WO2008065809A1 - Appareil de traitement et jig de traitement de surface - Google Patents

Appareil de traitement et jig de traitement de surface Download PDF

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Publication number
WO2008065809A1
WO2008065809A1 PCT/JP2007/069746 JP2007069746W WO2008065809A1 WO 2008065809 A1 WO2008065809 A1 WO 2008065809A1 JP 2007069746 W JP2007069746 W JP 2007069746W WO 2008065809 A1 WO2008065809 A1 WO 2008065809A1
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WO
WIPO (PCT)
Prior art keywords
processed
processing
treatment
jig
processing apparatus
Prior art date
Application number
PCT/JP2007/069746
Other languages
English (en)
Japanese (ja)
Inventor
Atsushi Miyanari
Original Assignee
Tokyo Ohka Kogyo Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co., Ltd. filed Critical Tokyo Ohka Kogyo Co., Ltd.
Publication of WO2008065809A1 publication Critical patent/WO2008065809A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Definitions

  • the present invention relates to a processing apparatus that performs processing using a processing liquid on the surface of an object to be processed, and a surface processing jig suitably used for the processing.
  • the thickness (film thickness) of the semiconductor wafer on which the semiconductor chip is based is currently 125 am to; 150 ⁇ m, but it must be 25 to 50 ⁇ m for next-generation chips. It is said.
  • the following thinning method can be exemplified.
  • a semiconductor wafer and a plate material such as a support plate are attached via a tape or an adhesive having adhesive layers on both sides.
  • This support plate serves to protect the thinned semiconductor wafer.
  • a thinned semiconductor wafer is formed by polishing the semiconductor wafer with a grinder or the like in a state protected by the support plate.
  • the support plate is peeled off from the thinned semiconductor wafer.
  • the adhesive is removed after the support plate is separated from the semiconductor wafer. It may remain on the semiconductor wafer. Therefore, the adhesive must be removed to make the upper surface of the semiconductor wafer clean.
  • the thinned semiconductor wafer is generally diced in a state where the shell is occupied by a dicing tape fixed to a dicinder frame, and is divided into individual chips. The thinned semiconductor wafer is attached to the dicing tape in a state of being bonded to the support plate, and then the support plate is peeled off and the adhesive on the semiconductor wafer is removed. There is power S to be called.
  • the exposed surface of the dicing tape is positioned on the outer periphery of the semiconductor wafer.
  • a treatment liquid solvent
  • the dicing tape is exposed.
  • the surface is also treated with this treatment liquid.
  • the processing is performed up to the exposed surface of the dicing tape provided on the outer periphery of the semiconductor wafer.
  • the present invention has been made in view of the above problems, and an object of the present invention is to provide a processing apparatus and a surface processing jig capable of performing processing using a processing liquid only on a surface to be processed. It is in.
  • a processing apparatus includes a mounting table on which a target object is mounted;
  • Supply means for supplying a treatment liquid to the surface treatment jig
  • Recovery means for recovering the treatment liquid supplied to the surface treatment jig
  • Separation maintaining means for maintaining the surface treatment jig away from the surface to be treated, and the surface treatment jig has a facing surface facing the surface to be treated, And a processing section for processing the surface to be processed while holding the processing liquid supplied from the supply means between the processing surface and the processing surface.
  • the processing apparatus includes a surface treatment jig capable of supplying and collecting the treatment liquid to and from the surface treatment jig while maintaining a state separated from the surface to be processed. Therefore, the processing liquid can be held only between the surface to be processed and the opposing surface opposite to the surface to be processed, and the processing liquid does not scatter on other than the surface to be processed. As a result, according to the processing apparatus of the present invention, it is possible to perform processing only on the region of the surface to be processed that is desired to be processed. Furthermore, since the surface treatment jig does not contact the object to be treated, the possibility of damaging the object to be treated can be reduced.
  • the processing unit includes a protruding portion protruding from the facing surface toward the object to be processed, and the protrusion and the surface to be processed are provided. It is preferable that the supplied processing liquid is held between the facing surface and the surface to be processed due to the surface tension of the processing liquid. According to this aspect, the protrusion is provided, so that the processing liquid can be reliably held between the surface to be processed and the opposing surface.
  • the surface of the protrusion that faces the surface to be processed is a flat surface, and the distance between the protrusion and the surface to be processed is determined by the separation maintaining means. It is preferably maintained at 3 mm or less. According to this aspect, the processing liquid can be more reliably held between the surface to be processed and the opposing surface of the surface processing jig by using the surface tension of the processing liquid. Therefore, it is possible to suppress the processing liquid from being scattered outside the surface to be processed.
  • the processing apparatus includes a drying means for drying the processed surface after processing! According to this aspect, the surface to be treated can be dried even when the treatment liquid cannot be completely collected.
  • the drying means is preferably an inert gas supply means for supplying an inert gas toward the surface to be processed. According to this aspect, it is possible to spray the treatment liquid and to dry it by blowing the inert gas.
  • the drying means is preferably a suction means for sucking the processing liquid remaining on the surface to be processed.
  • the suction means is performed using the surface treatment jig V, and supply of the treatment liquid from the supply means in the surface treatment jig is stopped. In this state, the treatment liquid is preferably collected by suctioning the treatment liquid remaining on the surface to be treated by the recovery means.
  • the surface treatment jig is used for both treatment and drying.
  • an area of the facing surface is smaller than an area of the processing target surface! /.
  • the separation maintaining means can move the surface treatment jig relative to the object to be processed. According to this aspect, even when the area of the facing surface is smaller than the area of the processing surface, the entire surface of the processing surface can be processed. And force S.
  • the separation maintaining means can move the surface processing jig from the approximate center of the object to be processed toward the outer edge.
  • the “substantially center” means that the center and the periphery of the center are included.
  • the entire object to be processed can be processed by moving the surface treatment jig from the center toward the outer periphery, particularly while rotating the object to be processed.
  • the mounting table can rotate the mounted object to be processed S. According to this aspect, when the area of the surface to be processed is larger than that of the opposing surface, the processing efficiency can be improved.
  • a surface treatment jig according to the present invention comprises:
  • a surface treatment jig used for treating a surface to be processed of a target object with a processing liquid, wherein a surface facing the surface to be processed is maintained when being separated from the surface to be processed.
  • a processing unit for processing the surface to be processed while holding the processing liquid supplied between the facing surface and the surface to be processed.
  • the surface treatment jig according to the present invention can hold the treatment liquid between the surface to be treated and the opposing surface. Therefore, the treatment with the treatment liquid can be performed only on a desired region by performing the treatment using the surface treatment jig which is effective in the present invention. As a result, even when a surface that is not desired to be processed at the same level as the surface to be processed is provided, it is possible to realize processing in which the processing liquid is prevented from being scattered on the surface.
  • FIG. 1 is a cross-sectional view of a main part showing the configuration of a processing apparatus according to an embodiment of the present invention.
  • FIG. 2 is a cross-sectional view showing part A of FIG. 1 in more detail.
  • FIG. 3 is a plan view showing a surface treatment jig included in the treatment apparatus according to the present embodiment.
  • FIG. 4 (a) is a cross-sectional view showing an example of an object to be processed that is processed by the processing apparatus according to the present embodiment.
  • FIG. 4 (b) is a cross-sectional view showing an example of an object to be processed that is processed by the processing apparatus according to the present embodiment.
  • FIG. 4 (c) is a cross-sectional view showing an example of an object to be processed that is processed by the processing apparatus according to the present embodiment.
  • FIG. 4 (d) A cross-sectional view showing an example of a workpiece to be processed by the processing apparatus according to the present embodiment.
  • FIG. 5 is a plan view showing a surface treatment jig that works on another aspect.
  • FIG. 1 is a cross-sectional view showing the main part of the processing apparatus 100 which is effective in the present embodiment.
  • FIG. 2 is a cross-sectional view showing part A of FIG. 1 in more detail.
  • FIG. 3 is a plan view showing a part of the surface treatment jig provided in the treatment apparatus which is effective in the present embodiment.
  • FIG. 3 is a plan view showing the facing surface (surface facing the surface to be processed) of the surface treatment tool.
  • a processing apparatus 100 includes a mounting table 10 on which a processing object 18 is mounted, and a surface processing jig 20 that processes a processing surface 18a of the processing object 18 with a processing liquid. And a supply means 30 for supplying the treatment liquid to the surface treatment jig 20, a collection means 40 for collecting the treatment liquid supplied to the surface treatment jig 20, and the surface treatment jig 20 separated from the surface to be treated 18a. And a distance maintaining means 50 for maintaining the maintained state. Furthermore, the processing apparatus 100 is provided with a cleaning cup 16 provided so as to surround the workpiece 18.
