WO2008062982A1 - Dispositif à blindage électromagnétique, module radiofréquence possédant ce dispositif et procédé de fabrication du module radiofréquence - Google Patents

Dispositif à blindage électromagnétique, module radiofréquence possédant ce dispositif et procédé de fabrication du module radiofréquence Download PDF

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Publication number
WO2008062982A1
WO2008062982A1 PCT/KR2007/005821 KR2007005821W WO2008062982A1 WO 2008062982 A1 WO2008062982 A1 WO 2008062982A1 KR 2007005821 W KR2007005821 W KR 2007005821W WO 2008062982 A1 WO2008062982 A1 WO 2008062982A1
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WO
WIPO (PCT)
Prior art keywords
conductive
mold member
module
module board
conductive layer
Prior art date
Application number
PCT/KR2007/005821
Other languages
English (en)
Inventor
Ki Min Lee
Original Assignee
Lg Innotek Co., Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020060115489A external-priority patent/KR20080046049A/ko
Priority claimed from KR1020060116462A external-priority patent/KR20080046864A/ko
Priority claimed from KR1020060119345A external-priority patent/KR100844790B1/ko
Priority claimed from KR1020060119346A external-priority patent/KR100844791B1/ko
Application filed by Lg Innotek Co., Ltd filed Critical Lg Innotek Co., Ltd
Publication of WO2008062982A1 publication Critical patent/WO2008062982A1/fr

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    • H—ELECTRICITY
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Definitions

  • the embodiments relates to an electromagnetic shielding device, radio frequency
  • mobile telecommunication terminals such as mobile phones, personal digital assistants (PDAs) and smart phones, terrestrial digital multimedia broadcasting terminals, satellite digital multimedia broadcasting terminals, complex terminals mixing multiple functions including communications and broadcasting, etc. are put on the market.
  • PDAs personal digital assistants
  • satellite digital multimedia broadcasting terminals satellite digital multimedia broadcasting terminals
  • complex terminals mixing multiple functions including communications and broadcasting, etc. are put on the market.
  • These mobile terminals are developed for multi-function and downsizing.
  • the parts in the mobile terminals such as RF elements, integrated circuit (IC) chips, etc. are being modularized.
  • EMC electromagnetic interference
  • EMI electromagnetic interference
  • the electromagnetic energy generated from the electronic appliances radiates along the path of a given medium, and thus causes interference to other appliances.
  • the electromagnetic noise or conducted emission, which is introduced from the outside, causes interference to the electronic appliances.
  • This EMI serves as a fector that causes functional interference to the electronic elements or chip parts or that causes malfunction to the electronic appliances. Disclosure of Invention Technical Problem
  • An embodiment provides an electromagnetic shielding device functioning not only to protect chip parts on a board but also shield electromagnetic waves, radio frequency (RF) module having the same, and method of manufecturing the radio frequency module.
  • RF radio frequency
  • An embodiment provides an electromagnetic shielding device, which is directly or indirectly connected between a conductive layer formed on top of a mold structure and the ground terminal of a board, and thereby effectively interrupts electromagnetic interference (EMI), and method of manuiacturing the same.
  • EMI electromagnetic interference
  • An embodiment provides an electromagnetic shielding device comprising: a mold member protecting a chip parts on a module board; a conductive layer on the mold member; and a conductive connector connecting the conductive layer to a ground part of the module board.
  • An embodiment provides a radio frequency module comprising: a module board comprising a ground pari; a chip parts on the module board; a mold member protecting the chip parts on the module board; a conductive layer on the mold member; and a conductive connector connecting the conductive layer to the ground part of the module board.
  • An embodiment provides a method of manuiacturing a radio frequency module, comprising the steps of: disposing a chip parts on a module board; forming a mold member on the module board; forming at least one conductive hole, which is conducted with a ground part of the module board, in the mold member; and forming a conductive layer on the mold member such that a conductive connector of the conductive layer is connected to the ground part of the module board through the conductive hole.
  • An embodiment provides a method of manuiacturing a radio frequency module, comprising the steps of: disposing a chip parts on a module board; connecting ground parts of adjacent modules to each other using a conductive connector; forming a mold member on the module board in order to protect the chip parts on the module board; cutting at least a part of the mold member on the module board so as to expose the conductive connector; and forming a conductive layer on the mold member so as to connect the conductive layer with one end of the conductive connector.
  • An embodiment provides a method of manuiacturing a radio frequency module, comprising the steps of: disposing a ground part on a module board; forming a mold member in order to protect a chip parts on the module board; cutting at least a part of the mold member on the module board so as to expose the ground part; and forming a conductive layer on the mold member and on the module board so as to connect the conductive layer with the ground part.
  • the EMI associated with EMC can be minimized.
  • the process of manuf ⁇ cturing the RF module can be simplified. As a result, the production cost of final products is reduced to increase price competitiveness.
  • the RF module can be downsized by a structure of packaging the mold member and the conductive layer, so that a mobile terminal can be made compact.
  • a structure of grounding the conductive layer formed on the mold member can be simply realized in the RF module.
  • a separate wire bonding process is not required.
  • a function of shielding RF between parts of the mobile terminal can be improved.
  • FIG. 1 a side sectional view illustrating a radio frequency (RF) module according to a first embodiment
  • FIGS. 2 to 6 are views illustrating a method of manuf ⁇ cturing an RF module according to a first embodiment
  • FIG. 7 is a perspective view illustrating the state before a first RF module according to a first embodiment is cut
  • FIG. 8 a side sectional view illustrating an RF module according to a second embodiment
  • FIGS. 9 to 13 are views illustrating a method of manufecturing an RF module according to a second embodiment
  • FIG. 14 a side sectional view illustrating an RF module according to a third embodiment
  • FIGS. 15 to 20 are views illustrating a method of manuf ⁇ cturing an RF module according to a third embodiment
  • FIG. 21 is a perspective view illustrating the RF module of FIG. 16;
  • FIG. 22 a side sectional view illustrating an RF module according to a fourth embodiment
  • FIGS. 23 to 28 are views illustrating a method of manuf ⁇ cturing an RF module according to a fourth embodiment
  • FIG. 29 is a perspective view illustrating the RF module of FIG. 24. Best Mode for Carrying Out the Invention
  • FIGS. 1 to 7 are views illustrating a radio frequency (RF) module according to a first embodiment.
  • FIG. 1 is a side sectional view illustrating an RF module according to a first embodiment.
  • the RF module 100 comprises a module board 110, chip parts
  • the module board 110 includes a ceramic printed circuit board made of, for instance, high-temperature co-fired ceramic (HTCC) or low-temperature co-fired ceramic (LTCC), or a common printed circuit board (PCB), and can be implemented as a single-layered printed circuit board or a multi- layered module board.
  • HTCC high-temperature co-fired ceramic
  • LTCC low-temperature co-fired ceramic
  • PCB common printed circuit board
  • the module board 110 includes, but not limited to, a wiring pattern 112 and a ground part 114, which are designed in advance.
  • the wiring pattern 112 is used not only to mount the chip parts 121 and 123 but also to connect the chip parts 121 and 123 to each other.
  • the ground part 114 is a ground terminal of the module board 110, and includes at least one ground structure selected from among a ground via, a ground via- hole, a ground through-hole, a ground pattern, and a ground pin, so that modifications, additions and substitutions thereof can be made without departing from the scope and spirit of the embodiment.
  • This ground part 114 can be formed on an outer circumference or at an arbitrary position of the module board 110, and thus is not limited to a specific position.
  • the chip parts 121 and 123 can be disposed on a top layer and/or in an inner layer of the module board 110, and be mounted by, for instance, surlace mounting technology (SMT).
  • Each of the chip parts 121 and 123 includes a device that can be mounted on the module board 110, for example, a part such as a multi-layer ceramic capacitor (MLCC), a chip inductor, a chip resistor and a chip switch, a circuit element such as a diode and an inductor, a filter, an integrated module, a printed resistor, a thin film condenser, a flash memory, and so on.
  • the type or number of the mounted chips can be changed or added depending on the characteristics of the RF module.
  • the chip parts 121 is an integrated circuit (IC) part
  • the chip parts 123 is a passive element.
  • the chips parts 121 and 123 are disclosed for illustrative purposes.
  • the chip parts 121 and 123 can be connected by, but apparently not limited to, wire bonding using wires 125, die bonding, or flip bonding. It is apparent that the chip parts can be mounted by another method. Also, the RF module can be configured of wireless chip parts. At this time, the mold member 130 can be reduced in height.
