighting system
DE202019104937U1 (de) * 2019-09-06 2020-12-08 Weidmüller Interface GmbH & Co. KG Leuchte und Beleuchtungsanordnung

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EP1519106A2 (fr) * 2003-09-24 2005-03-30 Toshiba Lighting & Technology Corporation Dispositif d'éclairage
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EP1519106A2 (fr) * 2003-09-24 2005-03-30 Toshiba Lighting & Technology Corporation Dispositif d'éclairage
EP1901406A1 (fr) * 2005-05-25 2008-03-19 Matsushita Electric Works, Ltd. Embase pour pièce électronique
DE102007028097A1 (de) * 2007-06-19 2008-12-24 Automotive Lighting Reutlingen Gmbh Beleuchtungsanordnung mit Halbleiterlichtquellen auf flexiblen Leiterplatten
WO2012150190A1 (fr) * 2011-05-03 2012-11-08 Osram Ag Module d'éclairage et chaîne de modules d'éclairage
WO2013066920A2 (fr) * 2011-11-03 2013-05-10 Cooledge Lighting, Inc. Systèmes d'éclairage de grande surface
WO2013096006A1 (fr) * 2011-12-23 2013-06-27 LaRose Industries, LLC Kit de construction de jouet éclairé

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017157420A1 (fr) * 2016-03-15 2017-09-21 Osram Opto Semiconductors Gmbh Dispositif semi-conducteur optoélectronique et module comprenant celui-ci

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