WO2008053732A1 - Matrice de moulage et procédé de fabrication de celle-ci - Google Patents

Matrice de moulage et procédé de fabrication de celle-ci Download PDF

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Publication number
WO2008053732A1
WO2008053732A1 PCT/JP2007/070540 JP2007070540W WO2008053732A1 WO 2008053732 A1 WO2008053732 A1 WO 2008053732A1 JP 2007070540 W JP2007070540 W JP 2007070540W WO 2008053732 A1 WO2008053732 A1 WO 2008053732A1
Authority
WO
WIPO (PCT)
Prior art keywords
molding die
mold
molding
layer
heat insulating
Prior art date
Application number
PCT/JP2007/070540
Other languages
English (en)
Japanese (ja)
Inventor
Kanji Sekihara
Original Assignee
Konica Minolta Opto, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konica Minolta Opto, Inc. filed Critical Konica Minolta Opto, Inc.
Priority to JP2008542049A priority Critical patent/JPWO2008053732A1/ja
Publication of WO2008053732A1 publication Critical patent/WO2008053732A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B29C33/3842—Manufacturing moulds, e.g. shaping the mould surface by machining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B29C33/424—Moulding surfaces provided with means for marking or patterning

Definitions

  • the present invention relates to a molding die used for forming a resin molded product and a method for manufacturing the same.
  • the width and depth are 1 to; 1000 m, which has a very fine flow path, has a microchip used for analysis of organic compounds and biological samples, and a fine step structure on the order of several tens of nm
  • a diffractive optical element or the like may be formed of a resin molded product formed by injection molding of a resin, and a mold is used for the molding (see Patent Documents 1 and 2).
  • a temperature adjusting medium passage (6) for allowing a temperature adjusting medium to pass therethrough is provided inside the mold (1), and the temperature adjusting medium flows into the mold.
  • a coil (4) for electromagnetic induction heating that rapidly heats the temperature adjustment medium is provided near the outlet, and the temperature adjustment medium is heated and cooled by the action of the coil, so that the molding cycle time in heat cycle molding can be controlled. Shortening is made (see paragraph numbers 0008 to 0014, FIG. 1 and FIG. 2).
  • the temperature controller (2), the accompanying members (such as hoses 3, 18), and the controller (19) are essential and large. If the system configuration is simple, forced heating / cooling is performed within a molding cycle that uses force, and there is a limit to shortening the molding cycle time.
  • Patent Document 2 forms a heat insulating layer (1) made of zirconia or the like inside the mold to keep the temperature of the resin in contact with the mold at a high temperature. (Refer to paragraphs 0022 to 0034, 0046 and FIGS. 1 to 4). By optimizing the configuration, the molding cycle time is shortened and the fineness from the mold to the resin is reduced. The shape transferability can be improved.
  • Patent Document 1 JP-A-8-103931
  • Patent Document 2 JP 2002-96335 A
  • the fine shape formed on the mold is transferred to the resin with high accuracy, but the mold is directly cut into the mold itself.
  • the surface processed layer (2) is provided by processing, for example, it is a mold (multi-cavity mold) that can mold a large number of resin molded products at the same time.
  • a mold multi-cavity mold
  • processing variations will occur in each forming process when a plurality of identical fine shapes are formed in one mold.
  • An object of the present invention is to prevent variations in processing in forming a fine shape on a mold while simultaneously reducing the molding cycle time and improving transferability from the mold to the resin.
  • the first invention is:
  • the surface layer is formed by transfer processing.
  • the transfer process is an electroplating process! /.
  • the surface layer is preferably made of nickel, nickel cobalt alloy, nickel cobalt phosphorus alloy or copper.
  • the surface layer is preferably formed on the heat insulating layer with a thickness in the range of 0.05-1 Omm!
