EP0674827A1 - Dispositif constitue d'une carte imprimee - Google Patents

Dispositif constitue d'une carte imprimee

Info

Publication number
EP0674827A1
EP0674827A1 EP94929471A EP94929471A EP0674827A1 EP 0674827 A1 EP0674827 A1 EP 0674827A1 EP 94929471 A EP94929471 A EP 94929471A EP 94929471 A EP94929471 A EP 94929471A EP 0674827 A1 EP0674827 A1 EP 0674827A1
Authority
EP
European Patent Office
Prior art keywords
heat
layer
power component
circuit board
plated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP94929471A
Other languages
German (de)
English (en)
Inventor
Wolfgang Mayer-Steuernagel
Reinhard Fassel
Herbert Klinger
Hans-Joerg Schmidt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of EP0674827A1 publication Critical patent/EP0674827A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09572—Solder filled plated through-hole in the final product
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09618—Via fence, i.e. one-dimensional array of vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Definitions

  • the invention is based on an arrangement consisting of a printed circuit board according to the preamble of the main claim.
  • a printed circuit board according to the preamble of the main claim.
  • it is often difficult to dissipate the heat generated in one or more power components to a heat sink, since the printed circuit board is covered on at least one of its two surfaces with a large number of conductor tracks carrying different electrical potentials, which one another and with the heat sink must not be short-circuited.
  • these plated-through holes are arranged in the area of the contact surface of the power component on the printed circuit board. After the power component has been put in place, these plated-through holes are no longer visible and are inaccessible to test procedures.
  • there are difficulties with the electrical insulation which has to be produced by an additional part, which in turn results in heat transfer losses.
  • the arrangement according to the invention with the characterizing features of the main claim has the advantage that, at the same time, for good heat dissipation from the power component to a heat sink, electrical isolation of the various power components from one another and also to the mostly metallic heat sink (housing or base plate of the housing) is ensured.
  • the electrical insulation is no longer covered, but is clearly visible and can be checked at any time.
  • the electrical insulation section can be manufactured with a small tolerance.
  • the serial production of the printed circuit board in this form is economical and inexpensive, since it is possible without additional work processes. There is also no need for an additional insulating part, no additional assembly, no expensive internal vias or additional metal cores for heat dissipation.
  • the measures listed in the subclaims enable advantageous further developments and improvements of the features specified in the main claim.
  • the arrangement is suitable both for multilayer (multilayer) and for simple, double-sided coated printed circuit boards.
  • 10 denotes a power component, the component of which is to be dissipated during operation, in particular by the heat generated in the silicon chip 30, ie heat loss.
  • the power component 10 and the silicon chip 30 are arranged with the cooling plate 11 integrated in the power component 10, which can be made of metal, for example, on the soldering surface 12 of a printed circuit board 13.
  • the printed circuit board 13 is constructed in multiple layers as a so-called multilayer board. It consists of several layers 14, 15, 16 made of electrical insulating material, for example glass fabric.
  • a copper layer 21 or 22 is arranged between each of these layers, ie between layers 14 and 15 or between layers 14 and 16.
  • another material that is good heat conductor and has electrically conductive properties would also be conceivable.
  • the wall of the plated-through holes 18 consists of a thin, heat-conducting and also electrically conductive layer 20.
  • an electrical insulation gap 19 is formed between the layer 17 and the layer 20 for the plated-through holes 18. This insulation path 19 is formed in a particularly simple manner in FIG. 1 by interrupting the connection between the layer 17 and the layer 20, ie the layer 17 and the layer 20 are not directly coupled to one another.
  • Layer 20 also lies like a tubular rivet on the surface of layers 14, 15, 16.
  • a via 18 for heat dissipation is formed on both sides of the power component 10, so that the intermediate layers 21, 22 extend through the printed circuit board 13 from the layer 20 of a via 18 to the layer 20 of the other via 18.
  • the power component 10 is surrounded by a plurality of plated-through holes 18 all around, ie in the shape of a frame.
  • a copper layer as the bottom layer 23 of the printed circuit board 13 connects the walls 20 of the plated-through holes 18 to one another.
  • the printed circuit board 13 is fastened on a cooling element or housing part, not shown in FIG. 1, which serves as a so-called heat sink for dissipating the heat.
  • a cooling element or housing part not shown in FIG. 1, which serves as a so-called heat sink for dissipating the heat.
  • heat sinks are mostly metallic and electrically leading to ground potential. The corresponding heat flow from the power component 10 to the heat sink is shown in FIG. 1 with the aid of arrows.
  • the printed circuit board 13a with the support surface 23a does not rest on the heat sink 35 over the whole area, but has only partial contact with the heat sink 35. This means that the printed circuit board 13a projects beyond the heat sink 35 .
  • the printed circuit board 13a is likewise designed as a multilayer printed circuit board, as a so-called multilayer.
  • the plated-through holes 18a are also formed laterally next to the power component 10a in the printed circuit board 13a.
  • the heat-conducting layer 17a is at least partially in contact with the heat-conducting layer 20a of the plated-through holes 18a.
  • the layer 17a on one side is connected to the layer 20a of the vias 18a formed there, while on the other side, ie on the right in FIG. 3, the layer 17a and the layer 20a of the vias 18a located there do not touch.
  • the necessary electrical insulation between the power component 10a and the heat sink 35 is now produced in that the heat-conducting layers 22a, 21a and 23a are mutually connected only to the layer 20a of the plated-through holes 18a, while on the other side there is no contact with the layer 20a. This in turn creates an electrical insulation path 19 between the power component 10a and the heat sink 35.
  • FIG. 1 In the exemplary embodiment according to FIG.
  • FIG. 5a shows a top view of the openings of the plated-through holes 18c and the layer 17c.
  • the electrical insulation gap 36a between the layer 17c and the layer 20c of the plated-through holes 18c is visible on the right side of FIG. 5. It can now be seen from FIG.
  • FIG. 5b shows that the electrical insulation gap 36b is between the layer 20c of the plated-through holes 18c and the layer 22c on the other side.
  • FIG. 5c shows that the insulation gap 36c is again shifted to the right side in the drawing and is located between the layer 21c and the layer 20c of the plated-through holes 18c.
  • the base plate 23c is now shown in FIG. 5d and the electrical insulation distance 36d to the layer 20c of the plated-through holes 18c located on the left side is visible. It can thus be seen that in each level and on each heat-conducting layer 21, 22, 23 there is at least one insulation section 19, 36.

