WO2008053732A1

WO2008053732A1 - Molding die and method for manufacturing the same

Info

Publication number: WO2008053732A1
Application number: PCT/JP2007/070540
Authority: WO
Inventors: Kanji Sekihara
Original assignee: Konica Minolta Opto, Inc.
Priority date: 2006-10-31
Filing date: 2007-10-22
Publication date: 2008-05-08
Also published as: JPWO2008053732A1

Abstract

Process fluctuation is eliminated for forming a fine shape of a molding die while shortening a molding cycle time and improving transfer characteristics from the die to a resin at the same time. A molding die (1) is provided for forming a member, which is composed of a resin material and has a fine structure, by injection molding. The molding die is provided with a die main body (2); an insulating layer (4) formed on the die main body (2); and a surface layer (3), which is a layer for substantially forming a shape of the fine structure and is formed on the main body (2) through the insulating layer (4). The surface layer (3) is formed by transfer process.

Description

Specification

Mold for molding and manufacturing method thereof

Technical field

TECHNICAL FIELD [0001] The present invention relates to a molding die used for forming a resin molded product and a method for manufacturing the same.

Yes

Background art

[0002] The width and depth are 1 to; 1000 m, which has a very fine flow path, has a microchip used for analysis of organic compounds and biological samples, and a fine step structure on the order of several tens of nm A diffractive optical element or the like may be formed of a resin molded product formed by injection molding of a resin, and a mold is used for the molding (see Patent Documents 1 and 2).

[0003] In particular, in the technique disclosed in Patent Document 1, a temperature adjusting medium passage (6) for allowing a temperature adjusting medium to pass therethrough is provided inside the mold (1), and the temperature adjusting medium flows into the mold. A coil (4) for electromagnetic induction heating that rapidly heats the temperature adjustment medium is provided near the outlet, and the temperature adjustment medium is heated and cooled by the action of the coil, so that the molding cycle time in heat cycle molding can be controlled. Shortening is made (see paragraph numbers 0008 to 0014, FIG. 1 and FIG. 2). However, in this method, it is necessary to heat and cool the mold with a large heat capacity. Therefore, the temperature controller (2), the accompanying members (such as hoses 3, 18), and the controller (19) are essential and large. If the system configuration is simple, forced heating / cooling is performed within a molding cycle that uses force, and there is a limit to shortening the molding cycle time.

[0004] On the other hand, the technique disclosed in Patent Document 2 forms a heat insulating layer (1) made of zirconia or the like inside the mold to keep the temperature of the resin in contact with the mold at a high temperature. (Refer to paragraphs 0022 to 0034, 0046 and FIGS. 1 to 4). By optimizing the configuration, the molding cycle time is shortened and the fineness from the mold to the resin is reduced. The shape transferability can be improved.

Patent Document 1: JP-A-8-103931

Patent Document 2: JP 2002-96335 A

Disclosure of the invention Problems to be solved by the invention

[0005] However, in the mold disclosed in Patent Document 2 (mold having a heat insulating structure), the fine shape formed on the mold is transferred to the resin with high accuracy, but the mold is directly cut into the mold itself. Since the surface processed layer (2) is provided by processing, for example, it is a mold (multi-cavity mold) that can mold a large number of resin molded products at the same time. For a fine shape, there is a possibility that processing variations will occur in each forming process when a plurality of identical fine shapes are formed in one mold.

[0006] An object of the present invention is to prevent variations in processing in forming a fine shape on a mold while simultaneously reducing the molding cycle time and improving transferability from the mold to the resin.

Means for solving the problem

[0007] In order to solve the above problems, the first invention is:

A mold for molding a member formed with a fine structure made of a resin material by injection molding,

Mold body,

A heat insulating layer formed on the mold body;

A layer for substantially forming the shape of the microstructure, and having a surface layer formed on the mold body via the heat insulating layer,

The surface layer is formed by transfer processing.

[0008] In the first invention,

It is preferable that the transfer process is an electroplating process! /.

[0009] In the first invention, the surface layer is preferably made of nickel, nickel cobalt alloy, nickel cobalt phosphorus alloy or copper.

[0010] In the first invention, the surface layer is preferably formed on the heat insulating layer with a thickness in the range of 0.05-1 Omm!

[0011] In the first invention, the heat insulating layer is preferably formed on the surface layer by a thermal spraying method.

