WO2008139633A1 - Film particulaire isolant monocouche à motifs et film d'accumulation particulaire isolant dont les dispositions sont commandées et procédé permettant de les fabriquer - Google Patents

Film particulaire isolant monocouche à motifs et film d'accumulation particulaire isolant dont les dispositions sont commandées et procédé permettant de les fabriquer Download PDF

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WO2008139633A1
WO2008139633A1 PCT/JP2007/060286 JP2007060286W WO2008139633A1 WO 2008139633 A1 WO2008139633 A1 WO 2008139633A1 JP 2007060286 W JP2007060286 W JP 2007060286W WO 2008139633 A1 WO2008139633 A1 WO 2008139633A1
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film
insulating particle
patterned
single layer
organic film
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PCT/JP2007/060286
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English (en)
Inventor
Kazufumi Ogawa
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Kazufumi Ogawa
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Priority to PCT/JP2007/060286 priority Critical patent/WO2008139633A1/fr
Publication of WO2008139633A1 publication Critical patent/WO2008139633A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/46—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes silicones

Definitions

  • the present invention relates to a single layer insulating particle film and a lamination body of single layer insulating particles for passivation that are used in an electronic part, a micro machine and an optical part. More particularly, the present invention relates to an insulating particle film of a single layer and a lamination body of insulating particles, which use particles where a thermal reactivity or optical reactivity, or a radical reactivity or ion reactivity is given to surfaces.
  • silica and alumina particles are included in
  • a semiconductor device and a printed circuit board are included in the electronic part.
  • a lens and a diffraction grating are included in the optical part.
  • a Langumuir-Blodgett method that uses amphophilic organic molecules, arranges the molecules on a water surface and accumulates monomolecular films on a substrate surface
  • a chemical absorption (CA) method that uses a chemical absorption method in a solution in which a surfactant is dissolved and then accumulates monomolecular films is known.
  • CA chemical absorption
  • a manufacturing method of an inorganic insulation film, a CVD method and a sol-gel method are well known (e.g., Japanese Laid Open Patent Application No. 2001-279471).
  • the organic insulating film where the single molecular film and the single molecular film are accumulated is superior in the control property of film thicknesses, when it is tried to be used in the electronic device, its withstanding voltage property is poor, and the practicable insulating film is not still provided. Also, even if those films were used in the electronic part, the micro machine and the optical part, its durability was insufficient.
  • electrically insulating inorganic particles have been variously developed and manufactured.
  • the insulating particles are required to be arranged in the film of a regular film thickness.
  • the present invention is invented to provide the film (the patterned single layer insulating particle film) of a regular thickness at a particle size level, in which insulating particles are used and without any loss of the original functions of the various insulating particles, new functions are given, and the insulating particles are selectively arranged in only one layer on any substrate surface, and the film (the patterned insulating particle accumulation film) in which the film where the insulating particles are arranged in only one layer is selectively accumulated in a plurality of layers, and a method of manufacturing them.
  • the first invention provided as the means for solving the problems is a patterned single layer insulating particle film, characterized in that a film of insulating particles which is selectively formed in one layer on a substrate surface is covalently bonded to each other through a first organic film selectively formed on the substrate surface and a second organic film formed on an insulating particle surface.
  • the second invention is the patterned single layer insulating particle film, characterized in that in the first invention, the first organic film formed on the substrate surface and the second organic film formed on the insulating particle surface are different from each other.
  • the third invention is the patterned single layer insulating particle film, characterized in that in the first invention, the covalent bond is the -N-C- bond which is formed by a reaction between an epoxy group and an imino group.
  • the fourth invention is the patterned single layer insulating particle film, characterized in that in the first invention and the second invention, the first organic film formed on the substrate surface and the second organic film formed on the insulating particle surface are constituted by monomolecular films.
