WO2008123507A1 - ポジ型感光性樹脂組成物及びその硬化膜並びに表示素子 - Google Patents

ポジ型感光性樹脂組成物及びその硬化膜並びに表示素子 Download PDF

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Publication number
WO2008123507A1
WO2008123507A1 PCT/JP2008/056374 JP2008056374W WO2008123507A1 WO 2008123507 A1 WO2008123507 A1 WO 2008123507A1 JP 2008056374 W JP2008056374 W JP 2008056374W WO 2008123507 A1 WO2008123507 A1 WO 2008123507A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin composition
photosensitive resin
positive photosensitive
display element
organic
Prior art date
Application number
PCT/JP2008/056374
Other languages
English (en)
French (fr)
Inventor
Kazuya Ebara
Original Assignee
Nissan Chemical Industries, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissan Chemical Industries, Ltd. filed Critical Nissan Chemical Industries, Ltd.
Priority to KR1020157036329A priority Critical patent/KR101674654B1/ko
Priority to KR1020147022771A priority patent/KR20140110091A/ko
Priority to JP2009509254A priority patent/JP5435227B2/ja
Publication of WO2008123507A1 publication Critical patent/WO2008123507A1/ja

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/17—Passive-matrix OLED displays
    • H10K59/173—Passive-matrix OLED displays comprising banks or shadow masks

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

【課題】有機ＥＬデバイス等の表示装置において、鮮明な画像を表示可能にする表示素子用材料となり、且つ低公害系有機溶剤に可溶なポジ型感光性樹脂組成物を提供する。 【解決手段】（Ａ）成分として、下記式（１）で表される構造単位を持つポリイミド前駆体又はそれから得られるポリイミドと、（Ｂ）成分として、光により酸を発生する化合物とを含有し、それらが（Ｃ）溶剤に溶解したポジ型感光性樹脂組成物。 （式（１）中、Ｒ1は式（２） （式（２）中、Ｒ3は硫黄原子を有する有機基を表し、Ｒ4及びＲ5はそれぞれ独立して水素原子又は炭素原子数１乃至２０の有機基を表す。）で表される芳香族基を表し、Ｒ2はフッ素原子を有する芳香族基を表し、ｎは自然数を表す。）
PCT/JP2008/056374 2007-04-02 2008-03-31 ポジ型感光性樹脂組成物及びその硬化膜並びに表示素子 WO2008123507A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020157036329A KR101674654B1 (ko) 2007-04-02 2008-03-31 포지티브형 감광성 수지 조성물, 이의 경화막 및 표시소자
KR1020147022771A KR20140110091A (ko) 2007-04-02 2008-03-31 포지티브형 감광성 수지 조성물, 이의 경화막 및 표시소자
JP2009509254A JP5435227B2 (ja) 2007-04-02 2008-03-31 ポジ型感光性樹脂組成物及びその硬化膜並びに表示素子

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-096379 2007-04-02
JP2007096379 2007-04-02

Publications (1)

Publication Number Publication Date
WO2008123507A1 true WO2008123507A1 (ja) 2008-10-16

Family

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PCT/JP2008/056374 WO2008123507A1 (ja) 2007-04-02 2008-03-31 ポジ型感光性樹脂組成物及びその硬化膜並びに表示素子

Country Status (4)

Country Link
JP (1) JP5435227B2 (ja)
KR (4) KR101640143B1 (ja)
TW (1) TWI438571B (ja)
WO (1) WO2008123507A1 (ja)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010211109A (ja) * 2009-03-12 2010-09-24 Asahi Kasei E-Materials Corp ポジ型感光性樹脂組成物及びそれを用いた樹脂パターンの製造方法
JP2011042701A (ja) * 2009-08-19 2011-03-03 Toray Ind Inc 樹脂およびポジ型感光性樹脂組成物
WO2011049011A1 (ja) * 2009-10-19 2011-04-28 東レ株式会社 感光性接着剤組成物、感光性接着剤シートおよびこれらを用いた半導体装置
JP2013232314A (ja) * 2012-04-27 2013-11-14 Jsr Corp 感放射線性樹脂組成物、絶縁膜および有機ｅｌ素子
WO2018190179A1 (ja) * 2017-04-10 2018-10-18 大日本印刷株式会社 ポリイミドフィルム、積層体、及びディスプレイ用表面材
CN110147031A (zh) * 2012-12-20 2019-08-20 东丽株式会社 感光性树脂组合物、耐热性树脂膜的制造方法及显示装置
CN115960352A (zh) * 2022-12-29 2023-04-14 深圳市道尔顿电子材料有限公司 一种光敏聚酰亚胺前体树脂及其制备方法和感光树脂组合物
CN117304225A (zh) * 2023-09-12 2023-12-29 波米科技有限公司 一种含炔基化合物、正型感光性树脂组合物及其制备方法和应用

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110192152B (zh) * 2017-01-13 2023-11-03 日产化学株式会社 包含酰胺溶剂的抗蚀剂下层膜形成用组合物

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JPH0673003A (ja) * 1992-08-28 1994-03-15 Toshiba Corp ビスマレイミド化合物及び感光性樹脂組成物
JP2001249454A (ja) * 2000-03-06 2001-09-14 Sumitomo Bakelite Co Ltd ポジ型感光性樹脂組成物
JP2003066608A (ja) * 2001-08-28 2003-03-05 Sumitomo Bakelite Co Ltd 半導体装置
JP2004029712A (ja) * 2003-01-27 2004-01-29 Hitachi Chemical Dupont Microsystems Ltd 感光性樹脂組成物、パターンの製造法及び電子部品
JP2005157327A (ja) * 2003-10-28 2005-06-16 Sumitomo Bakelite Co Ltd ポジ型感光性樹脂組成物、該ポジ型感光性樹脂組成物を用いた半導体装置及び表示素子、並びに半導体装置及び表示素子の製造方法
WO2005121895A1 (ja) * 2004-06-08 2005-12-22 Nissan Chemical Industries, Ltd. ポジ型感光性樹脂組成物
JP2007016214A (ja) * 2005-06-09 2007-01-25 Toray Ind Inc 樹脂組成物およびそれを用いた表示装置

