WO2008133229A1 - ケイ素含有化合物、硬化性組成物及び硬化物 - Google Patents
ケイ素含有化合物、硬化性組成物及び硬化物 Download PDFInfo
- Publication number
- WO2008133229A1 WO2008133229A1 PCT/JP2008/057665 JP2008057665W WO2008133229A1 WO 2008133229 A1 WO2008133229 A1 WO 2008133229A1 JP 2008057665 W JP2008057665 W JP 2008057665W WO 2008133229 A1 WO2008133229 A1 WO 2008133229A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- silicon
- containing compound
- curable composition
- general formula
- compound represented
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
- C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2237—Oxides; Hydroxides of metals of titanium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2296—Oxides; Hydroxides of metals of zinc
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Silicon Polymers (AREA)
Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008800122001A CN101657491B (zh) | 2007-04-23 | 2008-04-21 | 含硅化合物、固化性组合物及固化物 |
US12/596,933 US8003736B2 (en) | 2007-04-23 | 2008-04-21 | Silicon-containing compound, curable composition and cured product |
EP08740710.2A EP2141188B1 (en) | 2007-04-23 | 2008-04-21 | Silicon-containing compound, curable composition and cured product |
KR1020097021058A KR101437664B1 (ko) | 2007-04-23 | 2008-04-21 | 규소함유 화합물, 경화성 조성물 및 경화물 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007112738A JP5248033B2 (ja) | 2007-04-23 | 2007-04-23 | ケイ素含有化合物、硬化性組成物及び硬化物 |
JP2007-112738 | 2007-04-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008133229A1 true WO2008133229A1 (ja) | 2008-11-06 |
Family
ID=39925680
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/057665 WO2008133229A1 (ja) | 2007-04-23 | 2008-04-21 | ケイ素含有化合物、硬化性組成物及び硬化物 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8003736B2 (ja) |
EP (1) | EP2141188B1 (ja) |
JP (1) | JP5248033B2 (ja) |
KR (1) | KR101437664B1 (ja) |
CN (1) | CN101657491B (ja) |
TW (1) | TWI424005B (ja) |
WO (1) | WO2008133229A1 (ja) |
Cited By (8)
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WO2012014560A1 (ja) * | 2010-07-27 | 2012-02-02 | 株式会社Adeka | 半導体封止用硬化性組成物 |
WO2012133432A1 (ja) * | 2011-03-30 | 2012-10-04 | 旭化成ケミカルズ株式会社 | オルガノポリシロキサン、その製造方法、及びオルガノポリシロキサンを含有する硬化性樹脂組成物 |
WO2012153821A1 (ja) * | 2011-05-10 | 2012-11-15 | 住友電気工業株式会社 | 光ファイバ |
JP2012237801A (ja) * | 2011-05-10 | 2012-12-06 | Sumitomo Electric Ind Ltd | 光ファイバ |
JP2013057732A (ja) * | 2011-09-07 | 2013-03-28 | Adeka Corp | 光ファイバ |
JPWO2012133432A1 (ja) * | 2011-03-30 | 2014-07-28 | 旭化成ケミカルズ株式会社 | オルガノポリシロキサン、その製造方法、及びオルガノポリシロキサンを含有する硬化性樹脂組成物 |
JP2014208826A (ja) * | 2009-11-09 | 2014-11-06 | ダウ コーニング コーポレーションDowcorning Corporation | クラスタ化官能性ポリオルガノシロキサンの調製プロセス、及びそれらの使用方法 |
WO2015012141A1 (ja) * | 2013-07-24 | 2015-01-29 | 株式会社Adeka | 硬化性樹脂組成物 |