  • the fifth invention is a manufacturing method of a patterned single layer insulating particle film, characterized by including: a step of bringing a substrate surface into contact with a chemical absorption solution, which is generated by mixing at least a first alkoxysilane compound, a silanol condensation catalyst and a non-aqueous organic solvent, and reacting the alkoxysilane compound and the substrate surface and then forming a first reactive organic film on the substrate surface; a step of processing the first reactive organic film to a predetermined pattern; a step of dispersing insulating particles into a chemical absorption solution, which is generated by mixing at least a second alkoxysilane compound, the silanol condensation catalyst and the non-aqueous organic solvent, and reacting the alkoxysilane compound and the insulating particle surface and then forming a second reactive organic film on the insulating particle surface; and a step of bringing the insulating particles coated with the second reactive organic film into contact with the substrate surface on which the first reactive organic film is formed
  • the sixth invention is the manufacturing method of the patterned single layer insulating particle film, characterized by including: the step of bringing the substrate surface into contact with the chemical absorption solution, which is generated by mixing at least the first alkoxysilane compound, the silanol condensation catalyst and the non-aqueous organic solvent, and reacting the alkoxysilane compound and the substrate surface and then forming the first reactive organic film on the substrate surface; and the step of dispersing the insulating particles into the chemical absorption solution, which is generated by mixing at least the second alkoxysilane compound, the silanol condensation catalyst and the non-aqueous organic solvent, and reacting the alkoxysilane compound and the insulating particle surface and then forming the second reactive organic film on the insulating particle surface, and after the steps, washing the substrate and insulating particle surfaces with organic solvent, respectively, and then forming first and second reactive monomolecular films, which are covalently bonded, on the substrate and insulating particle surfaces, in the fifth invention.
  • the seventh invention is the manufacturing method of the patterned single layer insulating particle film, characterized in that in the fifth invention, the first reactive organic film includes an epoxy group and the second reactive organic film includes an imino group.
  • the eighth invention is the manufacturing method of the patterned single layer insulating particle film, characterized in that in the sixth invention, the first reactive monomolecular film includes an epoxy group and the second reactive monomolecular film includes the imino group.
  • the ninth invention is a patterned insulating particle accumulation film, characterized in that insulating particles which are selectively accumulated in a shape of layers on a substrate surface are covalently bonded to each other between the layers through organic films formed on insulating particle surfaces.
  • the tenth invention is the patterned insulating particle accumulation film, characterized in that in the ninth invention, in the organic films formed on the insulating particle surfaces, there are two kinds, and the insulating particle on which a first organic film is formed and the insulating particle on which a second organic film is formed are alternately laminated.
  • the eleventh invention is the patterned insulating particle accumulation film, characterized in that in the tenth invention, the covalent bond is formed by the reaction between the first organic film and the second organic film.
  • the twelfth invention is the patterned insulating particle accumulation film, characterized in that in the ninth invention, the covalent bond is the -N-C- bond formed by the reaction between an epoxy group and an imino group.
  • the thirteenth invention is a manufacturing method of a patterned insulating particle accumulation film, characterized by including: a step of bringing at least a substrate surface into contact with a chemical absorption solution, which is generated by mixing a first alkoxysilane compound, a silanol condensation catalyst and a non-aqueous organic solvent, and reacting the alkoxysilane compound and the substrate surface and then forming a first reactive organic film on the substrate surface; a step of processing the first reactive organic film to a predetermined pattern; a step of dispersing first insulating particles into a chemical absorption solution, which is generated by mixing at least a second alkoxysilane compound, the silanol condensation catalyst and the non-aqueous organic solvent, and reacting the alkoxysilane compound and the insulating particle surface and then forming a second reactive organic film on the first insulating particle surface; a step of bringing the first insulating particle coated with the second reactive organic film into contact with the substrate surface on which the first reactive organic film
  • the fourteenth invention is the manufacturing method of the patterned insulating particle accumulation film, characterized in that in the thirteenth invention, the first reactive organic film and the third reactive organic film are the same films.
  • the fifteenth invention is the manufacturing method of the patterned insulating particle accumulation film of a multiple-layer structure, characterized in that in the thirteenth invention, after the step of forming the second patterned single layer insulating particle film, similarly, the step of forming the first patterned single layer insulating particle film and the step of forming the second patterned single layer insulating particle film are repeated.