  • the heat insulating layer is preferably formed on the surface layer by a thermal spraying method.
  • the thickness of the heat insulation layer is preferably 0.;! ⁇ 2.Omm. That's right.
  • the heat conductivity of the heat insulating layer is preferably 10 W / m'K or less.
  • the heat insulating layer is preferably made of a ceramic material, a titanium alloy or cermet.
  • an intermediate layer made of a nickel-chromium-based material is preferably provided between the heat insulating layer and the surface layer! /.
  • the surface layer has a width and a depth, or a width and a height of 0.1.
  • Hm ⁇ It is preferable to have a fine shape in the range of 1mm! /
  • the surface layer is provided with a convex portion corresponding to a fine channel having a width and depth of 1 to 1000 m formed on the microchip. Is preferred.
  • the second invention is:
  • a molding die for molding a member having a microstructure made of a resin material by injection molding, the mold body, a heat insulating layer formed on the mold body, and a microstructure In a manufacturing method of a layer that is substantially formed and has a surface layer formed on the mold body through the heat insulating layer,
  • a first step of cutting the microstructure element shape on the transfer master is
  • a second step of forming the surface layer on the transfer master by a transfer process a third step of forming the heat insulating layer on the surface layer;
  • the surface of the transfer master is subjected to electroless nickel plating and then cut.
  • an oxidized skin is formed on the transfer-type master. It is preferable to include a step of forming a film.
  • a blast treatment is performed on the surface layer.
  • an intermediate layer made of a nickel-chromium-based material is formed between the second step and the third step.
  • an aluminum alloy, a cobalt alloy, a nickel alloy, a molybdenum alloy, a copper alloy, a titanium alloy it is preferable to provide a metal layer made of tungsten alloy or cermet.
  • the heat insulating layer is formed by masking a part of the surface layer.
  • FIG. 1 is a cross-sectional view of a molding die 1.
  • FIG. 2 is a drawing (cross-sectional view) for explaining a manufacturing method of the molding die 1.
  • FIG. 3 is a cross-sectional view of a molding die 30.
  • FIG. 4 is a drawing (cross-sectional view) for explaining a method of manufacturing the molding die 30.
  • FIG. 5 is a view showing a modified example of the molding die 30.
  • Mold 1 is a mold for molding a resin-molded member (resin molded product) by injection molding, and forms resin molded products such as microchips and optical elements. It is used suitably when doing.
  • the molding die 1 has a die body 2 (base die) that has a substantially rectangular parallelepiped appearance and is made of a metal material such as steel. A surface layer is formed on the die body 2. 3 and a heat insulating layer 4 are formed.
  • the surface layer 3 is a layer for substantially forming the shape of the fine structure, and is formed by transfer processing described later.
  • the surface layer 3 is formed on the mold body 2 via the heat insulating layer 4 and is formed on the heat insulating layer 4 with a thickness in the range of 0.05-0. 1 Omm.
  • the surface layer 3 is made of nickel, nickel-cobalt alloy, nickel-cobalt-phosphorus alloy, copper, or the like, and a convex portion 3a is formed on the surface layer 3.
  • the convex portion 3a corresponds to a concave portion of a fine structure formed in the resin molded product, and has a fine shape in the range of width and depth, or width and height of 0.;! To lmm. .
  • the protrusion 3a may have a fine channel shape with a width and height of 1 to 1000 m.
  • a micro-channel having a width and depth of 1 to 1000 m can be formed in a resin molded product such as a microchip or an optical element formed from the molding die 1.
  • the heat insulating layer 4 has a function of preventing the heat of the resin injected to the surface of the surface layer 3 from being transferred to the entire mold body 2, and the portion that has received the resin injection and its portion Heat is kept in the vicinity.
  • the heat insulating layer 4 is made of a material such as a ceramic material, a titanium alloy, or cermet, and has a thermal conductivity of 10 W / m'K or less.
