WO2008044697A1 - Dispositif permettant d'obtenir un réseau veineux - Google Patents

Dispositif permettant d'obtenir un réseau veineux Download PDF

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Publication number
WO2008044697A1
WO2008044697A1 PCT/JP2007/069733 JP2007069733W WO2008044697A1 WO 2008044697 A1 WO2008044697 A1 WO 2008044697A1 JP 2007069733 W JP2007069733 W JP 2007069733W WO 2008044697 A1 WO2008044697 A1 WO 2008044697A1
Authority
WO
WIPO (PCT)
Prior art keywords
finger
mounting member
main body
light source
acquisition device
Prior art date
Application number
PCT/JP2007/069733
Other languages
English (en)
Japanese (ja)
Inventor
Mitsuru Kobayashi
Jun Tatsuta
Youichiro Nakahara
Yasufumi Masaki
Naoto Ikegawa
Junji Imai
Original Assignee
Panasonic Electric Works Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2006277489A external-priority patent/JP2008093143A/ja
Priority claimed from JP2006304079A external-priority patent/JP2008123099A/ja
Application filed by Panasonic Electric Works Co., Ltd. filed Critical Panasonic Electric Works Co., Ltd.
Publication of WO2008044697A1 publication Critical patent/WO2008044697A1/fr

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Classifications

    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/48—Other medical applications
    • A61B5/4887—Locating particular structures in or on the body
    • A61B5/489—Blood vessels
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/68—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient
    • A61B5/6801—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient specially adapted to be attached to or worn on the body surface
    • A61B5/6813—Specially adapted to be attached to a specific body part
    • A61B5/6825—Hand
    • A61B5/6826—Finger
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/68—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient
    • A61B5/6801—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient specially adapted to be attached to or worn on the body surface
    • A61B5/683—Means for maintaining contact with the body
    • A61B5/6838—Clamps or clips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T1/00—General purpose image data processing
    • G06T1/0007—Image acquisition
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1312—Sensors therefor direct reading, e.g. contactless acquisition
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/14—Vascular patterns

