Classifications

• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
  • C23C16/04—Coating on selected surface areas, e.g. using masks
  • C23C16/045—Coating cavities or hollow spaces, e.g. interior of tubes; Infiltration of porous substrates
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
  • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
  • B05D1/00—Processes for applying liquids or other fluent materials
  • B05D1/62—Plasma-deposition of organic layers
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
  • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
  • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
  • B05D5/08—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an anti-friction or anti-adhesive surface
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
  • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
  • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
  • B05D7/22—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to internal surfaces, e.g. of tubes
  • B05D7/227—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to internal surfaces, e.g. of tubes of containers, cans or the like
• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
  • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
  • C03C17/001—General methods for coating; Devices therefor
  • C03C17/003—General methods for coating; Devices therefor for hollow ware, e.g. containers
  • C03C17/004—Coating the inside
• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
  • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
  • C03C17/22—Surface treatment of glass, not in the form of fibres or filaments, by coating with other inorganic material
  • C03C17/23—Oxides
  • C03C17/245—Oxides by deposition from the vapour phase
• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
  • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
  • C03C17/28—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material
  • C03C17/30—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material with silicon-containing compounds
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
  • C23C16/02—Pretreatment of the material to be coated
  • C23C16/0209—Pretreatment of the material to be coated by heating
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
  • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
  • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
  • C23C16/40—Oxides
  • C23C16/401—Oxides containing silicon
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
  • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
  • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
  • C23C16/511—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using microwave discharges
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
  • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
  • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
  • C23C16/515—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using pulsed discharges
• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
  • C03C2217/00—Coatings on glass
  • C03C2217/20—Materials for coating a single layer on glass
  • C03C2217/21—Oxides
  • C03C2217/24—Doped oxides
• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
  • C03C2217/00—Coatings on glass
  • C03C2217/20—Materials for coating a single layer on glass
  • C03C2217/28—Other inorganic materials
• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
  • C03C2217/00—Coatings on glass
  • C03C2217/20—Materials for coating a single layer on glass
  • C03C2217/28—Other inorganic materials
  • C03C2217/282—Carbides, silicides
• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
  • C03C2217/00—Coatings on glass
  • C03C2217/70—Properties of coatings
  • C03C2217/76—Hydrophobic and oleophobic coatings
• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
  • C03C2218/00—Methods for coating glass
  • C03C2218/10—Deposition methods
  • C03C2218/15—Deposition methods from the vapour phase
  • C03C2218/152—Deposition methods from the vapour phase by cvd
  • C03C2218/153—Deposition methods from the vapour phase by cvd by plasma-enhanced cvd
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
  • Y10T428/131—Glass, ceramic, or sintered, fused, fired, or calcined metal oxide or metal carbide containing [e.g., porcelain, brick, cement, etc.]
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
  • Y10T428/131—Glass, ceramic, or sintered, fused, fired, or calcined metal oxide or metal carbide containing [e.g., porcelain, brick, cement, etc.]
  • Y10T428/1317—Multilayer [continuous layer]
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
  • Y10T428/1352—Polymer or resin containing [i.e., natural or synthetic]
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/31504—Composite [nonstructural laminate]
  • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
  • Y10T428/31609—Particulate metal or metal compound-containing
  • Y10T428/31612—As silicone, silane or siloxane
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/31504—Composite [nonstructural laminate]
  • Y10T428/31652—Of asbestos
  • Y10T428/31663—As siloxane, silicone or silane
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/31504—Composite [nonstructural laminate]
  • Y10T428/31652—Of asbestos
  • Y10T428/31667—Next to addition polymer from unsaturated monomers, or aldehyde or ketone condensation product

