WO2009038042A1 - 積層実装構造体及び積層実装構造体の製造方法 - Google Patents

積層実装構造体及び積層実装構造体の製造方法 Download PDF

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Publication number
WO2009038042A1
WO2009038042A1 PCT/JP2008/066655 JP2008066655W WO2009038042A1 WO 2009038042 A1 WO2009038042 A1 WO 2009038042A1 JP 2008066655 W JP2008066655 W JP 2008066655W WO 2009038042 A1 WO2009038042 A1 WO 2009038042A1
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WIPO (PCT)
Prior art keywords
mounting structure
laminated mounting
laminated
main surface
component
Prior art date
Application number
PCT/JP2008/066655
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English (en)
French (fr)
Inventor
Mikio Nakamura
Yu Kondo
Original Assignee
Olympus Corporation
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Filing date
Publication date
Application filed by Olympus Corporation filed Critical Olympus Corporation
Priority to EP08832607.9A priority Critical patent/EP2194576B1/en
Priority to US12/678,855 priority patent/US20100202126A1/en
Priority to CN2008801075629A priority patent/CN101803020B/zh
Publication of WO2009038042A1 publication Critical patent/WO2009038042A1/ja
Priority to US13/668,982 priority patent/US10244639B2/en

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Combinations Of Printed Boards (AREA)
  • Wire Bonding (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

　狭ピッチ化を実現できるとともに、被実装部品を実装することのできる高さを確保することのできる積層実装構造体及び積層実装構造体の製造方法を提供する。 　少なくとも一方の主面上に被実装部品を設置、動作するために必要な実装領域、及び、被実装部品が動作するための信号伝達のための接続用領域、を備える複数の部材と、対向する部材との間の接続用領域に配置された導電部材と、を有し、導電部材の断面は、接続用領域と同じ又はそれより小さく、導電部材の端部は一方の部材主面から他方の部材主面に達し、導電部材の高さは、実装領域の間隔を規定する。
PCT/JP2008/066655 2007-09-18 2008-09-16 積層実装構造体及び積層実装構造体の製造方法 WO2009038042A1 (ja)

Priority Applications (4)

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EP08832607.9A EP2194576B1 (en) 2007-09-18 2008-09-16 Method for manufacturing a stacked mounting structure
US12/678,855 US20100202126A1 (en) 2007-09-18 2008-09-16 Stacked Mounting Structure and Method of Manufacturing Stacked Mounting Structure
CN2008801075629A CN101803020B (zh) 2007-09-18 2008-09-16 叠层安装结构体和叠层安装结构体的制造方法
US13/668,982 US10244639B2 (en) 2007-09-18 2012-11-05 Method of manufacturing stacked mounting structure

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JP2007240785 2007-09-18
JP2007-240785 2007-09-18
JP2008091636A JP2009094457A (ja) 2007-09-18 2008-03-31 積層実装構造体及び積層実装構造体の製造方法
JP2008-091636 2008-03-31

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US12/678,855 A-371-Of-International US20100202126A1 (en) 2007-09-18 2008-09-16 Stacked Mounting Structure and Method of Manufacturing Stacked Mounting Structure
US13/668,982 Division US10244639B2 (en) 2007-09-18 2012-11-05 Method of manufacturing stacked mounting structure

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US20130133190A1 (en) 2013-05-30
JP2009094457A (ja) 2009-04-30
EP2194576A4 (en) 2010-10-06
US20100202126A1 (en) 2010-08-12
CN101803020A (zh) 2010-08-11
CN101803020B (zh) 2012-05-23
US10244639B2 (en) 2019-03-26
EP2194576B1 (en) 2017-12-06
EP2194576A1 (en) 2010-06-09

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