US20100092335A1 - Pb-free solder alloy - Google Patents
Pb-free solder alloy Download PDFInfo
- Publication number
- US20100092335A1 US20100092335A1 US12/521,655 US52165507A US2010092335A1 US 20100092335 A1 US20100092335 A1 US 20100092335A1 US 52165507 A US52165507 A US 52165507A US 2010092335 A1 US2010092335 A1 US 2010092335A1
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- solder alloy
- free solder
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 115
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 93
- 239000000956 alloy Substances 0.000 title claims abstract description 93
- 229910052790 beryllium Inorganic materials 0.000 claims abstract description 12
- 229910052796 boron Inorganic materials 0.000 claims abstract description 11
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 7
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims abstract description 6
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000010949 copper Substances 0.000 claims description 44
- 239000012535 impurity Substances 0.000 claims description 25
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 229910052718 tin Inorganic materials 0.000 claims description 11
- 229910052709 silver Inorganic materials 0.000 claims description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 238000002474 experimental method Methods 0.000 description 115
- 230000035939 shock Effects 0.000 description 51
- 230000000052 comparative effect Effects 0.000 description 30
- 239000000155 melt Substances 0.000 description 15
- 229910002058 ternary alloy Inorganic materials 0.000 description 12
- 230000008018 melting Effects 0.000 description 11
- 238000002844 melting Methods 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- 238000005476 soldering Methods 0.000 description 7
- 229910017944 Ag—Cu Inorganic materials 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 229910020220 Pb—Sn Inorganic materials 0.000 description 5
- 229910020888 Sn-Cu Inorganic materials 0.000 description 5
- 229910019204 Sn—Cu Inorganic materials 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 229910000881 Cu alloy Inorganic materials 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 229910052698 phosphorus Inorganic materials 0.000 description 4
- 229910017770 Cu—Ag Inorganic materials 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 229910000765 intermetallic Inorganic materials 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910020836 Sn-Ag Inorganic materials 0.000 description 2
- 229910020988 Sn—Ag Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000005755 formation reaction Methods 0.000 description 2
- 239000005350 fused silica glass Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910018471 Cu6Sn5 Inorganic materials 0.000 description 1
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910020830 Sn-Bi Inorganic materials 0.000 description 1
- 229910020994 Sn-Zn Inorganic materials 0.000 description 1
- 229910018728 Sn—Bi Inorganic materials 0.000 description 1
- 229910009069 Sn—Zn Inorganic materials 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 229910002056 binary alloy Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 229910001325 element alloy Inorganic materials 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 206010016256 fatigue Diseases 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910002059 quaternary alloy Inorganic materials 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
- C22C30/04—Alloys containing less than 50% by weight of each constituent containing tin or lead
Definitions
- the present invention relates to a solder alloy not containing lead (hereinafter, referred to as a Pb-free solder alloy), and more particularly, to a Pb-free solder alloy that generates no whiskers by including beryllium (Be) or boron (B).
- a Pb-free solder alloy that generates no whiskers by including beryllium (Be) or boron (B).
- Soldering is a technique of joining two or more members together by using a solder having a melting point of 450° C. or less. In soldering, only the solder is melted and a base material is not melted.
- a conventional solder, used in soldering, is an alloy of lead (Pb) and tin (Sn).
- Pb—Sn solders mostly comprise 63% by weight of tin and have a eutectic composition of tin and Pb, and a melting point of 183° C., which does not thermally destroy electronic parts.
- the Pb—Sn solders have excellent wetability for the electrodes of ball grid arrays (BGAs) or the lands of printed circuit boards (PCBs) and thus reduce the number of soldering failures.
- Pb-free solders containing no lead are recently in use.
- a compound obtained by adding Ag, Cu, Zn, In, Ni, Cr, Fe, Co, Ge, P, or Ga to a Sn—Ag based material, a Sn—Cu based material, a Sn—Bi based material, a Sn—Zn based material, or an alloy of each of the aforementioned materials is the main representative of Pb-free solder alloys.