  • the sixteenth invention is the manufacturing method of the patterned insulating particle accumulation film, characterized in that in the thirteenth invention, after the steps of forming the first to third reactive organic films, the substrate or insulating particle surface is washed with organic solvent, respectively, and first to third reactive monomolecular films which are covalently bonded are formed on the substrate and insulating particle surfaces.
  • the seventh invention is the manufacturing method of the patterned insulating particle accumulation film, characterized in that in the thirteenth invention, the first and third reactive organic films include epoxy groups and the second reactive organic film includes an imino group.
  • the eighteenth invention is the patterned single layer insulating particle film and the patterned insulating particle accumulation film according to claims 5 and 13, characterized in that a ketimine compound, or an organic acid, an aldimine compound, an enamine compound, an oxazolidine compound, an amino-alkyl alkoxysilane compound is used instead of the silanol condensation catalyst.
  • the nineteenth invention is the patterned single layer insulating particle film and the patterned insulating particle accumulation film, characterized in that in the fifth invention and the thirteenth invention, at least one selected from a ketimine compound, or an organic acid, an aldimine compound, an enamine compound, an oxazolidine compound, an amino-alkyl alkoxysilane compound is mixed as a promoter into the silanol condensation catalyst, and they are then used.
  • the twenties invention is an electronic part that uses the single layer insulating particle film noted in the first to sixth inventions and the insulating particle accumulation film noted in the tenth to fifteenth inventions.
  • the twenty-first invention is a micro machine that uses the single layer insulating particle film noted in the first to sixth inventions and the insulating particle accumulation film noted in the tenth to fifteenth inventions.
  • the twenty-second invention is an optical part that uses the single layer insulating particle film noted in the first to sixth inventions and the insulating particle accumulation film noted in the tenth to fifteenth inventions.
  • the main point of the present invention is to provide the patterned single layer insulating particle film, wherein the film of the insulating particles which is selectively formed in one layer on the substrate surface is covalently bonded to each other through the first organic film selectively formed on the substrate surface and the second organic film formed on the insulating particle surface, by including: the step of bringing the substrate surface into contact with the chemical absorption solution, which is generated by mixing at least the first alkoxysilane compound, the silanol condensation catalyst and the non-aqueous organic solvent, and reacting the alkoxysilane compound and the substrate surface and then forming the first reactive organic film on the substrate surface; the step of processing the first reactive organic film to the predetermined pattern; the step of dispersing the insulating particles into the chemical absorption solution, which is generated by mixing at least the second alkoxysilane compound, the silanol condensation catalyst and the non-aqueous organic solvent, and reacting the
  • the film thickness control of the patterned single layer insulating particle film can be easily executed, thereby making this convenient.
  • the first reactive organic film includes the epoxy group and the second reactive organic film includes the imino group, this is convenient in manufacturing the patterned single layer insulating particle film which is covalently bonded on the substrate surface.
  • the first reactive monomolecular film includes the epoxy group and the second reactive monomolecular film includes the imino group, this is convenient in manufacturing the patterned single layer insulating particle film which is covalently bonded on the substrate surface.
  • the ketimine compound, or the organic acid, the aldimine compound, the enamine compound, the oxazolidine compound, the amino-alkyl alkoxysilane compound is used instead of the silanol condensation catalyst, this is convenient in making the film formation time shorter.
  • at least one selected from the ketimine compound, or the organic acid, the aldimine compound, the enamine compound, the oxazolidine compound, the amino-alkyl alkoxysilane compound is mixed as the promoter into the silanol condensation catalyst and they are then used, this is convenient in making the film formation time much shorter.
  • the first organic film formed on the insulating particle surface and the second organic film formed on the substrate surface are made different from each other, this is convenient in bonding the patterned single layer insulating particle film in only one layer on the substrate surface.
