WO2008082191A1 - Alliage de brasage sans plomb - Google Patents

Alliage de brasage sans plomb Download PDF

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Publication number
WO2008082191A1
WO2008082191A1 PCT/KR2007/006951 KR2007006951W WO2008082191A1 WO 2008082191 A1 WO2008082191 A1 WO 2008082191A1 KR 2007006951 W KR2007006951 W KR 2007006951W WO 2008082191 A1 WO2008082191 A1 WO 2008082191A1
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WIPO (PCT)
Prior art keywords
specimen
experiment
solder alloy
free solder
manufactured
Prior art date
Application number
PCT/KR2007/006951
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English (en)
Inventor
Dong-Nyung Lee
Sang-Beom Kim
Kyoo-Sik Kang
Original Assignee
Iljin Copper Foil Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Iljin Copper Foil Co., Ltd. filed Critical Iljin Copper Foil Co., Ltd.
Priority to EP07860735A priority Critical patent/EP2101951A4/fr
Priority to US12/521,655 priority patent/US20100092335A1/en
Priority to JP2009543954A priority patent/JP5210323B2/ja
Publication of WO2008082191A1 publication Critical patent/WO2008082191A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C30/00—Alloys containing less than 50% by weight of each constituent
    • C22C30/04—Alloys containing less than 50% by weight of each constituent containing tin or lead

