WO2008065972A1 - Moteur sans balai monté sur panneau - Google Patents

Moteur sans balai monté sur panneau Download PDF

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Publication number
WO2008065972A1
WO2008065972A1 PCT/JP2007/072684 JP2007072684W WO2008065972A1 WO 2008065972 A1 WO2008065972 A1 WO 2008065972A1 JP 2007072684 W JP2007072684 W JP 2007072684W WO 2008065972 A1 WO2008065972 A1 WO 2008065972A1
Authority
WO
WIPO (PCT)
Prior art keywords
ground pattern
conductive metal
metal plate
substrate
brushless motor
Prior art date
Application number
PCT/JP2007/072684
Other languages
English (en)
Japanese (ja)
Inventor
Yukio Shinozuka
Masahiro Miyashita
Original Assignee
Shinano Kenshi Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007296258A external-priority patent/JP2008161041A/ja
Application filed by Shinano Kenshi Kabushiki Kaisha filed Critical Shinano Kenshi Kabushiki Kaisha
Publication of WO2008065972A1 publication Critical patent/WO2008065972A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
    • H02K11/40—Structural association with grounding devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/091—Locally and permanently deformed areas including dielectric material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09554—Via connected to metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers

Definitions

  • the present invention relates to a substrate-mounted brushless motor that is driven at high speed by mounting a polygon mirror, CD, DVD or the like on a rotor, for example.
  • Spindle motors that drive a rotor at high speed are used in disk drive devices that drive OA equipment such as laser beam printers and copiers equipped with polygon mirrors, CDs, and DVDs.
  • an outer rotor type DC brushless motor is preferably used.
  • the rotor has a cup-shaped mouth housing supported on a rotating shaft, and a polygon mirror and various disks are positioned and mounted on the rotor housing in the horizontal and vertical directions, for example.
  • a housing is assembled to the substrate, and a stator is assembled to the outer periphery of the housing.
  • a rotor shaft is rotatably supported by the housing.
  • an iron substrate is formed by exposing a conductive pattern formed on an electrically conductive metal plate through an insulating layer from a surface resist layer. This board doubles as a motor mounting frame and a motor board!
  • a motor drive circuit is provided on the substrate, and electronic components such as sensors and switching elements are mounted.
  • the rotor is driven to rotate at high speed (for example, 10,000 rpm to 40, OOOrpm in the case of a polygon scanner motor), and the motor drive circuit is switched at high speed by PWM control.
  • high speed for example, 10,000 rpm to 40, OOOrpm in the case of a polygon scanner motor
  • the motor drive circuit is switched at high speed by PWM control.
  • electromagnetic noise is radiated due to a rapid voltage fluctuation generated in the wiring from the substrate to the motor coil or in the motor coil itself.
  • the metal plate on the back side of the substrate is connected to the ground pattern of the motor drive circuit because it easily diffuses electromagnetic waves.
  • a through hole is formed in a land portion of a ground pattern of a substrate, and the ground pattern and a metal plate (iron substrate) are electrically connected by filling the through hole with solder (Patent Document 1). .
  • Patent Document 1 Japanese Unexamined Patent Publication No. 2000-60094
  • the through hole is filled with solder
  • the wettability between the solder and the metal plate (iron substrate) is good, but the solder is repelled by the insulating layer that exists between the ground pattern.
  • workability is poor, and there is a problem that the electrical connection reliability between the ground pattern and the metal plate is affected.
  • through holes are provided in the substrate, and solder is filled and reflowed. For example, the manufacturing process increases, resulting in an increase in production costs.
  • the present invention has been made to solve these problems, and an object of the present invention is to provide a board-mounted brushless motor that improves the connection reliability between a ground pattern and a conductive metal plate with a simple configuration. It is to provide.
  • the present invention comprises the following arrangement.
  • a protruding portion that is pressed on the ground pattern and escapes the insulating layer to the periphery is formed, and the ground pattern and the conductive metal plate are electrically connected.
  • the ground pattern is recessed into a wedge shape or a substantially L-shaped cross section to electrically connect the ground pattern depressed from the substrate surface and the conductive metal plate, and the depressed metal is filled with the conductive metal material. Being done! /, Characterized in that.
  • the conductive metal plate and the ground pattern can be electrically connected with a simple configuration without being affected by the insulating layer, and the ability to radiate electromagnetic noise can be achieved.
  • a raised portion is formed on the ground pattern by, for example, pressing a tool to release the insulating layer to the periphery, and the ground pattern and the conductive metal plate are connected to each other. Since it can be conducted, it can be grounded simply by pressing a tool at any point on the pattern and plastically deforming it, making it cheap and easy to assemble!
  • the ground pattern is recessed into a wedge shape or a substantially L-shaped cross section to electrically connect the ground pattern depressed from the substrate surface and the conductive metal plate, and a conductive metal material ( (For example, solder, solder alloy, etc.) can be used to ensure electrical continuity between the ground pattern on the surface layer and the conductive metal plate via the conductive metal material in addition to the connection due to the depression of the ground pattern. Connection reliability can be improved.
  • FIG. 1 is a plan view of a polygon scanner motor.
