WO2008062707A1 - Composition durcissable contenant un composé de thiol contenant un groupement hydroxyle et produit durci obtenu à partir de cette composition - Google Patents
Composition durcissable contenant un composé de thiol contenant un groupement hydroxyle et produit durci obtenu à partir de cette composition Download PDFInfo
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- WO2008062707A1 WO2008062707A1 PCT/JP2007/072171 JP2007072171W WO2008062707A1 WO 2008062707 A1 WO2008062707 A1 WO 2008062707A1 JP 2007072171 W JP2007072171 W JP 2007072171W WO 2008062707 A1 WO2008062707 A1 WO 2008062707A1
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/0275—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with dithiol or polysulfide compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
- C08K5/37—Thiols
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/201—Filters in the form of arrays
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
- G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
Definitions
- Curable composition containing hydroxyl group-containing thiol compound and cured product thereof
- the present invention relates to a curable composition used for coating materials, UV and thermosetting paints, molding materials, adhesives, inks, optical materials, stereolithography materials, printing plate materials, resist materials, recording materials and the like. Among these, it relates to a curable composition particularly suitable as an optical material. More specifically, the present invention relates to a curable composition containing a specific thiol compound and a compound containing an ethylenically unsaturated double bond as components and cured by heat or light.
- compositions that are cured by irradiation with actinic rays such as ultraviolet rays or heat are used as coating materials, UV and thermosetting paints, molding materials, adhesives, inks, resist materials, optical materials, stereolithography materials, printing plates. It is used in a wide range of fields such as materials, dental materials, polymer battery materials, and polymer raw materials.
- the optical material can be used for optical lenses, film coating materials, optical fiber cladding materials, or optical adhesives such as optical fibers and optical lenses.
- the curable composition is mainly composed of a photo or thermal polymerization initiator, a compound having an ethylenically unsaturated double bond that is cured by a polymerization reaction, various additives, and the like.
- Various types are used.
- the curing method by irradiating active energy rays such as ultraviolet rays and electron beams has features such as normal temperature, quick drying, and no solvent, so it is notable from the viewpoint of environmental problems, energy saving, work safety, production cost, etc.
- the demand is increasing year by year.
- the compound constituting the curable composition is selected depending on its photosensitive wavelength and polymerization initiation characteristics.
- the compound or additive having an ethylenically unsaturated double bond is selected depending on the polymerizability and the physical properties of the desired cured product, and these are used in combination as a curable composition.
- curable compositions there is an increasing demand for curable compositions in these applications: those that cure with lower energy, those that cure faster, those that can form finer patterns, and those that have a greater depth of cure. Therefore, those having higher storage performance and higher developability are required.
- JP-A-10-253815 discloses a photopolymerizable composition containing a polyfunctional thiol and an initiator selected from a biimidazole compound, a titanocene compound, a triazine compound and an oxazole compound.
- JP 2000-249822 discloses a photopolymerization initiator containing a compound having a sensitizer, an organic boron complex, and a mercapto group.
- Patent Document 3 JP-A-2004-149755 discloses that a curable composition having excellent photocurability and storage stability by using a secondary or tertiary thiol compound. Thiol compounds that provide compositions are disclosed. However, there is a concern that developability may be reduced due to an increase in aliphatic groups. Patent Document 1: Japanese Patent Laid-Open No. 10-253815
- Patent Document 2 JP 2000-249822 Koyuki
- Patent Document 3 Japanese Patent Laid-Open No. 2004-149755
- An object of the present invention is to provide a curable resin composition having high sensitivity and at the same time having excellent developability, and further providing a curable composition having excellent storage stability as required. To do.
- the present inventors can solve the above problem by using this as a component of the curable composition in the curable composition. As a result, the present invention has been completed.
- the present invention includes the following items.
- R and R are each independently a hydrogen atom or an alkyl group having 1 to 10 carbon atoms;
- X represents an aliphatic group, a group containing an aromatic ring, or a group containing a heterocyclic ring
- Y represents an ester bond
- k and 1 are each an integer of 1 or more and 20 or less
- n is 0 or 1.
- [0015] [2] X-force of hydroxyl group-containing thiol compound, optionally 2 to 2 carbon atoms; ananolene glycolol having 10 ananolylene groups, diethyleneglycolanol, dipropyleneglycol 2-hydroxyisocyanurate, tris (2-hydroxyethynole) isocyanurate, bisphenol nore A, hydrogenated bisphenol nore A, 2, 2, 1 (4 1 (2 hydroxyethylenole) phenolino) bread, It is a residue of one or more polyfunctional alcohols selected from 4, 4, 1 (9-fluorenylidene) bis (2 phenoxyethanol), polyglycerin polyol and polycarbonate diol. [1 ] The curable composition as described in above.
