WO2008090950A1 - 封止用フィルム、及びそれを用いた半導体装置 - Google Patents

封止用フィルム、及びそれを用いた半導体装置 Download PDF

Info

Publication number
WO2008090950A1
WO2008090950A1 PCT/JP2008/050978 JP2008050978W WO2008090950A1 WO 2008090950 A1 WO2008090950 A1 WO 2008090950A1 JP 2008050978 W JP2008050978 W JP 2008050978W WO 2008090950 A1 WO2008090950 A1 WO 2008090950A1
Authority
WO
WIPO (PCT)
Prior art keywords
sealing film
component
disclosed
film
semiconductor device
Prior art date
Application number
PCT/JP2008/050978
Other languages
English (en)
French (fr)
Inventor
Hiroyuki Kawakami
Katsuyasu Niijima
Naoki Tomori
Daichi Takemori
Takuya Imai
Original Assignee
Hitachi Chemical Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007016891A external-priority patent/JP2008060523A/ja
Application filed by Hitachi Chemical Co., Ltd. filed Critical Hitachi Chemical Co., Ltd.
Priority to US12/299,714 priority Critical patent/US8771828B2/en
Priority to EP20080703806 priority patent/EP2110851A4/en
Publication of WO2008090950A1 publication Critical patent/WO2008090950A1/ja
Priority to US13/619,314 priority patent/US8715454B2/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/54—Inorganic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/66—Substances characterised by their function in the composition
    • C08L2666/72—Fillers; Inorganic pigments; Reinforcing additives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y10T428/2495—Thickness [relative or absolute]
    • Y10T428/24967—Absolute thicknesses specified
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Epoxy Resins (AREA)

Abstract

　下記（Ａ）、（Ｂ）及び（Ｃ）を含有し、８０°Cでのフロー量が１５０～１８００μｍである樹脂層を有する封止フィルムとして、充填性及び密着性に優れる封止フィルム、その製造方法及びそれを用いた半導体装置を提供する。 （Ａ）架橋性官能基を含み、重量平均分子量が１０万以上でかつＴｇが－５０～５０°Cである高分子量成分（ａ１）と、エポキシ樹脂を主成分とする熱硬化性成分（ａ２）と、を含む（Ａ）樹脂成分、 （Ｂ）平均粒径が１～３０μｍのフィラー、 （Ｃ）着色剤。 　または、上記（Ａ）、上記（Ｂ）及び（Ｃ）を含有し、Ｂステージ状態のフィルムの熱硬化粘弾性測定における５０～１００°Cの粘度が１００００～１０００００Ｐａ．ｓである樹脂層を有する封止用フィルムとして、密着性、形状維持性に優れる封止用フィルム、及びそれを用いた半導体装置を提供する。
PCT/JP2008/050978 2007-01-26 2008-01-24 封止用フィルム、及びそれを用いた半導体装置 WO2008090950A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US12/299,714 US8771828B2 (en) 2007-01-26 2008-01-24 Sealing film and a semiconductor device using the same
EP20080703806 EP2110851A4 (en) 2007-01-26 2008-01-24 SEALING FILM AND SEMICONDUCTOR ELEMENT FOR THIS
US13/619,314 US8715454B2 (en) 2007-01-26 2012-09-14 Sealing film and a semiconductor device using the same

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-016891 2007-01-26
JP2007016891A JP2008060523A (ja) 2006-08-01 2007-01-26 封止フィルム及びそれを用いた半導体装置
JP2007-109316 2007-04-18
JP2007109316 2007-04-18

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US12/299,714 A-371-Of-International US8771828B2 (en) 2007-01-26 2008-01-24 Sealing film and a semiconductor device using the same
US13/619,314 Division US8715454B2 (en) 2007-01-26 2012-09-14 Sealing film and a semiconductor device using the same

Publications (1)

Publication Number Publication Date
WO2008090950A1 true WO2008090950A1 (ja) 2008-07-31

Family

ID=39644524

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/050978 WO2008090950A1 (ja) 2007-01-26 2008-01-24 封止用フィルム、及びそれを用いた半導体装置