Definitions

• the invention relates generally to the production of coatings by means of CVD deposition, and more particularly to a method for applying hydrophobic layers to a substrate, as well as to products which can be produced according to the method.
• Barrier layers containing silica are particularly interesting in this context because they have several desirable properties. For example, they are transparent, recyclable and suitable for use in microwave ovens. Glass-like barrier layers in this regard are superior to thin metal layers currently commercially available on various polymer substrates.
• the packaged substances can be emptied as completely as possible.
• the adhesion of the packaged substance to the container wall also contributes, whereby this contribution even increases in proportion as the pack size decreases. This effect is among others already undesirable because it can lead to dose fluctuations.
• expensive medication can cause a noticeable loss.
• hydrophobic coatings are known in the prior art.
• One such approach is to apply silicone oils or to bake silicone oil emulsions.
• Such coatings are known, for example, from US Pat. No. 2,504,482 A.
• fluorine-containing layers as they are known from DE 199 21 303 Cl.
• coatings which in addition to fluorine also contain the elements Si, C, 0 and H, wherein for the fluorine and carbon content is that with fluorine contents less than 0.1%, the carbon content greater than or equal to 10% and fluorine contents greater than or equal 0.1% of the carbon content is greater than or equal to 5%.
• the invention is therefore based on the object to provide low-silicon coatings that are very are hydrophobic and have a further improved temperature resistance.
• the invention provides a composite material comprising a substrate and an uppermost layer, wherein the
• Composite material suitable for improving the residual emptying of packaging materials, and wherein the wetting or drainage behavior of liquids or suspensions over the uncoated substrate material is variable by the layer surface.
• the composite material includes a substrate and a coating deposited thereon that forms at least a portion of the surface of the coated substrate.
• the coating has as a relevant ingredient a
• This compound has a content of less than 10 at%, preferably less than 5 at%.
• This compound has a composition SiO x C y H 2 in which x is at most 1.2.
• the unit at% indicates, similar to mole percent, the respective mole fractions of the elements, the molar fraction of the elements in the unit being at% independent of the compound in which the elements are present.
• the compound has a composition SiO x C y H 2 with x less than 1.
• the compound in particular in the range from 0.6 to 0.9, preferably in the x Range from 0.7 to 0.8.
• Composition ranges with y in the range of 1.2 to 3.3, preferably in the range of 1.5 to 2.5 proved to be favorable.
• a method for producing a composite material in which a coating by means of plasma-assisted chemical
• Reaction space is introduced, which is at least partially limited by the substrate, and is ignited by pulsed irradiation of electromagnetic energy, a plasma in the reaction chamber, which forms reaction products in the plasma, which deposit as a coating on the substrate, wherein the layer, in a multilayer the uppermost layer has a composition of the form SiO x C y H z in which the ratio x is at most 1.2, and wherein other elements except fluorine and silicon have a content of less than 10 at%, preferably less than 5 at%.
• a composite material as can be produced by the method described above, can also be represented in particular by a method in which the coating is deposited on the substrate by means of plasma enhanced chemical vapor deposition, wherein for deposition a process gas with a silicon-containing gas component, as well as carbon and oxygen is admitted as a further gas constituents in a reaction space, which is at least partially limited by the substrate, and by pulsed irradiation of electromagnetic energy, a plasma is ignited in the reaction chamber, which forms reaction products in the plasma, which deposit as a layer on the substrate, wherein a pulsed Plasma with pulse durations in the range of 0, l ⁇ s - 500 ⁇ s, preferably 0.5 ⁇ s - lOO ⁇ s, more preferably l ⁇ s - 50 ⁇ s is used.
• typical pulse lengths of conventional methods are in the millisecond range.
• the pulses used according to the invention are shorter by at least a factor of 10.
• the shortened reaction time in the plasma is considered.
• the formation of certain reaction products, in particular the setting of a chemical equilibrium in the plasma is suppressed.
• silicone oils are applied as a hydrophobic coating, as is known from US Pat. No. 2,504,482 A, a film which is generally fluid and not firmly bound to the substrate is obtained.
• a condensate in particular a solid-state condensate, is obtained as a coating on account of the vapor-phase deposition.
• This coating is generally one Solid-state layer or a polymer, wherein the coating is also bonded to the substrate or at least firmly adhering thereto.
• a crosslinking of the layer constituents can be achieved.
• the layer can also be characterized as a plasma polymer.