- the curable composition according to the present invention includes (A) a hydroxyl group-containing thiol compound, (B) a compound having an ethylenically unsaturated double bond, and (C) a polymerization initiator by heat or light.
- A a hydroxyl group-containing thiol compound
- B a compound having an ethylenically unsaturated double bond
- C a polymerization initiator by heat or light.
- the hydroxyl group-containing thiol compound which is one component of the curable composition according to the present invention is represented by the following formula (1).
- R and R are each independently a hydrogen atom or a C 1-10;
- Examples of the alkyl group which represents an alkyl group or an aromatic ring and has 1 to 10 carbon atoms may be linear or branched, include a methyl group, an ethyl group, an n-propyl group, An iso-propyl group, an n-butyl group, an iso-butyl group, a tert-butyl group, an n-hexyl group, an n-octyl group, and the like can be mentioned. Among them, a methyl group or an ethyl group is preferable.
- R and R
- one of 2 is a hydrogen atom and the other is an alkyl group having 1 to 10 carbon atoms, particularly a methyl group or an ethyl group.
- m is 0 or an integer of 1 to 2, and preferably 0 or 1.
- n is 0 or 1, preferably 0.
- X represents an aliphatic group, a group containing an aromatic ring, or a group containing a heterocyclic ring, and is a (k + 1) -valent group.
- a polyfunctional alcohol having 4 to 30 carbon atoms composed of carbon, oxygen and nitrogen. More preferably, it is a residue, more preferably nitrogen is present as an isocyanurate group and oxygen is present as an ether bond or isocyanurate group. Specifically, the residue of the multifunctional alcohol mentioned later is mentioned.
- Aliphatic groups include chain and cyclic groups.
- Y is an ester bond represented by —COO— or —OOC—
- k and 1 are integers of 1 or more and 20 or less, respectively, preferably 2 ⁇ k + l ⁇ 20, more preferably 2 ⁇ k + l ⁇ 15, more preferably 2 ⁇ k + l ⁇ 6.
- the molecular weight of the hydroxyl group-containing phenolic compound is 150 force, et al. 10000, preferably 170 force, et al. 2000, and more preferably ⁇ (or 200 force, et al. 1000).
- hydroxyl group-containing polyfunctional thiol examples include (a) those having an ester structure represented by the following general formula (4).
- the hydroxyl group-containing thiol compound having an ester structure is represented by the following general formula (2 ′)
- a polyfunctional alcohol is used as the alcohol in order to make the compound after the esterification reaction a polyfunctional thiol compound.
- polyfunctional alcohol used. Alkylene glycol having 2 to 10 carbon atoms, diethylene glycol, dipropylene glycol, glycerin, trimethylol propane, pentaerythritol, dipentaerythritol, cyclohexanediol, cyclohexane Xanthodiethanolol, nonole bornene dimethanol, tricyclodecane dimethanol, 1,3,5-trihydroxy 3-methylenopentane, tris-2-hydroxyisocyanurate, tris (2-hydroxyethynole) iso cyanurate, bis Phenolic A, EO-modified Bisphenol A, Hydrogenated Bisphenol A, 2, 2, 1 (4 (2-hydroxyethyl) phenyl) propane, 4, 4, 1 (9 fluorenylidene) bis (2-phenoxyethanol) , Polyglycerin polyol, polycarbonate And polyfunctional alcohols such as polyols containing aromatic
- preferable polyfunctional alcohols include trimethylolpropane, pentaerythritol, dipentaerythritol, glycerin, polyglycerin polyol, and the like.
- mercapto group-containing carboxylic acid examples include thioglycolic acid, thiopropionic acid, 2 mercaptopropionic acid, 3 mercapto 3 phenylpropionic acid, 3 mercaptobutyric acid, 2 mercaptoisobutyric acid, 3 mercaptoisobutyric acid.
- 2 Mercapto 3-methyl butyric acid, 3-mercapto 3-methyl butyric acid, 3-mercapto valeric acid, 3-mercapto 4-methyl valeric acid carboxylic acid can be listed Secondary or tertiary thiol compound from the viewpoint of storage stability It is desirable to use! / Moreover, the thiol compound to be used is not limited to these.
- the compound having an ethylenically unsaturated double bond which is one component of the curable composition according to the present invention, is a compound that can be cured by radical polymerization or cross-linking) reaction and addition reaction.
- Aryl alcohol derivatives aromatic compounds containing ethylenically unsaturated groups, esters of (meth) acrylic acid and polyhydric alcohols, and (meth) acrylates such as urethane (meth) atrelate, various (meth) It is preferable to use one or two or more of these which are preferable to use acrylic oligomer, ethylenically unsaturated group-containing (meth) acrylic copolymer, etc.
- (meth) atalyloyl group means “atallyloyl group and / or methacryloyl group”
- (meth) acryl means “acryl and / or methacryl”
- ( “Meta) tartarate” means “metatalariate and / or attarate” respectively.
