TW200745756A - Positive type photosensitive resin composition and cured coating prepared therefrom - Google Patents
Positive type photosensitive resin composition and cured coating prepared therefromInfo
- Publication number
- TW200745756A TW200745756A TW096102705A TW96102705A TW200745756A TW 200745756 A TW200745756 A TW 200745756A TW 096102705 A TW096102705 A TW 096102705A TW 96102705 A TW96102705 A TW 96102705A TW 200745756 A TW200745756 A TW 200745756A
- Authority
- TW
- Taiwan
- Prior art keywords
- resin composition
- photosensitive resin
- film
- ingredient
- positive photosensitive
- Prior art date
Links
- 239000011342 resin composition Substances 0.000 title abstract 4
- 239000011248 coating agent Substances 0.000 title 1
- 238000000576 coating method Methods 0.000 title 1
- 239000004615 ingredient Substances 0.000 abstract 3
- 229920005601 base polymer Polymers 0.000 abstract 2
- 239000000126 substance Substances 0.000 abstract 2
- 239000002253 acid Substances 0.000 abstract 1
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 229920006037 cross link polymer Polymers 0.000 abstract 1
- 125000000524 functional group Chemical group 0.000 abstract 1
- 238000013007 heat curing Methods 0.000 abstract 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 abstract 1
- 239000007788 liquid Substances 0.000 abstract 1
- 239000004973 liquid crystal related substance Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 230000035945 sensitivity Effects 0.000 abstract 1
- 239000002904 solvent Substances 0.000 abstract 1
- 238000002834 transmittance Methods 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/80—Masked polyisocyanates
- C08G18/8061—Masked polyisocyanates masked with compounds having only one group containing active hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/64—Macromolecular compounds not provided for by groups C08G18/42 - C08G18/63
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
- G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Materials For Photolithography (AREA)
- Polyurethanes Or Polyureas (AREA)
Abstract
To provide: a positive photosensitive resin composition which has excellent storage stability and high sensitivity and is reduced in film thickness loss in unexposed areas and which, after film formation even when subjected to burning at a high temperature or a treatment with a resist stripper liquid, retains a high transmittance and suffers no decrease in film thickness; and a cured film which is obtained from the positive photosensitive resin composition and is suitable for use as a film material for various displays, e.g., an array planarization film for TFT liquid-crystal elements. The positive photosensitive resin composition comprises: ingredient (A) which is a thermally crosslinked polymer formed from a base polymer having a functional group capable of undergoing heat curing reaction by bonding the base polymer to itself through a chemical structure comprising two or more heat-crosslinkable groups represented by the formula (1); [Chemical formula 1] formula (1) ingredient (B) which is a compound having two or more blocked isocyanate groups per molecule; ingredient (C) which is a photo-acid generator; and a solvent (D).
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006016564 | 2006-01-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200745756A true TW200745756A (en) | 2007-12-16 |
TWI411883B TWI411883B (en) | 2013-10-11 |
Family
ID=38309048
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096102705A TWI411883B (en) | 2006-01-25 | 2007-01-24 | Positive type photosensitive resin composition and cured coating prepared therefrom |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5019055B2 (en) |
KR (1) | KR101369486B1 (en) |
CN (1) | CN101374878B (en) |
TW (1) | TWI411883B (en) |
WO (1) | WO2007086249A1 (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1904736B (en) | 2005-07-25 | 2012-06-13 | 日产化学工业株式会社 | Positive-type photosensitive resin composition and cured film manufactured therefrom |
ATE541242T1 (en) | 2007-01-22 | 2012-01-15 | Nissan Chemical Ind Ltd | POSITIVE LIGHT SENSITIVE RESIN COMPOSITION |
WO2009059031A2 (en) * | 2007-10-30 | 2009-05-07 | Brewer Science Inc. | Photoimageable branched polymer |
JP5562651B2 (en) * | 2008-01-21 | 2014-07-30 | 株式会社ダイセル | Chemically amplified photoresist resin and method for producing the same |
JP5498971B2 (en) * | 2010-03-11 | 2014-05-21 | 富士フイルム株式会社 | Positive photosensitive resin composition, method for forming cured film, cured film, liquid crystal display device, and organic EL display device |
JP5734152B2 (en) * | 2011-09-30 | 2015-06-10 | 富士フイルム株式会社 | Photosensitive resin composition, cured film and method for producing the same |
KR101989196B1 (en) * | 2013-03-14 | 2019-06-13 | 동우 화인켐 주식회사 | Binder resin |
CN103941544A (en) * | 2014-01-26 | 2014-07-23 | 京东方科技集团股份有限公司 | Photoresist, and preparation method and application method thereof |
KR102622165B1 (en) * | 2014-12-04 | 2024-01-08 | 닛산 가가쿠 가부시키가이샤 | Positive-acting photosensitive resin composition |
CN107357134B (en) * | 2016-05-09 | 2021-12-10 | 台湾积体电路制造股份有限公司 | Composition and method for forming a material layer |
CN113474684A (en) * | 2019-02-25 | 2021-10-01 | 日产化学株式会社 | Photosensitive resin composition for microlens |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0695369A (en) * | 1991-10-14 | 1994-04-08 | Sannopuko Kk | Photosensitive resin composition |
JP3570477B2 (en) * | 1997-01-24 | 2004-09-29 | 信越化学工業株式会社 | High molecular compound and chemically amplified positive resist material |
JP4424630B2 (en) * | 1999-07-13 | 2010-03-03 | 三菱レイヨン株式会社 | Chemically amplified resist composition and resist pattern forming method |
JP4124978B2 (en) * | 2001-04-05 | 2008-07-23 | 富士フイルム株式会社 | Positive resist composition |
KR100688109B1 (en) * | 2003-05-20 | 2007-03-02 | 도오꾜오까고오교 가부시끼가이샤 | Chemically amplified positive photo resist composition and method for forming resist pattern |
TWI331255B (en) * | 2003-05-22 | 2010-10-01 | Tokyo Ohka Kogyo Co Ltd | Chemical amplification type positive photoresist composition and resist pattern forming method using the same |
JP4131864B2 (en) * | 2003-11-25 | 2008-08-13 | 東京応化工業株式会社 | Chemical amplification type positive photosensitive thermosetting resin composition, method for forming cured product, and method for producing functional device |
JP2006003846A (en) * | 2004-06-21 | 2006-01-05 | Daito Chemix Corp | Chemically amplified photoresist polymer |
JP2006003844A (en) * | 2004-06-21 | 2006-01-05 | Tokyo Ohka Kogyo Co Ltd | Positive resist composition and method for forming resist pattern |
-
2007
- 2007-01-09 CN CN2007800036251A patent/CN101374878B/en active Active
- 2007-01-09 KR KR1020087020040A patent/KR101369486B1/en active IP Right Grant
- 2007-01-09 WO PCT/JP2007/050087 patent/WO2007086249A1/en active Application Filing
- 2007-01-09 JP JP2007555881A patent/JP5019055B2/en active Active
- 2007-01-24 TW TW096102705A patent/TWI411883B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TWI411883B (en) | 2013-10-11 |
JP5019055B2 (en) | 2012-09-05 |
CN101374878A (en) | 2009-02-25 |
KR20080089485A (en) | 2008-10-06 |
JPWO2007086249A1 (en) | 2009-06-18 |
CN101374878B (en) | 2012-01-18 |
KR101369486B1 (en) | 2014-03-05 |
WO2007086249A1 (en) | 2007-08-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |