TWI438571B - 正型感光性樹脂組成物及其硬化膜以及顯示元件 - Google Patents

正型感光性樹脂組成物及其硬化膜以及顯示元件 Download PDF

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Publication number
TWI438571B
TWI438571B TW097112034A TW97112034A TWI438571B TW I438571 B TWI438571 B TW I438571B TW 097112034 A TW097112034 A TW 097112034A TW 97112034 A TW97112034 A TW 97112034A TW I438571 B TWI438571 B TW I438571B
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TW
Taiwan
Prior art keywords
component
resin composition
photosensitive resin
positive photosensitive
formula
Prior art date
Application number
TW097112034A
Other languages
English (en)
Chinese (zh)
Other versions
TW200910009A (en
Inventor
Kazuya Ebara
Original Assignee
Nissan Chemical Ind Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissan Chemical Ind Ltd filed Critical Nissan Chemical Ind Ltd
Publication of TW200910009A publication Critical patent/TW200910009A/zh
Application granted granted Critical
Publication of TWI438571B publication Critical patent/TWI438571B/zh

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Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/039Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007Filters, e.g. additive colour filters; Components for display devices
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387Polyamides or polyimides
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/02Details
    • H05B33/04Sealing arrangements, e.g. against humidity
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/122Pixel-defining structures or layers, e.g. banks
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/17Passive-matrix OLED displays
    • H10K59/173Passive-matrix OLED displays comprising banks or shadow masks

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  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Engineering & Computer Science (AREA)
  • Materials For Photolithography (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Electroluminescent Light Sources (AREA)
TW097112034A 2007-04-02 2008-04-02 正型感光性樹脂組成物及其硬化膜以及顯示元件 TWI438571B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007096379 2007-04-02

Publications (2)

Publication Number Publication Date
TW200910009A TW200910009A (en) 2009-03-01
TWI438571B true TWI438571B (zh) 2014-05-21

Family

ID=39830984

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097112034A TWI438571B (zh) 2007-04-02 2008-04-02 正型感光性樹脂組成物及其硬化膜以及顯示元件

Country Status (4)

Country Link
JP (1) JP5435227B2 (ja)
KR (4) KR101640143B1 (ja)
TW (1) TWI438571B (ja)
WO (1) WO2008123507A1 (ja)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5497312B2 (ja) * 2009-03-12 2014-05-21 旭化成イーマテリアルズ株式会社 フレキシブルプリント配線基板
JP5381491B2 (ja) * 2009-08-19 2014-01-08 東レ株式会社 樹脂およびポジ型感光性樹脂組成物
WO2011049011A1 (ja) * 2009-10-19 2011-04-28 東レ株式会社 感光性接着剤組成物、感光性接着剤シートおよびこれらを用いた半導体装置
JP2013232314A (ja) * 2012-04-27 2013-11-14 Jsr Corp 感放射線性樹脂組成物、絶縁膜および有機el素子
WO2014097992A1 (ja) * 2012-12-20 2014-06-26 東レ株式会社 感光性樹脂組成物、耐熱性樹脂膜の製造方法および表示装置
CN117539127A (zh) * 2017-01-13 2024-02-09 日产化学株式会社 包含酰胺溶剂的抗蚀剂下层膜形成用组合物
WO2018190179A1 (ja) * 2017-04-10 2018-10-18 大日本印刷株式会社 ポリイミドフィルム、積層体、及びディスプレイ用表面材
CN115960352B (zh) * 2022-12-29 2024-07-05 深圳市道尔顿电子材料股份有限公司 一种光敏聚酰亚胺前体树脂及其制备方法和感光树脂组合物
CN117304225B (zh) * 2023-09-12 2024-03-29 波米科技有限公司 一种含炔基化合物、正型感光性树脂组合物及其制备方法和应用

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3683464D1 (de) 1985-12-05 1992-02-27 Ibm Photoresistzusammensetzungen mit vermindertem loesungsgrad in basischen entwicklern, auf basis von durch diazochinon sensibilisierter polyamidsaeure.
JPH0673003A (ja) * 1992-08-28 1994-03-15 Toshiba Corp ビスマレイミド化合物及び感光性樹脂組成物
JP3950104B2 (ja) * 1994-03-29 2007-07-25 株式会社東芝 ポリイミド前駆体、ポリイミド前駆体組成物、ポリイミド樹脂および電子部品
JP3207352B2 (ja) 1996-05-13 2001-09-10 住友ベークライト株式会社 ポジ型感光性樹脂組成物
JPH1184653A (ja) * 1997-09-11 1999-03-26 Hitachi Chem Co Ltd 耐熱性感光性重合体組成物及びパターンの製造法
JP4333095B2 (ja) * 1998-10-30 2009-09-16 日立化成デュポンマイクロシステムズ株式会社 感光性重合体組成物、レリーフパターンの製造法及び電子部品
JP4250841B2 (ja) * 1999-12-20 2009-04-08 日立化成デュポンマイクロシステムズ株式会社 ポジ型感光性樹脂組成物、パタ−ンの製造法および電子部品
JP4087037B2 (ja) * 2000-03-06 2008-05-14 住友ベークライト株式会社 ポジ型感光性樹脂組成物
JP2001296657A (ja) * 2000-04-17 2001-10-26 Sumitomo Bakelite Co Ltd ポジ型感光性樹脂組成物及びその製造方法並びにその組成物を用いた半導体装置
JP3953759B2 (ja) * 2001-08-28 2007-08-08 住友ベークライト株式会社 半導体装置
JP4178011B2 (ja) 2002-09-03 2008-11-12 群栄化学工業株式会社 ポジ型感光性樹脂組成物
JP4438296B2 (ja) 2003-01-27 2010-03-24 日立化成デュポンマイクロシステムズ株式会社 感光性樹脂組成物、パターンの製造法及び電子部品
JP4556616B2 (ja) * 2003-10-28 2010-10-06 住友ベークライト株式会社 ポジ型感光性樹脂組成物、該ポジ型感光性樹脂組成物を用いた半導体装置及び表示素子、並びに半導体装置及び表示素子の製造方法
JP4525937B2 (ja) * 2004-06-08 2010-08-18 日産化学工業株式会社 ポジ型感光性樹脂組成物
JP5211438B2 (ja) * 2005-06-09 2013-06-12 東レ株式会社 樹脂組成物およびそれを用いた表示装置
CN101278234B (zh) * 2005-09-05 2011-07-13 旭化成电子材料株式会社 正型感光性树脂组合物

Also Published As

Publication number Publication date
JP5435227B2 (ja) 2014-03-05
WO2008123507A1 (ja) 2008-10-16
KR20160005376A (ko) 2016-01-14
TW200910009A (en) 2009-03-01
KR101674654B1 (ko) 2016-11-09
KR20100016021A (ko) 2010-02-12
KR20140110091A (ko) 2014-09-16
KR20150085104A (ko) 2015-07-22
JPWO2008123507A1 (ja) 2010-07-15
KR101640143B1 (ko) 2016-07-18

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