- Examples of the aromatic compound containing an ethylenically unsaturated group include styrene, ⁇ -methylstyrene, o-methylstyrene, m-methylstyrene, p-methylstyrene, p-tert-butylstyrene, diisopropenenolebenzene, and o-chloro.
- Atarylates hydroxyethyl (meth) acrylate, hydroxypropyl (meth) atelier
- Phenoxyalkyl (meth) acrylates such as phenoxychetyl (meth) acrylate, 2-hydroxyl 3-phenoxypropinole (meth) acrylate, methoxyethyl (meth) acrylate, ethoxy ethyl (meth) acrylate , Alkoxyalkyls such as propoxychetyl (meth) acrylate, butoxyethyl (meth) acrylate, methoxybutyl (meth) acrylate (Meth) acrylates: Polyethylene glycol mono (meth) acrylate, ethoxyethylene glycol (meth) acrylate, methoxy polyethylene glycol (meth) acrylate, phenoxy polyethylene glycol (meth) acrylate, nourphenoxy polyethylene glycol Polyethylene glycol (meth) acrylates such as nore (meth) acrylate; polypropylene glycol mono (meth) acrylate, methoxy polypropylene glycol (me
- R represents a hydrogen atom or a methyl group, and R represents a straight-chain or
- R represents an oxygen, sulfur or NH group
- A is an aliphatic group
- R is a linear or branched alkyl group having 1 to 10 carbon atoms
- A represents one selected from an aliphatic group, a group containing an aromatic ring, and a group containing a heterocyclic ring, and o represents an integer of 1 or more and 20 or less.
- R represents a hydrogen atom or a methyl group, and R represents an oxygen, sulfur, or NH group.
- A represents an aliphatic group, a group containing an aromatic ring, a group containing a heterocyclic ring,
- P represents an integer of 1 or more and 20 or less
- q represents an integer of !! to 5
- R represents an integer from 0 to 4, and l ⁇ q + r ⁇ 5.
- R, R and R are as defined in the above formula (6), s represents an integer of 2 or more and 20 or less,
- A represents a kind selected from an aliphatic group, a group containing an aromatic ring, and a group containing a heterocyclic ring
- R, R and R are as defined in the above formula (6), t represents an integer of 1 or more and 20 or less,
- u represents an integer of 2 to 12
- A represents an aliphatic group, a group containing an aromatic ring, or a group containing a heterocyclic ring.
- Such urethane (meth) atalylate compounds include, for example, 2- (meth) ataryloxyethyl isocyanate, 4 (meth) acryloylbutyl isocyanate, 5- (meth)
- Ethylenically unsaturated group-containing isocyanate compounds such as (Ataliloyloxymethinole) methyl isocyanate, 3 Ataloyloxyphenyl isocyanate, 4 Atalyloxyphenyl isocyanate, and known alcohols, amines, thiols, etc. It can be obtained by reacting with a compound having active hydrogen.
- the compound having active hydrogen used in the reaction is not particularly limited, but alcohol can be preferably used for the convenience of the reaction.
- 2-hydroxyethyl (meth) a An alkylene glycol having 2 to 10 carbon atoms which may be branched, diethylene glycolanol, dipropylene glycolanol, glycerin, trimethylololepropane, pentaerythritol and dipentaerythritol, cyclohexanediol, cyclohexane
- examples include, but are not limited to, polyglycerin polyol, polycarbonate diol, both-end hydroxypolysilicone, and (meth) acrylic copolymers containing a hydroxyl group.
- a polymerization initiator can be used in the curable composition of the present invention, and for example, a heat or photopolymerization initiator can be used.
- the photopolymerization initiator can cause a polymerization reaction and an addition reaction by irradiation with active energy rays such as ultraviolet rays, visible rays, or electron beams, and a cured product can be obtained.
- active energy rays such as ultraviolet rays, visible rays, or electron beams
- Specific examples of such photopolymerization initiators include 1-hydroxycyclohexyl phenyl ketone, 2,2'-dimethoxy-2-phenylacetophenone, xanthone, fluorene, fluorenone, benzaldehyde, anthraquinone, triphenylamine.
- a cured product can also be obtained by causing a polymerization reaction by heat. That is, a curable composition can be obtained by adding a thermal polymerization initiator, and in some cases, an addition reaction can be caused even without the presence of a thermal polymerization initiator.
- thermal polymerization initiators include azo compounds such as azobisdiphenylmethane, 2,2'-azobisisobutyronitrile, dimethyl-2,2, -azobis (2-methylpropionate), and the like.
- azo compounds such as azobisdiphenylmethane, 2,2'-azobisisobutyronitrile, dimethyl-2,2, -azobis (2-methylpropionate), and the like.