  • the mounting table 10 can be held by sucking the workpiece 18, for example.
  • the mounting table 10 is provided on a rotating shaft 12 that can rotate about the center, and a motor 14 that rotates the rotating shaft 12 is attached to the rotating shaft 12. With this configuration, the object to be processed 18 can be rotated about a perpendicular passing through the approximate center of the surface to be processed 18a.
  • the surface treatment jig 20 has a facing surface 22a facing the surface to be processed 18a, and holds the processing liquid supplied from the supply means 30 between the facing surface 22a and the surface to be processed 18a. Fulfill.
  • the structure of the surface treatment jig 20 is not particularly limited as long as it can play the above role.
  • the surface treatment jig 20 has a treatment unit 22 for holding the supplied treatment liquid and treating the surface to be treated 18a.
  • the processing section 22 has a facing surface 22a that faces the surface to be processed 18a when the surface processing jig 20 is maintained apart from the surface to be processed 18a. That is, according to the surface treatment jig 20 according to the present embodiment, the treatment liquid can be held between the treatment unit 22 and the facing surface 22a.
  • the processing unit 22 is provided with a first through hole 26 and a second through hole 28.
  • the first through hole 26 is a hole for supplying the processing liquid to the processing unit 22, and the second through hole 28 is a hole for collecting the processing liquid in the processing unit 22.
  • each dashed arrow indicates the direction in which the processing liquid flows.
  • force S is shown when there are one first through-hole 26 and four second through-holes 28, but it is not limited to this.
  • the second through-hole Six or eight holes may be provided.
  • the arrangement of the first through hole 26 and the second through hole 28 is not limited to the arrangement shown in the drawing.
  • the planar shapes of the first through hole 26 and the second through hole 28 can be circular, elliptical, or rectangular, and are not particularly limited as long as they do not hinder the flow of the processing liquid. The same applies to the opening diameters of the first through hole 26 and the second through hole 28.
  • the processing unit 22 includes a protruding portion 24 that protrudes from the facing surface 22a toward the object 18 to be processed.
  • the protrusion 24 is preferably provided on the periphery of the facing surface 22a.
  • the processing unit 22 includes the protrusion 24, so that the supplied processing liquid can be reliably held between the processing surface 18a.
  • the treatment liquid is retained by utilizing the surface tension of the treatment liquid.
  • the distance force between the protrusion 24 and the surface to be processed 18a is 0.5 mm by the separation maintaining means 50 described later. As mentioned above, it is preferable to be maintained at 3 mm or less, more preferably 0.5 to 1.5 mm. It should be noted that the distance between the protrusion 24 and the surface to be processed 18a may be as close as Omm as long as it does not contact. Thereby, a process liquid can be hold
  • the area of the surface 18a to be treated is larger than the area of the opposite surface 22a (the treatment area of the treatment unit 22)! It is preferably used for If the area of the treated surface 18a is larger than the area of the facing surface 22a, By adjusting the distance between the surface 18a and the processing unit 22 by the separation maintaining means 50, it is possible to hold the processing liquid using the surface tension. Specifically, when the opposing surface 22a and the processing surface 18a (processing area of the processing unit 22) are circular, the diameter of the opposing surface 22a is smaller than the radius of the processing surface 18a. ! /, I like it! /
  • the supply means 30 plays a role of supplying the processing liquid to the processing unit 22 of the surface processing jig 20.
  • the supply means 30 includes, for example, a treatment liquid tank 34 for storing the treatment liquid, a supply pipe 32 connected to the treatment liquid tank 34, and a pump (not shown) for supplying the treatment liquid to the surface treatment jig 22. Etc.).
  • the supply pipe 32 is connected to the first through hole 26. Then, the processing liquid is supplied to the processing section 22 through the processing liquid tank 34, the supply pipe 32 and the first through hole 26.
  • the suction means 40 plays a role of collecting the processing liquid from the processing unit 22 of the surface processing jig 20.
  • the suction means 40 includes, for example, a processing liquid recovery pipe 42, a recovery tank 44 for recovering the processed processing liquid, a pump or an ejector for sucking the processing liquid, and the like.
  • the pump or ejector may be provided behind the collection tank.
  • the recovery pipe 42 is connected to the second through hole 28. Then, the processing liquid supplied to the processing unit 22 is recovered in the recovery tank 44 via the second through hole 28 and the recovery pipe 42.