  • the heat insulating layer 4 is formed on the surface layer 3 by a spraying method to be described later, and has a thickness of 0.;! ⁇ 2.Omm.
  • a master 10 shown in FIG. 2 is used as a premise for manufacturing the molding die 1.
  • the master 10 as the transfer mold master is the base of the mold 1 and the master blank 11 having grooves along the outer periphery thereof is subjected to Ni-P plating to form the mesh layer 12. Is.
  • the top surface of the plating layer 12 is subjected to cutting of the fine structure element shape, and the fine flow path of the resin molded product, etc.
  • the flow path portion 13 corresponding to the concave portion is formed (first step).
  • the plating layer 12 is not necessarily essential, but it is preferable that the plating layer 12 is formed particularly from the viewpoint of the homogeneity of the material.
  • electroless Ni plating may be performed on the master blank 11 (without forming the plating layer 12), and then cutting may be performed. preferable.
  • an oxide film (not shown) is formed on the upper surface of the master 10, and then the upper part of the oxide film is electroplated to form nickel, A thick first electroplated body 20 made of nickel cobalt alloy, nickel cobalt phosphorus alloy, copper, or the like is formed.
  • other transfer processing such as electroless Ni plating may be performed without performing electroplating.
  • electroplating means that a metal such as nickel, nickel-cobalt alloy, nickel-cobalt-phosphorus alloy, or copper is deposited on the surface of the master 10 by electroplating, and then the metal is peeled off from the master 10.
  • a metal such as nickel, nickel-cobalt alloy, nickel-cobalt-phosphorus alloy, or copper is deposited on the surface of the master 10 by electroplating, and then the metal is peeled off from the master 10.
  • the first electric machined body 20 is ground, so that the thickness of the first electric carousel body 20 is about 0.05 to 1.0 mm. Make the top surface flat while thinning.
  • the first electroplating body 20 corresponds to the surface layer 3, and the step of forming the first electroplating body 20 corresponds to the second step.
  • the mask member 21 is masked on the portion other than the portion where the heat insulating layer 4 is to be formed on the upper part of the first electroplated body 20, and the mask Thermal insulation layer 4 is formed by spraying a ceramic material, titanium alloy, cermet, or other material to the part surrounded by member 21 to a certain thickness (third step).
  • the formation of the heat insulating layer 4 is not limited to thermal spraying, but a material such as a ceramic material, a titanium alloy, or cermet is adhered on the first electrode body 20 or the like. You can go.
  • the masking of the mask member 21 is not necessarily required.
  • the masking range of the mask member 21 is arranged on the inner side within the range of 0.;! To 2 mm with respect to the outer shape of the final molding die 1. Is preferred. This range assumes the subsequent formation of the second electro-processed body 22 (re-electro-plating process, holding by thick-walled electro-magnet), Masking the inner side of 0.1 mm means that the thickness of the side electrode layer is synonymous with 0.1 mm. Below this, there is a possibility of breakage, and the upper limit is the heat insulating layer 4 This is to make the effect work effectively.
  • the conductive film may be formed by Ni—P plating! /, Or it may be formed by spraying a metal material.
  • the upper part of the heat insulating layer 4 and the first electro-processed body 20 is subjected to electro-process again, and the first electro-processed body 20 is insulated.
  • a thick second electroplating body 22 is formed so as to wrap around the layer 4, and these are integrated.
  • the second electric machined body 22 corresponds to the mold main body 2.
  • the external shape of the integrated body is shown as indicated by an arrow A in FIG.
  • the side of the monolith is removed until the side surface matches the side surface of the master 10 (mesh layer 12). That As a result, the mold body 2 and the surface layer 3 can be formed.