Definitions

  • the present invention relates to a solder alloy not containing lead (hereinafter, referred to as a Pb-free solder alloy), and more particularly, to a Pb-free solder alloy that generates no whiskers by including beryllium (Be) or boron (B)
  • Soldering is a technique of joining two or more members together by using a solder having a melting point of 450 ° C or less. In soldering, only the solder is melted and a base material is not melted.
  • a conventional solder, used in soldering, is an alloy of lead (Pb) and tin (Sn)
  • Pb-Sn solders mostly comprise 63% by weight of tin and have a eutectic composition of tin and Pb, and a melting point of 183 ° C , which does not thermally destroy electronic parts.
  • the Pb-Sn solders have excellent wetability for the electrodes of ball grid arrays (BGAs) or the lands of printed circuit boards (PCBs) and thus reduce the number of soldering failures.
  • Pb-free solders containing no lead are recently in use
  • a compound obtained by adding Ag, Cu, Zn, In, Ni, Cr, Fe, Co, Ge, P, or Ga to a Sn-Ag based material, a Sn-Cu based material, a Sn-Bi based material, a Sn-Zn based material, or an alloy of each of the aforementioned materials is the main representative of Pb-free solder alloys
  • a Sn-3Ag-0 5Cu compound from among Pb-free solders obtained by adding Cu to a Sn-Ag based material is good in terms of solderabihty, a joint strength, and high-resistant fatigability, and is thus currently used in soldering for many electronic apparatuses
  • the Sn-3Ag-0.5Cu compound is also used as a solder alloy for forming bumps and balls of BGAs.
  • whiskers are prone to be formed on the surface of the solder
  • the whiskers are denoted by crystals that grow from the surface of the solder when the solder is joined with a different material and their components are diffused with each other These whiskers are sensitive to heat and moisture When these whiskers are formed on the surface of a solder alloy, an electrical short occurs within a circuit. Therefore, the durabilities of a BGA package and a flip-chip package are reduced.
  • FIGS. 1A through 1 D are scanning electron microscope (SEM) pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, according to a first experiment;
  • SEM scanning electron microscope
  • 2A through 2D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a second experiment; FIGS.
  • 3A through 3D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a third experiment; FIGS.
  • FIGS. 4A through 4D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a fourth experiment; FIGS.
  • 5A through 5D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a fifth experiment; FIGS.
  • 6A through 6D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a sixth experiment; FIGS.
  • FIGS 8A through 8D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a seventh experiment,
  • FIGS 8A through 8D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to an eighth experiment,
  • FIGS 9A through 9D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a ninth experiment,
  • FIGS. 10A through 10D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a tenth experiment,
  • FIGS 11 A through 11 D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to an eleventh experiment,
  • FIGS 12A through 12D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a twelfth experiment,
  • FIGS 13A through 13D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a first comparative experiment,
  • FIGS 14A through 14D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a second comparative experiment;
  • FIGS. 15A through 15D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a third comparative experiment;
  • FIGS. 16A through 16D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a fourth comparative experiment;
  • FIGS. 16A through 16D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a fourth comparative experiment;
  • 17A through 17D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a fifth comparative experiment; and
  • FIGS. 18A through 18D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a sixth comparative experiment.
  • a Pb-free solder alloy comprising tin (Sn) as a first element and one of boron (B) or beryllium (Be) as a second element.
  • the second element of the Pb-free solder alloy may be 0.001 to 0.4 % by weight of Be and the rest of the Pb-free solder alloy may be comprised of the first element and inevitable impurities.
  • the second element of the Pb-free solder alloy may be 0.003 to 0.5 % by weight 5 of B and the rest of the Pb-free solder alloy may be comprised of the first element and inevitable impurities.
  • the Pb-free solder alloy may further include copper (Cu) as a third element.
  • the third element may be 0.1 to 5.0% by weight.
  • the second element of the Pb-free solder alloy may be 0.001 to 0.4 % by weight it) of Be and the rest of the Pb-free solder alloy may be comprised of the first element, the third element, and inevitable impurities.
  • the second element of the Pb-free solder alloy may be 0.003 to 0.5 % by weight of B and the rest of the Pb-free solder alloy may be comprised of the first element, the third element, and inevitable impurities.
  • the Pb-free solder alloy may further comprise silver (Ag) as a fourth element.
  • the second element of the Pb-free solder alloy may be 0.001 to 0.4 % by weight of Be and the rest of the Pb-free solder alloy may be comprised of one of a group of the first and fourth elements and inevitable impurities and a group of the first, third, and fourth elements and inevitable impurities.
  • the second element of the Pb-free solder alloy may be 0.003 to 0.5 % by weight of B and the rest of the Pb-free solder alloy may be comprised of one of a group of the first and fourth elements and inevitable impurities and a group of the first, third, and fourth elements and inevitable impurities. 5 ADVANTAGEOUS EFFECTS
  • a Pb-free solder alloy capable of preventing generation of whiskers can be provided.
  • the inventors of the present invention paid attention to the fact that when a Pb-Sn solder is bonded to a pad formed of Cu, Cu is diffused faster than Sn on a bonding5 surface between the solder and the Cu pad.
