WO2008105234A1 - 静電容量変化検出回路及び半導体装置 - Google Patents
静電容量変化検出回路及び半導体装置 Download PDFInfo
- Publication number
- WO2008105234A1 WO2008105234A1 PCT/JP2008/052287 JP2008052287W WO2008105234A1 WO 2008105234 A1 WO2008105234 A1 WO 2008105234A1 JP 2008052287 W JP2008052287 W JP 2008052287W WO 2008105234 A1 WO2008105234 A1 WO 2008105234A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- terminal
- capacitor
- pad
- detecting circuit
- chip
- Prior art date
Links
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
- G01D5/14—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage
- G01D5/24—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/146—Mixed devices
- H01L2924/1461—MEMS
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Pressure Sensors (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
- Circuit For Audible Band Transducer (AREA)
- Transmission And Conversion Of Sensor Element Output (AREA)
- Measurement Of Resistance Or Impedance (AREA)
- Wire Bonding (AREA)
Abstract
静電容量型センサが形成された半導体チップとその容量変化を検出する検出回路が形成された半導体チップとからなるハイブリッドICにおいて、両チップ間に必要なボンディングワイヤーの数を減らす。センサチップ(50)の裏面を、それが載置された支持基板の表面の電極に接続し、センサのキャパシタCmの一方端子Ncbを基準電位に設定する。センサチップ(50)の表面には他方端子Ncdのパッドを形成する。検出回路チップ(52)には、Cmとの接続端子Ndとなるパッドと、Ndに接続され、Cmを充電するバイアス電圧を出力するバイアス回路(54)と、NdにキャパシタCcを介して接続され、Cmの端子Ncdの電位変化を電気信号として検出する検出回路(56)とが形成される。両チップ(50),(52)は端子Ndのパッドと端子Ncdのパッドとの間のボンディングワイヤーで接続される。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/449,721 US20100066390A1 (en) | 2007-02-26 | 2008-02-13 | Capacitance variation detection circuit and semiconductor device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-045011 | 2007-02-26 | ||
JP2007045011A JP4959370B2 (ja) | 2007-02-26 | 2007-02-26 | 静電容量変化検出回路及び半導体装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008105234A1 true WO2008105234A1 (ja) | 2008-09-04 |
Family
ID=39721071
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/052287 WO2008105234A1 (ja) | 2007-02-26 | 2008-02-13 | 静電容量変化検出回路及び半導体装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20100066390A1 (ja) |
JP (1) | JP4959370B2 (ja) |
TW (1) | TWI362495B (ja) |
WO (1) | WO2008105234A1 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5310145B2 (ja) | 2008-08-20 | 2013-10-09 | 株式会社リコー | 電気泳動液、及びそれを用いた表示素子 |
JPWO2010073598A1 (ja) * | 2008-12-24 | 2012-06-07 | パナソニック株式会社 | 平衡信号出力型センサー |
WO2011161738A1 (ja) * | 2010-06-24 | 2011-12-29 | パナソニック株式会社 | センサー |
JP2012070120A (ja) * | 2010-09-22 | 2012-04-05 | Panasonic Corp | センサ |
JP6010880B2 (ja) * | 2011-04-15 | 2016-10-19 | 株式会社ニコン | 位置情報検出センサ、位置情報検出センサの製造方法、エンコーダ、モータ装置及びロボット装置 |
FR2976675B1 (fr) * | 2011-06-16 | 2013-07-12 | Nanotec Solution | Circuit integre de mesure capacitive a pont flottant. |
US8942389B2 (en) | 2011-08-10 | 2015-01-27 | Robert Bosch Gmbh | Trim method for CMOS-MEMS microphones |
US9695040B2 (en) * | 2012-10-16 | 2017-07-04 | Invensense, Inc. | Microphone system with integrated passive device die |
KR102210985B1 (ko) * | 2014-01-14 | 2021-02-03 | 삼성디스플레이 주식회사 | 구동집적회로, 이를 포함하는 표시장치 및 결합저항 측정 방법 |
JP6194372B2 (ja) * | 2014-01-22 | 2017-09-06 | アルプス電気株式会社 | センサモジュール、並びに、これに用いるセンサチップ及び処理回路チップ |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004184307A (ja) * | 2002-12-05 | 2004-07-02 | Tokyo Electron Ltd | 静電容量検出回路及び静電容量検出方法 |
WO2005086534A1 (ja) * | 2004-03-03 | 2005-09-15 | Matsushita Electric Industrial Co., Ltd. | エレクトレットコンデンサーマイクロフォンユニット |
JP2006211468A (ja) * | 2005-01-31 | 2006-08-10 | Sanyo Electric Co Ltd | 半導体センサ |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003148906A (ja) * | 2001-11-13 | 2003-05-21 | Toko Inc | 静電容量型センサ装置 |
EP1690332A1 (en) * | 2003-12-01 | 2006-08-16 | Audioasics A/S | Microphone with voltage pump |
US7373835B2 (en) * | 2005-01-31 | 2008-05-20 | Sanyo Electric Industries, Ltd. | Semiconductor sensor |
-
2007
- 2007-02-26 JP JP2007045011A patent/JP4959370B2/ja not_active Expired - Fee Related
-
2008
- 2008-02-13 US US12/449,721 patent/US20100066390A1/en not_active Abandoned
- 2008-02-13 WO PCT/JP2008/052287 patent/WO2008105234A1/ja active Application Filing
- 2008-02-15 TW TW97105313A patent/TWI362495B/zh not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004184307A (ja) * | 2002-12-05 | 2004-07-02 | Tokyo Electron Ltd | 静電容量検出回路及び静電容量検出方法 |
WO2005086534A1 (ja) * | 2004-03-03 | 2005-09-15 | Matsushita Electric Industrial Co., Ltd. | エレクトレットコンデンサーマイクロフォンユニット |
JP2006211468A (ja) * | 2005-01-31 | 2006-08-10 | Sanyo Electric Co Ltd | 半導体センサ |
Also Published As
Publication number | Publication date |
---|---|
TWI362495B (en) | 2012-04-21 |
JP2008211421A (ja) | 2008-09-11 |
TW200842317A (en) | 2008-11-01 |
JP4959370B2 (ja) | 2012-06-20 |
US20100066390A1 (en) | 2010-03-18 |
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