WO2008149730A1 - ポジ型感光性樹脂組成物及びポリヒドロキシアミド樹脂 - Google Patents

ポジ型感光性樹脂組成物及びポリヒドロキシアミド樹脂 Download PDF

Info

Publication number
WO2008149730A1
WO2008149730A1 PCT/JP2008/059726 JP2008059726W WO2008149730A1 WO 2008149730 A1 WO2008149730 A1 WO 2008149730A1 JP 2008059726 W JP2008059726 W JP 2008059726W WO 2008149730 A1 WO2008149730 A1 WO 2008149730A1
Authority
WO
WIPO (PCT)
Prior art keywords
positive photosensitive
resin composition
photosensitive resin
polyhydroxyamide
aromatic group
Prior art date
Application number
PCT/JP2008/059726
Other languages
English (en)
French (fr)
Inventor
Kazuya Ebara
Hideo Suzuki
Takayuki Tamura
Original Assignee
Nissan Chemical Industries, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissan Chemical Industries, Ltd. filed Critical Nissan Chemical Industries, Ltd.
Priority to EP08764754A priority Critical patent/EP2159637A4/en
Priority to US12/451,906 priority patent/US20100119969A1/en
Priority to CN2008800183486A priority patent/CN101681099B/zh
Priority to KR1020107000073A priority patent/KR101522583B1/ko
Priority to JP2009517811A priority patent/JP5246441B2/ja
Publication of WO2008149730A1 publication Critical patent/WO2008149730A1/ja
Priority to US15/064,288 priority patent/US9975996B2/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
    • C08G69/28—Preparatory processes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
    • C08G69/265—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids from at least two different diamines or at least two different dicarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/40—Polyamides containing oxygen in the form of ether groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/42—Polyamides containing atoms other than carbon, hydrogen, oxygen, and nitrogen
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Materials For Photolithography (AREA)
  • Polyamides (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

【課題】電気絶縁性、耐熱性、機械的強度及び電気特性に優れ、かつ高解像回路パターン形成が可能なポジ型感光性樹脂組成物を提供する。 【解決手段】式（１）で表される繰り返し単位を含み、重量平均分子量が３０００乃至１０００００である少なくとも１種のポリヒドロキシアミド樹脂（Ａ）、及び、光により酸を発生する化合物（Ｂ）を含有することを特徴とするポジ型感光性樹脂組成物。 （式中、Ｘは４価の脂肪族基又は芳香族基を表し、Ｒ1及びＲ2はそれぞれ独立して水素原子又は炭素原子数１乃至１０のアルキル基を表し、Ａｒ1及びＡｒ2はそれぞれ独立して芳香族基を表し、Ｙは少なくとも１つのＯＨ基で置換された芳香族基を含む有機基を表し、ｎは１以上の整数を表し、ｌ及びｍはそれぞれ独立して０又は１以上の整数を表し、かつｌ＋ｍ≦２を満足する。）
PCT/JP2008/059726 2007-06-05 2008-05-27 ポジ型感光性樹脂組成物及びポリヒドロキシアミド樹脂 WO2008149730A1 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
EP08764754A EP2159637A4 (en) 2007-06-05 2008-05-27 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND POLYHYDROXYAMIDE RESIN
US12/451,906 US20100119969A1 (en) 2007-06-05 2008-05-27 Positive photosensitive resin composition and dpolyhydroxyamide resin
CN2008800183486A CN101681099B (zh) 2007-06-05 2008-05-27 正型感光性树脂组合物和聚羟基酰胺树脂
KR1020107000073A KR101522583B1 (ko) 2007-06-05 2008-05-27 포지티브형 감광성 수지 조성물 및 폴리히드록시아미드 수지
JP2009517811A JP5246441B2 (ja) 2007-06-05 2008-05-27 ポジ型感光性樹脂組成物及びポリヒドロキシアミド樹脂
US15/064,288 US9975996B2 (en) 2007-06-05 2016-03-08 Positive photosensitive resin composition and polyhydroxyamide resin

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-149088 2007-06-05
JP2007149088 2007-06-05

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US12/451,906 A-371-Of-International US20100119969A1 (en) 2007-06-05 2008-05-27 Positive photosensitive resin composition and dpolyhydroxyamide resin
US15/064,288 Continuation US9975996B2 (en) 2007-06-05 2016-03-08 Positive photosensitive resin composition and polyhydroxyamide resin

Publications (1)

Publication Number Publication Date
WO2008149730A1 true WO2008149730A1 (ja) 2008-12-11

Family

ID=40093551

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/059726 WO2008149730A1 (ja) 2007-06-05 2008-05-27 ポジ型感光性樹脂組成物及びポリヒドロキシアミド樹脂

Country Status (7)

