WO2008102795A1 - フレキシブル多層配線板 - Google Patents

フレキシブル多層配線板 Download PDF

Info

Publication number
WO2008102795A1
WO2008102795A1 PCT/JP2008/052830 JP2008052830W WO2008102795A1 WO 2008102795 A1 WO2008102795 A1 WO 2008102795A1 JP 2008052830 W JP2008052830 W JP 2008052830W WO 2008102795 A1 WO2008102795 A1 WO 2008102795A1
Authority
WO
WIPO (PCT)
Prior art keywords
multilayer wiring
wiring board
flexible multilayer
board
inner layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/052830
Other languages
English (en)
French (fr)
Inventor
Shigehiro Nakamura
Toshihiko Itou
Masayoshi Joumen
Youichirou Mansei
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to CN2008800055774A priority Critical patent/CN101617575B/zh
Priority to JP2009500206A priority patent/JPWO2008102795A1/ja
Priority to US12/527,908 priority patent/US8232476B2/en
Publication of WO2008102795A1 publication Critical patent/WO2008102795A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

　本発明は、薄型化が容易であり、しかも繰り返しの屈曲や熱衝撃に対しても十分な耐久性を有するフレキシブル多層配線板を提供することを目的とする。好適なフレキシブル多層配線板（１００）は、絶縁層（２）の両面に内層配線（４）が形成された可とう性を有する内層基板（１０）と、内層基板の少なくとも片側に配置された外層配線（３０）と、内層基板と外層配線との間に介在する絶縁接着シート（２０）とを備える。そして、絶縁接着シートのうちの少なくとも一つは、イミド基含有ポリマーからなるものである。
PCT/JP2008/052830 2007-02-20 2008-02-20 フレキシブル多層配線板 Ceased WO2008102795A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2008800055774A CN101617575B (zh) 2007-02-20 2008-02-20 挠性多层配线板
JP2009500206A JPWO2008102795A1 (ja) 2007-02-20 2008-02-20 フレキシブル多層配線板
US12/527,908 US8232476B2 (en) 2007-02-20 2008-02-20 Flexible multilayer wiring board

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-039300 2007-02-20
JP2007039300 2007-02-20
JP2007-250028 2007-09-26
JP2007250028 2007-09-26

Publications (1)

Publication Number Publication Date
WO2008102795A1 true WO2008102795A1 (ja) 2008-08-28

Family

ID=39710069

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/052830 Ceased WO2008102795A1 (ja) 2007-02-20 2008-02-20 フレキシブル多層配線板

Country Status (6)

Country Link
US (1) US8232476B2 (ja)
JP (1) JPWO2008102795A1 (ja)
KR (1) KR101099400B1 (ja)
CN (1) CN101617575B (ja)
TW (1) TWI424802B (ja)
WO (1) WO2008102795A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8683681B2 (en) * 2010-12-07 2014-04-01 Raytheon Company Room temperature low contact pressure method
KR20150010161A (ko) * 2013-07-18 2015-01-28 삼성디스플레이 주식회사 가요성 인쇄 회로 필름 및 이를 포함하는 표시 장치
CN104582325B (zh) * 2013-10-12 2018-03-27 鹏鼎控股(深圳)股份有限公司 刚挠结合板及其制作方法、电路板模组
JP6809544B2 (ja) * 2017-02-20 2021-01-06 株式会社村田製作所 電子機器
US10912204B2 (en) * 2018-03-30 2021-02-02 Samsung Electro-Mechanics Co., Ltd. Electronic device and rigid-flexible substrate module
US10638616B1 (en) 2018-10-30 2020-04-28 Taiwan Semiconductor Manufacturing Co., Ltd. Circuit carrier and manifacturing method thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007013113A (ja) * 2005-05-30 2007-01-18 Hitachi Chem Co Ltd 多層配線板

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FR2376167A1 (fr) * 1976-12-31 1978-07-28 Rhone Poulenc Ind Polymeres a groupements imides
FR2427346A1 (fr) * 1978-05-30 1979-12-28 Rhone Poulenc Ind Polymeres a groupements imide
DE2946726C2 (de) * 1979-11-20 1982-05-19 Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern Leiterplatte mit starren und flexiblen Bereichen und Verfahren zu deren Herstellung
US4931134A (en) * 1989-08-15 1990-06-05 Parlex Corporation Method of using laser routing to form a rigid/flex circuit board
JPH03262195A (ja) * 1990-03-12 1991-11-21 Sharp Corp 複合多層プリント配線板の製造方法
US5206463A (en) * 1990-07-24 1993-04-27 Miraco, Inc. Combined rigid and flexible printed circuits and method of manufacture
JPH0541580A (ja) 1991-08-05 1993-02-19 Nitto Denko Corp 多層回路基板
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Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007013113A (ja) * 2005-05-30 2007-01-18 Hitachi Chem Co Ltd 多層配線板

Also Published As

Publication number Publication date
US20100084169A1 (en) 2010-04-08
KR101099400B1 (ko) 2011-12-27
TW200901848A (en) 2009-01-01
CN101617575B (zh) 2011-06-22
US8232476B2 (en) 2012-07-31
JPWO2008102795A1 (ja) 2010-05-27
KR20090101971A (ko) 2009-09-29
CN101617575A (zh) 2009-12-30
TWI424802B (zh) 2014-01-21

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