  • the mold body 2 the surface layer 3 and the thermal insulation layer 4 are released from the master 10 (fourth step), and the lower surface of the surface layer 3 (transfer) Surface) and the upper surface of the plating layer 12 of the master 10 are removed.
  • the force S can be used to manufacture the molding die 1 having the surface layer 3 and the heat insulating layer 4 on which the convex portions 3a corresponding to the flow path portions 13 of the master 10 are formed.
  • the heat insulating layer 4 is formed inside the mold main body 2, it is not necessary to greatly change the temperature of the molding mold 1 at the time of resin injection molding.
  • the molding cycle time can be shortened by that amount.
  • the temperature between the convex portion 3a and the vicinity thereof is also maintained at a high temperature, and the transferability from the molding die 1 to the resin can be improved.
  • the convex portion 3a of the mold body 2 is formed by performing transfer processing on the master 10 instead of cutting, so that one master 10 force also includes a plurality of forces. It is possible to prevent variations in processing when forming a fine shape on the surface layer 3 when producing one molding die 1 that forms the same fine shape, and the same shape can be obtained from one master 10. Even in the case of producing a plurality of molding dies 1 presented, it is possible to prevent processing variations from occurring among the molding dies 1. From the above, it is possible to prevent variations in processing when forming a fine shape on the mold while simultaneously reducing the molding cycle time and improving the transferability from the mold to the resin.
  • the molding die 1 (including the molding die 30 according to the second embodiment) and the manufacturing method thereof according to the present invention are very effective.
  • the molding die (30) according to the second embodiment and the manufacturing method thereof are different from the first embodiment in the following points, and are otherwise the same as those in the first embodiment.
  • the heat insulating layer 4 is formed flush with the mold body 2 and covers the upper part of the mold body 2. [0051] In the method of manufacturing the molding die 30, first, as shown in FIGS. 4 (a) and 4 (b), each of the first step and the second step is performed, and the surface layer 3 is applied to the master 10. The first electric caroe body 20 corresponding to is formed.
  • a material such as ceramic material, titanium alloy, cermet, etc. is simply sprayed (without masking) to a certain thickness to form the heat insulating layer 4.
  • the corresponding thermal spray 23 is formed.
  • the integrated body of the first electroplated body 20 and the thermal spray body 23 and the master 10 are not released from each other.
  • the side of the integral object is removed until the side surface of the outer surface is aligned with the side surface of the master 10 (mesh layer 12).
  • the surface layer 3 and the heat insulating layer 4 can be formed.
  • the surface layer 3, the heat insulating layer 4 and the mold body 2 are joined with an adhesive.
  • the surface layer 3, the heat insulating layer 4 and the mold body 2 may be joined by screwing or by clamping.
  • the molding die 30 can be manufactured.
  • the surface layer 3, the heat insulating layer 4 and the mold body 2 can be joined with a mechanical fixing member 31 as shown in FIG.
  • blasting may be performed on the first electric heating element 20 corresponding to the surface layer 3! / ,.
  • a step of forming an intermediate layer between the second step and the third step is provided, and a nickel chrome-based material is formed between the surface layer 3 and the heat insulating layer 4.
  • An intermediate layer may be provided.
  • an aluminum alloy is formed between the heat insulating layer 4 and the mold body 2 by providing a process for forming a metal layer on the heat insulating layer 4.
  • a metal layer made of cobalt alloy, nickel alloy, molybdenum alloy, copper alloy, titanium alloy, tungsten alloy, cermet, etc. may be provided.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