Abstract

Un composant de puissance (10), dont la chaleur produite pendant le fonctionnement doit être enlevée, est placé sur une carte imprimée (13) par l'intermédiaire d'une surface de brasage (12). Pour enlever la chaleur, des contacts traversants (18), isolés électriquement par une section isolante (19), sont prévus en dehors de la zone de la surface de brasage (12). Ces zones de contacts traversants (18) permettent un bon contact thermique avec le puits de chaleur (35), par l'intermédiaire de la couche de fond (23) de la carte imprimée (13). La section isolante (19) assure la séparation électrique entre la surface d'appui du composant de puissance (10), qui conduit le potentiel électrique, et la surface métallique d'appui du puits de chaleur (35), qui conduit de manière générale un potentiel de terre. Des couches intermédiaires (21, 22) supplémentaires se trouvant déjà dans une carte imprimée (13) (multicouche) de conception classique, ainsi qu'éventuellement des contacts traversants (18) remplis d'étain, favorisent le transport de la chaleur du composant de puissance (10) au puits de chaleur (35).
EP94929471A 1993-10-21 1994-10-14 Dispositif constitue d'une carte imprimee Withdrawn EP0674827A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE4335946 1993-10-21
DE19934335946 DE4335946C2 (de) 1993-10-21 1993-10-21 Anordnung bestehend aus einer Leiterplatte
PCT/DE1994/001216 WO1995011580A1 (fr) 1993-10-21 1994-10-14 Dispositif constitue d'une carte imprimee

Publications (1)

Publication Number Publication Date
EP0674827A1 true EP0674827A1 (fr) 1995-10-04

Family

ID=6500690

Family Applications (1)

Application Number Title Priority Date Filing Date
EP94929471A Withdrawn EP0674827A1 (fr) 1993-10-21 1994-10-14 Dispositif constitue d'une carte imprimee