- Disilver oxides, ketone peroxides, hydroperoxides, dialkyl peroxides, peroxyesters and other organic peroxides, persulfates, etc. can be used alone or in combination of two or more. Can be used in combination.
- organic peroxides include benzoyl peroxide, 3, 5, 5 trimethylhexanoyl peroxide, lauroyl peroxide, stearoyl peroxide, otatanyl peroxide, di-n-propyl peroxide carbon.
- Various additives can be added to the curable composition of the present invention in order to give viscosity, operability, cured product characteristics, and the like according to the application.
- a volatile solvent may be added for the purpose of sufficient dispersion of each component, improvement in operability and adhesion during coating, and viscosity adjustment.
- Volatile solvents include alcohols, ketones, esters, etc. .
- examples include noreb, propylene glycol monomethyl ether, isoamyl acetate, ethyl lactate, methyl ethyl ketone, acetone, cyclohexanone, etc., which can be used alone or in admixture of two or more.
- a reactive solvent For example, 2-hydroxyethyl (meth) acrylate, methyl (meth) acrylate, n-butyl (meth) acrylate, cyclohexyl (meth) acrylate, isobornyl (meth) acrylate, N, Examples include N-dimethylaminoethyl (meth) atalylate, N-attalyloylmonorephorin, N-attalyloylbiperidine, N, N-dimethyl (meth) acrylamide, N-vinylpyrrolidone, and N-buluacetoamide. These may be used alone or in combination of two or more, and may be further mixed with the volatile solvent as necessary.
- the hydroxyl group-containing thiol compound of the present invention improves sensitivity by using it in combination with an existing photopolymerization initiator and a compound having an ethylenically unsaturated double bond, and at the same time, good alkali development due to the effect of the hydroxyl group.
- a curable composition having good storage stability can be obtained as required. Accordingly, the curable composition of the present invention is preferably used in combination with a high molecular weight polymer, for example, in applications where good developability is desired without using an oxygen-blocking film. Can be preferably used.
- the polymer is a polymer capable of forming a uniform film having a thickness of 1 micron or more.
- a transparent polymer having a transmittance of 80% or more, more preferably 95% or more in the entire wavelength region of 400 to 700 nm in the visible light region is preferable. Further, those soluble in a developer (solvent or alkaline aqueous solution) are preferred.
- Examples of the high molecular polymer include thermosetting resins, thermoplastic resins, photosensitive resins, and the like.
- polyatalylates for example, polyatalylates, poly ⁇ -alkyl acrylates, polyamides, polyvinyl rubetals, Polyurethanes, polycarbonates, polystyrenes, polybutyl esters, phenol resins, epoxy resins, nopolac resins, alkyd resins, and other polymers and copolymers may be used alone or as a mixture of two or more.
- These high molecular weight polymers may have an ethylenically unsaturated bond group capable of radical polymerization for the purpose of promoting the curing reaction of the curable composition of the present invention or improving the properties of the cured product.
- the polymer it is preferable to use a polymer having excellent heat resistance and stability over time.
- a sensitizer can be used to further increase the sensitivity of the curable composition.
- benzophenone compounds such as benzophenone, 2, 4, 6 trimethylbenzophenone, 4 phenylbenzophenone, 4, 4 bis (dimethylamino) benzophenone, 4, 4 bis (jetylamino) benzophenone, 2, 4 Examples include thixanthone compounds such as jetylthioxanthone, isopropylthioxanthone, 2,4 diisopropylthixanthone, and 2-chlorothixanthone.
- a pigment component can be used as required, and specific examples thereof include the following. Both are indicated by the color index number.
- 40 50 CI Pigment Blue 15, 15: 1 15: 4 15: 6 22 60 64 CI Pigment Green7 36 CI Pigment Brown23 25 26
- CI Pigment Examples include B lack7 and titanium black. These pigments may be used alone or in combination of two or more.
- the curable composition of the present invention does not have an OH group in order to adjust sensitivity and developability.
- a monofunctional or polyfunctional thiol compound may be used in combination.
- trimethylolpropane tris (3-mercaptopropionate) is preferred because polyfunctional thiol compounds are preferred because they can maintain high elastic modulus, surface hardness, solvent resistance and water resistance without significantly impairing the crosslink density.
- a fluorescent whitening agent a surfactant, a plasticizer, a flame retardant, an antioxidant, an ultraviolet absorber, a foaming agent, an antifungal agent, and an antistatic agent.
- Magnetic materials, conductive materials, antibacterial / bactericidal materials, porous adsorbents, fragrances, etc., adhesion improvers such as silane coupling agents and acidic phosphate esters, curing accelerators, dyes, fillers, thixotropic agents, A lubricant may be added.
- the blending ratio of each component in the curable composition of the present invention cannot be generally specified, but is usually as follows.