  • the mold member 130 can be realized by, but not limited to, any one of epoxy molding compound, polypheny lene oxide, epoxy sheet molding (ESM), and silicon. This mold member 130 can be molded beyond a thickness of each chip prats 121 or 123 or a height (between about 100 ⁇ m and about 600 ⁇ m) of each wire. Further, in the RF module for the mobile terminal, the mold member can be formed at, but not limited to, a thickness between about 700 ⁇ m and about 1000 ⁇ m.
  • the mold member 130 includes at least one conductive hole 132.
  • the conductive hole 132 functions as a passage that is connected with the ground part 114, and can be formed at a position corresponding to part or whole of the ground part 114.
  • the conductive hole 132 can be formed at a position at which the ground via or the ground via-hole of the ground part is located.
  • the ground via or the ground via-hole can be formed on the top layer or in inner layer of the module board 110.
  • the conductive hole 132 can be formed so as to be perpendicular or inclined to the mold member 130.
  • the conductive hole 132 can have a circular or elliptic cylinder, a polygonal cylinder (e.g. a quadrilateral cylinder), or a shape inclined at a predetermined angle.
  • the conductive hole 132 can have the shape of a plate by cutting out the mold member at a predetermined width.
  • the conductive layer 140 is an electromagnetic shielding layer, and is formed on the mold member 130 at a predetermined thickness using conductive material or conductive compound material.
  • the conductive layer 140 includes a conductive connector 142 having the shape of a protrusion.
  • the conductive connector 142 is formed in the conductive hole 132, and thus is electrically connected with an upper end of the ground part 114 of the module board 110.
  • This conductive layer 140 is electrically grounded to the ground part 114.
  • the conductive connector 142 can be selectively connected to the ground part 114 of the top or inner layer of the module board 110 through the conductive hole 132.
  • the conductive layer 140 and the conductive connector 142 can be formed of materials, which are equal to or different from each other.
  • the RF module 100 has an electromagnetic shielding structure using the conductive layer 140 and the conductive connector 142, and thus effectively interrupts harmful electromagnetic waves, which are generated from the chip parts 121 and 123 or are introduced from the outside into the chip parts 121 and 123. Hence, the RF module 100 minimizes EMI between other parts or modules.
  • FIGS. 2 to 7 are views illustrating a method of manuiacturing an RF module according to the first embodiment.
  • the chip parts 121 and 123 are mounted on the module board
  • the module board 110 includes the wiring pattern 112 and the ground part 114, which are designed in advance.
  • the chip parts 121 and 123 can be mounted on the wiring pattern 112 by, but not limited to, wire bonding using the wires 125, die bonding, or flip bonding.
  • the mold member 130 is molded on the module board 110.
  • the mold member 130 is formed beyond the height of each chip 121 or 123 mounted on the module board 110 or the height of each wire, and thus protects the chip parts 121 and 123.
  • the method of forming the mold member 130 can make use of transfer molding using epoxy molding compound, compression molding using epoxy sheets, molding using liquid molding material (e.g. silicon) and heat treatment, or injection molding. It is apparent that the embodiment is not limited to these molding materials and method, and thus other molding materials and methods can be used.
  • the mold member can be formed on a selected region, for example regions for the chip parts, or an entire region of the module board.
  • one or more conductive holes 132 are formed in the mold member 130.
  • the conductive hole 132 is formed in the mold member 130 using equipment such as a drilling machine 134, a milling machine, or a cutting machine.
  • the conductive hole 132 goes through the mold member 130, and then reaches the upper end 116 of the ground part 114 of the module board 110.
  • the conductive hole 132 has a diameter greater or less than that of the ground part 114, and a depth from the top surface of the mold member 130 to the top or inner layer of the module board 110.
  • This conductive hole 132 can be formed at a position corresponding to the position of the ground part 114 using coordinate information of the ground part 114.
  • a conductive solvent 140A is printed, and then the module board is vacuumized.
  • the conductive solvent 140A is pushed and printed on the top suriace of the mold member 130 by a squeegee 145.
  • the conductive layer 140 is formed on the top suriace of the mold member 130 at a predetermined thickness (for instance, between about 15 ⁇ m and about 100 ⁇ m).
  • the conductive solvent 140A can include a conductive epoxy type solvent, a conductive paste type solvent, a conductive gel type solvent, or a mixture thereof.