Definitions

  • the present invention relates to a vein pattern acquisition device.
  • a placement unit for placing a finger Conventionally, a placement unit for placing a finger, a light source for irradiating the finger placed on the placement unit, and a scattering in which light from the light source is scattered in the finger placed on the placement unit
  • a vein pattern acquisition device including an image sensor that captures light or transmitted light that has passed through a finger
  • This vein pattern acquisition device attempts to acquire a vein pattern in a finger by imaging infrared light that has passed through the inside of the finger with an imaging device.
  • the vein pattern acquisition device of Patent Document 1 has a configuration in which a light source and a camera are attached to a housing.
  • a substrate on which a light source is mounted and a camera on which an imaging element is mounted. Is attached to the housing, the error in the relative mounting position of the light source and the image sensor overlaps the mounting error of the board on which the light source is mounted and the mounting error of the camera in the housing.
  • the accuracy of the mounting position there is difficult to ensure the accuracy of the mounting position.
  • an object of the present invention is to obtain a vein pattern acquisition device capable of further improving the accuracy of the mounting position between a light source and an image sensor.
  • Patent Document 1 Japanese Patent No. 3770241
  • a main body portion including a three-dimensional circuit component in which a conductor pattern is formed on a surface of a three-dimensional structure is provided, and a finger insertion portion that allows a finger to pass through the main body portion is formed.
  • a light source for irradiating a finger passed through the finger passage part and an image sensor for imaging the transmitted light through which the light from the light source has passed through the finger are directly mounted on the inner wall of the finger passage part. It is characterized by.
  • the image sensor may be provided in an elongated band shape substantially along the circumferential direction of the inner wall of the finger passage portion. [0008] In the present invention, the image sensor may acquire image information at each position in the longitudinal direction of the finger passed through the finger penetration section! /.
  • the plurality of light sources may be spaced apart substantially along the circumferential direction of the finger passage portion.
  • a reflection portion that reflects incident light toward the imaging element may be provided on the inner wall of the finger passage portion.
  • the present invention further includes a circuit board portion on which an arithmetic processing circuit that performs predetermined arithmetic processing on the image information acquired by the imaging device is mounted, and the main body portion and the circuit board portion are provided with each other. You may form integrally.
  • the present invention further includes a circuit board portion on which an arithmetic processing circuit that performs predetermined arithmetic processing on image information acquired by the imaging device is mounted, and the main body portion is hinged to the circuit board portion. You may connect so that folding is possible through a mechanism.
  • a main body portion configured as a three-dimensional circuit component having a conductor pattern formed on the surface of a three-dimensional structure and having a finger insertion portion for allowing a finger to pass therethrough, and the finger
  • a light source and an image pickup device arranged in a state of facing the through portion, and a mounting member on which the light source or the image pickup device is mounted, and a mounting member mounting portion for mounting the mounting member is formed on the main body portion,
  • the mounting member is attached to the mounting member mounting portion in a state in which a light source or an image sensor mounted on the mounting member faces the finger insertion portion.
  • the body portion is formed with a through-hole penetrating between the outer surface of the body portion and the inner peripheral surface of the finger passage portion as the mounting member mounting portion.
  • a conductor pattern is formed on the outer surface, and the mounting member is attached by inserting the outer surface side force into the through hole, and on the outer surface of the conductor portion of the mounting member and the main body portion. You may make it electrically connect with the formed conductor pattern.
  • the mounting member and the mounting member mounting portion may be integrated by fitting.
  • FIG. 1 is an external view of a vein pattern acquisition device according to the first embodiment of the present invention.
  • (A) is a top view
  • (b) is a front view
  • (c) is a back view.
  • FIG. 2 is a cross-sectional view of FIG. 1, where (a) is a cross-sectional view of Ila-Ila, (b) is a cross-sectional view of lib-lib, (c) is a cross-sectional view of lie-lie, and (d) Is an Ild-IId cross section, and (e) is a lie-lie cross section.
  • Fig. 3 is an external view (front view) of a vein pattern acquisition device that can be applied to a modification of the first embodiment of the present invention.
  • FIG. 4 is an external view (front view) of a vein pattern acquisition device according to a second embodiment of the present invention.
  • FIG. 5 is an external view (front view) of a vein pattern acquisition device according to a third embodiment of the present invention, where (a) is an overall view, and (b) is part A in (a).
  • FIG. 5 is an external view (front view) of a vein pattern acquisition device according to a third embodiment of the present invention, where (a) is an overall view, and (b) is part A in (a).
  • FIG. 6 is an external view of a vein pattern acquisition device according to a fourth embodiment of the present invention, where (a) is a plan view and (b) is a side view.
  • FIG. 7 is an external view of a vein pattern acquisition device that is a modification of the fourth embodiment of the present invention, and (a) is a Vila-Vila cross-sectional view of (b), (b) Is a side view.
  • Fig. 8 is an external view of a vein pattern acquisition device according to a fifth embodiment of the present invention, in which (a) is a side view of the main body folded, and (b) is a development of the main body. (C) is a side view (from arrow B in (b)) from another angle with the main body extended.
  • Fig. 9 is a diagram showing a conductor pattern formed on the surface of the main body portion of the vein pattern acquisition device according to the fifth embodiment of the present invention, wherein (a) is a side view, (b) Is a side view from another angle (view D in (a)).
  • FIG. 10 is an external view of a vein pattern acquisition device according to a sixth embodiment of the present invention, where (a) is a top view, (b) is a side view, and (c) is a front view. .
  • FIG. 11 is an exploded side view enlarging part B of FIG.
  • FIG. 12 is an exploded side view enlarging part C of FIG.
  • FIG. 1 is an external view of a vein pattern acquisition device according to a first embodiment of the present invention, where (a) is a top view, (b) is a front view, and (c) is a back view.
  • 2 is a cross-sectional view of FIG. 1, where (a) is a cross-sectional view of Ila-Ila, (b) is a cross-sectional view of lib-lib, (c) is a cross-sectional view of lie lie, and (d) Is a lid-lid cross-sectional view, and (e) is a lie-lie cross-sectional view.
  • FIG. 1 (b) is defined as the front surface
