WO2008108326A1 - 光半導体用熱硬化性組成物、光半導体素子用ダイボンド材、光半導体素子用アンダーフィル材、光半導体素子用封止剤及び光半導体素子 - Google Patents
光半導体用熱硬化性組成物、光半導体素子用ダイボンド材、光半導体素子用アンダーフィル材、光半導体素子用封止剤及び光半導体素子 Download PDFInfo
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- WO2008108326A1 WO2008108326A1 PCT/JP2008/053749 JP2008053749W WO2008108326A1 WO 2008108326 A1 WO2008108326 A1 WO 2008108326A1 JP 2008053749 W JP2008053749 W JP 2008053749W WO 2008108326 A1 WO2008108326 A1 WO 2008108326A1
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- Prior art keywords
- optical semiconductor
- semiconductor device
- thermosetting composition
- die
- optical
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- 230000003287 optical effect Effects 0.000 title abstract 11
- 239000004065 semiconductor Substances 0.000 title abstract 11
- 239000000463 material Substances 0.000 title abstract 5
- 229920001187 thermosetting polymer Polymers 0.000 title abstract 4
- 238000007789 sealing Methods 0.000 title abstract 2
- -1 phosphorus compound Chemical class 0.000 abstract 4
- 239000003795 chemical substances by application Substances 0.000 abstract 2
- 150000004292 cyclic ethers Chemical class 0.000 abstract 2
- 229910052698 phosphorus Inorganic materials 0.000 abstract 2
- 239000011574 phosphorus Substances 0.000 abstract 2
- 125000000217 alkyl group Chemical group 0.000 abstract 1
- 150000002989 phenols Chemical class 0.000 abstract 1
- XRBCRPZXSCBRTK-UHFFFAOYSA-N phosphonous acid Chemical group OPO XRBCRPZXSCBRTK-UHFFFAOYSA-N 0.000 abstract 1
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical group OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 abstract 1
- 229920002050 silicone resin Polymers 0.000 abstract 1
- 238000004383 yellowing Methods 0.000 abstract 1
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- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
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- C08K5/13—Phenols; Phenolates
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- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
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Abstract
本発明は、優れた透明性を有し、耐熱性、耐光性、及び、ハウジング材への密着性に優れ、使用条件下において黄変等の問題が生じることのない光半導体用熱硬化性組成物、光半導体素子用封止剤、光半導体素子用ダイボンド材、光半導体素子用アンダーフィル材、及び、これらを用いてなる光半導体素子を提供することを目的とする。
本発明は、分子内に環状エーテル含有基を有するシリコーン樹脂、前記環状エーテル含有基と反応する熱硬化剤、リン系化合物及びフェノール系化合物を含有する光半導体用熱硬化性組成物であって、前記リン系化合物は、ホスファイト骨格又はホスホナイト骨格を有し、前記フェノール系化合物は、少なくとも第2位にアルキル基を有する置換フェノール誘導体である光半導体用熱硬化性組成物である。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2008531476A JPWO2008108326A1 (ja) | 2007-03-05 | 2008-03-03 | 光半導体用熱硬化性組成物、光半導体素子用ダイボンド材、光半導体素子用アンダーフィル材、光半導体素子用封止剤及び光半導体素子 |
Applications Claiming Priority (2)
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JP2007054031 | 2007-03-05 | ||
JP2007-054031 | 2007-03-05 |
Publications (1)
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WO2008108326A1 true WO2008108326A1 (ja) | 2008-09-12 |
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PCT/JP2008/053749 WO2008108326A1 (ja) | 2007-03-05 | 2008-03-03 | 光半導体用熱硬化性組成物、光半導体素子用ダイボンド材、光半導体素子用アンダーフィル材、光半導体素子用封止剤及び光半導体素子 |
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WO (1) | WO2008108326A1 (ja) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101582480B (zh) * | 2009-05-08 | 2011-06-22 | 华灿光电股份有限公司 | 带热沉的led芯片及其制造方法 |
CN103087472A (zh) * | 2009-03-31 | 2013-05-08 | 日立化成工业株式会社 | 电子部件用液体状树脂组合物及电子部件装置 |
JP2015078256A (ja) * | 2013-10-15 | 2015-04-23 | 信越化学工業株式会社 | 加熱硬化型導電性シリコーン組成物、該組成物からなる導電性接着剤、該組成物からなる導電性ダイボンド材、該ダイボンド材の硬化物を有する光半導体装置。 |
JP2016050301A (ja) * | 2014-08-28 | 2016-04-11 | スリーボンドファインケミカル株式会社 | 熱伝導性樹脂組成物 |
CN108192293A (zh) * | 2009-03-31 | 2018-06-22 | 日立化成工业株式会社 | 电子部件用液体状树脂组合物及电子部件装置 |
WO2022138344A1 (ja) * | 2020-12-25 | 2022-06-30 | ダウ・東レ株式会社 | 硬化性シリコーン組成物、その硬化物および積層体 |
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2008
- 2008-03-03 JP JP2008531476A patent/JPWO2008108326A1/ja active Pending
- 2008-03-03 WO PCT/JP2008/053749 patent/WO2008108326A1/ja active Application Filing
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