  • the inventors of the present invention thought that a compressive stress applied by the intermetallic compound to the Sn of the solder can be removed by whiskers, 5 which are single crystals having beard formations, growing from the surface of the solder where Sn is spread
  • a Pb-free solder alloy according to the present invention is a Sn-based multi-element alloy that contains Sn as the main ions Accordingly, the Pb-free solder alloy according to the present invention may contain at least 80% by weight of Sn.
  • the main object of the present invention is to prevent generation of whiskers within a Pb-free solder alloy
  • the inventors of the present invention paid attention to Be or B as a material that can prevent the formation of a compressive stress within Sn crystals by preventing Sn and Cu from being diffused when a Sn-based solder and a Cu pad are bonded together
  • the Pb-free solder 0 alloy according to the present invention contains Sn as a first element and Be or B as a second element
  • the Pb-free solder alloy according to the present invention is referred to as a Sn-based alloy
  • the Pb-free solder alloy according to the present invention may contain 0 001 to 5 0 4 % by weight of Be or 0.003 to 0.5 % by weight of B
  • a sufficient amount of Be or B, as the second element, is inserted into an interstitial site in the Sn 1 which is the first element, as compared with a case where the Pb-free solder alloy according to the present invention contains less than 0 001 % by weight of Be or less than 0 003 % by weight of B
  • the0 effect of preventing growth of an intermetallic compound between Sn and Cu is high, and as described later, whiskers may not be generated even under harsh conditions such as a thermal shock test, a thermo-hydrostatic test, etc
  • the Pb-free solder alloy according to the present invention contains more than 0 4 % by weight of Be or more than 0.5 % by weight of B, the Be or B inserted into the interstitial site in the5 Sn is saturated, thereby causing an increase in the manufacturing costs and a degradation of economical efficiency.
  • the Pb-free solder alloy may further contain Cu as a third element. In this case,
  • Pb-free solder alloy may increase, as compared with when the Cu content is less than
  • the Pb-free solder alloy may further include silver (Ag) as a fourth element.
  • silver Ag
  • the thermal shock tolerance of the Pb-free solder alloy may significantly increase, as compared with when the Ag content is less than 1.0% by weight, and the drop tolerance thereof may improve, as compared with when the Ag content exceeds 3.0% by weight.
  • Such a Pb-free solder may be manufactured in various forms, such as, a ball, a cream, a bar, a wire, etc.
  • a Pb-free solder alloy is a Sn-Be-Cu ternary alloy.
  • a Be-Cu alloy was first manufactured, Sn was melted in a melting pot, and the Be-Cu alloy was melted in the melting pot, thereby producing a melt. After the temperature of the melt was kept for a certain period of time between 600 0 C and 650 " C 1 the melt was tapped from the melting pot and cast into a bar-shaped Sn-Be-Cu solder alloy specimen.
  • the unit of the numbers shown in Table 1 is % by weight, and the numbers are the contents of the elements inserted into the melt. Besides the elements stated in Table 1 , very small amounts of impurities, such as phosphorus (P), nickel (Ni), and cobalt (Co), may be further included in the melt.
  • impurities such as phosphorus (P), nickel (Ni), and cobalt (Co)
  • the column “right after the manufacture” indicates whether whiskers were generated on the experimental specimens just after being manufactured
  • the column “thermal shock” indicates whether whiskers were generated on the surfaces of the manufactured experimental specimens which underwent thermal shock tests in which a specimen is maintained between -55 0 C and 80 V 1000 times for 20 minutes per one time
  • the column “thermo-hydrostatic test” indicates whether whiskers were generated on the surfaces of the manufactured experimental specimens which underwent thermo-hydrostatic tests in which a specimen is maintained for 1000 hours at a humidity of 90% and a temperature of 80 0 C
  • the column “leaving undisturbed at a normal temperature” indicates whether whiskers were generated on the surfaces of the manufactured experimental specimens which were left for 12 months at a normal temperature.
  • "Undetected”, as shown in the below tables including Table 1 indicates that no whiskers were generated in the manufactured experimental specimens
  • "Detected” indicates that whiskers were generated in the manufactured experimental specimens.
  • FIGS. 1A through 1 D are scanning electron microscope (SEM) pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, according to a first experiment.
  • SEM scanning electron microscope
  • 2A through 2D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a second experiment.
  • FIGS. 3A through 3D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a third experiment.
  • FIGS. 4A through 4D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a fourth experiment.
  • FIGS. 5A through 5D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a fifth experiment.
  • the detected whiskers have lengths of 3.4 ⁇ m on average, and the number of whiskers per unit area (m ⁇ f) is 3
  • whiskers were generated after harsh conditions in the first experiment, the lengths of the whiskers are significantly less than those in comparative experiments that are to be described later, and the number of whiskers per unit area is small.
  • the Sn-Be-Cu ternary alloy according to the first embodiment provides good effects compared with conventional ones.
  • no whiskers were detected in the second through fifth experiments where the content of Be is at least 0.001% by weight
  • a Sn-Be-Cu ternary alloy including at least 0.001 % by weight of Be is preferable (Second embodiment)
  • a Pb-free solder alloy according to the second embodiment is a Sn-Be-Cu-Ag quaternary alloy.
  • a Be-Cu alloy was first manufactured, Sn was melted in a melting pot, and the Be-Cu alloy and silver (Ag) were melted in the melting pot, thereby producing a melt. After the temperature of the melt was kept for a certain period of time between a temperature of 600 ° C to 650 ° C , the melt was tapped from the melting pot and cast into a bar-shaped Sn-Be-Cu-Ag solder alloy specimen. The bar-shaped Sn-Be-Cu-Ag solder alloy specimen was processed as in the first embodiment so as to manufacture experimental specimens.
