WO2009066556A1 - 放射線検出装置 - Google Patents

放射線検出装置 Download PDF

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Publication number
WO2009066556A1
WO2009066556A1 PCT/JP2008/069954 JP2008069954W WO2009066556A1 WO 2009066556 A1 WO2009066556 A1 WO 2009066556A1 JP 2008069954 W JP2008069954 W JP 2008069954W WO 2009066556 A1 WO2009066556 A1 WO 2009066556A1
Authority
WO
WIPO (PCT)
Prior art keywords
board
light detector
circuit board
light
detecting device
Prior art date
Application number
PCT/JP2008/069954
Other languages
English (en)
French (fr)
Inventor
Hitoshi Chiyoma
Hiroshi Iwata
Original Assignee
Kabushiki Kaisha Toshiba
Toshiba Electron Tubes & Devices Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kabushiki Kaisha Toshiba, Toshiba Electron Tubes & Devices Co., Ltd. filed Critical Kabushiki Kaisha Toshiba
Priority to EP08851468.2A priority Critical patent/EP2224264B1/en
Publication of WO2009066556A1 publication Critical patent/WO2009066556A1/ja
Priority to US12/782,074 priority patent/US9006669B2/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/16—Measuring radiation intensity
    • G01T1/20—Measuring radiation intensity with scintillation detectors
    • G01T1/2018—Scintillation-photodiode combinations
    • G01T1/20188—Auxiliary details, e.g. casings or cooling
    • G01T1/20189—Damping or insulation against damage, e.g. caused by heat or pressure
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/16—Measuring radiation intensity
    • G01T1/20—Measuring radiation intensity with scintillation detectors
    • G01T1/2018—Scintillation-photodiode combinations
    • G01T1/20188—Auxiliary details, e.g. casings or cooling
    • G01T1/2019—Shielding against direct hits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Molecular Biology (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Measurement Of Radiation (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Light Receiving Elements (AREA)

Abstract

　放射線検出装置は、放射線を光に変換する蛍光体膜及び光を電気信号に変換する光電変換素子を有した光検出器（１９）と、前記光検出器を電気的に駆動し、前記光検出器からの出力信号を電気的に処理する回路基板（１３）と、互いに接続されたフレキシブル回路基板（２８）と、前記フレキシブル回路基板より可撓性が小さく集積回路半導体素子（２９）が搭載されたＩＣ搭載基板（３０）と、を有し、前記光検出器と前記回路基板とを電気的に接続した接続基板（１４）と、を備えている。
PCT/JP2008/069954 2007-11-19 2008-10-31 放射線検出装置 WO2009066556A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP08851468.2A EP2224264B1 (en) 2007-11-19 2008-10-31 Radiation detector
US12/782,074 US9006669B2 (en) 2007-11-19 2010-05-18 Radiation detector

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007298864A JP5032276B2 (ja) 2007-11-19 2007-11-19 放射線検出装置
JP2007-298864 2007-11-19

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/782,074 Continuation US9006669B2 (en) 2007-11-19 2010-05-18 Radiation detector

Publications (1)

Publication Number Publication Date
WO2009066556A1 true WO2009066556A1 (ja) 2009-05-28

Family

ID=40667381

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/069954 WO2009066556A1 (ja) 2007-11-19 2008-10-31 放射線検出装置

Country Status (4)

Country Link
US (1) US9006669B2 (ja)
EP (1) EP2224264B1 (ja)
JP (1) JP5032276B2 (ja)
WO (1) WO2009066556A1 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180104105A (ko) * 2016-05-11 2018-09-19 도시바 덴시칸 디바이스 가부시키가이샤 방사선 검출기
US10340302B2 (en) 2012-12-07 2019-07-02 Analog Devices, Inc. Compact sensor module
US11664340B2 (en) 2020-07-13 2023-05-30 Analog Devices, Inc. Negative fillet for mounting an integrated device die to a carrier
US11688709B2 (en) 2018-12-06 2023-06-27 Analog Devices, Inc. Integrated device packages with passive device assemblies
US12002838B2 (en) 2019-12-05 2024-06-04 Analog Devices, Inc. Shielded integrated device packages

