WO2009028208A1 - ネガ型感光性材料、および回路基板 - Google Patents
ネガ型感光性材料、および回路基板 Download PDFInfo
- Publication number
- WO2009028208A1 WO2009028208A1 PCT/JP2008/002369 JP2008002369W WO2009028208A1 WO 2009028208 A1 WO2009028208 A1 WO 2009028208A1 JP 2008002369 W JP2008002369 W JP 2008002369W WO 2009028208 A1 WO2009028208 A1 WO 2009028208A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- photosensitive material
- negative photosensitive
- disclosed
- circuit board
- quaternary ammonium
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0387—Polyamides or polyimides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Engineering & Computer Science (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Materials For Photolithography (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008801038742A CN101784957B (zh) | 2007-08-30 | 2008-08-29 | 负型感光性材料及电路基板 |
JP2009529998A JPWO2009028208A1 (ja) | 2007-08-30 | 2008-08-29 | ネガ型感光性材料、および回路基板 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US93577507P | 2007-08-30 | 2007-08-30 | |
US60/935,775 | 2007-08-30 | ||
JP2007226810 | 2007-08-31 | ||
JP2007-226810 | 2007-08-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009028208A1 true WO2009028208A1 (ja) | 2009-03-05 |
Family
ID=40386941
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/002369 WO2009028208A1 (ja) | 2007-08-30 | 2008-08-29 | ネガ型感光性材料、および回路基板 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPWO2009028208A1 (ja) |
WO (1) | WO2009028208A1 (ja) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009244745A (ja) * | 2008-03-31 | 2009-10-22 | Dainippon Printing Co Ltd | 感光性樹脂組成物、およびこれを用いた物品、及びネガ型パターン形成方法 |
JP2012027364A (ja) * | 2010-07-27 | 2012-02-09 | Dainippon Printing Co Ltd | 感光性樹脂組成物、およびこれを用いた物品、及びレリーフパターンの製造方法 |
JP2012025710A (ja) * | 2010-07-27 | 2012-02-09 | Wako Pure Chem Ind Ltd | 光塩基発生剤 |
JP2012093746A (ja) * | 2010-09-30 | 2012-05-17 | Dainippon Printing Co Ltd | 感光性樹脂組成物、パターン形成用材料及びパターン形成方法 |
WO2013051213A1 (ja) * | 2011-10-05 | 2013-04-11 | 日立化成デュポンマイクロシステムズ株式会社 | 高透明ポリイミド |
WO2014017618A1 (en) * | 2012-07-27 | 2014-01-30 | Fujifilm Corporation | Actinic ray-sensitive or radiation-sensitive resin composition, resist film using the same, pattern forming method, and method for manufacturing electronic device and electronic device using the same |
WO2015019802A1 (ja) * | 2013-08-09 | 2015-02-12 | 太陽ホールディングス株式会社 | 感光性樹脂組成物、そのレリーフパターン膜、レリーフパターン膜の製造方法、レリーフパターン膜を含む電子部品又は光学製品、及び感光性樹脂組成物を含む接着剤 |
WO2015146949A1 (ja) * | 2014-03-27 | 2015-10-01 | 富士フイルム株式会社 | 感光性樹脂組成物、硬化膜、硬化膜の製造方法および半導体デバイス |
