WO2008078788A1 - 放熱基板およびこれを用いた電子装置 - Google Patents

放熱基板およびこれを用いた電子装置 Download PDF

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Publication number
WO2008078788A1
WO2008078788A1 PCT/JP2007/075009 JP2007075009W WO2008078788A1 WO 2008078788 A1 WO2008078788 A1 WO 2008078788A1 JP 2007075009 W JP2007075009 W JP 2007075009W WO 2008078788 A1 WO2008078788 A1 WO 2008078788A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat dissipating
same
electronic device
dissipating substrate
metal layer
Prior art date
Application number
PCT/JP2007/075009
Other languages
English (en)
French (fr)
Inventor
Yuichi Abe
Kiyotaka Nakamura
Original Assignee
Kyocera Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corporation filed Critical Kyocera Corporation
Priority to JP2008551139A priority Critical patent/JP5202333B2/ja
Priority to EP07860238.0A priority patent/EP2109138B1/en
Publication of WO2008078788A1 publication Critical patent/WO2008078788A1/ja

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5386—Geometry or layout of the interconnection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

　放熱基板は、セラミック基板と、金属層と、１以上の放熱部材を有する。金属層は、前記セラミック基板の表面に設けられている。放熱部材は、金属層と当接する第一表面と、該第一表面の反対側にある第二表面とを具備する。金属層の面積Ａが、第一表面の面積Ｂより大きく、かつ前記第二表面の面積Ａ’より小さい。
PCT/JP2007/075009 2006-12-26 2007-12-26 放熱基板およびこれを用いた電子装置 WO2008078788A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008551139A JP5202333B2 (ja) 2006-12-26 2007-12-26 放熱基板およびこれを用いた電子装置
EP07860238.0A EP2109138B1 (en) 2006-12-26 2007-12-26 Heat dissipating substrate and electronic device using the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006-348935 2006-12-26
JP2006348935 2006-12-26

Publications (1)

Publication Number Publication Date
WO2008078788A1 true WO2008078788A1 (ja) 2008-07-03

Family

ID=39562579

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/075009 WO2008078788A1 (ja) 2006-12-26 2007-12-26 放熱基板およびこれを用いた電子装置

Country Status (3)

Country Link
EP (1) EP2109138B1 (ja)
JP (1) JP5202333B2 (ja)
WO (1) WO2008078788A1 (ja)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010076948A (ja) * 2008-09-24 2010-04-08 Hitachi Metals Ltd 窒化珪素回路基板およびそれを用いた半導体モジュール
JP2010077013A (ja) * 2008-08-29 2010-04-08 Kyocera Corp 炭素−金属複合体およびこれを用いた回路部材または放熱部材
CN102263185A (zh) * 2010-05-28 2011-11-30 景德镇正宇奈米科技有限公司 热辐射散热发光二极管结构及其制作方法
JP2012248576A (ja) * 2011-05-25 2012-12-13 Mitsubishi Shindoh Co Ltd ピン状フィン一体型ヒートシンク
WO2013008651A1 (ja) * 2011-07-14 2013-01-17 京セラ株式会社 回路基板および電子装置
JP2013115202A (ja) * 2011-11-28 2013-06-10 Toyota Industries Corp 半導体装置
JP2013222886A (ja) * 2012-04-18 2013-10-28 Toshiba Corp 半導体モジュール
JP2016181549A (ja) * 2015-03-23 2016-10-13 三菱マテリアル株式会社 ヒートシンク付きパワーモジュール用基板
JPWO2020045494A1 (ja) * 2018-08-30 2021-08-10 京セラ株式会社 電気メス用ヘッド
WO2022054691A1 (ja) * 2020-09-11 2022-03-17 オムロン株式会社 放熱構造体
CN115884952A (zh) * 2020-07-21 2023-03-31 罗杰斯德国有限公司 制造金属陶瓷基板的方法和借助其制造的金属陶瓷基板

