WO2009005029A1 - 樹脂製ヒートシンク - Google Patents

樹脂製ヒートシンク Download PDF

Info

Publication number
WO2009005029A1
WO2009005029A1 PCT/JP2008/061827 JP2008061827W WO2009005029A1 WO 2009005029 A1 WO2009005029 A1 WO 2009005029A1 JP 2008061827 W JP2008061827 W JP 2008061827W WO 2009005029 A1 WO2009005029 A1 WO 2009005029A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat sink
vol
resin heat
resin material
resin
Prior art date
Application number
PCT/JP2008/061827
Other languages
English (en)
French (fr)
Inventor
Yoshimitsu Kankawa
Original Assignee
Starlite Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Starlite Co., Ltd. filed Critical Starlite Co., Ltd.
Priority to CN2008800224768A priority Critical patent/CN101720569B/zh
Priority to KR1020097026754A priority patent/KR101408978B1/ko
Publication of WO2009005029A1 publication Critical patent/WO2009005029A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/06—Constructions of heat-exchange apparatus characterised by the selection of particular materials of plastics material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Soft Magnetic Materials (AREA)

Abstract

　放熱効果に優れたヒートシンクであって、電磁波遮蔽性に優れた樹脂材料からなるヒートシンクを提供することを課題とする。 　樹脂材料からなるヒートシンクであって、前記樹脂材料は、樹脂中に（ａ）炭素材料と（ｂ）セラミックス粉末および／または軟磁性粉末とが均一に分散されており、且つ当該樹脂材料中における（ａ）の割合が１５～６０体積％であり、（ｂ）の割合が５～４０体積％であり、（ａ）と（ｂ）の総和が２０～８０体積％であることを特徴とする。
PCT/JP2008/061827 2007-07-02 2008-06-30 樹脂製ヒートシンク WO2009005029A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2008800224768A CN101720569B (zh) 2007-07-02 2008-06-30 树脂制散热器
KR1020097026754A KR101408978B1 (ko) 2007-07-02 2008-06-30 수지제 히트싱크

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-173747 2007-07-02
JP2007173747A JP4631877B2 (ja) 2007-07-02 2007-07-02 樹脂製ヒートシンク

Publications (1)

Publication Number Publication Date
WO2009005029A1 true WO2009005029A1 (ja) 2009-01-08

Family

ID=40226074

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/061827 WO2009005029A1 (ja) 2007-07-02 2008-06-30 樹脂製ヒートシンク

Country Status (4)

Country Link
JP (1) JP4631877B2 (ja)
KR (1) KR101408978B1 (ja)
CN (1) CN101720569B (ja)
WO (1) WO2009005029A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011095919A1 (en) * 2010-02-05 2011-08-11 Koninklijke Philips Electronics N.V. Thermal management component for led lighting
EP2322708A3 (de) * 2009-11-13 2013-06-12 BSH Bosch und Siemens Hausgeräte GmbH Hausgerät mit Wärmetauscher aus thermoplastischem Kunststoff enthaltendem Werkstoff, sowie solcher Wärmetauscher
RU2488244C1 (ru) * 2012-06-05 2013-07-20 Федеральное государственное унитарное предприятие "Московское опытно-конструкторское бюро "Марс" (ФГУП МОКБ "Марс") Способ повышения теплоотдачи и радиационной защиты электронных блоков