- a Sn—3Ag—0.5Cu compound from among Pb-free solders obtained by adding Cu to a Sn—Ag based material is good in terms of solderability, a joint strength, and high-resistant fatigability, and is thus currently used in soldering for many electronic apparatuses.
- the Sn—3Ag—0.5Cu compound is also used as a solder alloy for forming bumps and balls of BGAs.
- whiskers are prone to be formed on the surface of the solder.
- the whiskers are denoted by crystals that grow from the surface of the solder when the solder is joined with a different material and their components are diffused with each other. These whiskers are sensitive to heat and moisture.
- whiskers are formed on the surface of a solder alloy, an electrical short occurs within a circuit. Therefore, the durabilities of a BGA package and a flip-chip package are reduced.
- FIGS. 1A through 1D are scanning electron microscope (SEM) pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, according to a first experiment;
- FIGS. 2A through 2D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a second experiment;
- FIGS. 3A through 3D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a third experiment;
- FIGS. 4A through 4D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a fourth experiment;
- FIGS. 5A through 5D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a fifth experiment;
- FIGS. 6A through 6D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a sixth experiment;
- FIGS. 7A through 7D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a seventh experiment;
- FIGS. 8A through 8D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to an eighth experiment;
- FIGS. 9A through 9D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a ninth experiment;
- FIGS. 10A through 10D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a tenth experiment;
- FIGS. 11A through 11D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to an eleventh experiment;
- FIGS. 12A through 12D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a twelfth experiment;
- FIGS. 13A through 13D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a first comparative experiment;
- FIGS. 14A through 14D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a second comparative experiment;
- FIGS. 15A through 15D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a third comparative experiment;
- FIGS. 16A through 16D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a fourth comparative experiment;
- FIGS. 17A through 17D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a fifth comparative experiment; and
- FIGS. 18A through 18D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a sixth comparative experiment.
- the present invention provides a Pb-free solder alloy that does not include lead (Pb) and also can prevent generation of whiskers.
- a Pb-free solder alloy comprising tin (Sn) as a first element and one of boron (B) or beryllium (Be) as a second element.
- the second element of the Pb-free solder alloy may be 0.001 to 0.4% by weight of Be and the rest of the Pb-free solder alloy may be comprised of the first element and inevitable impurities.
- the second element of the Pb-free solder alloy may be 0.003 to 0.5% by weight of B and the rest of the Pb-free solder alloy may be comprised of the first element and inevitable impurities.
- the Pb-free solder alloy may further include copper (Cu) as a third element.
- the third element may be 0.1 to 5.0% by weight.
- the second element of the Pb-free solder alloy may be 0.001 to 0.4% by weight of Be and the rest of the Pb-free solder alloy may be comprised of the first element, the third element, and inevitable impurities.
- the second element of the Pb-free solder alloy may be 0.003 to 0.5% by weight of B and the rest of the Pb-free solder alloy may be comprised of the first element, the third element, and inevitable impurities.
- the Pb-free solder alloy may further comprise silver (Ag) as a fourth element.
- the second element of the Pb-free solder alloy may be 0.001 to 0.4% by weight of Be and the rest of the Pb-free solder alloy may be comprised of one of a group of the first and fourth elements and inevitable impurities and a group of the first, third, and fourth elements and inevitable impurities.
- the second element of the Pb-free solder alloy may be 0.003 to 0.5% by weight of B and the rest of the Pb-free solder alloy may be comprised of one of a group of the first and fourth elements and inevitable impurities and a group of the first, third, and fourth elements and inevitable impurities.
- a Pb-free solder alloy capable of preventing generation of whiskers can be provided.
- a conventional Sn—Ag—Cu-based Pb-free solder has a disadvantage of generating whiskers on the surface thereof.