[0012] In the first invention, the thickness of the heat insulation layer is preferably 0.;! ~ 2.Omm. That's right.

[0013] In the first invention, the heat conductivity of the heat insulating layer is preferably 10 W / m'K or less.

[0014] In the first invention, the heat insulating layer is preferably made of a ceramic material, a titanium alloy or cermet.

[0015] In the first invention, an intermediate layer made of a nickel-chromium-based material is preferably provided between the heat insulating layer and the surface layer! /.

In the first invention, an aluminum alloy, a cobalt alloy, a nickel alloy, a molybdenum alloy, a copper alloy, a titanium alloy, between the heat insulating layer and the mold body, A metal layer made of a tungsten alloy or cermet is preferably provided.

[0017] In the first invention, the surface layer has a width and a depth, or a width and a height of 0.1.

Hm ~; It is preferable to have a fine shape in the range of 1mm! /

[0018] In the first aspect of the invention, the surface layer is provided with a convex portion corresponding to a fine channel having a width and depth of 1 to 1000 m formed on the microchip. Is preferred.

[0019] The second invention is:

A molding die for molding a member having a microstructure made of a resin material by injection molding, the mold body, a heat insulating layer formed on the mold body, and a microstructure In a manufacturing method of a layer that is substantially formed and has a surface layer formed on the mold body through the heat insulating layer,

A first step of cutting the microstructure element shape on the transfer master,

A second step of forming the surface layer on the transfer master by a transfer process; a third step of forming the heat insulating layer on the surface layer;

And a fourth step of releasing the surface layer and the heat insulation layer from the transfer mold master.

[0020] In the second invention, preferably, in the first step, the surface of the transfer master is subjected to electroless nickel plating and then cut.

[0021] In the second invention, in the second step, an oxidized skin is formed on the transfer-type master. It is preferable to include a step of forming a film.

[0022] In the second aspect of the invention, it is preferable that in the second step, a blast treatment is performed on the surface layer.

[0023] In the second invention, it is preferable that an intermediate layer made of a nickel-chromium-based material is formed between the second step and the third step.

[0024] In the second invention, in the third step, after forming the heat insulating layer, an aluminum alloy, a cobalt alloy, a nickel alloy, a molybdenum alloy, a copper alloy, a titanium alloy, It is preferable to provide a metal layer made of tungsten alloy or cermet.

[0025] In the second invention, preferably, in the third step, the heat insulating layer is formed by masking a part of the surface layer.

The invention's effect

[0026] According to the first and second inventions, while reducing both the molding cycle time and the transferability from the mold to the resin, it is possible to prevent variations in processing when forming a fine shape on the mold. Stop with force S

Brief Description of Drawings

FIG. 1 is a cross-sectional view of a molding die 1.

FIG. 2 is a drawing (cross-sectional view) for explaining a manufacturing method of the molding die 1.

FIG. 3 is a cross-sectional view of a molding die 30.

FIG. 4 is a drawing (cross-sectional view) for explaining a method of manufacturing the molding die 30.

FIG. 5 is a view showing a modified example of the molding die 30.

Explanation of symbols

[0028] 1, 30 Mold for molding

2 Mold body

3 Surface layer

3a Convex

4 Thermal insulation layer

10 Master

11 Master blank 12 Metsuki layer

13 Channel section

20 1st electric machined body

21 Mask material

22 Second electroplated body

23 Thermal spray

31 Fixing member

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, the best mode for carrying out the present invention will be described with reference to the drawings. However, the embodiments described below have various technically preferable limitations for carrying out the present invention. The scope of the invention is not limited to the following embodiments and illustrated examples.

[First embodiment]

First, a schematic configuration of the “molding die (1)” according to the present invention will be described with reference to FIG.

[0030] Mold 1 is a mold for molding a resin-molded member (resin molded product) by injection molding, and forms resin molded products such as microchips and optical elements. It is used suitably when doing. The molding die 1 has a die body 2 (base die) that has a substantially rectangular parallelepiped appearance and is made of a metal material such as steel. A surface layer is formed on the die body 2. 3 and a heat insulating layer 4 are formed.

[0031] The surface layer 3 is a layer for substantially forming the shape of the fine structure, and is formed by transfer processing described later. The surface layer 3 is formed on the mold body 2 via the heat insulating layer 4 and is formed on the heat insulating layer 4 with a thickness in the range of 0.05-0. 1 Omm. The surface layer 3 is made of nickel, nickel-cobalt alloy, nickel-cobalt-phosphorus alloy, copper, or the like, and a convex portion 3a is formed on the surface layer 3.