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JP5393373B2 (ja) * | 2009-09-16 | 2014-01-22 | 関西電力株式会社 | 半導体装置 |
JP2011222869A (ja) * | 2010-04-13 | 2011-11-04 | Kansai Electric Power Co Inc:The | 半導体装置 |
CN102971383B (zh) * | 2010-06-11 | 2014-11-12 | 株式会社艾迪科 | 含硅固化性组合物、该含硅固化性组合物的固化物及由该含硅固化性组合物形成的引线框基板 |
EP2601245A1 (en) | 2010-08-05 | 2013-06-12 | Biofilm IP, LLC | Cyclosiloxane-substituted polysiloxane compounds, compositions containing the compounds and methods of use thereof |
JP5781511B2 (ja) * | 2011-02-04 | 2015-09-24 | 株式会社Adeka | ヒンダードアミン骨格を有する化合物及び樹脂組成物 |
US9464191B2 (en) | 2011-08-10 | 2016-10-11 | Adeka Corporation | Silicon-containing curing composition and cured product thereof |
TWI575062B (zh) | 2011-12-16 | 2017-03-21 | 拜歐菲樂Ip有限責任公司 | 低溫注射組成物,用於低溫調節導管中流量之系統及方法 |
US8481626B1 (en) | 2012-01-16 | 2013-07-09 | Itron, Inc. | Wax-based encapsulant/moisture barrier for use with electronics received in water meter pits |
US8728568B2 (en) | 2012-01-16 | 2014-05-20 | Itron, Inc. | Method for encapsulation of electronics received in water meter pits with an improved wax-based encapsulant/moisture barrier |
EP2882796B1 (en) * | 2012-06-06 | 2017-03-01 | Henkel IP & Holding GmbH | Vinyl carbosiloxane resins |
US9388284B2 (en) * | 2013-04-12 | 2016-07-12 | Milliken & Company | Cross-linked silicone polymer and process for producing the same |
US9422317B2 (en) | 2013-04-12 | 2016-08-23 | Milliken & Company | Siloxane compound and process for producing the same |
US9334294B2 (en) | 2013-04-12 | 2016-05-10 | Milliken & Company | Siloxane compound and process for producing the same |
US9518073B2 (en) | 2013-04-12 | 2016-12-13 | Milliken & Company | Siloxane compound and process for producing the same |
US9530946B2 (en) * | 2013-04-12 | 2016-12-27 | Milliken & Company | Light emitting diode |
WO2015190644A1 (ko) * | 2014-06-10 | 2015-12-17 | 한국과학기술원 | 세포배양 기판, 이의 제조방법 및 용도 |
CN108137810A (zh) * | 2015-11-04 | 2018-06-08 | 美国陶氏有机硅公司 | 制备有机硅氧烷的方法 |
KR102590498B1 (ko) * | 2016-02-19 | 2023-10-19 | 삼성디스플레이 주식회사 | 플렉서블 표시장치, 윈도우 부재의 제조방법 및 하드 코팅 조성물 |
US10836906B2 (en) | 2016-12-19 | 2020-11-17 | Saint-Gobain Performance Plastics Corporation | Silicone-based composition and article made therefrom |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07309950A (ja) * | 1994-05-17 | 1995-11-28 | Toray Dow Corning Silicone Co Ltd | 有機ケイ素重合体およびその製造方法 |
JPH0853661A (ja) * | 1994-06-06 | 1996-02-27 | Shin Etsu Chem Co Ltd | シリコーン接着剤組成物 |
JP2005133073A (ja) * | 2003-10-10 | 2005-05-26 | Shin Etsu Chem Co Ltd | 硬化性組成物 |
JP2005523980A (ja) * | 2002-05-01 | 2005-08-11 | ダウ・コーニング・コーポレイション | オルガノハイドロジェンシリコン化合物 |
JP2005529989A (ja) * | 2002-05-01 | 2005-10-06 | ダウ・コーニング・コーポレイション | 向上したバス・ライフを持つ組成物 |