  • the first organic film formed on the insulating particle surface and the second organic film formed on the substrate surface are constituted by the monomolecular films, this is convenient in improving the film thickness regularity.
  • the main point of the present invention is to provide the patterned insulating particle accumulation film, wherein the insulating particles that are selectively accumulated in the shape of the layers on the substrate surface are covalently bonded to each other between the layers through the organic film formed on the insulating particle surface, by including: the step of bringing at least the substrate surface into contact with the chemical absorption solution, which is generated by mixing the first alkoxysilane compound, the silanol condensation catalyst and the non-aqueous organic solvent, and reacting the alkoxysilane compound and the substrate surface and then forming the first reactive organic film on the substrate surface; the step of processing the first reactive organic film to the predetermined pattern; the step of dispersing the first insulating particles into the chemical absorption solution, which is generated by mixing at least the second alkoxysilane compound, the silanol condensation catalyst and the non-aqueous organic solvent, and reacting the alkoxysilane compound and the insulating particle surface and then forming the second reactive organic film on the first insulating
  • the patterned insulating particle accumulation film of the multiple-layer structure can be easily manufactured.
  • first and third reactive organic films include the epoxy groups and the second reactive organic film includes the imino group
  • this is convenient in manufacturing the patterned insulating particle accumulation film that is covalently bonded between the layers by the reaction between the epoxy group and the imino group.
  • the ketimine compound, or the organic acid, the aldimine compound, the enamine compound, the oxazolidine compound, the amino-alkyl alkoxysilane compound is used instead of the silanol condensation catalyst, this is convenient in making the film formation time shorter.
  • the ketimine compound, or the organic acid, the aldimine compound, the enamine compound, the oxazolidine compound, the amino-alkyl alkoxysilane compound is mixed as the promoter into the silanol condensation catalyst and they are then used, this is convenient in making the film formation time much shorter.
  • the covalent bond is formed by the reaction between the first organic film and the second organic film, this is convenient in providing the patterned insulating particle accumulation film which is superior in the adhesion strength. Also, when the -N-C- bond formed by the reaction between the epoxy group and the imino group is used as the covalent bond, this is convenient in providing the patterned insulating particle accumulation film that is superior in the strength.
  • the foregoing single layer insulating particle film or insulating particle accumulation film is used for the passivation film of the electronic part, this is convenient because the curvature at a wiring stage difference portion can be improved. Also, if the foregoing single layer insulating particle film or insulating particle accumulation film is used for the sliding unit of the micro machine, this is convenient because the surface can be protected without any loss of the process precision.
  • the foregoing single layer insulating particle film or insulating particle accumulation film is used for the reflection avoidance film of the optical part, this is convenient because the film that is excellent in transmittance and low in refraction can be formed on the surface without any irregularity.
  • the film (the patterned single layer insulating particle film) of the regular thickness at the particle size level where the insulating particles are used and without any loss of the original functions of the various insulating particles, the insulating particles are arranged in only one layer on any substrate surface, and the film (the patterned insulating particle accumulation film) in which the insulating particles are arranged in only one layer is accumulated in the plurality of layers, and the method of manufacturing them can be provided at low costs. Also, there is the effect that the electronic device, the micro machine and the optical part, which use their films and have the high durability performance, can be provided.
  • FIG. 1 is a conceptual view where the reaction of the glass substrate surface in the first embodiment of the present invention is enlarged to the molecular level
  • FIG. 1A shows a view of the surface prior to the reaction
  • FIG. 1 B shows a view after the formation of the monomolecular film including the epoxy group
  • FIG. 1 C shows a view after the formation of the monomolecular film including the amino group
  • FIG. 1 D shows a view after the electronic rays are irradiated and the epoxy group is ring-open-bridged and deactivated.
  • FIG. 2 is a conceptual view where the reaction of the insulating particle surface in the second embodiment of the present invention is enlarged to the molecular level
  • FIG. 2A shows a view of the insulating particle surface prior to the reaction
  • FIG. 2B shows a view after the formation of the monomolecular film including the epoxy group
  • FIG. 2C shows after the monomolecular film including the amino group.
