WO2009017073A1 - ポリイミドフィルムおよび配線基板 - Google Patents

ポリイミドフィルムおよび配線基板 Download PDF

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Publication number
WO2009017073A1
WO2009017073A1 PCT/JP2008/063450 JP2008063450W WO2009017073A1 WO 2009017073 A1 WO2009017073 A1 WO 2009017073A1 JP 2008063450 W JP2008063450 W JP 2008063450W WO 2009017073 A1 WO2009017073 A1 WO 2009017073A1
Authority
WO
WIPO (PCT)
Prior art keywords
polyimide film
wiring board
wiring
metal layer
film
Prior art date
Application number
PCT/JP2008/063450
Other languages
English (en)
French (fr)
Inventor
Hiroaki Yamaguchi
Tadahiro Yokozawa
Shuichi Maeda
Original Assignee
Ube Industries, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ube Industries, Ltd. filed Critical Ube Industries, Ltd.
Priority to US12/671,011 priority Critical patent/US20100252309A1/en
Priority to JP2009525382A priority patent/JP5552811B2/ja
Priority to CN200880108624.8A priority patent/CN101808791B/zh
Priority to KR1020107004500A priority patent/KR101242342B1/ko
Publication of WO2009017073A1 publication Critical patent/WO2009017073A1/ja
Priority to US13/557,619 priority patent/US20120288621A1/en
Priority to US14/542,375 priority patent/US20150069012A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/068—Apparatus for etching printed circuits
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2079/00—Use of polymers having nitrogen, with or without oxygen or carbon only, in the main chain, not provided for in groups B29K2061/00 - B29K2077/00, as moulding material
    • B29K2079/08—PI, i.e. polyimides or derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Wire Bonding (AREA)
  • Moulding By Coating Moulds (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

　本発明のポリイミドフィルムは、片面（Ｂ面）に金属層を積層し、エッチングすることによって金属配線を形成した配線基板の製造に使用されるポリイミドフィルムであって、Ｂ面の反対側の面（Ａ面）側にカールしており、配線基板の金属配線形成時の垂れが減少するように、このポリイミドフィルムのカールが制御されており、このポリイミドフィルムを使用することにより、ＩＣチップを実装する際のハンドリング性・生産性を向上させることができる。
PCT/JP2008/063450 2007-07-27 2008-07-25 ポリイミドフィルムおよび配線基板 WO2009017073A1 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
US12/671,011 US20100252309A1 (en) 2007-07-27 2008-07-25 Polyimide film and wiring board
JP2009525382A JP5552811B2 (ja) 2007-07-27 2008-07-25 ポリイミドフィルムおよび配線基板
CN200880108624.8A CN101808791B (zh) 2007-07-27 2008-07-25 聚酰亚胺膜和配线板
KR1020107004500A KR101242342B1 (ko) 2007-07-27 2008-07-25 폴리이미드 필름 및 배선 기판
US13/557,619 US20120288621A1 (en) 2007-07-27 2012-07-25 Polyimide film and wiring board
US14/542,375 US20150069012A1 (en) 2007-07-27 2014-11-14 Polyimide film and wiring board

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-196695 2007-07-27
JP2007196695 2007-07-27

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US12/671,011 A-371-Of-International US20100252309A1 (en) 2007-07-27 2008-07-25 Polyimide film and wiring board
US13/557,619 Division US20120288621A1 (en) 2007-07-27 2012-07-25 Polyimide film and wiring board

Publications (1)

Publication Number Publication Date
WO2009017073A1 true WO2009017073A1 (ja) 2009-02-05

Family

ID=40304304

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/063450 WO2009017073A1 (ja) 2007-07-27 2008-07-25 ポリイミドフィルムおよび配線基板

Country Status (6)

Country Link
US (3) US20100252309A1 (ja)
JP (1) JP5552811B2 (ja)
KR (1) KR101242342B1 (ja)
CN (1) CN101808791B (ja)
TW (1) TWI441573B (ja)
WO (1) WO2009017073A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102623362A (zh) * 2011-12-29 2012-08-01 上海新傲科技股份有限公司 三维封装方法以及封装体
US20120231258A1 (en) * 2011-03-08 2012-09-13 Xerox Corporation Fuser member
JP2012211221A (ja) * 2011-03-30 2012-11-01 Ube Industries Ltd ポリイミドフィルムの製造方法、およびポリイミドフィルム
WO2012173204A1 (ja) * 2011-06-14 2012-12-20 宇部興産株式会社 ポリイミド積層体の製造方法、およびポリイミド積層体