  • the conductive solvent can include a mixture of conductive metal such as silver, copper or nickel, and a synthetic resin.
  • the conductive solvent is not limited to these materials.
  • the printing of the conductive solvent includes squeeze printing, or screen printing.
  • the conductive solvent 140A flows into the conductive hole 132 of the mold member 130, and arrives at the upper end of the ground part 114.
  • the module board 110 is vacuumized in a vacuum chamber. Thereby, air remaining between the conductive hole 132 and the conductive solvent can be eliminated. As a result, electrical connectivity between the conductive solvent inserted into the conductive hole 132 and the ground part 114 can be improved.
  • heat is applied to the conductive solvent (for instance, at a temperature from 100 to 200 0 C) in the process of curing the conductive solvent, so that the conductive layer 140 is formed.
  • the conductive connector 142 can be selectively connected with any one of the ground via, the ground via-hole, the ground through-hole, and the ground pattern. Further, the conductive connector 142 can be formed in a shape corresponding to the shape of the conductive hole 132, such as a cylinder, a shape inclined at a predetermined angle, a plate having a predetermined area.
  • FIG. 7 is a perspective view illustrating a module board completing the process of FIG. 5.
  • the mold member 130 is formed on the module board 110, and the conductive layer 140 is formed on the mold member 130.
  • the conductive connector 142 of the conductive layer 140 passes through the mold member 130, and is connected to the ground part 114 of the module board 110.
  • the conductive layer 140 and the conductive connector 142 function as a shielding mold structure, and thus interrupt the EMI of the chip parts 121 and 123 which is associated with the EMC.
  • the module board is cut in unit of a module.
  • the module board 110 is cut into unit module boards.
  • the module board 110 is subjected to full-cutting, so that the RF module 100 as in FIG. 1 is completed.
  • the unit of a module is a function unit of the RF module
  • the unit module boards are a each board of RF modules.
  • the protective layer for the parts is formed on the module board 110 using the mold member 130, and then the shielding conductive layer 140 is formed on the mold member 130 such that part of the shielding conductive layer 140 is electrically grounded with the ground part 114 of the module board 110.
  • the harmful electromagnetic waves can be interrupted without a separate grounding process.
  • FIGS. 8 to 13 are views illustrating an RF module according to a second embodiment. A description of the second embodiment, which is identical to that of the first embodiment, will not be repeated.
  • FIG. 8 is a side sectional view illustrating an RF module according to the second embodiment.
  • the RF module 200 comprises a module board 210, chip parts
  • the module board 210 includes a wiring pattern 212 and a ground part 214, which are designed in advance.
  • the chip parts 221 and 223 can be connected by, but not limited to, wire bonding using wires 225, flip bonding, or die bonding.
  • the module board 210 includes at least one ground part 214.
  • the ground part 214 can include a via, which passes through the module board 210, or a ground pattern. That is, the ground part 214 can selectively use a ground via, a ground via-hole, a ground through-hole, and a ground pattern on a top layer or in an inner layer of the board.
  • the suriace of the module board 210 positioned at least one of the ground part 214 is formed at, but not limited to, a depth D, which is lower than the top layer by at least one layer or two layers.
  • the conductive layer 240 includes a plated suriace layer for electromagnetic shielding, and covers a suriace of the mold member 230 and the a part of the module board 210.
  • a sidewall 241 of the conductive layer 240 is formed on a side suriace of the mold member 230 in part or in whole.
  • An end 242 of the conductive layer 240 extends from the sidewalls 241 of the conductive layer 240 to the module board 210.
  • the end 242 of the conductive layer 240 is directly connected to at least one ground part 214, to serve as a conductive connector of the conductive layer 240, so that the conductive layer 240 is electrically grounded.
  • FIGS. 9 to 13 are views illustrating a method of manuiacturing an RF module according to the second embodiment.
  • the chip parts 221 and 223 are connected on the module board 210 by wire bonding using wires 225, flip bonding, or die bonding.
  • the module board 210 includes at least one ground part 214.
  • the ground part 214 can selectively use a ground via, a ground via-hole, a ground through hole, and a ground pattern.
  • a molding process is performed using the mold member 230.
  • the mold member 230 is molded beyond a height of each chip 221 or 223 or each wire 225 on the module board 210 so as to protect the chip parts 221 and 223.