- the cause of the generation of the whiskers is not yet clearly revealed.
- the inventors of the present invention paid attention to the fact that when a Pb—Sn solder is bonded to a pad formed of Cu, Cu is diffused faster than Sn on a bonding surface between the solder and the Cu pad.
- the inventors of the present invention thought that a compressive stress applied by the intermetallic compound to the Sn of the solder can be removed by whiskers, which are single crystals having beard formations, growing from the surface of the solder where Sn is spread.
- the inventors of the present invention tried to reduce the number of generations of a compressive stress within the Sn by preventing intermetallic diffusion via the insertion of a metal whose atoms are small into an interstitial site within the crystal structure of the Sn, consequently preventing the generation of whiskers.
- Beryllium (Be) or boron (B) may be used as the metal with small atoms.
- a Pb-free solder alloy according to the present invention is a Sn-based multi-element alloy that contains Sn as the main ions. Accordingly, the Pb-free solder alloy according to the present invention may contain at least 80% by weight of Sn.
- the main object of the present invention is to prevent generation of whiskers within a Pb-free solder alloy.
- the inventors of the present invention paid attention to Be or B as a material that can prevent the formation of a compressive stress within Sn crystals by preventing Sn and Cu from being diffused when a Sn-based solder and a Cu pad are bonded together.
- the Pb-free solder alloy according to the present invention contains Sn as a first element and Be or B as a second element.
- the Pb-free solder alloy according to the present invention is referred to as a Sn-based alloy.
- the Pb-free solder alloy according to the present invention may contain 0.001 to 0.4% by weight of Be or 0.003 to 0.5% by weight of B.
- a sufficient amount of Be or B, as the second element, is inserted into an interstitial site in the Sn, which is the first element, as compared with a case where the Pb-free solder alloy according to the present invention contains less than 0.001% by weight of Be or less than 0.003% by weight of B.
- the effect of preventing growth of an intermetallic compound between Sn and Cu is high, and as described later, whiskers may not be generated even under harsh conditions such as a thermal shock test, a thermo-hydrostatic test, etc.
- the Pb-free solder alloy according to the present invention contains more than 0.4% by weight of Be or more than 0.5% by weight of B, the Be or B inserted into the interstitial site in the Sn is saturated, thereby causing an increase in the manufacturing costs and a degradation of economical efficiency.
- the Pb-free solder alloy may further contain Cu as a third element.
- Cu 0.1 to 5.0% by weight of Cu may be included.
- the mechanical strength of the Pb-free solder alloy may increase, as compared with when the Cu content is less than 0.1% by weight, and the wetability thereof may improve, as compared with when the Cu content exceeds 5.0% by weight.
- the Pb-free solder alloy may further include silver (Ag) as a fourth element.
- Ag silver
- 1.0 to 3.0% by weight of Ag may be included.
- the thermal shock tolerance of the Pb-free solder alloy may significantly increase, as compared with when the Ag content is less than 1.0% by weight, and the drop tolerance thereof may improve, as compared with when the Ag content exceeds 3.0% by weight.
- Such a Pb-free solder may be manufactured in various forms, such as, a ball, a cream, a bar, a wire, etc.
- a Pb-free solder alloy is a Sn—Be—Cu ternary alloy.
- a Be—Cu alloy was first manufactured, Sn was melted in a melting pot, and the Be—Cu alloy was melted in the melting pot, thereby producing a melt. After the temperature of the melt was kept for a certain period of time between 600° C. and 650° C., the melt was tapped from the melting pot and cast into a bar-shaped Sn—Be—Cu solder alloy specimen.
- a flux EC-19S-8 by Tamura-Kaken Corporation was coated on the polished surface of the Cu base.
- the prepared Sn—Be—Cu solder alloy specimen was melted in a fused silica tube by a predetermined amount, and the Cu base was digested in the resultant fused silica tube for 3 seconds so as to perform dip soldering.