  • FIG. 2 is a half sectional view of a polygon scanner motor.
  • FIG. 3A and FIG. 3B are a cross-sectional view of a concave portion of a substrate and a plan view of the concave portion.
  • FIG. 4 is a plan view of a polygon scanner motor according to another example.
  • FIG. 5 is a plan view of a recess formed in a ground pattern according to another example.
  • FIG. 6 is a plan view showing a state in which the concave portion of FIG. 5 is filled with a conductive metal material.
  • FIG. 7 is a partial cross-sectional view in the direction of arrows AA in FIG.
  • a substrate and a stator core are assembled to a rotor in which a polygon mirror is mounted in a cup-shaped rotor housing with the horizontal and vertical positions aligned, and a stator housing that rotatably supports the rotating shaft of the rotor.
  • An outer rotor type DC brushless motor having a stator is preferably used.
  • the schematic configuration of the polygon scanner motor will be described with reference to FIG. 1 and FIG.
  • a cup-shaped rotor housing 2 is used as the rotor 1.
  • a shaft hole 3 is formed in the rotor housing 2, and a rotating shaft 4 is integrally fixed to the shaft hole 3 by press fitting or shrink fitting.
  • a polygon mirror 5 is mounted on the upper surface of the rotor housing 2 and is pressed. Even the spring 6 is pressed against the upper surface of the rotor housing 2.
  • the holding spring 6 is fixed by a C-type retaining ring 7 that is fitted into a cylindrical portion that is formed upright around the shaft hole 3.
  • a ring-shaped magnet 8 is fixed to the inner peripheral surface of the rotor housing 2.
  • the magnet 8 is alternately magnetized with N and S poles in the circumferential direction.
  • a stator 9 has a rotating shaft 4 coaxially incorporated in a stator housing 10 via a dynamic pressure bearing 11.
  • the stator housing 10 is formed by continuously forming cylindrical portions having different outer diameters.
  • a stator core 12 is fitted into the small diameter portion with an adhesive, and a substrate (motor mounting plate / motor is mounted on the large diameter portion. Board) 13 is fixed.
  • a thrust receiver 14 is fitted into the stator housing 10 using a hole diameter step from the motor substrate 13 side. The thrust receiver 14 receives the shaft end (lower end) of the rotating shaft 4 and defines the shaft end position.
  • the substrate 13 is caulked on the stator housing 10 in a direction perpendicular to the rotation axis 4.
  • This board 13 serves both as a motor mounting frame and a motor board.
  • On the substrate 13 are mounted electronic components (drive IC) 15 and a magnetic pole sensor 23 that constitute a motor drive circuit.
  • the magnetic pole sensor 23 detects the magnetic pole position of the rotor 1 from the leakage magnetic flux of the magnet 8.
  • the motor drive circuit switches the energization of the stator coil 16 in the direction for energizing the rotation of the rotor 1.
  • an iron substrate 13 is formed on a conductive metal plate 17 with a conductor pattern (ground pattern 19) exposed from a resist film 20 via an insulating layer 18.
  • a concave portion 21 that is plastically deformed from the ground pattern 19 side toward the substrate 13 is formed in a part of the ground pattern 19.
  • FIG. 3A when a tool (not shown) is pressed against the ground pattern 19 exposed on the substrate surface side, the insulating layer 18 between the ground pattern 19 and the substrate 13 is crushed, escapes to the surroundings, and rises upward in a ring shape. A raised ridge 22 is formed (see FIG. 3B). As a result, the insulating layer 18 is broken, and the ground pattern 19 on the upper side of the recess can be electrically connected to the substrate 13 on the lower side of the recess. Further, since the cross section of the substrate is not exposed, wrinkles or the like do not occur in the concave portion 21. In this way, the conductive metal plate 17 and the ground pattern 19 can be electrically connected reliably and inexpensively with an extremely simple configuration. The power to suppress the radiation of S.
  • the ground pattern 19 is covered with the resist film 20.
  • the concave portion 21 is formed using a tool having a spherical tip shape.
  • the concave portion 21 may be formed using a tool having another tip shape.
  • a branch pattern 19a is provided in a part of the ground pattern 19.
  • a concave portion (recessed portion) 21 is formed by protruding on the branch pattern 19a with a tool.
  • An example of the planar shape of the recess 21 is shown in FIG. In this state, the ground pattern 19 depressed in the recess 21 and the conductive metal plate 17 may be electrically connected.
  • FIG. 6 it is more preferable that the recess 21 is filled with a conductive metal material (eg, solder, solder alloy, etc.) 24.
  • FIG. 7 shows a cross-sectional view along arrow AA in FIG.
  • the concave portion 21 is formed by being recessed in a cross-sectional wedge shape or a substantially L-shaped cross section, and the recessed ground pattern 19 is electrically connected to the conductive metal plate 17 by the insulating layer 18 being crushed.
  • a conductive metal material is formed so as to cover the ground pattern end 19A existing on the inclined surface 25 of the recessed portion 21 formed by this depression and the ground pattern end 19B exposed from the resist film 20 provided on the surface layer of the motor substrate 13. 24 is filled.
  • the cross-sectional shape of the concave portion 21 is slightly larger than the L-shape from the acute-angled wedge shape! /, The obtuse-angle shape! /, Or may be misaligned! /. The shape is preferred!
  • the electrical connection between the ground pattern end 19B on the surface layer side through the conductive metal material 24 and the conductive metal plate 17 can be secured, so the connection Reliability can be improved.
  • the above-described embodiment can also be used for other board-mounted brushless motors such as the power described with the polygon scanner motor and the spindle motor for driving the disk.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Brushless Motors (AREA)