Country Link
US (2) US20100119969A1 (ja)
EP (1) EP2159637A4 (ja)
JP (1) JP5246441B2 (ja)
KR (1) KR101522583B1 (ja)
CN (1) CN101681099B (ja)
TW (1) TWI468855B (ja)
WO (1) WO2008149730A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010005028A1 (ja) * 2008-07-09 2010-01-14 日産化学工業株式会社 ポジ型感光性樹脂組成物及びポリヒドロキシアミド樹脂
WO2010044275A1 (ja) * 2008-10-16 2010-04-22 住友ベークライト株式会社 ポジ型感光性樹脂組成物、硬化膜、保護膜、絶縁膜およびそれを用いた半導体装置、表示体装置、ならびにレジスト膜形成方法
WO2011058756A1 (ja) * 2009-11-13 2011-05-19 株式会社Adeka ポリアミド化合物及びそれを含有してなるエポキシ樹脂組成物
KR101781702B1 (ko) 2012-09-18 2017-09-25 아사히 가세이 이-매터리얼즈 가부시키가이샤 감광성 수지 조성물

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101522583B1 (ko) * 2007-06-05 2015-05-22 닛산 가가쿠 고교 가부시키 가이샤 포지티브형 감광성 수지 조성물 및 폴리히드록시아미드 수지
CN108383998B (zh) * 2018-05-24 2019-10-08 安徽农业大学 一种高强度湿度响应聚羟基酰胺及其制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4986498A (ja) * 1972-12-22 1974-08-19
JPS5855926A (ja) * 1981-09-29 1983-04-02 Masaki Hasegawa ポリアミド系線状高分子を用いる画像形成方法
JP2000230049A (ja) * 1999-02-15 2000-08-22 Toshiba Chem Corp 感光性樹脂組成物およびその製造方法
JP2002341527A (ja) * 2001-05-14 2002-11-27 Asahi Kasei Corp ポジ型感光性樹脂組成物

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3449296A (en) * 1967-05-29 1969-06-10 Du Pont Polybenzoxazole film
US4975517A (en) * 1985-01-07 1990-12-04 Masaki Hasegawa Polyamide from optically active, anti head-to-head coumarin dimer
EP0224680B1 (en) 1985-12-05 1992-01-15 International Business Machines Corporation Diazoquinone sensitized polyamic acid based photoresist compositions having reduced dissolution rates in alkaline developers
US5240819A (en) * 1986-10-02 1993-08-31 Hoechst Celanese Corporation Polyamide containing the hexafluoroisopropylidene group and process of using to form a positive image
DE59606657D1 (de) * 1995-08-31 2001-05-03 Infineon Technologies Ag Verfahren zur Herstellung von Poly-o-hydroxyamiden und Poly-o-mercaptoamiden
DE59606486D1 (de) 1995-08-31 2001-04-05 Infineon Technologies Ag Herstellung von Poly-o-hydroxyamiden und Poly-o-mercaptoamiden
DE60142844D1 (de) * 2000-10-31 2010-09-30 Intel Corp Positive lichtempfindliche harzzusammensetzung, prozess zu ihrer herstellung und halbleiterbauelemente
JP3812654B2 (ja) * 2002-01-23 2006-08-23 Ｊｓｒ株式会社 ポジ型感光性絶縁樹脂組成物およびその硬化物
JP2003302761A (ja) 2002-04-08 2003-10-24 Sumitomo Bakelite Co Ltd ポジ型感光性樹脂組成物及び半導体装置
TWI360565B (en) * 2003-07-09 2012-03-21 Toray Industries Photosensitive resin precursor composition
JP4128116B2 (ja) * 2003-07-29 2008-07-30 旭化成エレクトロニクス株式会社 ポジ型感光性樹脂組成物
WO2005069075A1 (ja) * 2004-01-14 2005-07-28 Hitachi Chemical Dupont Microsystems Ltd. 感光性重合体組成物、パターンの製造法及び電子部品
CN101048703A (zh) * 2004-10-29 2007-10-03 捷时雅株式会社 正型感光性绝缘树脂组合物及其固化物
JP2006227063A (ja) * 2005-02-15 2006-08-31 Hitachi Chemical Dupont Microsystems Ltd ポジ型感光性樹脂組成物、パターンの製造方法及び電子部品
KR101522583B1 (ko) * 2007-06-05 2015-05-22 닛산 가가쿠 고교 가부시키 가이샤 포지티브형 감광성 수지 조성물 및 폴리히드록시아미드 수지

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4986498A (ja) * 1972-12-22 1974-08-19
JPS5855926A (ja) * 1981-09-29 1983-04-02 Masaki Hasegawa ポリアミド系線状高分子を用いる画像形成方法
JP2000230049A (ja) * 1999-02-15 2000-08-22 Toshiba Chem Corp 感光性樹脂組成物およびその製造方法
JP2002341527A (ja) * 2001-05-14 2002-11-27 Asahi Kasei Corp ポジ型感光性樹脂組成物