• a plasma is particularly suitable in which a minimized energy density in the plasma is ensured by means of suitably selected process parameters, which however still ignites stably.
• this plasma is characterized by a very weak emission by means of a photon-sensitive
• Detector which is mounted in the vicinity of the plasma, still detectable.
• a plasma process with an average energy input per mass ⁇ M in a range of IGT 1 J / kg to 10 9 J / kg, preferably in a range of 10 2 J / kg to 5 x proves 10 6 J / kg as favorable, wherein the average energy input per mass ⁇ M is defined by
• W is the mean microwave power
• Fj the flow of the component i of the process gas mixture with components: O 2 , precursor and optionally a
• Carrier gas, M 1 the molecular mass of the component i, .DELTA.t pb the Pulse duration, ⁇ t pt the pulse pause and W p the pulse power. It is assumed that with these process parameters and a suitably selected process gas, which also does not necessarily contain a silicon-containing gas constituent, and / or carbon and / or oxygen as further gas constituents, it is also possible to deposit other coatings of unusual composition.
• a pulse pause without coupling in of energy is preferably carried out continuously, which is greater than the pulse duration, which is preferably between 0.1 ms and 200 ms, particularly preferably between 0.5 ms and 100 ms, very particularly preferably between 1 ms and 50 ms lies.
• the pulse pauses are particularly preferably of constant length. In this way, the deposition can be done with a constant low time averaged power.
• the pauses between the pulses do not have to be exactly the same length. Rather, a certain variation of the durations of the pulse pauses can take place. For example, the duration of the pauses in the pulse can fluctuate by up to a factor of 2, for example in their duration.
• the ratio of pulse pauses to pulse durations can be at least 5: 1, preferably at least 10: 1, for achieving low time-averaged power densities with nevertheless reliable ignition of the plasma in the development of the invention.
• the deposition of the coating can be achieved with the unusual composition of a process gas with otherwise ordinary precursor gases.
• SiO x C y H z coatings with x in the range of 0.0 to 1.2, y in the range of 0.0 to 6.0, and z in the range of 0.0 to 6.0 can be deposited.
• a can also Fluorine-free coating can be produced, which is still highly hydrophobic and also resistant to impacts, such as in autoclaving.
• Coating understood that contains no significant proportion of fluorine. Of course, but can not be ruled out that, for example, by contamination of the process gas still minimal amounts of fluorine may be included in the coating.
• a pulsed plasma with pulse durations in the range of 0.1 ⁇ s to 500 ⁇ s, preferably 0.5 ⁇ s to 100 ⁇ s, particularly preferably 1 ⁇ s to 50 ⁇ s.
• an inorganic layer can be embedded between the coating forming the uppermost layer and a compound with the elements C, O and H and the substrate.
• This inorganic layer is also preferably deposited by means of plasma-assisted vapor phase deposition.
• this layer has a composition of the form SiOi, 0-2, sCo, 0-0.5> on.
• a high proportion of silicon in relation to oxygen in the surface layer can also be achieved in particular by using a high proportion of silicon precursor in the process gas.
• silicon-organic precursor whose volume fraction in Process gas mixture adjusted to more than 10%, preferably more than 50%, more preferably more than 95%.
• the invention is particularly intended for the inner coating of hollow bodies, in which on the inside of the hollow body, the hydrophobic coating is applied, for example, to improve the emptying ability.
• the invention can also be used for other purposes. For example, easily cleaned surfaces can generally be provided with the coating.
• the invention is used for coating pharmaceutical packaging, such as vials, syringes or cartridges or components for a pharmaceutical packaging, such as needles or plugs.
• suitable plastics include COC (cyclo-olefin copolymer) and COP (cyclo-olefin polymer), on which good adhesion of the layer is achieved.
• COC cyclo-olefin copolymer
• COP cyclo-olefin polymer
• borosilicate glass is well suited as a glass.
• the emptiness of a hollow body as a substrate can be demonstrably improved in comparison to the uncoated hollow body. This is also reflected in the flow behavior of the coated hollow body in comparison to the uncoated hollow body, which can be improved in such a way that a semi-filled liquid with a closed hollow body after shaking the
• Liquid and immediately after a lapse of 5 seconds in the region of the inner surface above the liquid has a smaller area fraction of less than 50%, preferably less than 20% of adhering liquid than an uncoated hollow body.
• a composite material in the form of an internally coated hollow body in which the emptying is demonstrably improved compared to the uncoated hollow body, and / or the flow behavior of the coated hollow body compared to the uncoated hollow body is improved such that one with liquid semi-filled, closed hollow body after shaking the liquid and immediately after a lapse of 5 seconds in the region of the inner surface above the liquid has a smaller area fraction of less than 50%, preferably less than 20% of adhering liquid than an uncoated hollow body.
