WO2009034857A1 - Film pour transfert de film métallique et film adhésif avec film métallique - Google Patents

Film pour transfert de film métallique et film adhésif avec film métallique Download PDF

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Publication number
WO2009034857A1
WO2009034857A1 PCT/JP2008/065523 JP2008065523W WO2009034857A1 WO 2009034857 A1 WO2009034857 A1 WO 2009034857A1 JP 2008065523 W JP2008065523 W JP 2008065523W WO 2009034857 A1 WO2009034857 A1 WO 2009034857A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
film
metal
copper
metal film
Prior art date
Application number
PCT/JP2008/065523
Other languages
English (en)
Japanese (ja)
Inventor
Hirohisa Narahashi
Shigeo Nakamura
Tadahiko Yokota
Original Assignee
Ajinomoto Co., Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Co., Inc. filed Critical Ajinomoto Co., Inc.
Priority to JP2009532136A priority Critical patent/JPWO2009034857A1/ja
Publication of WO2009034857A1 publication Critical patent/WO2009034857A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/421—Blind plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0392—Pretreatment of metal, e.g. before finish plating, etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

Cette invention concerne un film pour un transfert de film métallique et un procédé pour produire une carte de circuit à l'aide d'un film pour transfert de film métallique, qui peuvent réaliser une élimination satisfaisante d'un résidu (déglaçage) présent sur le fond d'un trou d'interconnexion. Le film pour un transfert de film métallique est un film (10) pour un transfert de film métallique comprenant une première couche métallique (2) résistante à un liquide de gravure du cuivre et une seconde couche métallique (3) de cuivre ou d'un alliage de cuivre formées dans cet ordre sur une couche de support (1). Le procédé pour produire une carte de circuit comprend l'étape de préparation d'une carte comprenant une couche de cuivre ou une couche d'alliage de cuivre (un câblage) et une couche de composition de résine durcissable disposée en tant que couche de surface sur la couche de cuivre ou d'alliage de cuivre, superposition et empilage d'un film (10) pour un transfert de film métallique sur la carte, de telle sorte qu'une seconde couche métallique (3) est amenée en contact avec la couche de composition de résine durcissable, et durcissement de la couche de composition de résine durcissable, l'étape de séparation de la couche de support (1), l'étape de formation de trous d'interconnexion par un faisceau laser, l'étape d'élimination d'un résidu de fond de trou d'interconnexion, et l'étape de gravure de la surface de la couche de cuivre ou couche d'alliage de cuivre de substrat de fond de trou d'interconnexion.
PCT/JP2008/065523 2007-09-11 2008-08-29 Film pour transfert de film métallique et film adhésif avec film métallique WO2009034857A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009532136A JPWO2009034857A1 (ja) 2007-09-11 2008-08-29 金属膜転写用フィルム及び金属膜付き接着フィルム

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007236001 2007-09-11
JP2007-236001 2007-09-11

Publications (1)

Publication Number Publication Date
WO2009034857A1 true WO2009034857A1 (fr) 2009-03-19

Family

ID=40451866

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/065523 WO2009034857A1 (fr) 2007-09-11 2008-08-29 Film pour transfert de film métallique et film adhésif avec film métallique

Country Status (3)

Country Link
JP (1) JPWO2009034857A1 (fr)
TW (1) TW200924965A (fr)
WO (1) WO2009034857A1 (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011025532A (ja) * 2009-07-24 2011-02-10 Ajinomoto Co Inc 金属膜付きフィルム
WO2014074558A2 (fr) 2012-11-08 2014-05-15 Toray Plastics (America) Inc. Film de transfert de métal de polyester libérable
JP2017123452A (ja) * 2016-01-04 2017-07-13 サムソン エレクトロ−メカニックス カンパニーリミテッド． 電子部品及びその製造方法
US10099462B2 (en) 2013-06-28 2018-10-16 Toray Plastics (America), Inc. Releasable polyester high gloss metal transfer film
KR101948111B1 (ko) * 2017-03-31 2019-02-15 (주)심텍 도금용 시드 구조물, 도금용 시드 구조물의 제조 방법, 및 도금용 시드 구조물을 이용하는 인쇄회로기판의 제조 방법
CN113966099A (zh) * 2021-06-30 2022-01-21 西安空间无线电技术研究所 一种适用于固放产品的微波集成电路薄膜加厚工艺
WO2023149007A1 (fr) * 2022-02-07 2023-08-10 尾池工業株式会社 Film électroconducteur pour substrat de circuit, et procédé de production de film électroconducteur pour substrat de circuit