- the amount of the high molecular weight polymer is generally 100 parts by mass relative to 100 parts by mass of the compound having an ethylenically unsaturated double bond. Is 1 to 300 parts by mass, preferably 50 to 200 parts by mass. If the polymer is added in an amount of more than 300 parts by mass, the solubility of the unexposed part in the developer during UV irradiation may be reduced, and if it is less than 1 part by mass, the composition will not have sufficient sensitivity to light. there is such Rukoto force s.
- the blending amount of the heat or photopolymerization initiator is generally 2 to 400 parts by mass, preferably 20 to 200 parts by mass with respect to 100 parts by mass of the compound having an ethylenically unsaturated double bond.
- the hydroxyl group-containing thiol compound is generally blended so as to be 1 to 200 parts by weight, preferably 2 to 150 parts by weight with respect to 100 parts by weight of the compound having an ethylenically unsaturated double bond. I prefer to do it. If the amount of thiol compound is too small, the initiation of polymerization may not proceed efficiently.If the amount is too large, the polymerization initiation function cannot be improved, and the physical properties of the cured product may be adversely affected! / Preferred les.
- the sensitizer in the curable composition is a compound 1 having an ethylenically unsaturated double bond. It is preferable that the amount is generally 1 to 60 parts by mass, preferably 2 to 50 parts by mass with respect to 00 parts by mass. If the amount of the sensitizer is too small, the sensitization effect may not be obtained. If the amount is too large, the light transmission efficiency may deteriorate due to the light absorption of the sensitizer, and the polymerization initiation efficiency may decrease. .
- the amount of the pigment is generally about 100 to 2000 parts by mass with respect to 100 parts by mass of the compound having an ethylenically unsaturated double bond.
- thermal polymerization inhibitor can be added to the curable composition of the present invention for the purpose of preventing polymerization during storage.
- the thermal polymerization inhibitor include p-methoxyphenol, hydroquinone, force teconole, tert-butinore force teconore, phenothiazine, and methoquinone.
- a polymerization inhibitor may be added for the purpose of preventing gelation due to a polymerization reaction or the like during dispersion of various compositions.
- a dispersion aid can be appropriately added.
- the dispersing aid helps to disperse the pigment and prevents re-aggregation after dispersion.
- extender pigments such as barium sulfate, calcium carbonate, silica, titania, alumina, and aluminum powder may be added.
- the above-mentioned components are mixed using various dispersing means such as a three-roll mill, two-roller reminole, sand minore, attritor, vonoreminore, kneader, and paint shaker. This can be done. Further, a hydroxyl group-containing thiol compound, a compound having an ethylenically unsaturated double bond, or a heat or photopolymerization initiator may be added after dispersing the pigment.
- various dispersing means such as a three-roll mill, two-roller reminole, sand minore, attritor, vonoreminore, kneader, and paint shaker. This can be done.
- a hydroxyl group-containing thiol compound, a compound having an ethylenically unsaturated double bond, or a heat or photopolymerization initiator may be added after dispersing the pigment.
- Formation of a thin film using the curable composition of the present invention includes spray coating, spin coating, roll coating, screen coating, and spread coating on a substrate such as glass, aluminum, and a polyester film such as polyethylene terephthalate (PET). , Coating by dip coating, calendar coating, etc.
- a substrate such as glass, aluminum, and a polyester film such as polyethylene terephthalate (PET).
- PET polyethylene terephthalate
- the curable composition of the present invention contains a small amount of a silicone-based leveling agent or a surfactant such as a fluorine-based surfactant as a leveling agent or an antifoaming agent. May be added.
- the applied curable composition is heated in a hot air oven or hot plate as necessary.
- the volatile solvent is dried under conditions of 60 to 100 ° C for 10 to 30 minutes. If the temperature at this time is too high or the drying time is too long, partial polymerization or cross-linking occurs, so that the solubility of the unexposed area in the developer is lowered, which may cause so-called burn-in. /. It can also be dried under reduced pressure.
- the dried coating film is exposed.
- ultraviolet exposure may be performed through a photomask having a pattern depending on the application.
- a photomask having a pattern depending on the application.
- the pattern can be formed on the substrate by removing the uncured portion.
- the pattern formed by the curable composition of the present invention means a photocured product of the curable composition formed so as to maintain a certain shape on the substrate.
- the resist for photoengraving and the solder Examples include patterns in application fields such as resists, etching resists, color filter resists, holograms, stereolithography, and UV inks.
- the curable composition of the present invention is particularly suitable for a developing resist that forms a fine pattern.
- the substrate used for pattern formation of the present invention includes an inorganic material such as glass and silicon, a metal material such as aluminum, stainless steel, and copper, or a resin such as PET, polyester, polyimide, epoxy resin, polyethylene, and polycarbonate.
- a resin such as PET, polyester, polyimide, epoxy resin, polyethylene, and polycarbonate.