[0032] The convex portion 3a corresponds to a concave portion of a fine structure formed in the resin molded product, and has a fine shape in the range of width and depth, or width and height of 0.;! To lmm. . The protrusion 3a may have a fine channel shape with a width and height of 1 to 1000 m. A micro-channel having a width and depth of 1 to 1000 m can be formed in a resin molded product such as a microchip or an optical element formed from the molding die 1.

[0033] The heat insulating layer 4 has a function of preventing the heat of the resin injected to the surface of the surface layer 3 from being transferred to the entire mold body 2, and the portion that has received the resin injection and its portion Heat is kept in the vicinity. The heat insulating layer 4 is made of a material such as a ceramic material, a titanium alloy, or cermet, and has a thermal conductivity of 10 W / m'K or less. The heat insulating layer 4 is formed on the surface layer 3 by a spraying method to be described later, and has a thickness of 0.;! ~ 2.Omm.

[0034] Next, a "method for manufacturing a molding die" according to the present invention will be described with reference to FIG.

[0035] As a premise for manufacturing the molding die 1, a master 10 shown in FIG. 2 is used. The master 10 as the transfer mold master is the base of the mold 1 and the master blank 11 having grooves along the outer periphery thereof is subjected to Ni-P plating to form the mesh layer 12. Is.

[0036] In the actual manufacturing of the molding die 1, first, as shown in Fig. 2 (a), the top surface of the plating layer 12 is subjected to cutting of the fine structure element shape, and the fine flow path of the resin molded product, etc. The flow path portion 13 corresponding to the concave portion is formed (first step).

[0037] In the master 10, the plating layer 12 is not necessarily essential, but it is preferable that the plating layer 12 is formed particularly from the viewpoint of the homogeneity of the material. In the first step, electroless Ni plating may be performed on the master blank 11 (without forming the plating layer 12), and then cutting may be performed. preferable.

[0038] After that, in order to improve the releasability from the mold body 2, an oxide film (not shown) is formed on the upper surface of the master 10, and then the upper part of the oxide film is electroplated to form nickel, A thick first electroplated body 20 made of nickel cobalt alloy, nickel cobalt phosphorus alloy, copper, or the like is formed. In the formation of the first electroplated body 20, other transfer processing such as electroless Ni plating may be performed without performing electroplating.

[0039] Here, electroplating means that a metal such as nickel, nickel-cobalt alloy, nickel-cobalt-phosphorus alloy, or copper is deposited on the surface of the master 10 by electroplating, and then the metal is peeled off from the master 10. This is a product technology that is The shape can be transferred faithfully and accurately.

[0040] After that, as shown in FIG. 2 (b), the first electric machined body 20 is ground, so that the thickness of the first electric carousel body 20 is about 0.05 to 1.0 mm. Make the top surface flat while thinning. The first electroplating body 20 corresponds to the surface layer 3, and the step of forming the first electroplating body 20 corresponds to the second step.

[0041] After that, as shown in FIG. 2 (c), the mask member 21 is masked on the portion other than the portion where the heat insulating layer 4 is to be formed on the upper part of the first electroplated body 20, and the mask Thermal insulation layer 4 is formed by spraying a ceramic material, titanium alloy, cermet, or other material to the part surrounded by member 21 to a certain thickness (third step).

[0042] In the third step, the formation of the heat insulating layer 4 is not limited to thermal spraying, but a material such as a ceramic material, a titanium alloy, or cermet is adhered on the first electrode body 20 or the like. You can go. In addition, the masking of the mask member 21 is not necessarily required. The masking range of the mask member 21 is arranged on the inner side within the range of 0.;! To 2 mm with respect to the outer shape of the final molding die 1. Is preferred. This range assumes the subsequent formation of the second electro-processed body 22 (re-electro-plating process, holding by thick-walled electro-magnet), Masking the inner side of 0.1 mm means that the thickness of the side electrode layer is synonymous with 0.1 mm. Below this, there is a possibility of breakage, and the upper limit is the heat insulating layer 4 This is to make the effect work effectively.

Thereafter, the mask member 21 is removed, and a conductive film (not shown) is formed on the upper surface of the heat insulating layer 4 to impart conductivity. The conductive film may be formed by Ni—P plating! /, Or it may be formed by spraying a metal material.