Country Status (4)

Country Link
EP (1) EP0674827A1 (fr)
JP (1) JPH08505013A (fr)
DE (1) DE4335946C2 (fr)
WO (1) WO1995011580A1 (fr)

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Publication number Priority date Publication date Assignee Title
DE10315768A1 (de) * 2003-04-07 2004-11-25 Siemens Ag Mehrlagige Leiterplatte
DE102005022062A1 (de) * 2005-05-12 2006-11-16 Conti Temic Microelectronic Gmbh Leiterplatte
DE102005063281A1 (de) * 2005-12-30 2007-07-05 Robert Bosch Gmbh Integriertes elektronisches Bauteil sowie Kühlvorrichtung für ein integriertes elektronisches Bauteil
DE102007029913A1 (de) 2007-06-28 2009-01-02 Robert Bosch Gmbh Elektrisches Steuergerät
US7808788B2 (en) 2007-06-29 2010-10-05 Delphi Technologies, Inc. Multi-layer electrically isolated thermal conduction structure for a circuit board assembly
JP2009277784A (ja) * 2008-05-13 2009-11-26 Toshiba Corp 部品内蔵プリント配線板、同配線板の製造方法および電子機器
JP2011086663A (ja) * 2009-10-13 2011-04-28 Calsonic Kansei Corp 多層基板の放熱構造
DE102010030525A1 (de) * 2010-06-25 2011-12-29 Zf Friedrichshafen Ag Elektronische Steuerbaugruppe
DE102010039550A1 (de) * 2010-08-20 2012-02-23 Zf Friedrichshafen Ag Steuermodul
DE102010043077A1 (de) * 2010-10-28 2011-11-17 Continental Automotive Gmbh Mehrlagiger Schaltungsträger
DE102011077206B4 (de) 2011-06-08 2019-01-31 Zf Friedrichshafen Ag Leiterplatte und Steuergerät für ein Getriebe eines Fahrzeugs mit der Leiterplatte
DE102014118080B4 (de) * 2014-12-08 2020-10-15 Infineon Technologies Ag Elektronisches Modul mit einem Wärmespreizer und Verfahren zur Herstellung davon
DE102015112031B4 (de) 2015-07-23 2017-08-17 Halla Visteon Climate Control Corporation Anordnung zur Verbesserung einer Strombelastbarkeit von Leiterbahnen
JP6652844B2 (ja) * 2016-01-26 2020-02-26 株式会社テクノ高槻 エアポンプ用の多層基板及びエアポンプ用の電子回路基板
JP6729044B2 (ja) * 2016-06-20 2020-07-22 大日本印刷株式会社 配線基板およびその製造方法、ならびに半導体装置の製造方法
DE102017109682A1 (de) * 2017-05-05 2018-11-08 Schaeffler Technologies AG & Co. KG Kühlkörper
AT519741B1 (de) * 2017-07-18 2018-10-15 Zkw Group Gmbh Thermische Kopplung von Kupferspreizflächen

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DE3505167A1 (de) * 1985-02-15 1986-08-28 GAS Gesellschaft für Antriebs- und Steuerungstechnik mbH & Co KG, 7742 St Georgen Linearantrieb
US4729061A (en) * 1985-04-29 1988-03-01 Advanced Micro Devices, Inc. Chip on board package for integrated circuit devices using printed circuit boards and means for conveying the heat to the opposite side of the package from the chip mounting side to permit the heat to dissipate therefrom
IT1201315B (it) * 1985-06-17 1989-01-27 M A S Ind Spa Metodo per assicurare il raffreddamento di componenti elettronici fissati su di un multistrato per circuiti stampati e multistrato realizzato secondo detto metodo
FR2620587B1 (fr) * 1987-09-16 1993-07-02 Telemecanique Electrique Circuit imprime equipe d'un drain thermique
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Title
See references of WO9511580A1 *

Also Published As

Publication number Publication date
WO1995011580A1 (fr) 1995-04-27
DE4335946C2 (de) 1997-09-11
JPH08505013A (ja) 1996-05-28
DE4335946A1 (de) 1995-04-27

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