WO2008111327A1 - 電子部品の打ち抜き装置及び打ち抜き方法 - Google Patents
電子部品の打ち抜き装置及び打ち抜き方法 Download PDFInfo
- Publication number
- WO2008111327A1 WO2008111327A1 PCT/JP2008/050788 JP2008050788W WO2008111327A1 WO 2008111327 A1 WO2008111327 A1 WO 2008111327A1 JP 2008050788 W JP2008050788 W JP 2008050788W WO 2008111327 A1 WO2008111327 A1 WO 2008111327A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- carrier tape
- die
- driven
- punching out
- reel
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/79—Apparatus for Tape Automated Bonding [TAB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/79—Apparatus for Tape Automated Bonding [TAB]
- H01L2224/7955—Mechanical means, e.g. for pressing, stamping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Advancing Webs (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008800077468A CN101632162B (zh) | 2007-03-09 | 2008-01-22 | 电子部件的冲裁装置及冲裁方法 |
KR1020097018609A KR101087919B1 (ko) | 2007-03-09 | 2008-01-22 | 전자부품 펀칭 장치 및 펀칭 방법 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-060920 | 2007-03-09 | ||
JP2007060920 | 2007-03-09 | ||
JP2007231825A JP5350615B2 (ja) | 2007-03-09 | 2007-09-06 | 電子部品の打ち抜き装置及び打ち抜き方法 |
JP2007-231825 | 2007-09-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008111327A1 true WO2008111327A1 (ja) | 2008-09-18 |
Family
ID=39759270
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/050788 WO2008111327A1 (ja) | 2007-03-09 | 2008-01-22 | 電子部品の打ち抜き装置及び打ち抜き方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5350615B2 (ja) |
KR (1) | KR101087919B1 (ja) |
CN (1) | CN101632162B (ja) |
TW (1) | TWI430876B (ja) |
WO (1) | WO2008111327A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103978084A (zh) * | 2013-02-07 | 2014-08-13 | 日本发条株式会社 | 冲压出减振器的方法,冲压设备和附接设备 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100885273B1 (ko) * | 2008-07-24 | 2009-02-25 | 주식회사 성진하이메크 | Tab ic 타발 장치 및 tab ic 타발 방법 |
TWI448370B (zh) * | 2009-06-04 | 2014-08-11 | Au Optronics Corp | 沖切機台及定位沖切方法 |
KR101311082B1 (ko) * | 2011-10-31 | 2013-10-15 | 주식회사 테크웰시스템 | 이형 필름 공급 유닛 및 이를 갖는 전자 부품 몰딩 장치 |
CN102922564A (zh) * | 2012-09-28 | 2013-02-13 | 信源电子制品(昆山)有限公司 | 料带剪切机 |
CN106298596A (zh) * | 2016-10-15 | 2017-01-04 | 广州明森科技股份有限公司 | 一种智能卡芯片带输送装置 |
CN107504155A (zh) * | 2017-07-04 | 2017-12-22 | 深圳市联得自动化装备股份有限公司 | Cof载带棘轮 |
CN110467029A (zh) * | 2019-08-02 | 2019-11-19 | 深圳市华亚信科技有限公司 | 一种覆晶薄膜冲裁装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05136211A (ja) * | 1991-11-08 | 1993-06-01 | Toshiba Corp | インナリ−ドボンデイング装置 |
JPH11345931A (ja) * | 1998-05-29 | 1999-12-14 | Dainippon Printing Co Ltd | リードフレームのテーピング方法およびテーピング装置 |
JP2001127489A (ja) * | 1999-10-29 | 2001-05-11 | Shibaura Mechatronics Corp | 部品実装装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2515267B2 (ja) * | 1989-01-21 | 1996-07-10 | 新光電気工業株式会社 | リ―ドフレ―ム用テ―ピング装置 |
JP2617356B2 (ja) * | 1989-06-07 | 1997-06-04 | 株式会社新川 | タブテ−プボンディング装置 |
JPH10598A (ja) * | 1996-06-10 | 1998-01-06 | Toshiba Corp | 金型装置およびそれを用いた部品供給装置 |
JP2003095212A (ja) * | 2001-09-26 | 2003-04-03 | Jcm:Kk | 帯状キャリアテープの製造装置 |
-
2007
- 2007-09-06 JP JP2007231825A patent/JP5350615B2/ja active Active
-
2008
- 2008-01-22 CN CN2008800077468A patent/CN101632162B/zh active Active
- 2008-01-22 WO PCT/JP2008/050788 patent/WO2008111327A1/ja active Application Filing
- 2008-01-22 KR KR1020097018609A patent/KR101087919B1/ko active IP Right Grant
- 2008-02-12 TW TW097104805A patent/TWI430876B/zh active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05136211A (ja) * | 1991-11-08 | 1993-06-01 | Toshiba Corp | インナリ−ドボンデイング装置 |
JPH11345931A (ja) * | 1998-05-29 | 1999-12-14 | Dainippon Printing Co Ltd | リードフレームのテーピング方法およびテーピング装置 |
JP2001127489A (ja) * | 1999-10-29 | 2001-05-11 | Shibaura Mechatronics Corp | 部品実装装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103978084A (zh) * | 2013-02-07 | 2014-08-13 | 日本发条株式会社 | 冲压出减振器的方法,冲压设备和附接设备 |
CN103978084B (zh) * | 2013-02-07 | 2016-09-28 | 日本发条株式会社 | 冲压出减振器的方法,冲压设备和附接设备 |
Also Published As
Publication number | Publication date |
---|---|
KR101087919B1 (ko) | 2011-11-28 |
TW200916290A (en) | 2009-04-16 |
KR20090116790A (ko) | 2009-11-11 |
TWI430876B (zh) | 2014-03-21 |
CN101632162A (zh) | 2010-01-20 |
JP2008258560A (ja) | 2008-10-23 |
CN101632162B (zh) | 2012-11-28 |
JP5350615B2 (ja) | 2013-11-27 |
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