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10340424B2 (en) 2002-08-30 2019-07-02 GE Lighting Solutions, LLC Light emitting diode component
JP5683799B2 (ja) * 2009-09-14 2015-03-11 スターライト工業株式会社 自動車用ｌｅｄ用ヒートシンク
DE102009045063C5 (de) * 2009-09-28 2017-06-01 Infineon Technologies Ag Leistungshalbleitermodul mit angespritztem Kühlkörper, Leistungshalbleitermodulsystem und Verfahren zur Herstellung eines Leistungshalbleitermoduls
US8593040B2 (en) 2009-10-02 2013-11-26 Ge Lighting Solutions Llc LED lamp with surface area enhancing fins
JP2013524439A (ja) * 2010-04-02 2013-06-17 ジーイー ライティング ソリューションズ エルエルシー 軽量ヒートシンク及びそれを使用するｌｅｄランプ
KR101223485B1 (ko) * 2010-11-12 2013-01-17 한국과학기술연구원 복합 기능성 방열 입자와 이를 포함하는 구조체 및 필름, 및 그 제조방법
JP2012186384A (ja) * 2011-03-07 2012-09-27 Tdk Corp 電磁ノイズ抑制部材
WO2013012685A2 (en) * 2011-07-15 2013-01-24 Polyone Corporation Polyamide compounds containing pitch carbon fiber
JP2013036720A (ja) * 2011-08-11 2013-02-21 Sharp Corp 空気調和機
JP2013089718A (ja) * 2011-10-17 2013-05-13 Kaneka Corp 高熱伝導性樹脂を用いたヒートシンク及びｌｅｄ光源
US9500355B2 (en) 2012-05-04 2016-11-22 GE Lighting Solutions, LLC Lamp with light emitting elements surrounding active cooling device
CN102651961B (zh) * 2012-05-29 2016-02-03 安顿雷纳(上海)纤维材料科技有限公司 一种导热散热界面材料及其制造方法
US20140104284A1 (en) * 2012-10-16 2014-04-17 Qualcomm Mems Technologies, Inc. Through substrate via inductors
JP2014067728A (ja) * 2013-12-17 2014-04-17 Starlite Co Ltd 自動車用ｌｅｄランプ
CN105742252B (zh) * 2014-12-09 2019-05-07 台达电子工业股份有限公司 一种功率模块及其制造方法
CN105061999A (zh) * 2015-08-06 2015-11-18 殷姝媛 一种高导热性能高分子复合材料
CN105062000A (zh) * 2015-08-06 2015-11-18 殷姝媛 一种高导热性能高分子复合材料的制备方法
JP7212451B2 (ja) * 2018-02-16 2023-01-25 三井化学株式会社 金属樹脂接合板、筐体および電子装置
JPWO2020070863A1 (ja) * 2018-10-04 2021-09-02 昭和電工マテリアルズ株式会社 放熱材、放熱材の製造方法、組成物及び発熱体
KR20200097384A (ko) 2019-02-07 2020-08-19 원광희 발열사 및 이의 제조방법
JP7391761B2 (ja) * 2020-05-15 2023-12-05 キヤノン株式会社 電源装置及び画像形成装置
CN112497595A (zh) * 2020-11-12 2021-03-16 西安紫光国芯半导体有限公司 一种柔性散热外壳的制备方法及其应用
WO2022260194A1 (ko) * 2021-06-10 2022-12-15 주식회사 씨엔와이더스 탄소 소재를 이용한 히트 싱크를 포함하는 led 조명 모듈

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1092988A (ja) * 1996-09-12 1998-04-10 Tokin Corp ヒートシンク及び放熱シート
JP2000124369A (ja) * 1998-10-15 2000-04-28 Mitsubishi Chemicals Corp 放熱部材
JP2001294676A (ja) * 2000-04-13 2001-10-23 Jsr Corp 熱伝導性シート、熱伝導性シートの製造方法および熱伝導性シートを用いた放熱構造
JP2002064168A (ja) * 2000-08-17 2002-02-28 Toshiba Eng Co Ltd 冷却装置、冷却装置の製造方法および半導体装置
JP2002088250A (ja) * 2000-09-12 2002-03-27 Polymatech Co Ltd 熱伝導性高分子組成物及び熱伝導性成形体
JP2002184916A (ja) * 2000-12-15 2002-06-28 Kitagawa Ind Co Ltd 多機能シート及びその製造方法
JP2004207690A (ja) * 2002-12-13 2004-07-22 Usui Kokusai Sangyo Kaisha Ltd 樹脂材製ヒートシンク
JP2004528717A (ja) * 2001-04-30 2004-09-16 サーモ コムポジット、エルエルシー 熱管理材料、デバイスおよび方法
JP2004315761A (ja) * 2003-04-21 2004-11-11 Hitachi Metals Ltd 放熱体
JP2004349685A (ja) * 2003-04-14 2004-12-09 Integral Technologies Inc 導電性フィラー充填樹脂系材料で製作した低コストの熱管理デバイスであるヒートシンク
JP2006086471A (ja) * 2004-09-17 2006-03-30 Yaskawa Electric Corp 放熱フィンおよびその製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005146057A (ja) * 2003-11-12 2005-06-09 Polymatech Co Ltd 高熱伝導性成形体及びその製造方法

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1092988A (ja) * 1996-09-12 1998-04-10 Tokin Corp ヒートシンク及び放熱シート
JP2000124369A (ja) * 1998-10-15 2000-04-28 Mitsubishi Chemicals Corp 放熱部材
JP2001294676A (ja) * 2000-04-13 2001-10-23 Jsr Corp 熱伝導性シート、熱伝導性シートの製造方法および熱伝導性シートを用いた放熱構造
JP2002064168A (ja) * 2000-08-17 2002-02-28 Toshiba Eng Co Ltd 冷却装置、冷却装置の製造方法および半導体装置
JP2002088250A (ja) * 2000-09-12 2002-03-27 Polymatech Co Ltd 熱伝導性高分子組成物及び熱伝導性成形体
JP2002184916A (ja) * 2000-12-15 2002-06-28 Kitagawa Ind Co Ltd 多機能シート及びその製造方法
JP2004528717A (ja) * 2001-04-30 2004-09-16 サーモ コムポジット、エルエルシー 熱管理材料、デバイスおよび方法
JP2004207690A (ja) * 2002-12-13 2004-07-22 Usui Kokusai Sangyo Kaisha Ltd 樹脂材製ヒートシンク
JP2004349685A (ja) * 2003-04-14 2004-12-09 Integral Technologies Inc 導電性フィラー充填樹脂系材料で製作した低コストの熱管理デバイスであるヒートシンク
JP2004315761A (ja) * 2003-04-21 2004-11-11 Hitachi Metals Ltd 放熱体
JP2006086471A (ja) * 2004-09-17 2006-03-30 Yaskawa Electric Corp 放熱フィンおよびその製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2322708A3 (de) * 2009-11-13 2013-06-12 BSH Bosch und Siemens Hausgeräte GmbH Hausgerät mit Wärmetauscher aus thermoplastischem Kunststoff enthaltendem Werkstoff, sowie solcher Wärmetauscher
WO2011095919A1 (en) * 2010-02-05 2011-08-11 Koninklijke Philips Electronics N.V. Thermal management component for led lighting
RU2488244C1 (ru) * 2012-06-05 2013-07-20 Федеральное государственное унитарное предприятие "Московское опытно-конструкторское бюро "Марс" (ФГУП МОКБ "Марс") Способ повышения теплоотдачи и радиационной защиты электронных блоков