  • Table 2 shows the contents of Sn, Be, Cu, and Ag in the experimental specimens manufactured according to the second embodiment.
  • the unit of the numbers shown in Table 2 is % by weight, and the numbers are the contents of the elements inserted into the melt.
  • very small amounts of impurities, such as P, Ni, and Co, may be further included in the melt.
  • Table 2 also indicates whether whiskers were generated on the surfaces of the manufactured experimental specimens right after being manufactured, after a thermal shock test, after a thermo-hydrostatic test, and after being left undisturbed at a normal temperature, under the same conditions as those in Table 1.
  • FIGS. 6A through 6D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a sixth experiment
  • FIGS 7A through 7D are SEM pictures of a surface of a specimen that has just
  • FIGS 8A through 8D are SEM pictures of a surface of a specimen that has just been i o manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to an eighth experiment
  • FIGS 9A through 9D are SEM pictures of a surface of a specimen that has just
  • the bar-shaped Sn-B-Cu solder alloy specimen was processed as in the first embodiment so as to manufacture experimental specimens 5
  • the following Table 3 shows the contents of Sn, B, and Cu in the experimental specimens manufactured according to the third embodiment
  • the unit of the numbers shown in Table 3 is % by weight, and the numbers are the contents of the elements inserted into the melt.
  • very small amounts of impurities, such as P, Ni, and Co, may be further included in the melt.
  • Table 3 also indicates whether whiskers were generated on the surfaces of the manufactured experimental specimens right after being manufactured, after a thermal shock test, after a thermo-hydrostatic test, and after being left undisturbed at a normal temperature, under the same conditions as those in Table 1
  • FIGS. 10A through 10D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a tenth experiment.
  • FIGS. 10A through 10D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a tenth experiment.
  • FIGS. 10A through 10D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a
  • 1 1A through 11 D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to an eleventh experiment.
  • FIGS. 1 1A through 11 D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to an eleventh experiment.
  • 12A through 12D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a twelfth experiment.
  • Table 3 and FIGS. 10A through 12D no whiskers were generated on a surface of the Sn-B-Cu ternary alloy according to the third embodiment just after being manufactured.
  • whiskers were generated on the surface of the Sn-B-Cu ternary alloy that underwent a thermal shock test, the surface thereof that underwent a thermo-hydrostatic test, and the surface thereof that was left undisturbed at a normal temperature.
  • the detected whiskers have lengths of 3.0 ⁇ m on average, and the number of whiskers per unit area (m ⁇ f) is 5.
  • the Sn-Be-Cu ternary alloy according to the third embodiment provides good effects compared with conventional ones.
  • Pb-free solder alloys according to the comparative experiments are a Sn-Cu binary alloy and a Sn-Ag-Cu ternary alloy.
  • a Sn-Cu ingot and a Sn-Ag-Cu ingot by Samhwa Non-ferrous Metal Ind. Co., Ltd were used in the comparative experiments.
  • Experimental specimens were manufactured using the Sn-Cu ingot and the Sn-Ag-Cu ingot according to the same method as in the first embodiment.
  • the unit of the contents shown in Table 4 is % by weight.
  • Table 4 also indicates whether whiskers were generated on the surfaces of the manufactured experimental specimens right after being manufactured, after a thermal shock test, after a thermo-hydrostatic test, and after being left undisturbed at a normal temperature, under the same conditions as those in Tables 1 through 3.
  • FIGS. 13A through 13D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the 5 same conditions as those of the first experiment, according to a first comparative experiment.
  • FIGS. 14A through 14D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the i o specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a second comparative experiment.
  • FIGS. 15A through 15D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a i s surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a third comparative experiment.
  • FIGS. 16A through 16D are SEM pictures of a surface of a specimen that has just0 been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a fourth comparative experiment. 5 FIGS.
  • 17A through 17D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a fifth comparative0 experiment.
  • FIGS. 17A through 17D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a fifth comparative0 experiment.
  • 18A through 18D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a sixth comparative experiment.
  • whiskers were generated on the surfaces of all of the Sn-based solder alloys including neither Be nor B.
  • whiskers were generated on the surface of the manufactured specimen that underwent a thermal shock test, the surface thereof that underwent a thermo-hydrostatic test, and the surface thereof that was left undisturbed at a normal temperature.
  • Table 5 shows the mean of the lengths of the generated whiskers and the number of whiskers per unit area.
  • the solder alloys of the first and tenth experiments have whiskers that are significantly short and the number of which is significantly small, as compared with the Sn-Cu solder alloys of the first through third comparative experiments and the Sn-Ag-Cu solder alloys of the fourth through sixth comparative experiments.
  • a solder alloy according to the present invention can be prevented from having whiskers even when being under bad conditions. While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by one of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present invention as defined by the following claims.
  • solder alloy according to the present invention can be used in soldering wires of various machines and electronic apparatuses.