Des fluctuations de processus sont éliminées pour la formation d'une forme fine d'une matrice de moulage tout en raccourcissant une durée de cycle de moulage et en même temps en améliorant des caractéristiques de transfert de la matrice à une résine. Une matrice de moulage (1) est proposée pour la formation d'un élément, qui est composé d'une matière en résine et ayant une structure fine, par moulage par injection. La matrice de moulage est dotée d'un corps principal de matrice (2) ; d'une couche isolante (4) formée sur le corps principal de matrice (2) ; et d'une couche de surface (3), qui est une couche pour sensiblement former une forme de la structure fine et qui est formée sur le corps principal (2) à travers la couche isolante (4). La couche de surface (3) est formée par un procédé de transfert.
PCT/JP2007/070540 2006-10-31 2007-10-22 Matrice de moulage et procédé de fabrication de celle-ci WO2008053732A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008542049A JPWO2008053732A1 (ja) 2006-10-31 2007-10-22 成形用金型及びその製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006-296400 2006-10-31
JP2006296400 2006-10-31

Publications (1)

Publication Number Publication Date
WO2008053732A1 true WO2008053732A1 (fr) 2008-05-08

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011122215A1 (fr) * 2010-03-31 2011-10-06 コニカミノルタオプト株式会社 Micropuce et son procédé de fabrication
JP5725155B2 (ja) * 2011-03-17 2015-05-27 コニカミノルタ株式会社 射出成形用金型の製造方法、射出成形用金型、射出成形用金型セット、マイクロチップ用基板の製造方法、及びこの金型を用いたマイクロチップ製造方法
JPWO2013146985A1 (ja) * 2012-03-30 2015-12-14 コニカミノルタ株式会社 成形用金型及びその製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05200755A (ja) * 1992-01-24 1993-08-10 Olympus Optical Co Ltd 電鋳型の製作方法
JP2000192529A (ja) * 1998-10-20 2000-07-11 Toto Ltd 水洗式便器表面への水垢付着防止方法、水垢付着防止性水洗式便器、並びに水垢付着防止性水洗式便器用コ―ティング組成物
JP2001030306A (ja) * 1999-07-27 2001-02-06 Nippon Sheet Glass Co Ltd 樹脂正立レンズアレイおよびその製造方法
JP2002096335A (ja) * 2000-09-25 2002-04-02 Minolta Co Ltd 光学素子成形用金型及び光学素子成形方法
JP2004175112A (ja) * 2002-11-13 2004-06-24 Maxell Hi Tec Ltd 成型用金型及びその製造方法

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JPH09155875A (ja) * 1995-12-04 1997-06-17 Asahi Chem Ind Co Ltd 樹脂導光板成形用金型及び該金型を用いた樹脂導光板の成形法
JP2001273685A (ja) * 2000-03-28 2001-10-05 Ricoh Co Ltd 光ディスク基板成形用スタンパの製造装置及び製造方法
JP3901437B2 (ja) * 2000-09-07 2007-04-04 株式会社リコー 樹脂成形用断熱スタンパーおよびその製造方法
JP2005077239A (ja) * 2003-08-29 2005-03-24 Sumitomo Bakelite Co Ltd マイクロチップ基板の接合方法およびマイクロチップ
JP4815898B2 (ja) * 2004-06-29 2011-11-16 コニカミノルタオプト株式会社 射出成形用金型及び射出成形方法
JP4877640B2 (ja) * 2004-08-12 2012-02-15 コニカミノルタオプト株式会社 光学素子用成形金型の製造方法、光学素子用成形金型及び光学素子

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05200755A (ja) * 1992-01-24 1993-08-10 Olympus Optical Co Ltd 電鋳型の製作方法
JP2000192529A (ja) * 1998-10-20 2000-07-11 Toto Ltd 水洗式便器表面への水垢付着防止方法、水垢付着防止性水洗式便器、並びに水垢付着防止性水洗式便器用コ―ティング組成物
JP2001030306A (ja) * 1999-07-27 2001-02-06 Nippon Sheet Glass Co Ltd 樹脂正立レンズアレイおよびその製造方法
JP2002096335A (ja) * 2000-09-25 2002-04-02 Minolta Co Ltd 光学素子成形用金型及び光学素子成形方法
JP2004175112A (ja) * 2002-11-13 2004-06-24 Maxell Hi Tec Ltd 成型用金型及びその製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011122215A1 (fr) * 2010-03-31 2011-10-06 コニカミノルタオプト株式会社 Micropuce et son procédé de fabrication
JP5725155B2 (ja) * 2011-03-17 2015-05-27 コニカミノルタ株式会社 射出成形用金型の製造方法、射出成形用金型、射出成形用金型セット、マイクロチップ用基板の製造方法、及びこの金型を用いたマイクロチップ製造方法
JPWO2013146985A1 (ja) * 2012-03-30 2015-12-14 コニカミノルタ株式会社 成形用金型及びその製造方法

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