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5625566B2 (ja) * 2009-07-14 2014-11-19 味の素株式会社 銅箔付き接着フィルム
KR102465117B1 (ko) * 2017-11-29 2022-11-11 주식회사 잉크테크 인쇄회로기판 제조방법
CN115261859B (zh) * 2022-08-11 2023-06-20 李祥庆 铜蚀刻液组合物及其制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000049459A (ja) * 1998-07-28 2000-02-18 Matsushita Electric Works Ltd 多層プリント配線板の製造方法
JP2001053420A (ja) * 1999-08-12 2001-02-23 Reiko Co Ltd プリント配線板用転写フイルムとそれを使用して得るプリント配線板及びその製造方法
JP2002301790A (ja) * 2001-02-01 2002-10-15 Toray Ind Inc 離型フィルム
JP2006245213A (ja) * 2005-03-02 2006-09-14 Shinko Electric Ind Co Ltd 配線基板の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000049459A (ja) * 1998-07-28 2000-02-18 Matsushita Electric Works Ltd 多層プリント配線板の製造方法
JP2001053420A (ja) * 1999-08-12 2001-02-23 Reiko Co Ltd プリント配線板用転写フイルムとそれを使用して得るプリント配線板及びその製造方法
JP2002301790A (ja) * 2001-02-01 2002-10-15 Toray Ind Inc 離型フィルム
JP2006245213A (ja) * 2005-03-02 2006-09-14 Shinko Electric Ind Co Ltd 配線基板の製造方法

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011025532A (ja) * 2009-07-24 2011-02-10 Ajinomoto Co Inc 金属膜付きフィルム
WO2014074558A2 (fr) 2012-11-08 2014-05-15 Toray Plastics (America) Inc. Film de transfert de métal de polyester libérable
EP2917910A4 (fr) * 2012-11-08 2017-02-22 Toray Plastics (America) , Inc. Film de transfert de métal de polyester libérable
US9630385B2 (en) 2012-11-08 2017-04-25 Toray Plastics (America), Inc. Releasable polyester metal transfer film
EP3332963A1 (fr) * 2012-11-08 2018-06-13 Toray Plastics (America) , Inc. Film de transfert de métal en polyester retirable
US10596794B2 (en) 2012-11-08 2020-03-24 Toray Plastics (America), Inc. Releasable polyester high gloss metal transfer film method
US10099462B2 (en) 2013-06-28 2018-10-16 Toray Plastics (America), Inc. Releasable polyester high gloss metal transfer film
JP2017123452A (ja) * 2016-01-04 2017-07-13 サムソン エレクトロ−メカニックス カンパニーリミテッド． 電子部品及びその製造方法
KR101948111B1 (ko) * 2017-03-31 2019-02-15 (주)심텍 도금용 시드 구조물, 도금용 시드 구조물의 제조 방법, 및 도금용 시드 구조물을 이용하는 인쇄회로기판의 제조 방법
CN113966099A (zh) * 2021-06-30 2022-01-21 西安空间无线电技术研究所 一种适用于固放产品的微波集成电路薄膜加厚工艺
WO2023149007A1 (fr) * 2022-02-07 2023-08-10 尾池工業株式会社 Film électroconducteur pour substrat de circuit, et procédé de production de film électroconducteur pour substrat de circuit

Also Published As

Publication number Publication date
TW200924965A (en) 2009-06-16
JPWO2009034857A1 (ja) 2010-12-24

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