Country Status (5)

Country Link
US (2) US8771828B2 (ja)
EP (1) EP2110851A4 (ja)
KR (1) KR20090027612A (ja)
TW (1) TW200837137A (ja)
WO (1) WO2008090950A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7511399B2 (ja) 2020-06-26 2024-07-05 太陽ホールディングス株式会社 硬化性樹脂組成物、ドライフィルム、硬化物、電子部品

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110089360A (ko) * 2008-11-26 2011-08-05 쓰리엠 이노베이티브 프로퍼티즈 컴파니 복합 구조체용 표면처리 필름
JP5768023B2 (ja) * 2012-08-29 2015-08-26 日東電工株式会社 電子部品封止用熱硬化性樹脂シート、樹脂封止型半導体装置、及び樹脂封止型半導体装置の製造方法
JP2015103572A (ja) * 2013-11-21 2015-06-04 日東電工株式会社 両面セパレータ付き封止用シート、及び、半導体装置の製造方法
CN104091790B (zh) * 2014-07-25 2017-11-14 华进半导体封装先导技术研发中心有限公司 一种半导体封装基板结构及其制作方法
KR102394174B1 (ko) 2015-06-09 2022-05-04 주식회사 케이씨씨 반도체 소자용 봉지 필름
JP6904112B2 (ja) * 2017-06-30 2021-07-14 株式会社オートネットワーク技術研究所 車両用シール部材および車両用電気中継部品
USD962882S1 (en) * 2019-11-14 2022-09-06 Showa Denko Materials Co., Ltd. Temporary protective film for manufacturing semiconductor devices
USD962883S1 (en) * 2020-11-02 2022-09-06 Showa Denko Materials Co., Ltd. Temporary protective film for manufacturing semiconductor devices

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05190697A (ja) 1992-01-10 1993-07-30 Nitto Denko Corp 半導体部品の製造方法
JPH05283456A (ja) 1992-03-31 1993-10-29 Toshiba Corp 封止用シート、樹脂封止装置および樹脂封止型半導体装置の製造方法
JPH0873621A (ja) 1994-09-07 1996-03-19 Toshiba Corp 樹脂シート
JP2004043761A (ja) * 2001-08-27 2004-02-12 Hitachi Chem Co Ltd 接着シート並びに半導体装置及びその製造方法
JP2005060584A (ja) 2003-08-18 2005-03-10 Hitachi Chem Co Ltd 封止用フィルム

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62270617A (ja) 1986-05-20 1987-11-25 Mitsui Toatsu Chem Inc 半導体封止用樹脂組成物
EP0749996B1 (en) 1995-01-05 2004-08-18 Sumitomo Bakelite Co., Ltd. Epoxy resin composition
JPH10287795A (ja) 1997-04-16 1998-10-27 Hitachi Chem Co Ltd 半導体封止用エポキシ樹脂組成物及びそれを用いた半導体装置
US6294271B1 (en) 1999-02-12 2001-09-25 Shin-Etsu Chemical Co., Ltd. Flip-chip type semiconductor device sealing material and flip-chip type semiconductor device
WO2000078887A1 (fr) * 1999-06-18 2000-12-28 Hitachi Chemical Company, Ltd. Adhesif, element adhesif, substrat de circuit pour montage de semi-conducteur presentant un element adhesif, et dispositif a semi-conducteur contenant ce dernier
JP3632558B2 (ja) * 1999-09-17 2005-03-23 日立化成工業株式会社 封止用エポキシ樹脂組成物及び電子部品装置
KR100894207B1 (ko) * 2000-03-31 2009-04-22 히다치 가세고교 가부시끼가이샤 접착제 조성물, 그의 제조 방법, 이것을 사용한 접착 필름,반도체 탑재용 기판 및 반도체 장치
JP3876965B2 (ja) * 2000-11-17 2007-02-07 信越化学工業株式会社 液状エポキシ樹脂組成物及び半導体装置
WO2003018703A1 (fr) 2001-08-27 2003-03-06 Hitachi Chemical Co., Ltd. Feuille adhesive et dispositif semi-conducteur; procede de fabrication
JP4816871B2 (ja) * 2004-04-20 2011-11-16 日立化成工業株式会社 接着シート、半導体装置、及び半導体装置の製造方法
JP4682796B2 (ja) 2005-04-19 2011-05-11 日立化成工業株式会社 封止用シート