  • FIG. 3 is a conceptual view where the reaction of the glass substrate surface in the third and fourth embodiments of the present invention is enlarged to the molecular level
  • FIG. 3A shows a view of the substrate surface on which the patterned single layer insulating particle film is formed
  • FIG. 3B shows a view of the substrate surface on which the two layers of the patterned single layer insulating particle films are formed.
  • the present invention provides the patterned insulating particle accumulation film, wherein the insulating particles accumulated in the shape of the layers on the substrate surface are covalently bonded to each other between the layers through the organic films formed on the insulating particle surfaces, by including: the step of bringing at least the substrate surface into contact with the chemical absorption solution, which is generated by mixing the first alkoxysilane compound, the silanol condensation catalyst and the non-aqueous organic solvent, and reacting the alkoxysilane compound and the substrate surface and then forming the first reactive organic film on the substrate surface; the step of processing the first reactive organic film to the predetermined pattern; the step of dispersing the first insulating particles into the chemical absorption solution, which is generated by mixing at least the second alkoxysilane compound, the silanol condensation catalyst and the non-aqueous organic solvent, and reacting the alkoxysilane compound and the insulating particle surface and then forming the second reactive organic film on the first insulating particle surface; the step of bringing the first insul
  • the present invention since using the two kinds of the insulating particles coated with the films, can provide the film (the patterned single layer insulating particle film) of the regular thickness at the particle size level where without any loss of the original functions of the various insulating particles, only one layer of the insulating particles is arranged selectively in the large area on any substrate surface, and the film (the patterned insulating particle accumulation film) where the film in which the insulating particles are arranged in only one layer is accumulated selectively in the large area in the plurality of layers, and can provide the method of manufacturing them simply at the low costs. Also, there is the action that the electronic device, the micro machine and the optical part, which use their films and have the high durability performance, can be manufactured and provided simply at the low costs.
  • the oxide of silicon and semiconductors specifically, silica particles, alumina particles and the like can be used.
  • the silica particle is firstly listed and explained as a representative example.
  • a glass substrate 1 is prepared and sufficiently dried.
  • a reactive functional group for example, a medicine that includes the epoxy group and the alkoxysilyl group at the other end, for example, a medicine indicated in the following equation (chemical formula C1 )
  • the silanol condensation catalyst for example, dibutyltin diacetyl acetonato, or acetic acid that is the organic acid are prepared and configured so as to exhibit 99 weight % and 1 weight % when a weight per unit area is measured, respectively.
  • the chemical absorption solution was prepared.
  • silicon solvent for example, hexamethyldisiloxane solvent, so as to exhibit the concentration of about 1 weight % (preferably, the concentration of the chemical absorbent is about 0.5 to 3 %). Consequently, the chemical absorption solution was prepared.
  • the glass substrate 1 is immersed into this absorption solution, and reacted in usual air (relative humidity of 45 %) for two hours.
  • a large number of hydroxyl groups 2 are included on the glass substrate 1 surface (FIG.1A).
  • a -Si (OCH 3 ) group in the chemical absorbent and the hydroxyl group carry out a dealcoholization (in this case, de-CHsOH) reaction under the existence of the silanol condensation catalyst or the acetic acid that is the organic acid, and form the coupling as indicated in the following equation (chemical formula C2). Consequently, a chemical absorption monomolecular film 3 that includes the epoxy group chemically bonded onto the surface over the entire surface of the glass substrate 1 is formed at a film thickness of about 1 ⁇ ano-meter. [C2]
  • the tin-based catalyst involves the generation of precipitation.
  • the organic acid such as the acetic acid and the like.
  • the amino group includes the imino group
  • the material including the imino group other than the amino group there are a pyrrole derivative, an imidazole derivative and the like.
  • a ketimine derivative was used, after the film formation, the hydrolysis enabled the easy introduction of the amino group.