  • the method of forming the mold member 230 can include transfer molding using epoxy molding compound, compression molding using epoxy sheets, molding using liquid molding material and heat treatment, or injection molding.
  • the module board can be free from a half-cutting process, which will be described below.
  • a half-cutting process is performed between a unit module boards of the module board 210.
  • the half-cutting process refers to a process that half- cuts the border area of the unit module board, and more specifically performs cutting from the suriace of the mold member 230 to a part of the layers of the module board 210, thereby forming a recess 232.
  • the recess 232 is deep enough to expose the ground part 214 of the module board 210.
  • the depth D of the suriace 216 of the module board 210 of the region cut the mold momber 230 is about one-third the thickness of the module board 210, or can be lower than the top layer by a predetermined number of layers
  • the upper end or the side of the ground part 214 is exposed on the module board 210 by a difference in material characteristic between the module board 210 and the ground part 214.
  • a process of plating a shielding suriace is performed using the conductive layer 240.
  • the conductive layer 240 is formed on the suriace of the mold member 230 and the module board 210 of the region cut the mold member 230.
  • the conductive layer 240 can selectively employ, but not limited to, sputtering, evaporating, electro-plating or electroless plating.
  • the conductive layer 240 can include at least one metal layer.
  • the conductive layer 240 can be formed on the suriace of the mold member 230 using one or more of conductive materials such as copper (Cu), titan (Ti), nickel (Ni) and gold (Au).
  • the conductive layer 240 can be formed on the suriace of the mold member 230 by sequentially stacking a Cu layer, a Ni layer and a Au layer at a predetermined thickness (for instance, about 15 ⁇ m to 25 ⁇ m).
  • the Cu layer can have a thickness of about 10 ⁇ m to 15 ⁇ m, the Ni layer can have a thickness of about 5 ⁇ m to 10 ⁇ m, and the Au layer may can a thickness of about 0.1 ⁇ m to 0.5 ⁇ m.
  • the Cu layer effectively shields the RF, the Ni layer improves the bondability between the layers, and the Au layer prevents the conductive layer from being damaged by impact or friction.
  • the conductive layer 240 can be formed of a conductive epoxy type solvent, a conductive paste type solvent, a conductive gel type solvent, or a mixture thereof.
  • the conductive solvent can include a mixture of conductive metal, such as silver, copper and nickel, and synthetic resin.
  • the end 242 of the conductive layer 240 is directly connected to the ground part 214 of the module board 210, so that the conductive layer 240 is electrically grounded to prevent the EMI associated with the EMC.
  • the module board 210 is cut in unit of a module. A full-cutting process is performed on a border area between the unit module boards of the module board 210, so that the unit RF module 200 as in FIG. 8 is completed.
  • the protective layer for the parts is formed using the mold member 230, the cutting process is performed to expose the ground part on the module board 210, and the conductive layer 240 is directly grounded with the ground part 214 through a packaging process for forming the shielding conductive layer 240, so that the harmful electromagnetic waves are blocked by a simple process.
  • FIGS. 14 to 21 are views illustrating an RF module according to a third embodiment.
  • FIG. 14 is a side sectional view illustrating an RF module according to the third embodiment.
  • the RF module 300 comprises a module board 310, chip parts
  • the module board 310 is implemented as a single-layered board or a multi-layered board, and includes a wiring pattern 312, which is designed in advance and has chip parts 321 and 323 mounted thereon.
  • the module board 310 includes at least one ground part 314.
  • the ground part 214 can include a ground pattern of the wiring pattern 312.
  • the conductive connector 330 connects the ground part 314 with the conductive layer 340.
  • one end 351 of the conductive connector 350 is bonded to the ground part 314, and the other end 352 of the conductive connector 350 is connected to a sidewall 341 of the conductive layer 340.
  • the conductive connector 350 is a metal structure, has the shape of a plate bent at a predetermined curvature (e.g. C shape, inverse V shape or inverse U shape), and is formed of metal such as Au, Cu or Al. It is apparent that the shape and material of the conductive connector 350 is not limited in the third embodiment, and thus can be changed without departing from the scope and spirit of the invention.
  • the other end 352 of the conductive connector 350 is exposed to a side suriace of the mold member 330.
  • the conductive connector 350 is cut together. Thereby, the other end 352 of the conductive connector 350 is exposed on the same plane as the side suriace of the mold member 330.