JP2016130836A (ja) * | 2015-01-13 | 2016-07-21 | 太陽ホールディングス株式会社 | 感光性樹脂組成物、そのドライフィルム及び硬化物、硬化物を含む電子部品又は光学製品、並びに感光性樹脂組成物を含む接着剤 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007119766A (ja) * | 2005-09-30 | 2007-05-17 | Dainippon Printing Co Ltd | 感光性樹脂組成物及び物品 |
JP2007262276A (ja) * | 2006-03-29 | 2007-10-11 | Dainippon Printing Co Ltd | 感光性樹脂組成物、物品、及びネガ型パターン形成方法 |
-
2008
- 2008-08-29 WO PCT/JP2008/002369 patent/WO2009028208A1/ja active Application Filing
- 2008-08-29 JP JP2009529998A patent/JPWO2009028208A1/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007119766A (ja) * | 2005-09-30 | 2007-05-17 | Dainippon Printing Co Ltd | 感光性樹脂組成物及び物品 |
JP2007262276A (ja) * | 2006-03-29 | 2007-10-11 | Dainippon Printing Co Ltd | 感光性樹脂組成物、物品、及びネガ型パターン形成方法 |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009244745A (ja) * | 2008-03-31 | 2009-10-22 | Dainippon Printing Co Ltd | 感光性樹脂組成物、およびこれを用いた物品、及びネガ型パターン形成方法 |
JP2012027364A (ja) * | 2010-07-27 | 2012-02-09 | Dainippon Printing Co Ltd | 感光性樹脂組成物、およびこれを用いた物品、及びレリーフパターンの製造方法 |
JP2012025710A (ja) * | 2010-07-27 | 2012-02-09 | Wako Pure Chem Ind Ltd | 光塩基発生剤 |
JP2016021068A (ja) * | 2010-09-30 | 2016-02-04 | 大日本印刷株式会社 | 感光性樹脂組成物、パターン形成用材料及びパターン形成方法 |
JP2012093746A (ja) * | 2010-09-30 | 2012-05-17 | Dainippon Printing Co Ltd | 感光性樹脂組成物、パターン形成用材料及びパターン形成方法 |
WO2013051213A1 (ja) * | 2011-10-05 | 2013-04-11 | 日立化成デュポンマイクロシステムズ株式会社 | 高透明ポリイミド |
WO2014017618A1 (en) * | 2012-07-27 | 2014-01-30 | Fujifilm Corporation | Actinic ray-sensitive or radiation-sensitive resin composition, resist film using the same, pattern forming method, and method for manufacturing electronic device and electronic device using the same |
JP2014026179A (ja) * | 2012-07-27 | 2014-02-06 | Fujifilm Corp | 感活性光線性又は感放射線性樹脂組成物、これを用いたレジスト膜、パターン形成方法、並びに、これらを用いる電子デバイスの製造方法、及び、電子デバイス |
WO2015019802A1 (ja) * | 2013-08-09 | 2015-02-12 | 太陽ホールディングス株式会社 | 感光性樹脂組成物、そのレリーフパターン膜、レリーフパターン膜の製造方法、レリーフパターン膜を含む電子部品又は光学製品、及び感光性樹脂組成物を含む接着剤 |
JPWO2015019802A1 (ja) * | 2013-08-09 | 2017-03-02 | 太陽ホールディングス株式会社 | 感光性樹脂組成物、そのレリーフパターン膜、レリーフパターン膜の製造方法、レリーフパターン膜を含む電子部品又は光学製品、及び感光性樹脂組成物を含む接着剤 |
KR101749874B1 (ko) | 2013-08-09 | 2017-06-21 | 다이요 홀딩스 가부시키가이샤 | 감광성 수지 조성물, 그의 릴리프 패턴막, 릴리프 패턴막의 제조 방법, 릴리프 패턴막을 포함하는 전자 부품 또는 광학 제품, 및 감광성 수지 조성물을 포함하는 접착제 |
WO2015146949A1 (ja) * | 2014-03-27 | 2015-10-01 | 富士フイルム株式会社 | 感光性樹脂組成物、硬化膜、硬化膜の製造方法および半導体デバイス |
JP2016130836A (ja) * | 2015-01-13 | 2016-07-21 | 太陽ホールディングス株式会社 | 感光性樹脂組成物、そのドライフィルム及び硬化物、硬化物を含む電子部品又は光学製品、並びに感光性樹脂組成物を含む接着剤 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2009028208A1 (ja) | 2010-11-25 |
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