• the coating is also particularly advantageous also by their improved resistance to various influences, as they can occur in the packaging of pharmaceutical packaging.
• sterilization tests i) an autoclaving test at 121 ° C, 30 min., Ii) depyrogenation at 300 0 C, 20 min., Iii) gamma sterilization with 25kGy, iv) electron beam sterilization at 25 kGy, or v) ethylene oxide sterilization (ETO sterilization)
• the contact angle of the coating for water is changed by less than 4 °, preferably by less than 3 °, more preferably by less than 1 °, and / or
• a composite material preferably in the form of a container, comprising a substrate and a coating deposited thereon, the coating each having at least one, preferably all of the above-mentioned features i) to v).
• Such a layer has the following properties after the storage test:
• the contact angle of the layer for water is changed by less than 4 °, preferably by less than 3 °, more preferably by less than 1 ° with respect to the contact angle before the bearing test,
• the drainage angle for a drop of water having a volume of 26 ⁇ l is reduced by less than 30 °, preferably less than 20 °, more preferably by less than
• a composite material having a substrate and a coating deposited thereon, preferably in the form of an internally coated container, the coating of which has the aforementioned characteristics after the storage test.
• the substrate is heated prior to the deposition of the layer, preferably to a temperature between 40 0 C and 300 0 C, particularly preferably to a temperature between 60 0 C and 200 0 C.
• the heating can be done in particular by means of a plasma. In this way, on the one hand can be dispensed with an additional heater, on the other hand can be done by the plasma treatment simultaneously activation of the surface, which further improves the layer adhesion.
• the substrate is heated by a plasma process using a noble gas, such as argon, or an inert gas, such as nitrogen, or an oxygen-containing gas, such as oxygen, or a nitrogen-containing gas, such as ammonia.
• a noble gas such as argon
• an inert gas such as nitrogen
• an oxygen-containing gas such as oxygen
• a nitrogen-containing gas such as ammonia
• heating aucu outside the coating reactor preferably with an infrared radiator, are heated.
• Such a development of the invention is advantageous, inter alia, for coating systems with high throughputs.
• the process time of the vacuum processes can be advantageously shortened.
• the average power used for the plasma deposition is very low according to the invention. It is therefore generally favorable if the medium used Power for the heating process is higher than for the coating process. This is also manifested in the fact that the light emission of the plasma during the deposition of the coating averaged over time is less than the light emission of the Aufmoreplasmas averaged over time.
• the invention provides, as a further aspect, a method for producing a composite material in which the substrate before deposition of the coating with a plasma process using a noble gas such as argon, or an inert gas such as nitrogen, or an oxygen-containing gas such as oxygen, or a nitrogen-containing gas, such as ammonia, is heated and then also in a plasma process with pulsed plasma, the coating is deposited, wherein the light emission of the plasma in the deposition of the
• Coating thereby by at least a factor 10 less, preferably by at least a factor 10 2 , more preferably even by at least a factor 10 3 is lower.
• the gas exchange time between the heating and coating process is as small as possible.
• the gas exchange time may be less than 60 seconds, preferably less than 30 seconds, more preferably less than 15 seconds. Also, in this way, the heating of the substrate surface is maintained.
• process gases are suitable for this purpose which comprise at least one of the constituents hexamethyldisiloxane, Tetramethyldisiloxane, hexamethyldisilazane, TMCTS, TMDSN, TMS included.
• the coating according to the invention represents at least a part of the surface and a permanent
• Hydrophilization is generated, it is further particularly preferred to provide an end product with the coating as part of the surface, or as the uppermost layer.
• this can be both a filled container and a ready-to-use container.
• further treatment steps may follow before the pharmaceutical is filled in. For example, a lyophilization can take place.
• the container may optionally be additionally sterilized.
• the composite materials produced can also, depending on the application, empty or filled, optionally also be packaged sterile.
• the figure shows a pulse diagram of microwave pulses used for the layer deposition, wherein the microwave intensity I is plotted against the time t.
• the pulse durations ti of the pulses are very short with pulse durations in the range of 0.5 ⁇ s to at most 100 ⁇ s.
• the durations t 2 of the pulse pauses between the individual pulses are chosen to be much longer, with pulse intervals preferably being set with lengths between 0.5 and 100 milliseconds.
• the ratio of the durations t 2 / ti should be at least 5: 1, preferably at least 10: 1.