[0044] After that, as shown in FIG. 2 (d), the upper part of the heat insulating layer 4 and the first electro-processed body 20 is subjected to electro-process again, and the first electro-processed body 20 is insulated. A thick second electroplating body 22 is formed so as to wrap around the layer 4, and these are integrated. The second electric machined body 22 corresponds to the mold main body 2.

[0045] After that, in a state where the integrated body of the first and second electroplated bodies 20 and 22 and the master 10 are not released, the external shape of the integrated body is shown as indicated by an arrow A in FIG. The side of the monolith is removed until the side surface matches the side surface of the master 10 (mesh layer 12). That As a result, the mold body 2 and the surface layer 3 can be formed.

[0046] After that, as indicated by arrow B in FIG. 2 (e), the mold body 2, the surface layer 3 and the thermal insulation layer 4 are released from the master 10 (fourth step), and the lower surface of the surface layer 3 (transfer) Surface) and the upper surface of the plating layer 12 of the master 10 are removed. As a result, the force S can be used to manufacture the molding die 1 having the surface layer 3 and the heat insulating layer 4 on which the convex portions 3a corresponding to the flow path portions 13 of the master 10 are formed.

[0047] In the present embodiment described above, since the heat insulating layer 4 is formed inside the mold main body 2, it is not necessary to greatly change the temperature of the molding mold 1 at the time of resin injection molding. The molding cycle time can be shortened by that amount. On the other hand, the temperature between the convex portion 3a and the vicinity thereof is also maintained at a high temperature, and the transferability from the molding die 1 to the resin can be improved.

[0048] Furthermore, when forming the convex portion 3a of the mold body 2, the convex portion 3a is formed by performing transfer processing on the master 10 instead of cutting, so that one master 10 force also includes a plurality of forces. It is possible to prevent variations in processing when forming a fine shape on the surface layer 3 when producing one molding die 1 that forms the same fine shape, and the same shape can be obtained from one master 10. Even in the case of producing a plurality of molding dies 1 presented, it is possible to prevent processing variations from occurring among the molding dies 1. From the above, it is possible to prevent variations in processing when forming a fine shape on the mold while simultaneously reducing the molding cycle time and improving the transferability from the mold to the resin.

[0049] In addition, in an optical element such as a microchip having a fine flow path, a lens having a fine structure, or a prism, it is indispensable to suppress the shape variation between components as well as transfer the fine shape. Therefore, the molding die 1 (including the molding die 30 according to the second embodiment) and the manufacturing method thereof according to the present invention are very effective.

[Second Embodiment]

The molding die (30) according to the second embodiment and the manufacturing method thereof are different from the first embodiment in the following points, and are otherwise the same as those in the first embodiment.

As shown in FIG. 3, in the molding die 30, the heat insulating layer 4 is formed flush with the mold body 2 and covers the upper part of the mold body 2. [0051] In the method of manufacturing the molding die 30, first, as shown in FIGS. 4 (a) and 4 (b), each of the first step and the second step is performed, and the surface layer 3 is applied to the master 10. The first electric caroe body 20 corresponding to is formed.

[0052] In the third step, as shown in FIG. 4 (c), a material such as ceramic material, titanium alloy, cermet, etc. is simply sprayed (without masking) to a certain thickness to form the heat insulating layer 4. The corresponding thermal spray 23 is formed.

[0053] In the fourth step, as shown by an arrow A in FIG. 4 (d), the integrated body of the first electroplated body 20 and the thermal spray body 23 and the master 10 are not released from each other. The side of the integral object is removed until the side surface of the outer surface is aligned with the side surface of the master 10 (mesh layer 12). As a result, the surface layer 3 and the heat insulating layer 4 can be formed.

Thereafter, as indicated by arrow B in FIG. 4D, the surface layer 3 and the heat insulating layer 4 are released from the master 10.

[0055] After that, as shown in FIG. 4 (e), the surface layer 3, the heat insulating layer 4 and the mold body 2 are joined with an adhesive. The surface layer 3, the heat insulating layer 4 and the mold body 2 may be joined by screwing or by clamping. As a result, the molding die 30 can be manufactured. The surface layer 3, the heat insulating layer 4 and the mold body 2 can be joined with a mechanical fixing member 31 as shown in FIG.