  • the conductive layer 340 can be a conductive suriace layer for electromagnetic shielding, and can be formed on the top and side surfaces of the mold member 330, and/or a part of the module board 310.
  • the other end 352 of the conductive connector 350 which is exposed to the side surface of the mold member 330 is electrically connected to the sidewall 341 of the conductive layer 340, so that the conductive layer 340 is electrically grounded. Further, in the case in which the conductive connector 350 is higher than the mold member 330, a contact area between the conductive connector 350 and the conductive layer 340 can be increased.
  • An electromagnetic shielding structure using the conductive layer 340 and the conductive connector 350 interrupts harmful electromagnetic waves, which are generated from the chip parts of the RF module 300 or are introduced from the outside.
  • FIGS. 15 to 21 are views illustrating a method of manufecturing an RF module according to the third embodiment.
  • the wiring pattern 312 and the ground part 314 are formed on the module board 310, and the chip parts 321 and 323 are mounted on the module board 310. Further, the ground part 314 can be formed as a ground pattern on on the module board 310.
  • one end 351 of the conductive connector 350 is connected to the ground part 314 of the module board 310.
  • the conductive connector 350 interconnects the ground parts 314 of the unit module boards, and is interposed between the adjacent unit module boards of the module board 310.
  • This conductive connector 350 can have the shape of a plate bent at a predetermined curvature (e.g. C shape, inverse V shape or inverse U shape), and is formed of metal such as Au, Cu or Al. It is apparent that the shape and material of the conductive connector 350 can be changed.
  • a predetermined curvature e.g. C shape, inverse V shape or inverse U shape
  • the conductive connector 350 can be changed in the shape or arrangement so as to be able to increase a cross section thereof, or so as to be able to increase or decrease a height of the center thereof.
  • the conductive connector 350 is mounted by flip bonding. In the case in which the chip parts 323 is mounted on the module board 310 without wire bonding, a separate wire bonding process is not required.
  • the mold member 330 is molded beyond a height of each chip parts, each wire 325, or the conductive connector 350, and protects the chip parts 321 and 323.
  • a half-cutting process is performed between the unit module boards of the module board 310.
  • the boarder area between the unit module boards is half-cut at a predetermined width W2.
  • the boarder areas is formed with a recess 332.
  • the half-cutting process can cut the module board at such a depth that the conductive connector 350 is exposed or cut or in a manner such that the module board 310 can be exposed. At this time, the other end 352 of the conductive connector 350 is exposed to the side surface of the mold member 330 on the module board 310.
  • a process of plating a shielding suriace is performed using the conductive layer 340.
  • the conductive layer 340 is formed on the top and side surfaces of the mold member 330 and the suriace of the module board 310 of the recess 332.
  • the sidewall of the conductive layer 340 is electrically connected to the other end 352 of the conductive connector 350.
  • the conductive layer 340 is electrically grounded through the opposite ends 351 and 352 of the conductive connector 350, so that it can interrupt the EMI associated with the EMC.
  • the conductive layer 340 can selectively employ sputtering, evaporating, electro-plating or electroless plating. Further, in consideration of bondability with respect to the mold member 330 and rigidity of a conductor, the conductive layer 340 can include at least one metal layer. For example, at least one layer of the conductive layer 340 can be formed on the suriace of the mold member 330 using one or more of conductive materials such as Cu, Ti, Ni and Au.
  • the module board 310 is cut in unit of a module.
  • the conductive layer 340 on the suriace of the module board 310 of the recess 332 is cut first, and then the module board 310 is cut at a unit size.
  • the conductive layer 340 and the module board 310 are sequentially cut step by step.
  • the conductive layer 340 and the module board 310 may be cut at a time using a full-cutting process.
  • the protective layer for the parts is formed using the mold member 330, and then the conductive connector 330 is connected to the shielding conductive layer 340 through the mold member 330, so that the conductive layer 340 is grounded with the ground part 314 of the module board 310 through the conductive connector 330. As a result, the harmful electromagnetic waves are interrupted.
  • FIGS. 22 to 29 are views illustrating an RF module according to a fourth embodiment. A description of the fourth embodiment, which is identical to that of the first embodiment, will not be repeated.
  • FIG. 22 is a side sectional view illustrating an RF module according to the fourth embodiment.