  • the film surface was coated with a cation-based polymerization initiator, for example, IRGACURE 250 made by Ciba Specialty Chemicals Corporation after the dilution through MEK. Then, even if it was selectively exposed through far-ultraviolet rays, the epoxy group could be selectively ring-open-polymerized and deactivated in the patterned manner.
  • a cation-based polymerization initiator for example, IRGACURE 250 made by Ciba Specialty Chemicals Corporation after the dilution through MEK.
  • an anhydrous silica particle 11 whose size was about 100 nm was prepared and sufficiently dried.
  • the reactive functional group for example, the medicine that includes the epoxy group or imino group and the alkoxysilyl group at the other end, for example, the medicine indicated in the foregoing equation (chemical formula C1 ) or the following equation (chemical formula C3) and as the silanol condensation catalyst, for example, the dibutyltin diacetyl acetonato are prepared and configured so as to exhibit 99 weight % and 1 weight % when a weight per unit area is measured, respectively.
  • the silicon solvent for example, the mixture solvent of the hexamethyldisiloxane solvent and dimethylformamide (50:50), so as to exhibit the concentration of about 1 weight % (preferably, the concentration of the chemical absorbent is about 0.5 to 3 %). Consequently, the chemical absorption solution was prepared.
  • the silicon solvent for example, the mixture solvent of the hexamethyldisiloxane solvent and dimethylformamide (50:50)
  • the anhydrous silica particles 11 were mixed into this absorption solution and agitated and then reacted in the usual air (relative humidity of 45 %) for about two hours. At this time, a large number of hydroxyl groups 12 are included on the anhydrous silica particle surface (FIG. 2A).
  • the -Si (OCH 3 ) group in the chemical absorbent and the hydroxyl group carry out the dealcoholization (in this case, de-CI-bOH) reaction under the existence of the silanol condensation catalyst, and form the coupling as indicated in the foregoing equation (chemical formula C2) or the following equation (chemical formula C4).
  • a chemical absorption monomolecular film 13 that includes the epoxy group chemically bonded onto the surface over the entire surface of the insulating particles or a chemical absorption film 14 including the amino group is formed at a film thickness of about 1 nano-meter (FIG. 2B, 2C).
  • the amino group includes the imino group.
  • the material including the imino group other than the amino group there are the pyrrole derivative, the imidazole derivative and the like.
  • the hydrolysis enabled the easy introduction of the amino group.
  • the reactive functional group for example, a silica particle 15 coated with the chemical absorption monomolecular film having the epoxy group, or a silica particle 16 coated with the chemical absorption monomolecular film having the amino group could be manufactured on the surface, respectively.
  • this film was very thin in the film thickness of the nano-meter level, the particle diameter was not lost.
  • the feature of this method lies in the de-alcohol reaction.
  • the insulating particle is organic or inorganic, it can be used, and the applicable range is wide.
  • a patterned single layer insulating particle film 24 of the regular thickness at the particle size level could be formed in the situation that silica particles 23 coated with the chemical absorption monomolecular films having the amino group which were covalently bonded were arranged in only one layer on a glass substrate 22 surface (FIG. 3A).
  • the thickness of the patterned single layer insulating particle film constituted by the silica particles was about 100 nm, and the regularity was very excellent. Thus, an interference color was not viewed at all.
  • the film thickness of the insulating particle film was desired to be made thick
  • silica particles 25 coated with the chemical absorption monomolecular films having the epoxy group were dispersed through the alcohol and coated on a glass substrate surface 22 on which the patterned single layer insulating particle film 24 of the regular thickness at the particle size level was formed in the situation that the silica particles coated with the chemical absorption monomolecular films having the amino group which were covalently bonded were arranged in only one layer in the shape of the pattern and it was heated to 250 0 C
  • the epoxy group on the silica particle surface in contact with the amino group in the portion where the silica particles coated with the chemical absorption monomolecular films having the amino group were formed in the single layer in the shape of the pattern was added by the reaction indicated in the foregoing equation (chemical formula C5), and the silica particle coated with the chemical absorption monomolecular film having the amino group and the silica particle coated with the chemical absorption monomolecular film having the epoxy group were
  • the insulating particle film of the multiple-layer structure could be accumulatively manufactured.