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2159637A4 *

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010005028A1 (ja) * 2008-07-09 2010-01-14 日産化学工業株式会社 ポジ型感光性樹脂組成物及びポリヒドロキシアミド樹脂
WO2010044275A1 (ja) * 2008-10-16 2010-04-22 住友ベークライト株式会社 ポジ型感光性樹脂組成物、硬化膜、保護膜、絶縁膜およびそれを用いた半導体装置、表示体装置、ならびにレジスト膜形成方法
WO2011058756A1 (ja) * 2009-11-13 2011-05-19 株式会社Adeka ポリアミド化合物及びそれを含有してなるエポキシ樹脂組成物
CN102575004A (zh) * 2009-11-13 2012-07-11 Adeka株式会社 聚酰胺化合物及含有它而成的环氧树脂组合物
CN102575004B (zh) * 2009-11-13 2014-06-25 Adeka株式会社 聚酰胺化合物及含有它而成的环氧树脂组合物
TWI496815B (zh) * 2009-11-13 2015-08-21 Adeka Corp 聚醯胺化合物及含有它而成之環氧樹脂組成物
KR101740081B1 (ko) 2009-11-13 2017-05-25 가부시키가이샤 아데카 폴리아미드 화합물 및 그것을 함유하여 이루어지는 에폭시 수지 조성물
KR101781702B1 (ko) 2012-09-18 2017-09-25 아사히 가세이 이-매터리얼즈 가부시키가이샤 감광성 수지 조성물

Also Published As

Publication number Publication date
US20100119969A1 (en) 2010-05-13
TW200916951A (en) 2009-04-16
EP2159637A4 (en) 2011-12-21
US9975996B2 (en) 2018-05-22
EP2159637A1 (en) 2010-03-03
JPWO2008149730A1 (ja) 2010-08-26
CN101681099B (zh) 2013-02-20
KR101522583B1 (ko) 2015-05-22
KR20100022512A (ko) 2010-03-02
CN101681099A (zh) 2010-03-24
TWI468855B (zh) 2015-01-11
US20160185905A1 (en) 2016-06-30
JP5246441B2 (ja) 2013-07-24

Similar Documents

Publication Publication Date Title
WO2008149730A1 (ja) ポジ型感光性樹脂組成物及びポリヒドロキシアミド樹脂
TW200635978A (en) Polyarylene block copolymer and use thereof
TW200704664A (en) Epoxy resin, epoxy resin composition, prepreg and laminated plate using same
ATE384338T1 (de) Anti-vergilbungs- polykondensationspolymerzusammensetzungen und gegenstände
WO2004081664A3 (en) Novel photosensitive resin compositions
ATE444980T1 (de) Elektrisch leitende polymere und verfahren zur herstellung elektrisch leitender polymere
WO2009008468A1 (ja) ベンゾキサジン構造を有する熱硬化性樹脂及びその製造方法
EP2508518A4 (en) CYCLIC POLYPHENYLENE-ETHER-ETHER-KETONE COMPOSITION AND METHOD FOR PRODUCING THE SAME
SG168462A1 (en) Novel copolymer and photoresist composition comprising the same
WO2009069778A1 (ja) 末端変性アクリル重合体及び末端変性アクリル重合体の製造方法
GB2475667A (en) Polymers derived from bis (thienocyclopenta) benzothiadiazole and their use as organic semiconductors
DE502008003027D1 (de) Härtbare zusammensetzungen aus silanen mit zwei hydrolisierbaren gruppen
RU2009135761A (ru) Получаемые по способу электропрядения органическо-неорганические волокна
TW200641522A (en) Positive resist composition, method for forming resist pattern and compound
MY153770A (en) Resin composition for encapsulating semiconductor and semiconductor device using the same
ATE513010T1 (de) Flammgeschützte schlagzähmodifizierte polycarbonat-zusammensetzungen
KR101681442B1 (ko) 할로겐 비함유 난연성 수지 조성물 및 그 용도
MY145098A (en) Phenol resin composition, cured article thereof, resin composition for copper-clad laminate, copper-clad laminate, and novel phenol resin
MX2010005477A (es) Articulo que comprende fibras y metodo de formacion del mismo.
WO2009011270A1 (ja) トリアジン環含有高分子化合物および該高分子化合物を用いた有機発光素子
TW201129582A (en) Radiation-sensitive resin composition, polymer and resist pattern formation method
TW200631979A (en) Curing accelerator, curable resin composition, and electronic part/device
MY138699A (en) Epoxy compound, preparation method thereof, and use thereof
JP2008075039A5 (ja)
WO2010087528A3 (en) Norbornene copolymer and production method thereof

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880018348.6

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08764754

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2009517811

Country of ref document: JP

Kind code of ref document: A

WWE Wipo information: entry into national phase

Ref document number: 12451906

Country of ref document: US

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 2008764754

Country of ref document: EP

ENP Entry into the national phase

Ref document number: 20107000073

Country of ref document: KR

Kind code of ref document: A