JP2005325174A (ja) | 2004-05-12 | 2005-11-24 | Asahi Denka Kogyo Kk | ケイ素含有硬化性組成物、及びこれを熱硬化させた硬化物 |
JP2006511645A (ja) * | 2002-12-20 | 2006-04-06 | ダウ・コーニング・コーポレイション | 有機水素シリコン化合物由来の分岐ポリマー |
JP2006511646A (ja) * | 2002-12-20 | 2006-04-06 | ダウ・コーニング・コーポレイション | 有機水素シリコン化合物から得られる分岐ポリマー |
WO2006090609A1 (ja) * | 2005-02-24 | 2006-08-31 | Adeka Corporation | ケイ素含有硬化性組成物及びその硬化物 |
Family Cites Families (9)
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JPH05264010A (ja) | 1992-03-19 | 1993-10-12 | Hitachi Ltd | 流動層処理装置及び加圧流動層複合発電装置 |
US5346980A (en) * | 1992-04-14 | 1994-09-13 | Minnesota Mining And Manufacturing Company | Crosslinkable silarylene-siloxane copolymers |
US6136917A (en) | 1993-07-22 | 2000-10-24 | Dow Corning Corporation | Stable dispersible silicone compositions |
US5536803A (en) * | 1994-06-06 | 1996-07-16 | Shin-Etsu Chemical Co., Ltd. | Adhesive silicone compositions |
JPH111560A (ja) * | 1997-06-13 | 1999-01-06 | Toray Dow Corning Silicone Co Ltd | オルガノシクロシロキサンおよびその製造方法 |
GB0127983D0 (en) * | 2001-11-22 | 2002-01-16 | Neutec Pharma Plc | Treatment of micro-organism infection |
TW200513483A (en) * | 2003-10-10 | 2005-04-16 | Shinetsu Chemical Co | Curable composition |
US20060134440A1 (en) * | 2004-10-27 | 2006-06-22 | Crivello James V | Silicone encapsulants for light emitting diodes |
JP2006213762A (ja) * | 2005-02-01 | 2006-08-17 | Asahi Kasei Corp | 発光素子封止用樹脂組成物、発光部品及び該発光部品を用いた表示機器 |
-
2007
- 2007-04-23 JP JP2007112738A patent/JP5248033B2/ja not_active Expired - Fee Related
-
2008
- 2008-04-21 CN CN2008800122001A patent/CN101657491B/zh not_active Expired - Fee Related
- 2008-04-21 WO PCT/JP2008/057665 patent/WO2008133229A1/ja active Application Filing
- 2008-04-21 EP EP08740710.2A patent/EP2141188B1/en not_active Not-in-force
- 2008-04-21 US US12/596,933 patent/US8003736B2/en not_active Expired - Fee Related
- 2008-04-21 KR KR1020097021058A patent/KR101437664B1/ko active IP Right Grant
- 2008-04-23 TW TW097114890A patent/TWI424005B/zh not_active IP Right Cessation
Patent Citations (10)
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JPH07309950A (ja) * | 1994-05-17 | 1995-11-28 | Toray Dow Corning Silicone Co Ltd | 有機ケイ素重合体およびその製造方法 |
US5545837A (en) | 1994-05-17 | 1996-08-13 | Dow Corning Toray Silicone Co., Ltd. | Organosilicon copolymers and methods for the preparation thereof |
JPH0853661A (ja) * | 1994-06-06 | 1996-02-27 | Shin Etsu Chem Co Ltd | シリコーン接着剤組成物 |
JP2005523980A (ja) * | 2002-05-01 | 2005-08-11 | ダウ・コーニング・コーポレイション | オルガノハイドロジェンシリコン化合物 |
JP2005529989A (ja) * | 2002-05-01 | 2005-10-06 | ダウ・コーニング・コーポレイション | 向上したバス・ライフを持つ組成物 |
JP2006511645A (ja) * | 2002-12-20 | 2006-04-06 | ダウ・コーニング・コーポレイション | 有機水素シリコン化合物由来の分岐ポリマー |
JP2006511646A (ja) * | 2002-12-20 | 2006-04-06 | ダウ・コーニング・コーポレイション | 有機水素シリコン化合物から得られる分岐ポリマー |