  • the materials indicated in the equation (chemical formula C1) or (chemical formula C3) were used as the chemical absorbent including the reactive group.
  • the materials indicated in the following chemical formulas (1 ) to (16) could be used in addition to the above-mentioned chemical formulas.
  • the (CH 2 OCH) - group represents the functional group indicated by the following equation (chemical formula C6)
  • the (CH 2 CHOCH (CH 2 ) 2 ) CH - group represents the functional group indicated by the following equation (chemical formula Cl).
  • the silanol condensation catalyst it is possible to use carboxylic acid metal salt, carboxylic acid ester metal salt, carboxylic acid metal salt polymer, carboxylic acid metal salt chelate, titanic acid ester and titanic acid ester chelate kind.
  • stannous acetate dibutyltin dilaurate, dibutyltin dioctate, dibutyltin diacetate, dioctyltin dilaurate, dioctyltin dioctate, dioctyltin diacetate, stannous dioctanoic acid, lead naphthenate, cobalt naphthenate, iron 2-ethylhexoate, dioctyltin ????, dioctyltin maleate, dioctyltin maleate polymer, dibutyltin bis-acetyl acetate, dioctyltin bis-acetyl laurate, tetrabutyl titanate, tetra-nonyl titanate and bis (acetyl acetonyl), di-propyl titanate.
  • the solvent of the film formation solution it is possible to use organic chlorine-based solvent that does not include water, hydrocarbon-based solvent, or fluorocarbon-based solvent, silicon-based solvent, or the mixture of them.
  • organic chlorine-based solvent that does not include water, hydrocarbon-based solvent, or fluorocarbon-based solvent, silicon-based solvent, or the mixture of them.
  • the boiling point of the solvent may be between 50 and 250 0 C.
  • the absorbent belonged to the alkoxysilane-based material and the solvent was evaporated to form the organic film in addition to the foregoing solvents, it was possible to use the alcohol-based solvent, such as methanol, ethanol, propanol and the like, or the mixture of them.
  • chlorosilane-based non-aqueous petroleum naphtha As the specifically usable solvents, it is possible to list chlorosilane-based non-aqueous petroleum naphtha, solvent naphtha, petroleum ether, petroleum benzene, iso-paraffin, normal paraffin, decalin, industrial gasoline, nonane, decane, kerosene, di-methyl silicon, phenyl silicon, alkyl denaturation silicon, polyether silicon, dimethyl formamide and the like.
  • the fluorocarbon-based solvent there are flon-based solvent, Fluoinert (3M Company Product), Afludo (ASAHI GLASS CO., LTD, Product) and the like. By the way, with regard to them, it may be used as one patterned single layer or may be used by combining two kinds or more if they can be well mixed. Moreover, it is allowable to add the organic-salt-based solvent such as chloroform and the like.
  • the process time could be reduced to between approximate one-half and two-thirds, even under the same concentration.
  • the process time can be made several times faster (to about 30 minutes), and the film formation time can be reduced to a fraction of several minutes.
  • the dibutyltin oxide serving as the silanol catalyst was replaced by H3 made by Japan Epoxy Resin Corporation that was the ketimine compound and the other conditions were set equal, the substantially similar result was obtained except the point that the reaction time could be reduced to about one hour.
  • silanol catalyst was replaced by the mixture of the H3 made by Japan Epoxy Resin Corporation that was the Ketimine compound and the dibutyltin bis-acetyl acetonate serving as the silanol catalyst (the mixture ratio of 1 :1 ) and the other conditions are set equal, the substantially similar result was obtained except the point that the reaction time could be reduced to about 30 minutes.
  • the usable ketimine compound was not especially limited.
  • the present invention can be applied to the wiring protection film of the electronic device, such as a semiconductor device, a printed circuit board and the like, where electronic circuits are formed, or the sliding unit protection film of the micro machine requiring the surface durability, and the optical part such as a diffraction grating and the like.