  • the treatment liquid is collected in the collection tank.
  • the treatment liquid may be discharged from the surface treatment jig 20 simply by a pump, an ejector, or the like.
  • the separation maintaining means 50 is for maintaining the surface treatment jig 20 away from the surface to be treated 18a.
  • the processing liquid can be held in the processing section 22 by maintaining the distance between the surface processing jig 20 and the surface to be processed 18a at a predetermined distance.
  • the separation maintaining means 50 may include a mechanism that allows the surface treatment jig 20 to move in a direction parallel to the surface to be processed 18a and in a vertical direction with respect to the surface to be processed 18a.
  • the separation maintaining means 50 can be realized by, for example, an arm 52 for holding the surface treatment jig 20.
  • the processing apparatus 100 that is effective in the present embodiment includes a drying unit that dries the processed surface 18a after processing.
  • a drying means for example, an inert gas is applied to the surface to be processed 18a.
  • examples thereof include an inert gas supply means 60 to be supplied and a suction means (not shown) for sucking the processing liquid remaining on the surface to be processed 18a.
  • the inert gas supply means 60 can include, for example, an inert gas tank 62, an inert gas supply pipe 64, and a nozzle 66 provided at the tip of the inert gas supply pipe 64.
  • the inert gas a known inert gas such as argon or nitrogen can be used.
  • the suction means can be composed of, for example, a pump for suction, a recovery tank for recovering the processing liquid, and a recovery liquid recovery pipe.
  • the inert gas supply means 60 and the suction means may be configured integrally with a surface treatment jig 20 described later or may be configured separately.
  • the object to be processed 18 can be dried using the surface treatment jig 20. A processing method in the case where the surface to be processed 18a is dried using the surface processing jig 20 will be described later.
  • the workpiece 18 is held on the mounting table 10.
  • the mounting table 10 is provided with a suction mechanism and can hold the workpiece 18.
  • the surface treatment jig 20 is disposed above the workpiece 18 by the separation maintaining means 50.
  • the distance force between the surface to be processed 18a of the object to be processed 18 and the surface treatment jig 20 is preferably maintained to be, for example, 3 mm or less. This makes it easy to hold the processing liquid between the surface to be processed 18 a and the facing surface 22 a of the surface processing jig 20.
  • the processing liquid is supplied from the processing liquid supply means 30 to the surface processing jig 20 (processing section 22).
  • the treatment liquid is supplied through the first through hole 26 of the surface treatment jig 20.
  • recovery of the supplied processing liquid is performed by the recovery means 40 (hereinafter referred to as “supply / recovery processing”).
  • the recovery of the processing liquid is performed by sucking the processing liquid toward the recovery pipe 44 through the second through hole 28 of the surface processing jig 20.
  • a force S for holding the processing liquid can be obtained by utilizing the surface tension of the processing liquid generated between the surface to be processed 18 a and the surface processing jig 20.
  • the supply amount and the recovery amount of the treatment liquid in the above-mentioned supply / recovery process are the same as the case where the treatment liquid does not diffuse from the surface treatment jig 20 while maintaining the above surface tension. For example, it may be adjusted to substantially the same amount.
  • the supply / recovery processing of the processing liquid can be performed while moving the surface processing jig 20 relative to the target object 18. At this time, it is preferable to move the surface treatment jig 20 from the approximate center of the workpiece 18 toward the outer edge. In this way, by moving the surface treatment jig 20, even if the treatment surface of the treatment part 22 of the surface treatment jig 20 is smaller than the treatment surface 18a, the treatment surface 18a Processing can be applied to the entire area.
  • substantially center means including the center and the periphery of the center.
  • the supply / recovery process may be performed while rotating the object 18 about a vertical line passing through the approximate center of the surface.
  • the rotation speed is preferably 10 rpm or more and 10 rpm or less. This is because the processing liquid can be held between the processing section 22 and the surface to be processed 18a within the above range, and the processing liquid can be prevented from scattering to other regions. Further, the processing efficiency can be improved by rotating the workpiece 18 in this way.
  • drying processing the surface to be processed 18a is dried (hereinafter referred to as “drying processing”).
  • the drying process can be performed using the above-described inert gas supply means 60 or suction means. Further, this drying step can be performed using the surface treatment jig 20.