- the adhesion of the curable composition may be improved on the surface of these substrates by oxidation treatment, acid treatment, plasma treatment, discharge treatment or the like. Since the curable composition is on the surface of the substrate, the thickness of the substrate can be arbitrarily set. Further, a resin layer or the like that does not participate in the photoreaction may be provided between the curable composition and the substrate.
- the uncured portion of the curable composition after light irradiation is dissolved and removed.
- a solvent for the developing solution for example, N-methylpyrrolidone, methanol, ethanol, tonolen, cyclohexane, isophorone, cellosonolev acetate, diethylene glyconoresinino ethenore, ethylene Glycono lesino enotenole, xylen, ethino benzene, methino cerero sonoreb, ethino cerero sonoleb, butino cerero sonoleb, propylene glycol eno eno eno eno enole, propylene glycol eno eno eno eno enorea
- organic solvents such as cetate, isoamyl acetate, ethyl acetate, methyl
- alkaline aqueous solution examples include aqueous solutions of inorganic salts such as sodium hydroxide, potassium hydroxide, sodium carbonate and potassium carbonate, and aqueous solutions of organic salts such as hydroxytetramethylammonium and hydroxytetraethylammonium. Can be used. These can be used alone or in combination of two or more.
- inorganic salts such as sodium hydroxide, potassium hydroxide, sodium carbonate and potassium carbonate
- organic salts such as hydroxytetramethylammonium and hydroxytetraethylammonium.
- part means “part by mass”
- % means “% by mass”.
- Synthesis Example 1 Synthesis of pentaerythritol tris (3-mercaptobutyrate) (PE3MB) Pentaerythritol (manufactured by Tokyo Chemical Industry Co., Ltd.) 15 ⁇ Og (110.2 mmol), 3-mercaptobutanoic acid (Sakai Chemical Co., Ltd.) 26.5 g (220.
- PE3MB pentaerythritol tris
- Pentaerythritol manufactured by Tokyo Chemical Industry Co., Ltd.
- 3-mercaptobutanoic acid Sakai Chemical Co., Ltd.
- Dipentaerythritol (manufactured by Tokyo Chemical Industry Co., Ltd.) 19 ⁇ lg (75 mmol), 3-mercaptobutanoic acid (manufactured by Sakai Chemical Co., Ltd.) 54. lg (450. Ommol), p-toluenesulfonic acid monohydrate (Pure Chemical Co., Ltd.) 1. 7 g (9. Ommol) and toluene (Pure Chemical Co., Ltd.) 300 g were charged into a 500 ml three-necked flask and equipped with a Dean-Stark device and a condenser. The contents were heated at an oil bath temperature of 130 ° C while stirring. 1.
- Tris ( 2 -hydroxyethyl) isocyanurate (manufactured by Tokyo Chemical Industry Co., Ltd.) 2 6 ⁇ lg dOOmmol), 3-mercaptobutanoic acid (manufactured by Sakai Chemical Co., Ltd.) 18.0g (150. Ommol), p-toluenesulfur Phosphonic acid monohydrate (manufactured by Junsei Chemical Co., Ltd.) 0.6 g (3. Ommol), toluene (manufactured by Junsei Chemical Co., Ltd.) 300 g are charged into a 500 ml 3-neck flask, Dean-Stark device and condenser Attached.
- THI2MB was a colorless transparent liquid, and the yield was 28%.
- the formula of THI2MB is CHOS and the molecular weight is 465 ⁇ 54.
- Synthesis Example 4 Synthesis of pentaerythritol tris (3-mercaptopropionate) (PE3MP) Pentaerythritol (manufactured by Tokyo Chemical Industry Co., Ltd.) 15.0 g (110.2 mmol), 3-mercaptopropionic acid (Sakai Chemical Co., Ltd.) 2) 4g (220.
- PE3MP pentaerythritol tris (3-mercaptopropionate)
- reaction solution was allowed to cool and neutralized with 200 ml of saturated aqueous sodium hydrogen carbonate solution. Further, the reaction solution was washed twice with 200 ml of pure water, and then dehydrated and dried with anhydrous magnesium sulfate (manufactured by Pure Chemical Co., Ltd.). Next, toluene was distilled off to obtain a mixture of the desired product.
- the obtained PE 3MP was a colorless and transparent liquid, and the yield was 14. lg and the yield was 32%.
- the composition formula of PE3MP is C H O S and the molecular weight is 400.53.
- Synthesis Example 5 Synthesis of pentaerythritol tris (2-mercaptoisobutyrate) (PE3MIB) Pentaerythritol (manufactured by Tokyo Chemical Industry Co., Ltd.) 15 ⁇ 0 g (110.2 mmol), 2-mercaptoisobutanoic acid 26.5 g (220 3 mmol), p-toluenesulfonic acid monohydrate (manufactured by Junsei Chemical Co., Ltd.) 1.