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2502955A4 (en) 2009-11-20 2013-05-01 Ube Industries AROMATIC POLYIMIDE FILM, LAMINATE THEREOF AND SOLAR CELL THEREWITH
KR101892783B1 (ko) * 2011-06-14 2018-08-28 우베 고산 가부시키가이샤 폴리이미드 적층체의 제조 방법, 및 폴리이미드 적층체
CN102493015A (zh) * 2011-12-05 2012-06-13 江西先材纳米纤维科技有限公司 一种高强度耐高温聚酰亚胺粗纤维的制备方法
KR20150144174A (ko) * 2014-06-16 2015-12-24 삼성전자주식회사 반도체 패키지
JP6880723B2 (ja) * 2016-12-27 2021-06-02 住友金属鉱山株式会社 両面金属積層板、両面金属積層板の製造方法、及びパターンの画像転写方法
CN108682665B (zh) * 2018-05-16 2019-06-18 清华大学 可拉伸的柔性电子器件的制造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62282486A (ja) * 1986-05-30 1987-12-08 日東電工株式会社 フレキシブルプリント基板
JP2006124685A (ja) * 2004-09-29 2006-05-18 Ube Ind Ltd Ｃｏｆ用ポリイミドフィルムおよび積層体
JP2006299198A (ja) * 2005-04-25 2006-11-02 Toyobo Co Ltd ポリイミドフィルムおよび複合フィルム

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60206639A (ja) * 1984-03-31 1985-10-18 日東電工株式会社 ポリイミド−金属箔複合フイルムの製造方法
US5460890A (en) * 1991-10-30 1995-10-24 E. I. Du Pont De Nemours And Company Biaxially stretched isotropic polyimide film having specific properties
JPH11274687A (ja) * 1998-03-20 1999-10-08 Sony Chem Corp フレキシブルプリント配線板の製造方法
WO2003009657A1 (en) * 2001-07-19 2003-01-30 Toray Industries, Inc. Circuit board, circuit board-use member and production method therefor and method of laminating fexible film
WO2005063860A1 (ja) * 2003-12-26 2005-07-14 Toyo Boseki Kabushiki Kaisha ポリイミドフィルム
KR20060051831A (ko) * 2004-09-29 2006-05-19 우베 고산 가부시키가이샤 폴리이미드 필름 및 폴리이미드 복합 시트
JP2006291157A (ja) * 2005-03-14 2006-10-26 Toyobo Co Ltd ポリイミドフィルムロールの製造方法
US8415024B2 (en) * 2005-04-07 2013-04-09 Ube Industries, Ltd. Process for producing polyimide film, and polyimide film
JP2006299196A (ja) * 2005-04-25 2006-11-02 Toyobo Co Ltd ポリイミドフィルムおよび複合フィルム

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62282486A (ja) * 1986-05-30 1987-12-08 日東電工株式会社 フレキシブルプリント基板
JP2006124685A (ja) * 2004-09-29 2006-05-18 Ube Ind Ltd Ｃｏｆ用ポリイミドフィルムおよび積層体
JP2006299198A (ja) * 2005-04-25 2006-11-02 Toyobo Co Ltd ポリイミドフィルムおよび複合フィルム

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120231258A1 (en) * 2011-03-08 2012-09-13 Xerox Corporation Fuser member
JP2012211221A (ja) * 2011-03-30 2012-11-01 Ube Industries Ltd ポリイミドフィルムの製造方法、およびポリイミドフィルム
WO2012173204A1 (ja) * 2011-06-14 2012-12-20 宇部興産株式会社 ポリイミド積層体の製造方法、およびポリイミド積層体
JPWO2012173204A1 (ja) * 2011-06-14 2015-02-23 宇部興産株式会社 ポリイミド積層体の製造方法、およびポリイミド積層体
CN102623362A (zh) * 2011-12-29 2012-08-01 上海新傲科技股份有限公司 三维封装方法以及封装体

Also Published As

Publication number Publication date
US20120288621A1 (en) 2012-11-15
KR101242342B1 (ko) 2013-03-11
US20150069012A1 (en) 2015-03-12
JP5552811B2 (ja) 2014-07-16
JPWO2009017073A1 (ja) 2010-10-21
TW200906236A (en) 2009-02-01
CN101808791B (zh) 2016-01-20
US20100252309A1 (en) 2010-10-07
CN101808791A (zh) 2010-08-18
TWI441573B (zh) 2014-06-11
KR20100050529A (ko) 2010-05-13

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