  • the surface treatment jig 20 is used, the treatment liquid remaining on the surface to be treated 18a is sucked by using the collection means 40 while the supply of the treatment liquid from the supply means 30 is stopped. In this case, the surface treatment jig 20 can realize treatment with the treatment liquid and drying, and the treatment apparatus can be effectively used.
  • the processing surface 18a can be processed with the processing liquid using the processing apparatus according to the present embodiment.
  • the processing for the surface treatment jig 20 is performed while maintaining the state where the surface to be treated 18a and the surface treatment jig 20 are separated by the separation maintaining unit 50.
  • the liquid can be supplied and the supplied processing liquid can be recovered.
  • the processing liquid can be held between the surface processing jig 20 and the surface to be processed 18a by simultaneously supplying the processing liquid and collecting the supplied processing liquid. Therefore, it is possible to suppress the dispersion of the treatment liquid to the region where the treatment liquid is not expected to be scattered. As a result, processing It is possible to provide a processing apparatus that can perform processing only on the desired surface (surface to be processed).
  • the surface tension of the processing liquid is utilized by adjusting the distance between the surface processing jig 20 and the processing target surface 18a by the separation maintaining means 50.
  • the treatment liquid can be held more reliably. Therefore, the dispersion of the treatment liquid can be prevented, and a predetermined amount of the treatment liquid can be held in the region to be treated.
  • a depression is generated in the processing unit 22 according to the length of the protrusion 24. As a result, this depression can function as a treatment liquid holding region. In this way, by using the surface treatment jig 20, it becomes possible to hold a desired amount of the treatment liquid and perform the treatment satisfactorily.
  • the object 18 is not limited to the object illustrated below.
  • the object 18 to be processed satisfactorily by this processing apparatus which is the power of this embodiment, is a thinned semiconductor wafer provided on a dicing tape as a support.
  • the semiconductor wafer thinned in this way has the ability to remain an adhesive force on the surface of the semiconductor wafer in the thinning process.
  • the present embodiment can be applied to a processing apparatus.
  • FIG. 4A to FIG. 4D are cross-sectional views for explaining a semiconductor wafer thinning process.
  • an example using the support plate 70 with holes will be described.
  • the support plate 70 and the semiconductor element 74a are pasted with the adhesive 72 interposed therebetween.
  • This semiconductor wafer 74a is the one before thinning.
  • the semiconductor wafer 74a is polished to form a thinned semiconductor wafer 74.
  • the semiconductor wafer 74a can be polished by various known techniques.
  • the surface of the semiconductor wafer 74 that is not in contact with the adhesive 72 is bonded to the dicing tape (support) 76. At this time, the dicing tape 76 supplements the strength of the semiconductor wafer 74 after being peeled off, and serves to facilitate handling.
  • a die cinder frame (fixing tool) 78 is provided around the dicing tape 76.
  • the dicing frame 78 prevents the dicing tape 76 from loosening.
  • the hole of the support plate 70 also supplies a solvent that dissolves the adhesive 72, dissolves the adhesive 72, and then removes the support plate 70.
  • the adhesive 72 is not completely removed and remains on the semiconductor wafer 74. Residual adhesive 72 is shown as residual adhesive 73.
  • the semiconductor wafer 74 having the remaining adhesive 73 corresponds to the workpiece 18.
  • the object to be processed 18 is subjected to the above-described steps, and a dicing tape 76 is disposed on the outer periphery thereof.
  • the dicing tape 76 has a power S that deteriorates due to adhesion of a solvent (treatment liquid) used for removing the residual adhesive 73.
  • the deterioration of the dicing tape 76 causes slack, which can cause cracking of the semiconductor wafer 74 that has been thinned and reduced in strength. Therefore, it is necessary to remove the residual adhesive 73 on the semiconductor wafer 74 without deteriorating the dicing tape 76. That is, it is required to remove the solvent only on the surface of the semiconductor wafer 74.
  • the processing apparatus 100 according to the present embodiment is used to remove the residual adhesive 73 on the semiconductor wafer 74, as described above, the solvent is scattered in addition to the semiconductor wafer 74 (object 18). It is possible to perform a process that suppresses the above. Therefore, the remaining adhesive 73 can be removed satisfactorily without deteriorating the dicing tape 76.
  • the surface that is not desired to be processed can be satisfactorily processed on the surface that is desired to be processed while suppressing the scattering of the processing liquid.