- the dip-soldered substrate was dipped in ethyl acetate, and then residues of the flux were removed through ultrasonic cleaning, thereby manufacturing experimental specimens.
- Table 1 shows the contents of Sn, Be, and Cu in the experimental specimens manufactured according to the first embodiment.
- the unit of the numbers shown in Table 1 is % by weight, and the numbers are the contents of the elements inserted into the melt.
- very small amounts of impurities such as phosphorus (P), nickel (Ni), and cobalt (Co), may be further included in the melt.
- the column “right after the manufacture” indicates whether whiskers were generated on the experimental specimens just after being manufactured
- the column “thermal shock” indicates whether whiskers were generated on the surfaces of the manufactured experimental specimens which underwent thermal shock tests in which a specimen is maintained between ⁇ 55° C. and 80° C. 1000 times for 20 minutes per one time
- the column “thermo-hydrostatic test” indicates whether whiskers were generated on the surfaces of the manufactured experimental specimens which underwent thermo-hydrostatic tests in which a specimen is maintained for 1000 hours at a humidity of 90% and a temperature of 80° C.
- the column “leaving undisturbed at a normal temperature” indicates whether whiskers were generated on the surfaces of the manufactured experimental specimens which were left for 12 months at a normal temperature.
- “Undetected”, as shown in the below tables including Table 1, indicates that no whiskers were generated in the manufactured experimental specimens
- “Detected” indicates that whiskers were generated in the manufactured experimental specimens.
- FIGS. 1A through 1D are scanning electron microscope (SEM) pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, according to a first experiment.
- SEM scanning electron microscope
- FIGS. 2A through 2D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a second experiment.
- FIGS. 3A through 3D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a third experiment.
- FIGS. 4A through 4D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a fourth experiment.
- FIGS. 5A through 5D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a fifth experiment.
- whiskers were generated on a surface of the Sn—Be—Cu ternary alloy according to the first embodiment just after being manufactured.
- whiskers were generated on the surface of the Sn—Be—Cu ternary alloy that underwent a thermal shock test, the surface thereof that underwent a thermo-hydrostatic test, and the surface thereof that was left undisturbed at a normal temperature.
- the detected whiskers have lengths of 3.4 ⁇ m on average, and the number of whiskers per unit area (mm 2 ) is 3.
- the Sn—Be—Cu ternary alloy according to the first embodiment provides good effects compared with conventional ones.
- a Pb-free solder alloy according to the second embodiment is a Sn—Be—Cu—Ag quaternary alloy.
- a Be—Cu alloy was first manufactured, Sn was melted in a melting pot, and the Be—Cu alloy and silver (Ag) were melted in the melting pot, thereby producing a melt. After the temperature of the melt was kept for a certain period of time between a temperature of 600° C. to 650° C., the melt was tapped from the melting pot and cast into a bar-shaped Sn—Be—Cu—Ag solder alloy specimen.
- the bar-shaped Sn—Be—Cu—Ag solder alloy specimen was processed as in the first embodiment so as to manufacture experimental specimens.
- Table 2 shows the contents of Sn, Be, Cu, and Ag in the experimental specimens manufactured according to the second embodiment.
- the unit of the numbers shown in Table 2 is % by weight, and the numbers are the contents of the elements inserted into the melt.
- very small amounts of impurities, such as P, Ni, and Co, may be further included in the melt.
- Table 2 also indicates whether whiskers were generated on the surfaces of the manufactured experimental specimens right after being manufactured, after a thermal shock test, after a thermo-hydrostatic test, and after being left undisturbed at a normal temperature, under the same conditions as those in Table 1.
- FIGS. 6A through 6D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a sixth experiment.
- FIGS. 7A through 7D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a seventh experiment;
- FIGS. 8A through 8D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to an eighth experiment.
- FIGS. 9A through 9D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a ninth experiment.
- a Pb-free solder alloy according to the third embodiment is a Sn—B—Cu ternary alloy.