  • FIGS. 23 to 29 are views illustrating a method of manuiacturing an RF module according to the fourth embodiment.
  • the RF module 400 comprises a module board 410, chip parts 421 and 423, a mold member 430, a conductive layer 440, and a conductive connector 430.
  • the module board 410 includes a wiring pattern 412 and a ground part 414, which are designed in advance.
  • the wiring pattern 412 is mounted with chip parts 421 and 423.
  • the ground part 414 can be formed as a ground pattern of the wiring pattern 412.
  • the ground part 414 can selectively use a ground via, a ground via-hole, a ground through-hole, and a ground pattern.
  • the conductive connector 430 can use at least one of a single bonding wire, a double bonding wire, and a ribbon bonding wire, includes a metal material such as Au, Cu or Al, and is not limited to the shape or material of the wire.
  • a second end of the conductive connector 430 is exposed to a side suriace of the mold member 430.
  • the conductive connector 430 is cut together. Thereby, the second end of the conductive connector 430 is exposed on the same plane as the side suriace of the mold member 430.
  • the conductive layer 340 is a conductive suriace layer for electromagnetic shielding, and is formed on the top and side surfaces of the mold member 430.
  • a sidewall 441 of the conductive layer 440 is electrically connected with the conductive connector 430, which is exposed to the side suriace of the mold member 430, so that the conductive layer 440 is electrically grounded.
  • the conductive connector 430 is higher than the mold member 430, a contact area between the conductive connector 430 and the conductive layer 440 can be increased.
  • An electromagnetic shielding structure using the conductive layer 440 and the conductive connector 430 protects the mounted parts of the RF module 400, and interrupts harmful electromagnetic waves, which are generated from the chip parts or are introduced from the outside.
  • the wiring pattern 412 and the ground part 414 are formed on the module board 410.
  • the ground part 414 can include a ground pattern or be selected from among a ground via, a ground via-hole, a ground through-hole.
  • the ground part 414 is formed on the module board 410.
  • the ground parts 414 of the adjacent unit module boards are connected to each other by the conductive connector 430 having a wire shape.
  • the conductive connector 430 is a wire interconnecting two modules, can selectively use one of a single bonding wire, a double bonding wire, and a ribbon bonding wire, includes a metal material such as Au, Cu or Al.
  • the process of bonding the conductive connector 430 can be performed in the same process as the wire bonding process of the chip parts 421 and 423, and thus does not require another additional process.
  • the conductive connector 430 can be connected to the ground parts of the adjacent unit module boards of the module board 310 in a diagonal direction and/or in a linear direction.
  • the conductive connector 430 can be changed in the shape or arrangement so as to be able to increase a cross section thereof (for instance, a cross section of the wire).
  • the cross section of the conductive connector can be increased in the case in which the wire is connected in a diagonal direction, compared to the case in which the wire is connected in a linear direction.
  • height and length of the conductive connector 430 can be changed for electrical characteristics.
  • a molding process is performed using the mold member 430.
  • the mold member 430 is molded beyond a height of each chip parts, each wire, or the conductive connector on the module board, and protects the mounted chip parts 421 and 423.
  • a half-cutting process is performed between the unit module boards.
  • a space between the adjacent unit module boards is cut at a predetermined width W3, thereby forming a recess 432.
  • the recess 432 can have such a depth that the conductive connector 450 is exposed or cut.
  • a second end (i.e. cutting end) of the conductive connector 450 is exposed to a side suriace of the mold member 430.
  • a process of plating a shielding suriace is performed using the conductive layer 440.
  • the conductive layer 440 is formed on the top suriace of the mold member 430 and the module board 410 of the recess 432.
  • the conductive layer 440 can selectively employ sputtering, evaporating, electro-plating or electroless plating.
  • a sidewall 441 of the conductive layer 440 is electrically connected to the second end (i.e. cutting end) of the conductive connector 450.
  • the conductive layer 340 is electrically grounded, and thus interrupts the EMI associated with the EMC.
  • the module board is cut in unit of a module.
  • the cutting process can be performed step by step in a manner such that the conductive layer 440 is first cut on the suriace of the module board 410, and then the module board 410 is cut.
  • the conductive layer and the module board may be cut using a full- cutting process.