• the substrate (s) are preheated, preferably with a plasma (O 2, N 2, NH 3, noble gas), particularly preferably with an argon plasma.
• the preheating is carried out to a surface temperature in the range of 40 ° C-300 ° C, preferably 60 ° C-200 ° C.
• Process gas used in particular more than 10%, preferably more than 50%, more preferably even more than 95%, fraction of the silicon-organic precursor is used in the process gas.
• the deposition takes place after a gas exchange time of less than 30s after the
• Heating phase preferably less than 15s, i. as soon as possible after heating up.
• the layer deposition takes place in two stages. First, a very thin film is deposited at a higher power, thereby providing improved plasma ignition for the subsequent film than when dispensing with this first film. The second layer is then deposited at lower power accordingly.
• very short pulses with pulse durations in the range of 0, l ⁇ s - 500 ⁇ s, preferably 0.5 ⁇ s - lOO ⁇ s, more preferably l ⁇ s - 50 ⁇ s used.
• a combination layer of a barrier layer in particular with a barrier against alkali leaching and a coating of hydrophobic surface applied thereto, according to the invention, is produced.
• This combination layer both reduces leaching of substances from the substrate (e.g., glass ion leaching), as well as good residual drainability and drainage performance.
• the deposition of this combination layer is carried out in a continuous process.
• the reaction space is pumped out.
• the substrate is heated, preferably with an oxygen or argon plasma to a temperature T> 150 0 C, preferably> 200 0 C.
• a barrier layer is deposited with a mixture of silicon-organic precursor and oxygen, wherein the
• Precursor concentration in the process gas mixture at less than 20%, preferably less than 10%.
• a cooling phase during which the temperature drops at least by 2O 0 C, preferably at least 50 0 C.
• process gas preferably argon
• a plasma is ignited.
• the substrate is brought to the desired temperature.
• a gas exchange to a process gas mixture with silicon-organic precursor With the renewed plasma ignition, a hydrophobic coating according to the invention is deposited. This is followed by flooding to atmospheric pressure.
• 3rd process variant This variant is similar to the second process variant described above, but the
• the reaction space is pumped off, the substrate is heated in a plasma, preferably an oxygen or argon plasma to a temperature T> 150 0 C, preferably> 200 0 C and then in a process gas -Atmospotrore with a mixture of silicon-organic precursor and oxygen with a precursor concentration less than 20%, preferably less than 10%, the barrier coating deposited.
• a plasma preferably an oxygen or argon plasma to a temperature T> 150 0 C, preferably> 200 0 C
• the reaction space is flooded to atmospheric pressure.
• the reaction space is pumped out again and then brought in a plasma, preferably using argon as the process gas, the substrate in a short heating to target temperature.
• a plasma preferably using argon as the process gas
• Embodiment 1 hydrophobic inner coating of vials
• the vial is initially on the underside of the reactor on a sealing surface. Subsequently, the top of the reactor is closed and the interior of the vial evacuated to a Base pressure ⁇ 0.05 mbar is reached.
• the outdoor space remains at atmospheric pressure throughout the treatment process. While the connection to the vacuum remains maintained at the bottom, a gas inlet valve is opened and oxygen is introduced via the gas supply as the first process gas.
• a microwave source pulsed microwave energy is introduced at a frequency of 2.45 GHz and ignited a plasma. The substrate is heated with the plasma to a temperature of 250 0 C.
• a mixture of hexamethyldisiloxane and oxygen is introduced in a gas exchange time and deposited a 100 nm thick, glassy SiOx layer.
• the system is then flooded and the vial cooled to room temperature.
• the interior of the vial is again evacuated to a base pressure ⁇ 0.05 mbar and it is introduced as the third process gas argon gas with a flow of 86.5 sccm and at a pressure of 0.5 mbar.
• the microwave energy is stopped.
• a gas exchange time in which a fourth gas mixture of hexamethyldisiloxane with an HMDSO flow of 15 sccm is passed into the interior of the vial at a pressure of 0.2 mbar.
• pulsed microwave energy from the microwave source with a frequency of 2.45 GHz with a mean microwave power of 2.4W and a pulse duration of 12 ⁇ s and a pulse pause 10 ms
• pulse power 2000 W is introduced via the waveguide in the reactor chamber, inside the vial ignites a plasma and it is for a coating time of 90.2s, a silicon-organic, hydrophobic layer with a mean layer thickness of
• the microwave energy is stopped, the supply of the process gas is interrupted and the interior of the vial is flooded to atmospheric pressure.
• the coated vials have a significantly improved emptying abilities compared to uncoated Fiolax vials: Uncoated and coated vials are weighed and then filled with 10 ml of water. By means of a syringe cannula attached to the bottom of the bottle, the vials are emptied so far that only the remaining volume adhering to the container wall remains in the container. After removal of the liquid, the vials are again weighed. From the difference between the weight of the vial after emptying and the weight of the empty vial, the weight for the residual amount remaining in the vial is determined. The result for an uncoated vial is a residual amount with a weight of 15.3 mg, for hydrophobic coated vials, on the other hand, have a residual amount with a weight that is below the measurement error of 10.4 mg.