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201854534U (zh) * 2010-06-24 2011-06-01 景德镇正宇奈米科技有限公司 陶瓷辐射散热结构
JP5397497B2 (ja) 2012-04-20 2014-01-22 ダイキン工業株式会社 冷凍装置
JP2014013789A (ja) * 2012-07-03 2014-01-23 Denso Corp 半導体装置
TWI513069B (zh) * 2013-05-21 2015-12-11 Subtron Technology Co Ltd 散熱板
JP6259625B2 (ja) * 2013-10-02 2018-01-10 日産自動車株式会社 絶縁基板と冷却器の接合構造体、その製造方法、パワー半導体モジュール、及びその製造方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0969590A (ja) 1995-06-23 1997-03-11 Toshiba Corp 窒化けい素回路基板
JPH10189845A (ja) * 1996-12-25 1998-07-21 Denso Corp 半導体素子の放熱装置
JPH11307696A (ja) * 1998-04-20 1999-11-05 Mitsubishi Electric Corp パワー半導体装置及びその製造方法
EP1107310A2 (de) 1999-12-08 2001-06-13 DaimlerChrysler Rail Systems GmbH Isolationsverbesserung bei Hochleistungs-Halbleitermodulen
JP2003017627A (ja) * 2001-06-28 2003-01-17 Toshiba Corp セラミックス回路基板およびそれを用いた半導体モジュール
JP2006140402A (ja) * 2004-11-15 2006-06-01 Toshiba Corp 半導体集積回路装置
JP2006245437A (ja) 2005-03-04 2006-09-14 Hitachi Metals Ltd セラミックス回路基板およびパワーモジュール並びにパワーモジュールの製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63104360A (ja) * 1986-10-20 1988-05-09 Mitsubishi Electric Corp 半導体装置
JPH0226058A (ja) * 1988-07-15 1990-01-29 Hitachi Ltd 混成集積回路用ヒートシンク
US5172301A (en) * 1991-10-08 1992-12-15 Lsi Logic Corporation Heatsink for board-mounted semiconductor devices and semiconductor device assembly employing same
JP3139523B2 (ja) * 1994-07-15 2001-03-05 三菱マテリアル株式会社 放熱フィン
JP2845203B2 (ja) * 1996-07-19 1999-01-13 日本電気株式会社 半導体装置およびその製造方法
US6294244B1 (en) * 1997-12-22 2001-09-25 Kyocera Corporation Wiring board having excellent heat-radiating property
JPH11265976A (ja) * 1998-03-18 1999-09-28 Mitsubishi Electric Corp パワー半導体モジュールおよびその製造方法
JP2002231865A (ja) * 2001-02-02 2002-08-16 Toyota Industries Corp ヒートシンク付絶縁基板、接合部材及び接合方法
JP4394477B2 (ja) * 2003-03-27 2010-01-06 Ｄｏｗａホールディングス株式会社 金属−セラミックス接合基板の製造方法
JP4496404B2 (ja) * 2003-10-10 2010-07-07 Ｄｏｗａメタルテック株式会社 金属−セラミックス接合基板およびその製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0969590A (ja) 1995-06-23 1997-03-11 Toshiba Corp 窒化けい素回路基板
JPH10189845A (ja) * 1996-12-25 1998-07-21 Denso Corp 半導体素子の放熱装置
JPH11307696A (ja) * 1998-04-20 1999-11-05 Mitsubishi Electric Corp パワー半導体装置及びその製造方法
EP1107310A2 (de) 1999-12-08 2001-06-13 DaimlerChrysler Rail Systems GmbH Isolationsverbesserung bei Hochleistungs-Halbleitermodulen
JP2003017627A (ja) * 2001-06-28 2003-01-17 Toshiba Corp セラミックス回路基板およびそれを用いた半導体モジュール
JP2006140402A (ja) * 2004-11-15 2006-06-01 Toshiba Corp 半導体集積回路装置
JP2006245437A (ja) 2005-03-04 2006-09-14 Hitachi Metals Ltd セラミックス回路基板およびパワーモジュール並びにパワーモジュールの製造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2109138A4 *

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010077013A (ja) * 2008-08-29 2010-04-08 Kyocera Corp 炭素−金属複合体およびこれを用いた回路部材または放熱部材
JP2010076948A (ja) * 2008-09-24 2010-04-08 Hitachi Metals Ltd 窒化珪素回路基板およびそれを用いた半導体モジュール
CN102263185A (zh) * 2010-05-28 2011-11-30 景德镇正宇奈米科技有限公司 热辐射散热发光二极管结构及其制作方法
JP2012248576A (ja) * 2011-05-25 2012-12-13 Mitsubishi Shindoh Co Ltd ピン状フィン一体型ヒートシンク
JPWO2013008651A1 (ja) * 2011-07-14 2015-02-23 京セラ株式会社 回路基板および電子装置
WO2013008651A1 (ja) * 2011-07-14 2013-01-17 京セラ株式会社 回路基板および電子装置
JP5665988B2 (ja) * 2011-07-14 2015-02-04 京セラ株式会社 回路基板および電子装置
JP2013115202A (ja) * 2011-11-28 2013-06-10 Toyota Industries Corp 半導体装置
JP2013222886A (ja) * 2012-04-18 2013-10-28 Toshiba Corp 半導体モジュール
JP2016181549A (ja) * 2015-03-23 2016-10-13 三菱マテリアル株式会社 ヒートシンク付きパワーモジュール用基板
JPWO2020045494A1 (ja) * 2018-08-30 2021-08-10 京セラ株式会社 電気メス用ヘッド
JP7248687B2 (ja) 2018-08-30 2023-03-29 京セラ株式会社 電気メス用ヘッド
CN115884952A (zh) * 2020-07-21 2023-03-31 罗杰斯德国有限公司 制造金属陶瓷基板的方法和借助其制造的金属陶瓷基板
WO2022054691A1 (ja) * 2020-09-11 2022-03-17 オムロン株式会社 放熱構造体

Also Published As

Publication number Publication date
JP5202333B2 (ja) 2013-06-05
EP2109138A4 (en) 2012-02-22
EP2109138A1 (en) 2009-10-14
EP2109138B1 (en) 2015-12-23
JPWO2008078788A1 (ja) 2010-04-30

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