- Sn was melted in a melting pot, and boron (B) and copper (Cu) were then melted in the resultant melting pot, thereby producing a melt.
- the temperature of the melt was kept for a certain period of time between a temperature of 600° C. to 650° C., the melt was tapped from the melting pot and cast into a bar-shaped Sn—B—Cu solder alloy specimen.
- the bar-shaped Sn—B—Cu solder alloy specimen was processed as in the first embodiment so as to manufacture experimental specimens.
- Table 3 shows the contents of Sn, B, and Cu in the experimental specimens manufactured according to the third embodiment.
- the unit of the numbers shown in Table 3 is % by weight, and the numbers are the contents of the elements inserted into the melt.
- very small amounts of impurities, such as P, Ni, and Co, may be further included in the melt.
- Table 3 also indicates whether whiskers were generated on the surfaces of the manufactured experimental specimens right after being manufactured, after a thermal shock test, after a thermo-hydrostatic test, and after being left undisturbed at a normal temperature, under the same conditions as those in Table 1.
- FIGS. 10A through 10D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a tenth experiment.
- FIGS. 11A through 11D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to an eleventh experiment.
- FIGS. 12A through 12D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a twelfth experiment.
- the detected whiskers have lengths of 3.0 ⁇ m on average, and the number of whiskers per unit area (mm 2 ) is 5.
- the Sn—Be—Cu ternary alloy according to the third embodiment provides good effects compared with conventional ones.
- Pb-free solder alloys according to the comparative experiments are a Sn—Cu binary alloy and a Sn—Ag—Cu ternary alloy.
- a Sn—Cu ingot and a Sn—Ag—Cu ingot by Samhwa Non-ferrous Metal Ind. Co., Ltd were used in the comparative experiments.
- Experimental specimens were manufactured using the Sn—Cu ingot and the Sn—Ag—Cu ingot according to the same method as in the first embodiment.
- the unit of the contents shown in Table 4 is % by weight.
- Table 4 also indicates whether whiskers were generated on the surfaces of the manufactured experimental specimens right after being manufactured, after a thermal shock test, after a thermo-hydrostatic test, and after being left undisturbed at a normal temperature, under the same conditions as those in Tables 1 through 3.
- FIGS. 13A through 13D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a first comparative experiment.
- FIGS. 14A through 14D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a second comparative experiment.
- FIGS. 15A through 15D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a third comparative experiment.
- FIGS. 16A through 16D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a fourth comparative experiment.
- FIGS. 17A through 17D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a fifth comparative experiment.
- FIGS. 18A through 18D are SEM pictures of a surface of a specimen that has just been manufactured, a surface of the specimen subjected to a thermal shock test, a surface of the specimen subjected to a thermo-hydrostatic test, and a surface of the specimen that was left undisturbed at a normal temperature, respectively, under the same conditions as those of the first experiment, according to a sixth comparative experiment.
- whiskers were generated on the surfaces of all of the Sn-based solder alloys including neither Be nor B.
- whiskers were generated on the surface of the manufactured specimen that underwent a thermal shock test, the surface thereof that underwent a thermo-hydrostatic test, and the surface thereof that was left undisturbed at a normal temperature.
- Table 5 shows the mean of the lengths of the generated whiskers and the number of whiskers per unit area.
- the solder alloys of the first and tenth experiments have whiskers that are significantly short and the number of which is significantly small, as compared with the Sn—Cu solder alloys of the first through third comparative experiments and the Sn—Ag—Cu solder alloys of the fourth through sixth comparative experiments.
- a solder alloy according to the present invention can be prevented from having whiskers even when being under bad conditions.
- solder alloy according to the present invention can be used in soldering wires of various machines and electronic apparatuses.