Also Published As

Publication number Publication date
JP4631877B2 (ja) 2011-02-16
KR101408978B1 (ko) 2014-06-16
CN101720569B (zh) 2013-08-21
JP2009016415A (ja) 2009-01-22
CN101720569A (zh) 2010-06-02
KR20100027148A (ko) 2010-03-10

Similar Documents

Publication Publication Date Title
WO2009005029A1 (ja) 樹脂製ヒートシンク
WO2009075322A1 (ja) 樹脂炭素複合材料
EP1812487A4 (en) MODIFIED PHENOLIC NOVOLASE RESINS AND THEIR APPLICATIONS
EP2141137A4 (en) LOW-LOSS FERRITE AND ELECTRONIC COMPONENT USING THE SAME
ATE553792T1 (de) Medizinische vorrichtungen mit verbundstoffen
GB0705334D0 (en) Material and heating cable
GB2545832A (en) Magneto-dielectric substrate, circuit material, and assembly having the same
EP1816111A4 (en) LOSS-RELIABLE MN-ZN-FERRITE AND THIS USE ELECTRONIC COMPONENT, ELECTRONIC COMPONENT AND SWITCHGEAR
GB2460579A (en) Silylethynylated heteroacenes and electronic devices made therewith
HK1130438A1 (en) Using pi3k and mek modulators in treatments of cancer
EP2223969A4 (en) RESIN COMPOSITION, TRANSPARENT ELEMENT DERIVED FROM THE RESIN COMPOSITION AND USE
EP1826180A4 (en) COMPOSITE MATERIAL COMPOSED OF TRANSITION METAL NANOPARTICLES AND MAGNETIC FERRIC OXIDE, PROCESS FOR PREPARATION AND USES THEREOF
EP3468326A4 (en) FERRITE PARTICLES, RESIN COMPOSITION, AND ELECTROMAGNETIC WAVE DISPLAY MATERIAL.
EP2031020A4 (en) FLAME-RESISTANT AND LIGHT-BREATHING POLYCARBONATE RESIN COMPOSITIONS AND LIGHT SPREADING PLATE THEREOF
EP1710272A4 (en) RESIN DISPERSION AND RESIN PARTICLES
TW200643994A (en) Inductor and magnetic body thereof
MX2009007867A (es) Dispositivo de proteccion electromagnetica.
EP2136379A4 (en) FERRITE POWDER AND RESIN COMPOSITION FOR BONDED MAGNET AND MOLDED BODY COMPRISING THESE MATERIALS
EP2394761A4 (en) RARE EARTH MAGNETIC POWDER HAVING SURFACE TREATMENT, BONDED MAGNET RESIN COMPOSITION INCLUDING RARE EARTH MAGNETIC POWDER, AND BONDED MAGNET
DE602006001510D1 (de) Festes, teilchenförmiges tadalafil mit bimodaler teilchengrössenverteilung
SG10201504278QA (en) Magnetic disk substrate, magnetic disk, and magnetic disk device
EP2109890A4 (en) MOSFET CIRCUIT WITH DEPTH MODE AND APPLICATIONS
WO2008112290A3 (en) Use of ephb4 as a diagnostic marker and a therapeutic target for ovarian cancer
EP3689825A4 (en) MN-ZN FERRITE PARTICLES, RESIN SHAPED BODIES, SOFT MAGNETIC MIXED POWDER AND MAGNETIC CORE
EP4043402A4 (en) FERRITE POWDER, FERRITE RESIN COMPOSITE MATERIAL AND ELECTROMAGNETIC SHIELDING MATERIAL, ELECTRONIC MATERIAL OR ELECTRONIC COMPONENT

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880022476.8

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08790740

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 20097026754

Country of ref document: KR

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08790740

Country of ref document: EP

Kind code of ref document: A1