WO2009028208A1 - ネガ型感光性材料、および回路基板 - Google Patents

ネガ型感光性材料、および回路基板 Download PDF

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Publication number
WO2009028208A1
WO2009028208A1 PCT/JP2008/002369 JP2008002369W WO2009028208A1 WO 2009028208 A1 WO2009028208 A1 WO 2009028208A1 JP 2008002369 W JP2008002369 W JP 2008002369W WO 2009028208 A1 WO2009028208 A1 WO 2009028208A1
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WO
WIPO (PCT)
Prior art keywords
photosensitive material
negative photosensitive
disclosed
circuit board
quaternary ammonium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/002369
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English (en)
French (fr)
Inventor
Jun Tokuhiro
Hiroyuki Sekino
Mitsuaki Chida
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Mitsui Chemicals Inc
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Mitsui Chemicals Inc
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Filing date
Publication date
Application filed by Mitsui Chemicals Inc filed Critical Mitsui Chemicals Inc
Priority to CN2008801038742A priority Critical patent/CN101784957B/zh
Priority to JP2009529998A priority patent/JPWO2009028208A1/ja
Publication of WO2009028208A1 publication Critical patent/WO2009028208A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

　本発明の目的は、熱線膨張係数が基板となる金属箔と同等であり、感度に優れ、且つアルカリ水溶液で現像可能なネガ型感光性材料、及び該ネガ型感光性材料を用いた回路基板を安価に提供することである。 　その解決手段は、下記一般式（Ｉ）の繰り返し単位を有するポリイミド前駆体１００重量部に対して、４級アンモニウム塩を５～３０重量部含有するネガ型感光性材料であって、前記４級アンモニウム塩が、活性光線の照射により３級アミンを発生する光塩基発生剤であり、かつ前記３級アミンは、分子中に窒素原子と酸素原子とをそれぞれ一以上含む、ネガ型感光性材料である。 ［式（Ｉ）において、Ｘは４価の脂肪族基又は４価の芳香族基であり、Ｙは２価の脂肪族基又は２価の芳香族基である］
PCT/JP2008/002369 2007-08-30 2008-08-29 ネガ型感光性材料、および回路基板 Ceased WO2009028208A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2008801038742A CN101784957B (zh) 2007-08-30 2008-08-29 负型感光性材料及电路基板
JP2009529998A JPWO2009028208A1 (ja) 2007-08-30 2008-08-29 ネガ型感光性材料、および回路基板

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US93577507P 2007-08-30 2007-08-30
US60/935,775 2007-08-30
JP2007226810 2007-08-31
JP2007-226810 2007-08-31

Publications (1)

Publication Number Publication Date
WO2009028208A1 true WO2009028208A1 (ja) 2009-03-05

Family

ID=40386941

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/002369 Ceased WO2009028208A1 (ja) 2007-08-30 2008-08-29 ネガ型感光性材料、および回路基板

Country Status (2)

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JP (1) JPWO2009028208A1 (ja)
WO (1) WO2009028208A1 (ja)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009244745A (ja) * 2008-03-31 2009-10-22 Dainippon Printing Co Ltd 感光性樹脂組成物、およびこれを用いた物品、及びネガ型パターン形成方法
JP2012025710A (ja) * 2010-07-27 2012-02-09 Wako Pure Chem Ind Ltd 光塩基発生剤
JP2012027364A (ja) * 2010-07-27 2012-02-09 Dainippon Printing Co Ltd 感光性樹脂組成物、およびこれを用いた物品、及びレリーフパターンの製造方法
JP2012093746A (ja) * 2010-09-30 2012-05-17 Dainippon Printing Co Ltd 感光性樹脂組成物、パターン形成用材料及びパターン形成方法
WO2013051213A1 (ja) * 2011-10-05 2013-04-11 日立化成デュポンマイクロシステムズ株式会社 高透明ポリイミド
WO2014017618A1 (en) * 2012-07-27 2014-01-30 Fujifilm Corporation Actinic ray-sensitive or radiation-sensitive resin composition, resist film using the same, pattern forming method, and method for manufacturing electronic device and electronic device using the same
WO2015019802A1 (ja) * 2013-08-09 2015-02-12 太陽ホールディングス株式会社 感光性樹脂組成物、そのレリーフパターン膜、レリーフパターン膜の製造方法、レリーフパターン膜を含む電子部品又は光学製品、及び感光性樹脂組成物を含む接着剤
WO2015146949A1 (ja) * 2014-03-27 2015-10-01 富士フイルム株式会社 感光性樹脂組成物、硬化膜、硬化膜の製造方法および半導体デバイス
JP2016130836A (ja) * 2015-01-13 2016-07-21 太陽ホールディングス株式会社 感光性樹脂組成物、そのドライフィルム及び硬化物、硬化物を含む電子部品又は光学製品、並びに感光性樹脂組成物を含む接着剤
WO2024203918A1 (ja) * 2023-03-29 2024-10-03 富士フイルム株式会社 樹脂組成物、再配線層用層間絶縁膜の製造方法、及び樹脂
WO2024203915A1 (ja) * 2023-03-29 2024-10-03 富士フイルム株式会社 樹脂組成物、再配線層用層間絶縁膜の製造方法、及び樹脂