  • the protective layer for the parts is formed using the mold member 430, and then the conductive connector 450 having a wire shape is connected to the shielding conductive layer 440 outside the mold member 430, so that the conductive layer 440 is grounded with ground part 414 of the module board 410 through the conductive connector 450.
  • the harmful electromagnetic waves of the RF module can be interrupted.
  • the conductive layer grounding structures described in the first through fourth embodiments can be independently or selectively used.
  • the structure of shielding the harmful electromagnetic waves of the RF module can be applied to modules of mobile telecommunication terminals, terrestrial digital multimedia broadcasting terminals, satellite digital multimedia broadcasting terminals, complex terminals mixing multiple functions including communications and broadcasting, and so on.
  • the RF module With the electromagnetic shielding device, the RF module having the same, and the method of manuiacturing the RF module according to the embodiments, the RF module can be downsized compared to a shield can/simple mold structure, the chip parts can be protected, and the harmful electromagnetic waves can be effectively prevented from radiating outside.
  • the number of parts can be reduced compared to the RF module using the shield can, and the process of manuiacturing the RF module can be simplified. As a result, the production cost of final products is reduced, and thus price competitiveness can be increased.
  • the height, length and width of the RF module can be reduced by the structure of packaging the mold member and the conductive layer, and thus the volume of the RF module can be reduced. As a result, the final products employing the RF module can be made compact.
  • the conductive layer is formed, and simultaneously the electrical ground is carried out, so that the grounding structure can be simply realized.

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Abstract

L'invention concerne un dispositif à blindage électromagnétique, un module radiofréquence (RF) possédant ce dispositif et un procédé de fabrication du module RF. Le module RF comprend une carte comportant une partie terre, des puces placées sur la carte, un moule protégeant les puces sur la carte du module, une couche conductrice placée sur le moule et un connecteur conducteur raccordant la couche conductrice à la partie terre de la carte du module.
PCT/KR2007/005821 2006-11-21 2007-11-20 Dispositif à blindage électromagnétique, module radiofréquence possédant ce dispositif et procédé de fabrication du module radiofréquence WO2008062982A1 (fr)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
KR1020060115489A KR20080046049A (ko) 2006-11-21 2006-11-21 전자파 차폐장치 및 이를 갖는 고주파 모듈과 고주파 모듈제조방법
KR10-2006-0115489 2006-11-21
KR1020060116462A KR20080046864A (ko) 2006-11-23 2006-11-23 전자파 차폐장치 및 이를 갖는 고주파 모듈과 고주파 모듈제조방법
KR10-2006-0116462 2006-11-23
KR10-2006-0119346 2006-11-29
KR1020060119345A KR100844790B1 (ko) 2006-11-29 2006-11-29 전자파 차폐장치 및 이를 갖는 고주파 모듈과 고주파 모듈제조방법
KR1020060119346A KR100844791B1 (ko) 2006-11-29 2006-11-29 전자파 차폐장치 및 이를 갖는 고주파 모듈과 고주파 모듈제조방법
KR10-2006-0119345 2006-11-29

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US20130043568A1 (en) * 2011-08-16 2013-02-21 In-Sang Song Memory device and a fabricating method thereof
CN104966703A (zh) * 2015-06-04 2015-10-07 苏州日月新半导体有限公司 集成电路封装体及其形成方法
WO2016093040A1 (fr) * 2014-12-12 2016-06-16 株式会社メイコー Module de circuit moulé et son procédé de fabrication
WO2017172119A1 (fr) * 2016-04-01 2017-10-05 Intel Corporation Boîtier de circuit intégré à blindage emi intégré
WO2022178650A1 (fr) * 2021-02-25 2022-09-01 苏政纬 Procédé de fabrication d'une carte de circuit imprimé capable de faire écran aux interférences électromagnétiques

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JPWO2016093040A1 (ja) * 2014-12-12 2017-04-27 株式会社メイコー モールド回路モジュール及びその製造方法
CN104966703A (zh) * 2015-06-04 2015-10-07 苏州日月新半导体有限公司 集成电路封装体及其形成方法
WO2017172119A1 (fr) * 2016-04-01 2017-10-05 Intel Corporation Boîtier de circuit intégré à blindage emi intégré
WO2022178650A1 (fr) * 2021-02-25 2022-09-01 苏政纬 Procédé de fabrication d'une carte de circuit imprimé capable de faire écran aux interférences électromagnétiques

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