WO2008123210A1 - 感光性樹脂組成物 - Google Patents

感光性樹脂組成物 Download PDF

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Publication number
WO2008123210A1
WO2008123210A1 PCT/JP2008/055480 JP2008055480W WO2008123210A1 WO 2008123210 A1 WO2008123210 A1 WO 2008123210A1 JP 2008055480 W JP2008055480 W JP 2008055480W WO 2008123210 A1 WO2008123210 A1 WO 2008123210A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin composition
photosensitive resin
photosensitive
cured
relief pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/055480
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
Tomohiro Yorisue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Kasei Corp
Asahi Kasei Microdevices Corp
Original Assignee
Asahi Kasei E Materials Corp
Asahi Kasei EMD Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei E Materials Corp, Asahi Kasei EMD Corp filed Critical Asahi Kasei E Materials Corp
Priority to JP2009509102A priority Critical patent/JP5144646B2/ja
Priority to AT08738789T priority patent/ATE516519T1/de
Priority to CN2008800101518A priority patent/CN101646978B/zh
Priority to EP08738789A priority patent/EP2133744B1/en
Priority to US12/531,813 priority patent/US8557498B2/en
Publication of WO2008123210A1 publication Critical patent/WO2008123210A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C08F290/148—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • C08F299/08—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/58—Metal-containing linkages
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/14—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inorganic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Materials For Photolithography (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Silicon Polymers (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
PCT/JP2008/055480 2007-04-04 2008-03-25 感光性樹脂組成物 Ceased WO2008123210A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2009509102A JP5144646B2 (ja) 2007-04-04 2008-03-25 感光性樹脂組成物
AT08738789T ATE516519T1 (de) 2007-04-04 2008-03-25 Lichtempfindliche harzzusammensetzung
CN2008800101518A CN101646978B (zh) 2007-04-04 2008-03-25 感光性树脂组合物
EP08738789A EP2133744B1 (en) 2007-04-04 2008-03-25 Photosensitive resin composition
US12/531,813 US8557498B2 (en) 2007-04-04 2008-03-25 Photosensitive resin composition

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007098088 2007-04-04
JP2007-098088 2007-04-04

Publications (1)

Publication Number Publication Date
WO2008123210A1 true WO2008123210A1 (ja) 2008-10-16

Family

ID=39830705

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/055480 Ceased WO2008123210A1 (ja) 2007-04-04 2008-03-25 感光性樹脂組成物

Country Status (8)