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  • Spectroscopy & Molecular Physics (AREA)
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Abstract

Afin d'utiliser efficacement les fonctions des particules isolantes, celles-ci doivent être conçues sous la forme d'un film d'épaisseur régulière et selon des formes à motifs arbitraires. Toutefois, l'idée n'est pas de les accumuler pour chaque monocouche et de former le film à motifs à épaisseur régulière à un certain niveau de taille particulaire. Le film particulaire isolant monocouche à motifs se caractérise en ce que le film constitué de particules isolantes selectivement déposé en une couche sur une surface d'un substrat est lié par covalence à la surface de ce substrat par l'intermédiaire d'un premier film organique sélectivement formé sur la surface de substrat et d'un second film organique sur la surface des particules isolantes. Le film particulaire isolant monocouche à motifs se caractérise en ce que les films organiques formés sont différents les uns des autres.
PCT/JP2007/060286 2007-05-14 2007-05-14 Film particulaire isolant monocouche à motifs et film d'accumulation particulaire isolant dont les dispositions sont commandées et procédé permettant de les fabriquer WO2008139633A1 (fr)

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PCT/JP2007/060286 WO2008139633A1 (fr) 2007-05-14 2007-05-14 Film particulaire isolant monocouche à motifs et film d'accumulation particulaire isolant dont les dispositions sont commandées et procédé permettant de les fabriquer

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PCT/JP2007/060286 WO2008139633A1 (fr) 2007-05-14 2007-05-14 Film particulaire isolant monocouche à motifs et film d'accumulation particulaire isolant dont les dispositions sont commandées et procédé permettant de les fabriquer

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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH053319A (ja) * 1991-06-25 1993-01-08 Canon Inc 薄膜半導体装置及びその製造方法
JPH08337654A (ja) * 1995-06-14 1996-12-24 Matsushita Electric Ind Co Ltd 化学吸着膜の製造方法及びこれに用いる化学吸着液
JP2002341161A (ja) * 2001-05-21 2002-11-27 Kunihito Kawamoto フォトニック結晶及びその製造方法
JP2003145042A (ja) * 2001-11-08 2003-05-20 Matsushita Electric Ind Co Ltd コーティング膜の製造方法
JP2003168606A (ja) * 2001-01-24 2003-06-13 Matsushita Electric Ind Co Ltd 微粒子配列体とその製造方法及びこれを用いたデバイス
JP2005083505A (ja) * 2003-09-09 2005-03-31 Olympus Corp スライド式バルブ装置
JP2005280020A (ja) * 2004-03-29 2005-10-13 Kazufumi Ogawa 金型とその製造方法及びそれを用いて作成した成型品
JP2006140000A (ja) * 2004-11-11 2006-06-01 Sumitomo Osaka Cement Co Ltd 保護膜形成用塗布液

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH053319A (ja) * 1991-06-25 1993-01-08 Canon Inc 薄膜半導体装置及びその製造方法
JPH08337654A (ja) * 1995-06-14 1996-12-24 Matsushita Electric Ind Co Ltd 化学吸着膜の製造方法及びこれに用いる化学吸着液
JP2003168606A (ja) * 2001-01-24 2003-06-13 Matsushita Electric Ind Co Ltd 微粒子配列体とその製造方法及びこれを用いたデバイス
JP2002341161A (ja) * 2001-05-21 2002-11-27 Kunihito Kawamoto フォトニック結晶及びその製造方法
JP2003145042A (ja) * 2001-11-08 2003-05-20 Matsushita Electric Ind Co Ltd コーティング膜の製造方法
JP2005083505A (ja) * 2003-09-09 2005-03-31 Olympus Corp スライド式バルブ装置
JP2005280020A (ja) * 2004-03-29 2005-10-13 Kazufumi Ogawa 金型とその製造方法及びそれを用いて作成した成型品
JP2006140000A (ja) * 2004-11-11 2006-06-01 Sumitomo Osaka Cement Co Ltd 保護膜形成用塗布液

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