• the drainage angle for droplets with a volume of 2 ⁇ l is 20 °.
• the contact angle remains unchanged at 110 ° ⁇ 2 °. Consequently, the layers are very resistant to autoclaving since no change in contact angle is detectable.
• the coated vials have a good time-dependent behavior for water: after shaking, no or only a few drops adhere to the container wall after an expiry time of 2 s (area fraction ⁇ 10%).
• the coated vials have a good flow behavior for water: after shaking, no or only a few drops adhere to the container wall after an expiry time of 2 s (area fraction ⁇ 10%).
• Hydrophobically coated vials are filled with water and shaken in a 200-stroke apparatus for a period of 1 minute.
• the vials After shaking test, the vials still have a good flow behavior. Consequently, the layers are very resistant to abrasion.
• the composition of the hydrophobic layer is determined.
• the result is a composition of: Si: 26.4 at%, O: 19.8 at%, C: 53.7 at%.
• the ratio O / Si is very low and even surprisingly smaller than 1.
• the carbon content of more than 50 at% is very high.
• the layer has a composition SiO x C y H z with y in the range of 1.2 to 3.3, in particular in the range of 1.5 to 2.5 and x in the range of 0.6 to 0.9, in particular in the range of 0.7 to 0.8.
• Embodiment 3 Hydrophobic interior coating of vials
• a borosilicate glass vial (SCHOTT-Fiolax),. Type 2R, 4ml full volume, is fed to a reactor.
• the vial is initially on the underside of the reactor on the sealing surface.
• the top of the reactor is closed and evacuated the interior of the vial until a base pressure ⁇ 0.05 mbar is reached.
• the outdoor space remains at atmospheric pressure throughout the treatment process.
• a gas inlet valve is opened and oxygen is introduced via the gas supply as the first process gas.
• pulsed microwave energy is introduced at a frequency of 2.45 GHz and ignited a plasma.
• the substrate is heated with the plasma to a temperature of 250 0 C.
• a mixture of hexamethyldisiloxane and oxygen is introduced in a gas exchange time and deposited a 100 nm thick, glassy SiOx layer.
• the system is then flooded and the vial cooled to room temperature.
• the interior of the vial is again evacuated to a base pressure ⁇ 0.05 mbar and it is introduced as the third process gas argon gas with a flow of 86.5 sccm and at a pressure of 0.5 mbar.
• the third process gas argon gas with a flow of 86.5 sccm and at a pressure of 0.5 mbar.
• a gas exchange time in which a second gas mixture of hexamethyldisiloxane with an HMDSO flow of 15 sccm at a pressure of 0, lmbar is passed into the interior of the vial.
• a plasma inside the vial ignites and it is for a coating time 95s applied a silicon organic, hydrophobic layer.
• the microwave energy is stopped, the supply of the process gas is interrupted and the interior of the vial is flooded to atmospheric pressure.
• the hydrophobically coated vials have a significantly improved emptying abilities compared to uncoated Fiolax vials: Uncoated and coated vials are weighed and then filled with 4 ml of water. By means of a syringe cannula attached to the bottom of the bottle, the vials are emptied so far that only the remaining volume adhering to the container wall remains in the container. After removal of the liquid, the vials are again weighed. From the difference between the weight of the vial after emptying and the weight of the empty vial, the weight for the residual amount remaining in the vial is determined. The result for an uncoated vial is a residual amount with a weight of 18.0 mg, for hydrophobic coated vials, however, a residual amount with a weight that is below the measurement error of 10.4 mg.
• coated vials have a good flow behavior for water over time. You will be using 10ml of water for better visualization with a white one
• Dyestuff dyed filled and shaken. After shaking, no or only a few drops adhere to the container wall after an expiry time of 2 s (area fraction ⁇ 10%), while uncoated Fiolax vials still have a water film or droplets adhering to the surface and the surface area is higher than 50%.
• the drainage angle for droplets with a volume of 2 ⁇ l is 20 °.
• the coated vials have a good time-dependent behavior for water: after shaking, no or only a few drops adhere to the container wall after an expiry time of 2 s (area fraction ⁇ 10%).
• Hydrophobically coated vials are filled with water and shaken in a 200-stroke apparatus for a period of 1 minute.
• the vials After shaking test, the vials still have a good flow behavior. Consequently, the layers are very resistant to abrasion.
• hydrophobic single layer hydrophobic single layer
• the hydrophobic single layer is produced, but dispenses with the previous deposition of a barrier layer.
• Corresponding tests as in Example 2 show that the coated vials also have the properties mentioned in Example 2.
• Embodiments can also be combined with each other.