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007119766A (ja) * 2005-09-30 2007-05-17 Dainippon Printing Co Ltd 感光性樹脂組成物及び物品
JP2007262276A (ja) * 2006-03-29 2007-10-11 Dainippon Printing Co Ltd 感光性樹脂組成物、物品、及びネガ型パターン形成方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007119766A (ja) * 2005-09-30 2007-05-17 Dainippon Printing Co Ltd 感光性樹脂組成物及び物品
JP2007262276A (ja) * 2006-03-29 2007-10-11 Dainippon Printing Co Ltd 感光性樹脂組成物、物品、及びネガ型パターン形成方法

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009244745A (ja) * 2008-03-31 2009-10-22 Dainippon Printing Co Ltd 感光性樹脂組成物、およびこれを用いた物品、及びネガ型パターン形成方法
JP2012025710A (ja) * 2010-07-27 2012-02-09 Wako Pure Chem Ind Ltd 光塩基発生剤
JP2012027364A (ja) * 2010-07-27 2012-02-09 Dainippon Printing Co Ltd 感光性樹脂組成物、およびこれを用いた物品、及びレリーフパターンの製造方法
JP2016021068A (ja) * 2010-09-30 2016-02-04 大日本印刷株式会社 感光性樹脂組成物、パターン形成用材料及びパターン形成方法
JP2012093746A (ja) * 2010-09-30 2012-05-17 Dainippon Printing Co Ltd 感光性樹脂組成物、パターン形成用材料及びパターン形成方法
WO2013051213A1 (ja) * 2011-10-05 2013-04-11 日立化成デュポンマイクロシステムズ株式会社 高透明ポリイミド
WO2014017618A1 (en) * 2012-07-27 2014-01-30 Fujifilm Corporation Actinic ray-sensitive or radiation-sensitive resin composition, resist film using the same, pattern forming method, and method for manufacturing electronic device and electronic device using the same
JP2014026179A (ja) * 2012-07-27 2014-02-06 Fujifilm Corp 感活性光線性又は感放射線性樹脂組成物、これを用いたレジスト膜、パターン形成方法、並びに、これらを用いる電子デバイスの製造方法、及び、電子デバイス
WO2015019802A1 (ja) * 2013-08-09 2015-02-12 太陽ホールディングス株式会社 感光性樹脂組成物、そのレリーフパターン膜、レリーフパターン膜の製造方法、レリーフパターン膜を含む電子部品又は光学製品、及び感光性樹脂組成物を含む接着剤
JPWO2015019802A1 (ja) * 2013-08-09 2017-03-02 太陽ホールディングス株式会社 感光性樹脂組成物、そのレリーフパターン膜、レリーフパターン膜の製造方法、レリーフパターン膜を含む電子部品又は光学製品、及び感光性樹脂組成物を含む接着剤
KR101749874B1 (ko) 2013-08-09 2017-06-21 다이요 홀딩스 가부시키가이샤 감광성 수지 조성물, 그의 릴리프 패턴막, 릴리프 패턴막의 제조 방법, 릴리프 패턴막을 포함하는 전자 부품 또는 광학 제품, 및 감광성 수지 조성물을 포함하는 접착제
WO2015146949A1 (ja) * 2014-03-27 2015-10-01 富士フイルム株式会社 感光性樹脂組成物、硬化膜、硬化膜の製造方法および半導体デバイス
JP2016130836A (ja) * 2015-01-13 2016-07-21 太陽ホールディングス株式会社 感光性樹脂組成物、そのドライフィルム及び硬化物、硬化物を含む電子部品又は光学製品、並びに感光性樹脂組成物を含む接着剤
WO2024203918A1 (ja) * 2023-03-29 2024-10-03 富士フイルム株式会社 樹脂組成物、再配線層用層間絶縁膜の製造方法、及び樹脂
WO2024203915A1 (ja) * 2023-03-29 2024-10-03 富士フイルム株式会社 樹脂組成物、再配線層用層間絶縁膜の製造方法、及び樹脂

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