JP2005133073A (ja) * | 2003-10-10 | 2005-05-26 | Shin Etsu Chem Co Ltd | 硬化性組成物 |
JP2005325174A (ja) | 2004-05-12 | 2005-11-24 | Asahi Denka Kogyo Kk | ケイ素含有硬化性組成物、及びこれを熱硬化させた硬化物 |
WO2006090609A1 (ja) * | 2005-02-24 | 2006-08-31 | Adeka Corporation | ケイ素含有硬化性組成物及びその硬化物 |
Non-Patent Citations (2)
Title |
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"Bulletin of the Chemical Society of Japan", 1998, THE CHEMICAL SOCIETY OF JAPAN, pages: 571 |
See also references of EP2141188A4 * |
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016153512A (ja) * | 2009-11-09 | 2016-08-25 | ダウ コーニング コーポレーションDow Corning Corporation | クラスタ化官能性ポリオルガノシロキサンの調製プロセス、及びそれらの使用方法 |
JP2014208826A (ja) * | 2009-11-09 | 2014-11-06 | ダウ コーニング コーポレーションDowcorning Corporation | クラスタ化官能性ポリオルガノシロキサンの調製プロセス、及びそれらの使用方法 |
JPWO2012014560A1 (ja) * | 2010-07-27 | 2013-09-12 | 株式会社Adeka | 半導体封止用硬化性組成物 |
WO2012014560A1 (ja) * | 2010-07-27 | 2012-02-02 | 株式会社Adeka | 半導体封止用硬化性組成物 |
JP5801208B2 (ja) * | 2010-07-27 | 2015-10-28 | 株式会社Adeka | 半導体封止用硬化性組成物 |
US8470937B2 (en) | 2010-07-27 | 2013-06-25 | Adeka Corporation | Curable composition for semiconductor encapsulation |
JP5857039B2 (ja) * | 2011-03-30 | 2016-02-10 | 旭化成ケミカルズ株式会社 | オルガノポリシロキサン、その製造方法、及びオルガノポリシロキサンを含有する硬化性樹脂組成物 |
JPWO2012133432A1 (ja) * | 2011-03-30 | 2014-07-28 | 旭化成ケミカルズ株式会社 | オルガノポリシロキサン、その製造方法、及びオルガノポリシロキサンを含有する硬化性樹脂組成物 |
US9243007B2 (en) | 2011-03-30 | 2016-01-26 | Asahi Kasei Chemicals Corporation | Organopolysiloxane, method for producing the same, and curable resin composition containing the organopolysiloxane |
WO2012133432A1 (ja) * | 2011-03-30 | 2012-10-04 | 旭化成ケミカルズ株式会社 | オルガノポリシロキサン、その製造方法、及びオルガノポリシロキサンを含有する硬化性樹脂組成物 |
JP2012237801A (ja) * | 2011-05-10 | 2012-12-06 | Sumitomo Electric Ind Ltd | 光ファイバ |
WO2012153821A1 (ja) * | 2011-05-10 | 2012-11-15 | 住友電気工業株式会社 | 光ファイバ |
US9297950B2 (en) | 2011-05-10 | 2016-03-29 | Sumitomo Electric Industries, Ltd. | Optical fiber |
JP2013057732A (ja) * | 2011-09-07 | 2013-03-28 | Adeka Corp | 光ファイバ |
WO2015012141A1 (ja) * | 2013-07-24 | 2015-01-29 | 株式会社Adeka | 硬化性樹脂組成物 |
JPWO2015012141A1 (ja) * | 2013-07-24 | 2017-03-02 | 株式会社Adeka | 硬化性樹脂組成物 |
Also Published As
Publication number | Publication date |
---|---|
KR20090130035A (ko) | 2009-12-17 |
TW200911885A (en) | 2009-03-16 |
JP5248033B2 (ja) | 2013-07-31 |
EP2141188A4 (en) | 2010-08-04 |
EP2141188B1 (en) | 2014-04-23 |
CN101657491A (zh) | 2010-02-24 |
KR101437664B1 (ko) | 2014-09-04 |
US20100179283A1 (en) | 2010-07-15 |
JP2008266484A (ja) | 2008-11-06 |
EP2141188A1 (en) | 2010-01-06 |
CN101657491B (zh) | 2012-05-23 |
TWI424005B (zh) | 2014-01-21 |
US8003736B2 (en) | 2011-08-23 |
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