  • a processing device that can be performed can be provided.
  • the force described for the case where the object 18 is the semiconductor wafer 74 provided on the dicing tape 76 is not limited to this.
  • a processing apparatus that is effective for the present embodiment can be used.
  • the case where the planar shape of the surface treatment jig 20 is circular is illustrated, but the shape of the surface treatment jig 20 is not limited to this.
  • the surface treatment jig 70 will be described with reference to FIG. 5 as a modification of the surface treatment jig 20.
  • FIG. 5 is a plan view in the case where the surface treatment jig 70 is positioned above the surface to be treated 18a. Other configurations are the same as those of the surface treatment jig 20.
  • the surface treatment jig 70 has a rectangular shape and a planar shape with rounded corners.
  • the surface treatment jig 70 is provided with a first through hole 76 for supplying a treatment liquid to the surface to be treated 18a and a second through hole 78.
  • the processing liquid is supplied to the processing section through the first through hole 76 and the processing liquid supplied through the second through hole 78 is collected.
  • the opening shape, the number, and the arrangement of the first through hole 76 and the second through hole 78 are not limited to those shown in FIG.
  • the longitudinal force of the surface treatment tool 70 is preferably substantially the same as the radius of the surface to be treated 18a.
  • the entire surface to be processed can be processed.
  • the surface treatment jig 70 may be provided with a protruding portion on the surface facing the surface to be treated 18a, similarly to the surface treatment jig 20.
  • the surface treatment jig 70 shows the case where the planar shape is rectangular. The surface treatment jig 70 and the treatment target are supplied to the treatment surface 18a and the collected treatment liquid is recovered. The shape is not limited as long as the treatment liquid can be held between the surface 18a.
  • the processing apparatus includes a surface processing jig that is maintained separately from the target object, a processing liquid supply unit, and a recovery unit, so that the processing surface and the opposing surface are provided. It is possible to hold the processing liquid during this period, and it is possible to realize processing in which scattering of the processing liquid to other than the surface to be processed is suppressed.
  • the processing apparatus which is effective in the present invention can achieve various processes such as cleaning and coating with a processing solution with a force S.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)

Abstract

Cette invention concerne un appareil de traitement (100) comprenant une table de montage (10) sur laquelle un objet (18) à traiter est monté, un jig de traitement de surface (20) pour traiter sur sa surface (18a) l'objet (18) à traiter avec un liquide de traitement, des moyens d'alimentation (30) pour transmettre le liquide de traitement au jig de traitement de surface (20), des moyens de récupération (40) pour récupérer le liquide de traitement transmis au jig de traitement de surface (20), et des moyens de maintien d'espace (50) pour maintenir le jig de traitement de surface (20) dans un état espacé de la surface de traitement (18a). Le jig de traitement de surface (20) a une surface opposée (22a), qui fait face à la surface de traitement (18a), et comprend une partie de traitement pour maintenir le liquide de traitement transmis depuis les moyens d'alimentation (30) vers une partie entre la surface opposée (22a) et la surface de traitement (18a) pour traiter la surface de traitement (18a). La structure ci-dessus peut concerner un appareil de traitement et un jig de traitement de surface qui peuvent traiter la surface de traitement avec le liquide de traitement tout en supprimant la diffusion du liquide de traitement vers la surface autre que la surface de traitement.
PCT/JP2007/069746 2006-11-30 2007-10-10 Appareil de traitement et jig de traitement de surface WO2008065809A1 (fr)

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JP2006324438A JP5038695B2 (ja) 2006-11-30 2006-11-30 処理装置および表面処理治具
JP2006-324438 2006-11-30

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JP2010530638A (ja) * 2007-06-19 2010-09-09 ラム リサーチ コーポレーション 制御されたメニスカス内における液体の分離を維持するためのシステム、方法、及び装置
JP2012525704A (ja) * 2009-04-28 2012-10-22 ラム リサーチ コーポレーション 基板を洗浄するための装置及びシステム

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JP5687862B2 (ja) * 2010-08-06 2015-03-25 東京応化工業株式会社 洗浄装置、洗浄方法及び組成物
JP5945094B2 (ja) * 2010-12-03 2016-07-05 東京応化工業株式会社 基板の洗浄方法
US11705351B2 (en) 2017-12-01 2023-07-18 Elemental Scientific, Inc. Systems for integrated decomposition and scanning of a semiconducting wafer

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