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Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
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KR20060138548 | 2006-12-29 | ||
KR10-2006-0138548 | 2006-12-29 | ||
PCT/KR2007/006951 WO2008082191A1 (fr) | 2006-12-29 | 2007-12-28 | Alliage de brasage sans plomb |
KR10-2007-0139767 | 2007-12-28 | ||
KR1020070139767A KR101042031B1 (ko) | 2006-12-29 | 2007-12-28 | 무연 솔더 합금 |
Publications (1)
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US20100092335A1 true US20100092335A1 (en) | 2010-04-15 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US12/521,655 Abandoned US20100092335A1 (en) | 2006-12-29 | 2007-12-28 | Pb-free solder alloy |
Country Status (7)
Country | Link |
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US (1) | US20100092335A1 (fr) |
EP (1) | EP2101951A4 (fr) |
JP (1) | JP5210323B2 (fr) |
KR (2) | KR101042031B1 (fr) |
CN (1) | CN101588889A (fr) |
TW (1) | TWI366497B (fr) |
WO (1) | WO2008082191A1 (fr) |
Families Citing this family (8)
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EP2101951A4 (fr) | 2006-12-29 | 2010-01-27 | Iljin Copper Foil Co Ltd | Alliage de brasage sans plomb |
JP5245568B2 (ja) * | 2008-06-23 | 2013-07-24 | 新日鉄住金マテリアルズ株式会社 | 無鉛ハンダ合金、ハンダボール及びハンダバンプを有する電子部材 |
CN103056543B (zh) * | 2013-01-18 | 2015-03-25 | 江苏师范大学 | 一种含Yb、Al、B的纳米无铅钎料 |
CN105149809B (zh) * | 2015-10-10 | 2017-09-26 | 南京青锐风新材料科技有限公司 | 一种适用于SnAgCu或SnCu焊料的抗氧化剂及其制备方法 |
CN105834612B (zh) * | 2016-05-04 | 2018-02-23 | 中南大学 | 一种适用于电子封装的高尺寸稳定性Sn‑Ag‑Cu焊料 |
CN105834611B (zh) * | 2016-05-04 | 2018-02-13 | 中南大学 | 一种适用于电子封装的高电导高可靠性Ce‑Sn‑Ag‑Cu焊料 |
CN107877031A (zh) * | 2017-11-27 | 2018-04-06 | 东莞市千岛金属锡品有限公司 | 一种无铅低温焊料及其制备方法 |
KR20240060350A (ko) | 2022-10-28 | 2024-05-08 | (주)에버텍엔터프라이즈 | 소결접합용 은 페이스트 조성물 |
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US2024545A (en) * | 1933-10-04 | 1935-12-17 | L D Caulk Company | Dental alloy |
US3827884A (en) * | 1970-07-15 | 1974-08-06 | Daido Metal Co | Tin based white metal bearing alloys producing good bond with backing material |
US5384090A (en) * | 1987-01-30 | 1995-01-24 | Tanaka Denshi Kogyo Kabushiki Kaisha | Fine wire for forming bump electrodes using a wire bonder |
US5837191A (en) * | 1996-10-22 | 1998-11-17 | Johnson Manufacturing Company | Lead-free solder |
US20050123784A1 (en) * | 2003-12-02 | 2005-06-09 | Fcm Co., Ltd. | Terminal having surface layer formed of Sn-Ag-Cu ternary alloy formed thereon, and part and product having the same |
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JP2778171B2 (ja) * | 1990-01-10 | 1998-07-23 | 三菱マテリアル株式会社 | 半導体装置組み立て用Pb合金はんだ材 |
JP3226213B2 (ja) * | 1996-10-17 | 2001-11-05 | 松下電器産業株式会社 | 半田材料及びそれを用いた電子部品 |
JP3306007B2 (ja) * | 1998-06-30 | 2002-07-24 | 株式会社東芝 | ハンダ材 |