- PE3MIB pentaerythritol tris (2-mercaptoisobutyrate)
- reaction solution was washed twice with 200 ml of pure water, and then dehydrated and dried with anhydrous magnesium sulfate (manufactured by Junsei Chemical Co., Ltd.). Next, toluene was distilled off to obtain a mixture of the desired product.
- the obtained PE3MIB was a colorless and transparent liquid, and the yield was 14.4 g and the yield was 30%.
- the composition formula of PE3MIB is CHO S, molecular weight is 442.61.
- Pentaerythritol (manufactured by Tokyo Chemical Industry Co., Ltd.) 15.0 g (110.2 mmol), 3 mercapto 3 phenylpropionic acid 40. lg (220. 3 mmol), p-toluenesulfonic acid monohydrate 1) 8 g (9.3 mmol) and 35 g of toluene (manufactured by Junsei Chemical Co., Ltd.) were charged into a 200 ml three-necked flask and equipped with a Dean-Stark apparatus and a condenser. The contents were heated at an oil bath temperature of 130 ° C while stirring.
- composition formula of PE3MPP is C H O S and the molecular weight is 628.82.
- Synthesis Example 7 Synthesis of binder resin (EP-1) having a carboxyl group in the side chain
- Epicoat 1004 (Bisphenol A type epoxy resin, Japan Epoxy Resin Co., Ltd., Epoxy equivalent 925) 185 g, Atalinoleic acid 14 ⁇ 4 g, Neutroquinone 0 ⁇ 20 g and Jetylene glycol monoethyl ether acetate (hereinafter referred to as “DGEA”) Abbreviated, Daicel Chemical Co., Ltd.) 197 g was charged and heated to 95 ° C. After confirming that the mixture was uniformly dissolved, 2.0 g of triphenylphosphine was charged, heated to 100 ° C. and reacted for about 30 hours to obtain a reaction product having an acid value of 0.5 mgKOH / g.
- DGEA Jetylene glycol monoethyl ether acetate
- Ajisper PB822 pigment dispersant, Ajinomoto Fine-Techno ( 1) 98 g was charged, and this was dissolved in 113.5 g of propylene glycol monomethyl ether acetate (hereinafter abbreviated as “PMA”; manufactured by Daicel Chemical Industries, Ltd.).
- PMA propylene glycol monomethyl ether acetate
- the compound having an ethylenically unsaturated double bond, the sensitizer, the photopolymerization initiator, the thiol compound, and the leveling agent is added as a solvent to the mouthpiece.
- the curable compositions shown in Tables 1 and 2 were obtained by mixing so that each composition component was uniformly dispersed.
- PEMB represents pentaerythritol tetrakis (3-mercaptobutyrate)
- DPMB represents dipentaerythritol hexa (3-mercaptobutyrate)
- PEMP represents pentaerythritol tetrakis (3-mercaptopropionate).
- the curable compositions of Examples 1 to 7 and Comparative Examples 1 to 4 were spin-coated on a glass substrate (size 100 X 100 X lmm) so that the dry film thickness was about 1 am, and 30 minutes at room temperature. After standing, the solvent was removed by drying at 70 ° C. for 20 minutes to form a resist film. Next, after measuring the thickness of the resist film in advance with a film thickness meter ("SURFCOM130A" manufactured by Tokyo Seimitsu Co., Ltd.), an exposure apparatus incorporating a super high pressure mercury lamp (trade name: Multi Light, manufactured by Usio Electric Co., Ltd.) Using ML-251A / B), the exposure amount was automatically changed stepwise, and the resist film was exposed and cured through a quartz photomask.
- SURFCOM130A a film thickness meter
- an exposure apparatus incorporating a super high pressure mercury lamp trade name: Multi Light, manufactured by Usio Electric Co., Ltd.
- the amount of exposure was measured using a UV integrated light meter (trade name: UIT-150, light receiving unit UVD-S365, manufactured by Usio Electric Co., Ltd.).
- the quartz photomask used was formed with patterns with 5, 7, 10, 30, 50, 70 and 100 ⁇ m lines / spaces.
- the resist film exposed as described above was subjected to developer 9033 (manufactured by Shipley's Far East Co., Ltd.) 25%, which is an alkaline developer containing potassium carbonate, and sodium dodecylbenzene sulfonate 0.03. % Aqueous solution (25 ° C.) and alkaline development for a predetermined time.
- tD 25 seconds
- Remaining film ratio (%) 100 X (film thickness after alkali development) / (film thickness before alkali development) Furthermore, the photocuring operation similar to the above was carried out by changing the exposure amount, and a graph plotting the relationship between the exposure amount and the remaining film rate was created, and the exposure amount at which the remaining film rate reached saturation was determined.
