WO2008084602A1 - 電子部品の実装装置及び実装方法 - Google Patents

電子部品の実装装置及び実装方法 Download PDF

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Publication number
WO2008084602A1
WO2008084602A1 PCT/JP2007/072886 JP2007072886W WO2008084602A1 WO 2008084602 A1 WO2008084602 A1 WO 2008084602A1 JP 2007072886 W JP2007072886 W JP 2007072886W WO 2008084602 A1 WO2008084602 A1 WO 2008084602A1
Authority
WO
WIPO (PCT)
Prior art keywords
liquid crystal
crystal cell
electronic component
mounting
drive means
Prior art date
Application number
PCT/JP2007/072886
Other languages
English (en)
French (fr)
Inventor
Masahiro Suzuki
Original Assignee
Shibaura Mechatronics Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corporation filed Critical Shibaura Mechatronics Corporation
Priority to JP2008553015A priority Critical patent/JP5574401B2/ja
Priority to KR1020097013137A priority patent/KR101166057B1/ko
Priority to CN2007800495820A priority patent/CN101584032B/zh
Publication of WO2008084602A1 publication Critical patent/WO2008084602A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0064—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Nonlinear Science (AREA)
  • Liquid Crystal (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Wire Bonding (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

保持面（４ａ）を有し、保持面から液晶セル（Ｗ）が一側部を突出させて保持されるとともに水平方向に駆動されるＸテーブル（４）と、上下駆動手段（１２）によって上下方向に駆動可能に設けられ上端面によって液晶セルの一側部の電子部品（９）が実装される上面に対応する部分の下面を支持するバックアップツール（８）と、加圧駆動手段（２２）によって上下方向に駆動可能に設けられバックアップツールの上端面に下面が支持された液晶セルの一側部の上面に電子部品を実装する実装ツール（２１）と、保持テーブルに保持された液晶セルの一側部の電子部品が実装される部分の下面の高さを測定する高さセンサ（７）と、高さセンサの測定に基づいて上下駆動手段を駆動してバックアップツールの上端面を液晶セルの下面の高さと同じに設定する制御装置を具備する。
PCT/JP2007/072886 2007-01-10 2007-11-28 電子部品の実装装置及び実装方法 WO2008084602A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008553015A JP5574401B2 (ja) 2007-01-10 2007-11-28 電子部品の実装装置及び実装方法
KR1020097013137A KR101166057B1 (ko) 2007-01-10 2007-11-28 전자 부품 실장 장치 및 실장 방법
CN2007800495820A CN101584032B (zh) 2007-01-10 2007-11-28 电子器件的安装装置以及安装方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007002753 2007-01-10
JP2007-002753 2007-01-10

Publications (1)

Publication Number Publication Date
WO2008084602A1 true WO2008084602A1 (ja) 2008-07-17

Family

ID=39608501

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/072886 WO2008084602A1 (ja) 2007-01-10 2007-11-28 電子部品の実装装置及び実装方法

Country Status (5)

Country Link
JP (1) JP5574401B2 (ja)
KR (1) KR101166057B1 (ja)
CN (1) CN101584032B (ja)
TW (1) TWI439775B (ja)
WO (1) WO2008084602A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011096956A (ja) * 2009-11-02 2011-05-12 Panasonic Corp 部品実装装置および部品実装方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5997990B2 (ja) 2012-09-13 2016-09-28 ヤマハ発動機株式会社 電子部品用実装装置および電子部品用実装装置の使用方法
JP6675356B2 (ja) * 2016-08-16 2020-04-01 芝浦メカトロニクス株式会社 電子部品実装装置
JP6998149B2 (ja) * 2017-08-08 2022-01-18 株式会社ディスコ レーザー加工方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0346243A (ja) * 1989-07-14 1991-02-27 Toshiba Corp キャリアテープ部品の実装装置
JPH10163276A (ja) * 1996-12-02 1998-06-19 Matsushita Electric Ind Co Ltd ワークの熱圧着装置
JP2000031211A (ja) * 1998-07-16 2000-01-28 Matsushita Electric Ind Co Ltd ボンディング装置およびボンディング方法
JP2002305214A (ja) * 2001-04-05 2002-10-18 Toray Eng Co Ltd チップボンディング方法およびその装置
JP2003234373A (ja) * 2002-02-06 2003-08-22 Shibaura Mechatronics Corp 電子部品の実装装置及び実装方法、接着材料の貼付装置及び貼付方法
JP2004273688A (ja) * 2003-03-07 2004-09-30 Seiko Epson Corp 圧着方法、圧着装置、電気光学装置の製造方法及び製造装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000200805A (ja) * 1998-12-28 2000-07-18 Casio Comput Co Ltd 電子部品のボンディング方法
JP4262162B2 (ja) * 2004-08-05 2009-05-13 芝浦メカトロニクス株式会社 電子部品の実装装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0346243A (ja) * 1989-07-14 1991-02-27 Toshiba Corp キャリアテープ部品の実装装置
JPH10163276A (ja) * 1996-12-02 1998-06-19 Matsushita Electric Ind Co Ltd ワークの熱圧着装置
JP2000031211A (ja) * 1998-07-16 2000-01-28 Matsushita Electric Ind Co Ltd ボンディング装置およびボンディング方法
JP2002305214A (ja) * 2001-04-05 2002-10-18 Toray Eng Co Ltd チップボンディング方法およびその装置
JP2003234373A (ja) * 2002-02-06 2003-08-22 Shibaura Mechatronics Corp 電子部品の実装装置及び実装方法、接着材料の貼付装置及び貼付方法
JP2004273688A (ja) * 2003-03-07 2004-09-30 Seiko Epson Corp 圧着方法、圧着装置、電気光学装置の製造方法及び製造装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011096956A (ja) * 2009-11-02 2011-05-12 Panasonic Corp 部品実装装置および部品実装方法

Also Published As

Publication number Publication date
TWI439775B (zh) 2014-06-01
CN101584032B (zh) 2011-03-30
KR101166057B1 (ko) 2012-07-19
JP5574401B2 (ja) 2014-08-20
TW200830009A (en) 2008-07-16
JPWO2008084602A1 (ja) 2010-04-30
KR20090096471A (ko) 2009-09-10
CN101584032A (zh) 2009-11-18

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