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012104775A2 (en) 2011-02-03 2012-08-09 Koninklijke Philips Electronics N.V. Single or multi-energy vertical radiation sensitive detectors
JP2013120242A (ja) * 2011-12-06 2013-06-17 Canon Inc 放射線撮影装置
US8829454B2 (en) * 2012-02-27 2014-09-09 Analog Devices, Inc. Compact sensor module
JP5815483B2 (ja) * 2012-07-27 2015-11-17 富士フイルム株式会社 放射線画像撮影装置
US10705228B2 (en) 2014-06-18 2020-07-07 Oregon State University Photo sensor for use as a radiation detector and power supply and method for making and using the device
US10422888B1 (en) 2015-07-17 2019-09-24 Triad National Security, Llc Scintillation detectors
CN105182395B (zh) * 2015-09-26 2019-02-01 上海联影医疗科技有限公司 X射线探测器及ct系统
CN106324648B (zh) * 2016-08-31 2023-08-01 同方威视技术股份有限公司 半导体探测器及其封装方法
CN114822234A (zh) * 2021-01-29 2022-07-29 京东方科技集团股份有限公司 一种柔性显示模组及其制备方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08116044A (ja) 1993-12-27 1996-05-07 Canon Inc 光電変換装置、その駆動方法及びそれを有するシステム
JP2002022841A (ja) * 2000-07-04 2002-01-23 Canon Inc 放射線撮影装置及びそれを備えたシステム
JP2003035778A (ja) * 2001-07-19 2003-02-07 Canon Inc 光電変換装置および放射線撮像装置
JP2003163343A (ja) 2001-07-30 2003-06-06 Canon Inc 撮像装置および撮像システム
JP2004165354A (ja) * 2002-11-12 2004-06-10 Canon Inc 半導体装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4037047A (en) * 1974-12-31 1977-07-19 Martin Marietta Corporation Multilayer circuit board with integral flexible appendages
JP3957803B2 (ja) * 1996-02-22 2007-08-15 キヤノン株式会社 光電変換装置
JPH11220656A (ja) * 1998-01-30 1999-08-10 Canon Inc 二次元撮像装置の実装構造
JP2001251557A (ja) * 1999-12-27 2001-09-14 Canon Inc エリアセンサ、該エリアセンサを有する画像入力装置および該エリアセンサの駆動方法
DE10116222A1 (de) * 2001-03-30 2002-10-17 Siemens Ag Detektor für Röntgen-Computertomograph
US6713768B2 (en) * 2001-04-16 2004-03-30 Photon Imaging, Inc. Junction-side illuminated silicon detector arrays
JP2003017673A (ja) * 2001-06-28 2003-01-17 Canon Inc 撮像装置および放射線撮像装置
JP2004085456A (ja) * 2002-08-28 2004-03-18 Canon Inc 放射線撮像装置及び放射線撮像システム
JP4138529B2 (ja) * 2003-02-24 2008-08-27 浜松ホトニクス株式会社 半導体装置、及びそれを用いた放射線検出器
JP2004279319A (ja) * 2003-03-18 2004-10-07 Canon Inc 放射線検出装置及び放射線撮像システム
JP3848288B2 (ja) * 2003-04-25 2006-11-22 キヤノン株式会社 放射線画像撮影装置
JP2005195643A (ja) * 2003-12-26 2005-07-21 Canon Inc 放射線画像撮影装置
JP2006017742A (ja) * 2005-08-24 2006-01-19 Canon Inc 放射線検出装置
JP4892894B2 (ja) * 2005-08-31 2012-03-07 株式会社島津製作所 光または放射線検出ユニットの製造方法、およびその製造方法で製造された光または放射線検出ユニット

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08116044A (ja) 1993-12-27 1996-05-07 Canon Inc 光電変換装置、その駆動方法及びそれを有するシステム
JP2002022841A (ja) * 2000-07-04 2002-01-23 Canon Inc 放射線撮影装置及びそれを備えたシステム
JP2003035778A (ja) * 2001-07-19 2003-02-07 Canon Inc 光電変換装置および放射線撮像装置
JP2003163343A (ja) 2001-07-30 2003-06-06 Canon Inc 撮像装置および撮像システム
JP2004165354A (ja) * 2002-11-12 2004-06-10 Canon Inc 半導体装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2224264A4

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10340302B2 (en) 2012-12-07 2019-07-02 Analog Devices, Inc. Compact sensor module
KR20180104105A (ko) * 2016-05-11 2018-09-19 도시바 덴시칸 디바이스 가부시키가이샤 방사선 검출기
KR102146033B1 (ko) 2016-05-11 2020-08-19 캐논 덴시칸 디바이스 가부시키가이샤 방사선 검출기
US11688709B2 (en) 2018-12-06 2023-06-27 Analog Devices, Inc. Integrated device packages with passive device assemblies
US12002838B2 (en) 2019-12-05 2024-06-04 Analog Devices, Inc. Shielded integrated device packages
US11664340B2 (en) 2020-07-13 2023-05-30 Analog Devices, Inc. Negative fillet for mounting an integrated device die to a carrier

Also Published As

Publication number Publication date
US20100224785A1 (en) 2010-09-09
JP5032276B2 (ja) 2012-09-26
EP2224264A4 (en) 2017-04-12
EP2224264B1 (en) 2021-03-10
EP2224264A1 (en) 2010-09-01
JP2009122058A (ja) 2009-06-04
US9006669B2 (en) 2015-04-14

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