- the line width of the resist formed in the portion where the photomask line / space was 10 ⁇ m was measured with an optical microscope (VH-Z250, manufactured by Keyence Corporation).
- the photosensitive compositions of Examples 1 to 7 and Comparative Examples 1 to 4 were spin-coated on a glass substrate (size 100 X 100 X lmm) so that the dry film thickness was about 1 am, and 30 minutes at room temperature. After standing, the solvent was removed by drying at 70 ° C. for 20 minutes to form a resist film.
- the resist film formed as described above was mixed with developer 90 33 (manufactured by Shipley Far East Co., Ltd.), which is an alkaline developer containing potassium carbonate, and sodium dodecylbenzenesulfonate 0.03. Development was performed for a predetermined time using an aqueous solution containing 25% (25 ° C.), and the time until the resist was completely dissolved was determined. The results are shown in Table 3.
- the curable composition of the present invention exhibits good developability while maintaining the same sensitivity as that of conventional thiol compounds by using a hydroxyl group-containing thiol compound in the composition.
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Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
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KR1020097012740A KR101175834B1 (ko) | 2006-11-21 | 2007-11-15 | 히드록실기 함유 티올 화합물을 포함하는 경화성 조성물 및 그의 경화물 |
EP07831901.9A EP2088163B1 (en) | 2006-11-21 | 2007-11-15 | Curable composition containing hydroxyl group-containing thiol compound and cured product thereof |
US12/515,214 US8053167B2 (en) | 2006-11-21 | 2007-11-15 | Curable compositions containing hydroxythiol compound, and cured products thereof |
JP2008545371A JP5302688B2 (ja) | 2006-11-21 | 2007-11-15 | ヒドロキシル基含有チオール化合物を含む硬化性組成物およびその硬化物 |
CN2007800432361A CN101541837B (zh) | 2006-11-21 | 2007-11-15 | 含有含羟基的硫醇化合物的固化性组合物及其固化物 |
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JP2006-314257 | 2006-11-21 | ||
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WO2008062707A1 true WO2008062707A1 (fr) | 2008-05-29 |
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PCT/JP2007/072171 WO2008062707A1 (fr) | 2006-11-21 | 2007-11-15 | Composition durcissable contenant un composé de thiol contenant un groupement hydroxyle et produit durci obtenu à partir de cette composition |
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US (1) | US8053167B2 (ja) |
EP (1) | EP2088163B1 (ja) |
JP (1) | JP5302688B2 (ja) |
KR (1) | KR101175834B1 (ja) |
CN (1) | CN101541837B (ja) |
TW (1) | TWI420241B (ja) |
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- 2007-11-15 CN CN2007800432361A patent/CN101541837B/zh active Active
- 2007-11-15 WO PCT/JP2007/072171 patent/WO2008062707A1/ja active Application Filing
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WO2017221620A1 (ja) * | 2016-06-22 | 2017-12-28 | 富士フイルム株式会社 | 硬化性組成物、硬化膜、カラーフィルタ、遮光膜、固体撮像素子、画像表示装置、硬化膜の製造方法、及び、多官能チオール化合物 |
JPWO2017221620A1 (ja) * | 2016-06-22 | 2019-04-18 | 富士フイルム株式会社 | 硬化性組成物、硬化膜、カラーフィルタ、遮光膜、固体撮像素子、画像表示装置、硬化膜の製造方法、及び、多官能チオール化合物 |
JP2021004921A (ja) * | 2019-06-25 | 2021-01-14 | 東洋インキScホールディングス株式会社 | 感光性着色組成物、並びにこれを用いたカラーフィルタ、液晶表示装置 |
JP2021004922A (ja) * | 2019-06-25 | 2021-01-14 | 東洋インキScホールディングス株式会社 | 感光性着色組成物、並びにこれを用いたカラーフィルタ、液晶表示装置 |
JP7415342B2 (ja) | 2019-06-25 | 2024-01-17 | 東洋インキScホールディングス株式会社 | 感光性着色組成物、並びにこれを用いたカラーフィルタ、液晶表示装置 |
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Publication number | Publication date |
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TWI420241B (zh) | 2013-12-21 |
CN101541837B (zh) | 2013-02-06 |
JP5302688B2 (ja) | 2013-10-02 |
EP2088163B1 (en) | 2013-05-15 |
KR20090091189A (ko) | 2009-08-26 |
US8053167B2 (en) | 2011-11-08 |
TW200844658A (en) | 2008-11-16 |
JPWO2008062707A1 (ja) | 2010-03-04 |
US20100047713A1 (en) | 2010-02-25 |
EP2088163A1 (en) | 2009-08-12 |
EP2088163A4 (en) | 2010-11-03 |
CN101541837A (zh) | 2009-09-23 |
KR101175834B1 (ko) | 2012-08-24 |
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