Country Link
US (1) US8557498B2 (https=)
EP (1) EP2133744B1 (https=)
JP (1) JP5144646B2 (https=)
KR (1) KR101121936B1 (https=)
CN (1) CN101646978B (https=)
AT (1) ATE516519T1 (https=)
TW (1) TW200905400A (https=)
WO (1) WO2008123210A1 (https=)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009078336A1 (ja) * 2007-12-14 2009-06-25 Asahi Kasei E-Materials Corporation 感光性樹脂組成物
JP2010031272A (ja) * 2008-07-01 2010-02-12 Asahi Kasei E-Materials Corp 感光性樹脂組成物
JP2010047746A (ja) * 2008-07-01 2010-03-04 Asahi Kasei E-Materials Corp 感光性樹脂組成物
JP2012088575A (ja) * 2010-10-20 2012-05-10 Jsr Corp 感放射線性組成物、硬化膜、及びそれらの形成方法
US9434818B2 (en) 2011-01-21 2016-09-06 Fraundhofer-Gesellschaft zur Foerderung der angewandter Forschung e.V. Polymerizable compositions, cured products obtained therewith, and use of these materials
JP2017095643A (ja) * 2015-11-27 2017-06-01 信越化学工業株式会社 ケイ素含有縮合物、ケイ素含有レジスト下層膜形成用組成物、及びパターン形成方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5386314B2 (ja) * 2009-01-13 2014-01-15 コリア アドバンスト インスティテュート オブ サイエンス アンド テクノロジー 透明複合体組成物
KR102232349B1 (ko) 2013-05-31 2021-03-26 롬엔드하스전자재료코리아유한회사 고내열성 네거티브형 감광성 수지 조성물 및 이로부터 제조된 경화막
KR102396005B1 (ko) * 2013-10-21 2022-05-10 닛산 가가쿠 가부시키가이샤 광도파로의 제조방법
EP3243845A1 (en) * 2016-05-13 2017-11-15 Ricoh Company, Ltd. Active energy ray curable composition, cured product, composition storage container, two-dimensional or three-dimensional image forming apparatus, and two-dimensional or three-dimensional image forming method
CN110221731B (zh) * 2018-03-02 2023-03-28 宸鸿光电科技股份有限公司 触控面板的直接图案化方法及其触控面板
KR20250001148A (ko) 2023-06-28 2025-01-06 주식회사 창발켐텍 새로운 글리시딜옥시프로필 유기 실록산 공중합체 및 이의 제조방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05202146A (ja) * 1991-12-27 1993-08-10 I C I Japan Kk 光硬化性樹脂組成物
JPH1083080A (ja) * 1996-06-26 1998-03-31 Dow Corning Asia Kk 紫外線硬化性組成物およびこれを用いた硬化物パターンの形成方法
JP2006045316A (ja) * 2004-08-03 2006-02-16 Nagase Chemtex Corp シルセスキオキサン含有化合物及びその製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6167263A (ja) * 1984-09-10 1986-04-07 Semiconductor Energy Lab Co Ltd 半導体装置作製方法
EP0487453B1 (de) * 1990-11-21 1996-05-22 Ciba-Geigy Ag Silylierte Acylphosphinoxide
JPH04198270A (ja) * 1990-11-27 1992-07-17 Toshiba Silicone Co Ltd 光硬化型シリコーン組成物及びその接着剤組成物
US5861235A (en) 1996-06-26 1999-01-19 Dow Corning Asia, Ltd. Ultraviolet-curable composition and method for patterning the cured product therefrom
JPH1010741A (ja) * 1996-06-27 1998-01-16 Dow Corning Asia Kk 紫外線硬化性ポリシロキサン組成物およびこれを用いた硬化物パターンの製造方法
CN1142217C (zh) * 1998-12-16 2004-03-17 旭化成株式会社 具有改进的熔体流动性的阻燃聚碳酸酯树脂组合物
DE19932629A1 (de) 1999-07-13 2001-01-18 Fraunhofer Ges Forschung Organisch modifizierte, lagerstabile, UV-härtbare, NIR-durchlässige und in Schichtdicken von 1 bis 150 mum fotostrukturierbare Kieselsäurepolykondensate, deren Herstellung und deren Verwendung
EP1391476B1 (en) * 2001-04-09 2015-12-09 Sekisui Chemical Co., Ltd. Photoreactive composition
US6627672B1 (en) 2001-05-16 2003-09-30 Henkel Loctite Corporation UV/moisture dual cure silicone potting compound with improved depth of cure
DE10148894A1 (de) * 2001-10-04 2003-04-30 Fraunhofer Ges Forschung Photochemisch und/oder thermisch strukturierbare Harze auf Silanbasis, einstufiges Verfahren zu deren Herstellung, dabei einzetzbare Ausgangsverbindungen und Herstellungsverfahren für diese
KR100614976B1 (ko) * 2004-04-12 2006-08-25 한국과학기술원 광소자 또는 디스플레이에 이용되는 무기/유기혼성올리고머, 나노혼성고분자 및 그 제조방법
JP5241241B2 (ja) * 2006-01-24 2013-07-17 旭化成イーマテリアルズ株式会社 感光性樹脂組成物
JP4912058B2 (ja) * 2006-06-29 2012-04-04 旭化成イーマテリアルズ株式会社 ハイブリッド感光性樹脂組成物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05202146A (ja) * 1991-12-27 1993-08-10 I C I Japan Kk 光硬化性樹脂組成物
JPH1083080A (ja) * 1996-06-26 1998-03-31 Dow Corning Asia Kk 紫外線硬化性組成物およびこれを用いた硬化物パターンの形成方法
JP2006045316A (ja) * 2004-08-03 2006-02-16 Nagase Chemtex Corp シルセスキオキサン含有化合物及びその製造方法

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009078336A1 (ja) * 2007-12-14 2009-06-25 Asahi Kasei E-Materials Corporation 感光性樹脂組成物
US8475996B2 (en) 2007-12-14 2013-07-02 Asahi Kasei E-Materials Corporation Photosensitive resin composition
JP5525821B2 (ja) * 2007-12-14 2014-06-18 旭化成イーマテリアルズ株式会社 感光性樹脂組成物
JP2010031272A (ja) * 2008-07-01 2010-02-12 Asahi Kasei E-Materials Corp 感光性樹脂組成物
JP2010047746A (ja) * 2008-07-01 2010-03-04 Asahi Kasei E-Materials Corp 感光性樹脂組成物
JP2012088575A (ja) * 2010-10-20 2012-05-10 Jsr Corp 感放射線性組成物、硬化膜、及びそれらの形成方法
US9434818B2 (en) 2011-01-21 2016-09-06 Fraundhofer-Gesellschaft zur Foerderung der angewandter Forschung e.V. Polymerizable compositions, cured products obtained therewith, and use of these materials
JP2017095643A (ja) * 2015-11-27 2017-06-01 信越化学工業株式会社 ケイ素含有縮合物、ケイ素含有レジスト下層膜形成用組成物、及びパターン形成方法

Also Published As

Publication number Publication date
CN101646978A (zh) 2010-02-10
EP2133744A4 (en) 2010-06-16
JPWO2008123210A1 (ja) 2010-07-15
EP2133744A1 (en) 2009-12-16
JP5144646B2 (ja) 2013-02-13
US20100104827A1 (en) 2010-04-29
TW200905400A (en) 2009-02-01
CN101646978B (zh) 2011-11-02
US8557498B2 (en) 2013-10-15
KR101121936B1 (ko) 2012-03-09
TWI375125B (https=) 2012-10-21
KR20100009536A (ko) 2010-01-27
EP2133744B1 (en) 2011-07-13
ATE516519T1 (de) 2011-07-15

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