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Abstract

La présente invention concerne un procédé pour empêcher la génération de barbes par un alliage de brasage sans plomb (Pb). À cet effet, la présente invention concerne un alliage de brasage sans plomb (Pb) comprenant de l'étain en tant que premier élément et soit le bore (B) soit le béryllium (Be) en tant que second élément.
PCT/KR2007/006951 2006-12-29 2007-12-28 Alliage de brasage sans plomb WO2008082191A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP07860735A EP2101951A4 (fr) 2006-12-29 2007-12-28 Alliage de brasage sans plomb
US12/521,655 US20100092335A1 (en) 2006-12-29 2007-12-28 Pb-free solder alloy
JP2009543954A JP5210323B2 (ja) 2006-12-29 2007-12-28 無鉛ソルダ合金

Applications Claiming Priority (4)

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KR20060138548 2006-12-29
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KR101042031B1 (ko) 2006-12-29 2011-06-16 일진머티리얼즈 주식회사 무연 솔더 합금

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CN103056543B (zh) * 2013-01-18 2015-03-25 江苏师范大学 一种含Yb、Al、B的纳米无铅钎料
CN105149809B (zh) * 2015-10-10 2017-09-26 南京青锐风新材料科技有限公司 一种适用于SnAgCu或SnCu焊料的抗氧化剂及其制备方法
CN105834612B (zh) * 2016-05-04 2018-02-23 中南大学 一种适用于电子封装的高尺寸稳定性Sn‑Ag‑Cu焊料
CN105834611B (zh) * 2016-05-04 2018-02-13 中南大学 一种适用于电子封装的高电导高可靠性Ce‑Sn‑Ag‑Cu焊料
CN107877031A (zh) * 2017-11-27 2018-04-06 东莞市千岛金属锡品有限公司 一种无铅低温焊料及其制备方法
KR20240060350A (ko) 2022-10-28 2024-05-08 (주)에버텍엔터프라이즈 소결접합용 은 페이스트 조성물

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JP2010000537A (ja) * 2008-06-23 2010-01-07 Nippon Steel Materials Co Ltd 無鉛ハンダ合金、ハンダボール及びハンダバンプを有する電子部材

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TWI366497B (en) 2012-06-21
KR20100132470A (ko) 2010-12-17
KR20080063176A (ko) 2008-07-03
JP2010514931A (ja) 2010-05-06
JP5210323B2 (ja) 2013-06-12
US20100092335A1 (en) 2010-04-15
KR101165426B1 (ko) 2012-07-12
EP2101951A4 (fr) 2010-01-27
EP2101951A1 (fr) 2009-09-23
KR101042031B1 (ko) 2011-06-16
CN101588889A (zh) 2009-11-25

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