Landscapes

• Chemical & Material Sciences (AREA)
• Engineering & Computer Science (AREA)
• Organic Chemistry (AREA)
• General Chemical & Material Sciences (AREA)
• Materials Engineering (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Mechanical Engineering (AREA)
• Metallurgy (AREA)
• Life Sciences & Earth Sciences (AREA)
• Physics & Mathematics (AREA)
• Geochemistry & Mineralogy (AREA)
• Plasma & Fusion (AREA)
• Inorganic Chemistry (AREA)
• Wood Science & Technology (AREA)
• Details Of Rigid Or Semi-Rigid Containers (AREA)
• Laminated Bodies (AREA)
• Chemical Vapour Deposition (AREA)
• Paints Or Removers (AREA)
• Wrappers (AREA)

Priority Applications (4)

Applications Claiming Priority (2)

Publications (1)

Family

ID=39245071

Family Applications (1)

Country Status (6)

Cited By (25)

Families Citing this family (38)

Citations (6)

Family Cites Families (13)

• 2006
  • 2006-12-12 DE DE102006058771.5A patent/DE102006058771B4/de active Active
• 2007
  • 2007-12-12 EP EP20070857182 patent/EP2106461B1/de active Active
  • 2007-12-12 WO PCT/EP2007/011493 patent/WO2008071458A1/de not_active Ceased
  • 2007-12-12 JP JP2009540670A patent/JP5197625B2/ja active Active
  • 2007-12-12 US US12/448,232 patent/US8592015B2/en active Active
  • 2007-12-12 AT AT07857182T patent/ATE552360T1/de active

Patent Citations (6)

Non-Patent Citations (1)

Also Published As

Similar Documents

Legal Events