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EP0224680B1 (en) 1985-12-05 1992-01-15 International Business Machines Corporation Diazoquinone sensitized polyamic acid based photoresist compositions having reduced dissolution rates in alkaline developers
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JP3207352B2 (ja) 1996-05-13 2001-09-10 住友ベークライト株式会社 ポジ型感光性樹脂組成物
JPH1184653A (ja) * 1997-09-11 1999-03-26 Hitachi Chem Co Ltd 耐熱性感光性重合体組成物及びパターンの製造法
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JP2001296657A (ja) * 2000-04-17 2001-10-26 Sumitomo Bakelite Co Ltd ポジ型感光性樹脂組成物及びその製造方法並びにその組成物を用いた半導体装置
JP4178011B2 (ja) 2002-09-03 2008-11-12 群栄化学工業株式会社 ポジ型感光性樹脂組成物
KR100944135B1 (ko) * 2005-09-05 2010-02-24 아사히 가세이 이-매터리얼즈 가부시키가이샤 포지티브형 감광성 수지 조성물

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0673003A (ja) * 1992-08-28 1994-03-15 Toshiba Corp ビスマレイミド化合物及び感光性樹脂組成物
JP2001249454A (ja) * 2000-03-06 2001-09-14 Sumitomo Bakelite Co Ltd ポジ型感光性樹脂組成物
JP2003066608A (ja) * 2001-08-28 2003-03-05 Sumitomo Bakelite Co Ltd 半導体装置
JP2004029712A (ja) * 2003-01-27 2004-01-29 Hitachi Chemical Dupont Microsystems Ltd 感光性樹脂組成物、パターンの製造法及び電子部品
JP2005157327A (ja) * 2003-10-28 2005-06-16 Sumitomo Bakelite Co Ltd ポジ型感光性樹脂組成物、該ポジ型感光性樹脂組成物を用いた半導体装置及び表示素子、並びに半導体装置及び表示素子の製造方法
WO2005121895A1 (ja) * 2004-06-08 2005-12-22 Nissan Chemical Industries, Ltd. ポジ型感光性樹脂組成物
JP2007016214A (ja) * 2005-06-09 2007-01-25 Toray Ind Inc 樹脂組成物およびそれを用いた表示装置

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010211109A (ja) * 2009-03-12 2010-09-24 Asahi Kasei E-Materials Corp ポジ型感光性樹脂組成物及びそれを用いた樹脂パターンの製造方法
JP2011042701A (ja) * 2009-08-19 2011-03-03 Toray Ind Inc 樹脂およびポジ型感光性樹脂組成物
WO2011049011A1 (ja) * 2009-10-19 2011-04-28 東レ株式会社 感光性接着剤組成物、感光性接着剤シートおよびこれらを用いた半導体装置
JP5887693B2 (ja) * 2009-10-19 2016-03-16 東レ株式会社 感光性接着剤組成物、感光性接着剤シートおよびこれらを用いた半導体装置
KR101791710B1 (ko) * 2009-10-19 2017-10-30 도레이 카부시키가이샤 감광성 접착제 조성물, 감광성 접착제 시트 및 이들을 이용한 반도체 장치
JP2013232314A (ja) * 2012-04-27 2013-11-14 Jsr Corp 感放射線性樹脂組成物、絶縁膜および有機ｅｌ素子
CN110147031A (zh) * 2012-12-20 2019-08-20 东丽株式会社 感光性树脂组合物、耐热性树脂膜的制造方法及显示装置
WO2018190179A1 (ja) * 2017-04-10 2018-10-18 大日本印刷株式会社 ポリイミドフィルム、積層体、及びディスプレイ用表面材
JPWO2018190179A1 (ja) * 2017-04-10 2020-05-14 大日本印刷株式会社 ポリイミドフィルム、積層体、及びディスプレイ用表面材
JP7088173B2 (ja) 2017-04-10 2022-06-21 大日本印刷株式会社 フレキシブルディスプレイ用表面材
CN115960352A (zh) * 2022-12-29 2023-04-14 深圳市道尔顿电子材料有限公司 一种光敏聚酰亚胺前体树脂及其制备方法和感光树脂组合物
CN117304225A (zh) * 2023-09-12 2023-12-29 波米科技有限公司 一种含炔基化合物、正型感光性树脂组合物及其制备方法和应用
CN117304225B (zh) * 2023-09-12 2024-03-29 波米科技有限公司 一种含炔基化合物、正型感光性树脂组合物及其制备方法和应用

Also Published As

Publication number Publication date
KR20140110091A (ko) 2014-09-16
TW200910009A (en) 2009-03-01
KR20160005376A (ko) 2016-01-14
TWI438571B (zh) 2014-05-21
KR101674654B1 (ko) 2016-11-09
KR101640143B1 (ko) 2016-07-18
KR20150085104A (ko) 2015-07-22
KR20100016021A (ko) 2010-02-12
JPWO2008123507A1 (ja) 2010-07-15
JP5435227B2 (ja) 2014-03-05

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