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05190697A (ja) 1992-01-10 1993-07-30 Nitto Denko Corp 半導体部品の製造方法
JPH05283456A (ja) 1992-03-31 1993-10-29 Toshiba Corp 封止用シート、樹脂封止装置および樹脂封止型半導体装置の製造方法
JPH0873621A (ja) 1994-09-07 1996-03-19 Toshiba Corp 樹脂シート
JP2004043761A (ja) * 2001-08-27 2004-02-12 Hitachi Chem Co Ltd 接着シート並びに半導体装置及びその製造方法
JP2005060584A (ja) 2003-08-18 2005-03-10 Hitachi Chem Co Ltd 封止用フィルム

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2110851A4

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7511399B2 (ja) 2020-06-26 2024-07-05 太陽ホールディングス株式会社 硬化性樹脂組成物、ドライフィルム、硬化物、電子部品

Also Published As

Publication number Publication date
US20090189300A1 (en) 2009-07-30
US8715454B2 (en) 2014-05-06
KR20090027612A (ko) 2009-03-17
EP2110851A4 (en) 2013-09-04
EP2110851A1 (en) 2009-10-21
US8771828B2 (en) 2014-07-08
US20130093105A1 (en) 2013-04-18
TW200837137A (en) 2008-09-16

Similar Documents

Publication Publication Date Title
WO2008090950A1 (ja) 封止用フィルム、及びそれを用いた半導体装置
WO2010039470A3 (en) Poly(arylene ether) composition with improved melt flow and method for the preparation thereof
WO2007097835A3 (en) Silicone resin film, method of preparing same, and nanomaterial-filled silicone composition
EP1837373A4 (en) RESIN COMPOSITION AND FILM MANUFACTURED THEREOF
CN102964980A (zh) 一种木制品表面辊涂的水性uv涂料及其制备方法
WO2008051242A3 (en) Silicone resin film, method of preparing same, and nanomaterial-filled silicone compositon
CN105189103A (zh) 封装阻隔叠层
SG144820A1 (en) Highly conductive composition for wafer coating
WO2008126675A1 (ja) インクジェット記録用油性白色インク及びその製造方法
TW200706593A (en) Molding composition and method, and molded article
MX2009006432A (es) Composicion de recubrimiento y articulo optico fotocromico.
WO2009051084A3 (en) Curable silicone composition and cured product thereof
RU2008109007A (ru) Порошкообразная композиция покрытия для покрывания поверхностей термопластичных композитов
WO2008051947A3 (en) Highly filled polymer materials
CN105339446B (zh) 纳米颗粒油墨组合物、方法和用途
EP1842883A3 (en) Coating composition for forming pattern and coated article
RU2011124512A (ru) Композиция полиариленсульфидной смолы и элемент трубопровода для текучей среды
BR112013002007A2 (pt) bi-poliuretano baseados em hirperpolímeros
WO2008143085A1 (ja) 半導体封止用エポキシ樹脂組成物およびそれを用いて得られる半導体装置
TW200728427A (en) Adhesive composition and adhesive thin film made of the same
EP2374849A3 (en) Opacifying particles and compositions formed therefrom
WO2009014115A1 (ja) 電子部品用接着剤、半導体チップの積層方法及び半導体装置
MY153000A (en) Resin composition for encapsulating semiconductor and semiconductor device
TW200604277A (en) Liquid curable resin composition, cured film and multilayer body
RU2013132705A (ru) Демпфирующий материал со связанным слоем

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880000239.1

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08703806

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 1020087026980

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 12299714

Country of ref document: US

REEP Request for entry into the european phase

Ref document number: 2008703806

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 2008703806

Country of ref document: EP

NENP Non-entry into the national phase

Ref country code: DE