[0056] It should be noted that the present invention is not limited to the first and second embodiments described above, and various modifications and design changes can be made without departing from the scope of the present invention. Yo! /

[0057] As one of the improvements and design changes, in the second step, blasting may be performed on the first electric heating element 20 corresponding to the surface layer 3! / ,.

[0058] As another improvement and design change, a step of forming an intermediate layer between the second step and the third step is provided, and a nickel chrome-based material is formed between the surface layer 3 and the heat insulating layer 4. An intermediate layer may be provided.

[0059] As another improvement 'design change, in the third step, an aluminum alloy is formed between the heat insulating layer 4 and the mold body 2 by providing a process for forming a metal layer on the heat insulating layer 4. A metal layer made of cobalt alloy, nickel alloy, molybdenum alloy, copper alloy, titanium alloy, tungsten alloy, cermet, etc. may be provided.

Claims

The scope of the claims

[1] A molding die for molding a member having a fine structure made of a resin material by injection molding,

Mold body,

A heat insulating layer formed on the mold body;

The molding die, wherein the surface layer is formed by transfer processing.

[2] In the molding die according to claim 1,

A mold for molding, wherein the transfer process is an electroplating process.

[3] In the molding die according to claim 1 or 2,

The molding die according to claim 1, wherein the surface layer is made of nickel, nickel cobalt alloy, nickel cobalt phosphorus alloy or copper.

[4] The molding die according to any one of claims 1 to 3, wherein the surface layer is formed on the heat insulating layer with a thickness in the range of 0.05 to 1.0 mm. Mold for molding, characterized by

[5] The molding die according to any one of claims 1 to 4, wherein the heat insulating layer is formed on the surface layer by a thermal spraying method. Mold for molding.

[6] The molding die according to any one of claims 1 to 5, wherein the heat-insulating layer has a thickness of 0 .;! To 2.0mm. Mold.

[7] The molding die according to any one of claims 1 to 6, wherein the thermal conductivity of the heat insulating layer is 10 W / m'K or less. Mold.

[8] In the molding die according to any one of claims 1 to 7,

The mold for molding, wherein the heat insulating layer is made of a ceramic material, a titanium alloy, or cermet.

[9] The molding die according to any one of claims 1 to 8, wherein an intermediate layer made of a nickel chromium-based material is provided between the heat insulating layer and the surface layer. Mold for molding, characterized by being!

[10] The molding die according to any one of claims 1 to 9, wherein an aluminum alloy, a cobalt alloy, an Eckenole is interposed between the heat insulating layer and the die body. A metal mold comprising a metal layer made of an alloy of molybdenum, molybdenum, copper, titanium, tungsten, or cermet is provided.

[11] The molding die according to any one of claims 1 to 10, wherein a fine shape in a range of 0.1 m to lmm is formed on the surface layer. Mold for molding.

[12] The molding die according to any one of claims 1 to 10, wherein the surface layer has a width and a depth of 1 to 1000 mm formed on the microchip. A molding die characterized in that a convex portion corresponding to a fine flow path in the range of is formed.

[13] A molding die for molding a member having a microstructure made of a resin material by injection molding, the mold body, a heat insulating layer formed on the mold body, and a microstructure In a manufacturing method of a layer for substantially forming a shape and having a surface layer formed on the mold body through the heat insulating layer,

[14] In the method for manufacturing a molding die according to claim 13,

In the first step, the surface of the transfer mold master is subjected to electroless nickel plating, followed by cutting.

[15] The method for manufacturing a molding die according to claim 13 or 14, wherein the second step includes a step of forming an oxide film on the transfer mold master. A method for manufacturing a molding die.

[16] In the method for manufacturing a molding die according to any one of claims 13 to 15, In the second step, a method for producing a molding die, wherein a blast treatment is performed on the surface layer.

[17] In the method for manufacturing a molding die according to any one of claims 13 to 16,

An intermediate layer made of a nickel-chromium-based material is formed between the second step and the third step.

[18] In the method for manufacturing a molding die according to any one of claims 13 to 17,

In the third step, after the heat insulation layer is formed, a metal layer made of an aluminum alloy, cobalt alloy, nickel alloy, molybdenum alloy, copper alloy, titanium alloy, tungsten alloy or cermet is provided. A method for producing a mold for molding.

[19] In the method for manufacturing a molding die according to any one of claims 13 to 17,

In the third step, the heat insulating layer is formed by masking a part of the surface layer.