Abstract

L'invention concerne un moteur sans balai monté sur panneau dans lequel la fiabilité de connexion entre un motif de masse et une plaque métallique conductrice de l'électricité est améliorée par une structure simple. Une partie du motif de masse (19) est percée pour former une section creuse (21). Par ceci, une couche d'isolation intermédiaire (18) est pressée et écrasée pour connecter électriquement le motif de masse (19) et la plaque (17) métallique conductrice de l'électricité.
PCT/JP2007/072684 2006-11-27 2007-11-22 Moteur sans balai monté sur panneau WO2008065972A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2006317963 2006-11-27
JP2006-317963 2006-11-27
JP2007296258A JP2008161041A (ja) 2006-11-27 2007-11-15 基板取付型ブラシレスモータ
JP2007-296258 2007-11-15

Publications (1)

Publication Number Publication Date
WO2008065972A1 true WO2008065972A1 (fr) 2008-06-05

Family

ID=39467763

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/072684 WO2008065972A1 (fr) 2006-11-27 2007-11-22 Moteur sans balai monté sur panneau

Country Status (1)

Country Link
WO (1) WO2008065972A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010051046A (ja) * 2008-08-19 2010-03-04 Panasonic Corp ブラシレスモータ
JP2014110706A (ja) * 2012-12-03 2014-06-12 Minebea Co Ltd ブラシレスモータ

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03201498A (ja) * 1989-12-28 1991-09-03 Matsushita Electric Ind Co Ltd 金属基板の層間接続方法
JPH04171889A (ja) * 1990-11-05 1992-06-19 Matsushita Electric Ind Co Ltd 金属基板の層間接続方法
JPH07162104A (ja) * 1993-12-02 1995-06-23 Sankyo Seiki Mfg Co Ltd 回路基板及びその製造方法
JPH07288368A (ja) * 1994-04-19 1995-10-31 Sony Corp プリント基板の接地方法
JPH0991552A (ja) * 1995-07-17 1997-04-04 Tokai Denshi Kk 共振タグの製造方法および共振タグ
JP2000060094A (ja) * 1998-08-06 2000-02-25 Kitashiba Electric Co Ltd 基板取付型ブラシレスモータ

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03201498A (ja) * 1989-12-28 1991-09-03 Matsushita Electric Ind Co Ltd 金属基板の層間接続方法
JPH04171889A (ja) * 1990-11-05 1992-06-19 Matsushita Electric Ind Co Ltd 金属基板の層間接続方法
JPH07162104A (ja) * 1993-12-02 1995-06-23 Sankyo Seiki Mfg Co Ltd 回路基板及びその製造方法
JPH07288368A (ja) * 1994-04-19 1995-10-31 Sony Corp プリント基板の接地方法
JPH0991552A (ja) * 1995-07-17 1997-04-04 Tokai Denshi Kk 共振タグの製造方法および共振タグ
JP2000060094A (ja) * 1998-08-06 2000-02-25 Kitashiba Electric Co Ltd 基板取付型ブラシレスモータ

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010051046A (ja) * 2008-08-19 2010-03-04 Panasonic Corp ブラシレスモータ
JP2014110706A (ja) * 2012-12-03 2014-06-12 Minebea Co Ltd ブラシレスモータ

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