JP3833829B2 (ja) * | 1998-07-07 | 2006-10-18 | 内橋エステック株式会社 | はんだ合金及び電子部品の実装方法 |
JP2002248596A (ja) * | 2001-02-27 | 2002-09-03 | Toshiba Tungaloy Co Ltd | 耐酸化性に優れる鉛レス半田ボール |
JP2005288544A (ja) * | 2004-03-09 | 2005-10-20 | Toshiba Corp | 無鉛はんだ、はんだ付け方法および電子部品 |
JP2005288478A (ja) * | 2004-03-31 | 2005-10-20 | Toshiba Corp | 無鉛はんだ接合部 |
JP2005319470A (ja) * | 2004-05-06 | 2005-11-17 | Katsuaki Suganuma | 鉛フリーはんだ材料、電子回路基板およびそれらの製造方法 |
JP4471825B2 (ja) * | 2004-12-09 | 2010-06-02 | 日本電波工業株式会社 | 電子部品、及び電子部品の製造方法 |
JP4471824B2 (ja) * | 2004-12-09 | 2010-06-02 | 日本電波工業株式会社 | 高温はんだ及びクリームはんだ |
JP4617485B2 (ja) * | 2004-12-13 | 2011-01-26 | ナノジョイン株式会社 | はんだ合金、金属化フィルムコンデンサ端面電極材料、金属化フィルムコンデンサ |
JP2008030047A (ja) * | 2006-07-26 | 2008-02-14 | Eishin Kogyo Kk | 無鉛ハンダ |
EP2101951A4 (fr) | 2006-12-29 | 2010-01-27 | Iljin Copper Foil Co Ltd | Alliage de brasage sans plomb |
-
2007
- 2007-12-28 EP EP07860735A patent/EP2101951A4/fr not_active Withdrawn
- 2007-12-28 KR KR1020070139767A patent/KR101042031B1/ko active IP Right Grant
- 2007-12-28 JP JP2009543954A patent/JP5210323B2/ja active Active
- 2007-12-28 CN CNA200780047594XA patent/CN101588889A/zh active Pending
- 2007-12-28 WO PCT/KR2007/006951 patent/WO2008082191A1/fr active Application Filing
- 2007-12-28 US US12/521,655 patent/US20100092335A1/en not_active Abandoned
-
2008
- 2008-06-26 TW TW097123948A patent/TWI366497B/zh active
-
2010
- 2010-11-22 KR KR1020100116460A patent/KR101165426B1/ko active IP Right Grant
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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US2024545A (en) * | 1933-10-04 | 1935-12-17 | L D Caulk Company | Dental alloy |
US3827884A (en) * | 1970-07-15 | 1974-08-06 | Daido Metal Co | Tin based white metal bearing alloys producing good bond with backing material |
US5384090A (en) * | 1987-01-30 | 1995-01-24 | Tanaka Denshi Kogyo Kabushiki Kaisha | Fine wire for forming bump electrodes using a wire bonder |
US5837191A (en) * | 1996-10-22 | 1998-11-17 | Johnson Manufacturing Company | Lead-free solder |
US20050123784A1 (en) * | 2003-12-02 | 2005-06-09 | Fcm Co., Ltd. | Terminal having surface layer formed of Sn-Ag-Cu ternary alloy formed thereon, and part and product having the same |
Also Published As
Publication number | Publication date |
---|---|
TW200927358A (en) | 2009-07-01 |
TWI366497B (en) | 2012-06-21 |
KR20100132470A (ko) | 2010-12-17 |
KR20080063176A (ko) | 2008-07-03 |
JP2010514931A (ja) | 2010-05-06 |
JP5210323B2 (ja) | 2013-06-12 |
KR101165426B1 (ko) | 2012-07-12 |
WO2008082191A1 (fr) | 2008-07-10 |
EP2101951A4 (fr) | 2010-01-27 |
EP2101951A1 (fr) | 2009-09-23 |
KR101042031B1 (ko) | 2011-06-16 |
CN101588889A (zh) | 2009-11-25 |
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