  • FIG. 1 (c) is defined as the back surface.
  • the vein pattern acquisition device 1 which is effective in this embodiment is a three-dimensional circuit component (MID: Molded
  • the light source 3, the image sensor 4 and the circuit element 5 are directly mounted on the main body 2 configured as an Interconnect Device).
  • the main body 2 can be obtained by molding a resin material into a predetermined shape by, for example, injection molding and forming the conductor pattern 6 on the surface.
  • a resin material for example, UV exposure (Subtractive method, semi-additive method, additive method, etc.), laser imaging method, IVOND method, etc., one-time molding method, SKW method, etc., two-time molding method, etc.).
  • the base material it can be used, for example 30% (wt 0/0) fiberglass containing the PEE K (poly E chill ether ketone) resins.
  • the vein pattern acquisition device 1 can be easily compared to a case where a light source or an image sensor is attached to a simple housing or a flat substrate. Since it is possible to reduce the number of mounting brackets, wiring (lead wires), connectors, etc., and it can be omitted, it can be made smaller and lighter. There is also an advantage of being able to do it.
  • the main body 2 has a through hole 2a having a substantially circular cross section as a finger passage portion and is formed in a substantially annular shape (ring shape), and a light source 3 and an imaging device are formed on the inner wall surface 2b.
  • Element 4 is mounted.
  • a conductor pattern 6 is formed on the surface 2c including the inner wall surface 2b, and is used as wiring for electrically connecting the light source 3, the image sensor 4 and the circuit element 5 to operate.
  • a light source (for example, a near infrared LED bare chip having an output wavelength of 850 nm) 3 is disposed on the upper side of the through hole 2a, and is mounted on the bottom surface of a substantially mortar-shaped recess 2d provided on the inner wall surface 2b.
  • the concave portion 2d (particularly the side surface) may be appropriately treated with copper or the like to form a reflection surface that directs light from the light source 3 in a predetermined direction.
  • the image pickup device 4 is disposed below the through hole 2a.
  • the image pickup device 4 is mounted in a state of being accommodated in a belt-like concave groove 2e provided at a lower portion of the inner wall surface 2b. .
  • This groove 2 e elongates substantially along the circumferential direction (tangential direction) of the inner wall surface 2b of the through hole 2a, and its bottom surface 2f is formed flat.
  • the image pickup device 4 has a flat, strip-like, strip-like appearance that extends in a straight line, and is mounted on the bottom surface 2f of the groove 2e.
  • As the image sensor 4 an element in which dies are arranged in a lattice pattern can be used.
  • a circuit element (an element forming at least a part of an arithmetic processing circuit; for example, an integrated circuit) 5 is mounted in a state of being accommodated in a recess 2 h formed on the upper surface 2 g of the main body 2.
  • Reference numeral 10 denotes a female connector formed as a bottomed cylindrical recess into which a male connector pin (not shown) is inserted.
  • the light source 3 and the imaging element 4 are opposed to each other vertically on the inner wall surface 2b of the through hole 2a with the center (axial center) of the through hole 2a interposed therebetween. It is arranged. For this reason, the light emitted from the light source 3 enters the inside of the finger passed through the through hole 2 a and is transmitted therethrough and is received by the image sensor 4. In addition, according to the force and the layout, since a finger is interposed between the light source 3 and the image sensor 4, the light from the light source 3 is prevented from directly entering the image sensor 4 by the finger. .
  • the imaging device 4 is formed in an elongated strip shape substantially along the circumferential direction (tangential direction) of the inner wall surface 2b of the through hole 2a, the thickness of the main body 2 is set to the through hole 2a.
  • the main body 2 can be formed thin, and the vein pattern acquisition device 1 can be further miniaturized.
  • the finger is repeatedly imaged at a predetermined timing (fixed timing) according to the finger being inserted into the through hole 2a. If the image information for each position in the longitudinal direction is acquired (scanned) and stored in a memory (not shown), and the information obtained by combining the information at each position is used for identity verification, the vein pattern Personal characteristics can be easily obtained, and the accuracy of identity verification can be improved as compared with the case where identity verification is performed based on image information corresponding to the width of the image sensor 4.
  • FIG. 3 is an external view (front view) of a vein pattern acquisition device that can be applied to a modification of the present embodiment.
  • the circuit element 5 is mounted in a state where it is housed in a recess provided on the side surface 2i of the main body 2A. in this way, The circuit element 5 may be provided at any position in the main body 2A.
  • the conductor pattern is not shown, and the same components are denoted by the same reference numerals.
  • FIG. 4 is an external view (front view) of a vein pattern acquisition device according to a second embodiment of the present invention.
  • the vein pattern acquisition device 1B which is effective in the present embodiment, has the same components as the vein pattern acquisition device 1 according to the first embodiment. Accordingly, common reference numerals are given to those similar components, and redundant description is omitted below.
  • the conductor pattern is not shown.
  • substantially mortar-shaped recesses 2d are formed at two locations on the left and right of the inner wall surface 2b of the through hole 2a, and the bottom surface of each recess 2d
  • Light sources 3 and 3 are mounted on the top. These light sources 3 and 3 (recesses 2d and 2d) are arranged apart from each other in the circumferential direction of the through-hole 2a and symmetrically about the vertical center line C, and in FIG. As shown by broken line arrows, the light emitted from the light sources 3 and 3 without the finger is arranged so as to be directed to the central axis (axial center) O of the through hole 2a.
  • the strength of the light source and the structure of the light source will change the angle of the light incident on the finger from each light source 3, and the personal characteristics of the vein pattern will be more apparent in three dimensions, improving the accuracy of identity verification.
  • the power S to do The power S to do.
  • FIG. 5 is an external view (front view) of a vein pattern acquisition device according to a third embodiment of the present invention, where (a) is an overall view, and (b) is (a). It is the elements on larger scale in the A section in).
  • the device for obtaining vein pattern 1C that is effective in the present embodiment has the same components as those in the device for acquiring vein pattern 1 that is effective for the first embodiment. Therefore, the same reference numerals are given to the same constituent elements, and redundant description is omitted below.
  • the conductor pattern is not shown.
  • the reflecting surface reflects the incident light toward the imaging device 4 on the inner wall surface 2b of the through hole 2a formed in the main body portion 2C.
  • the side walls at both ends in the longitudinal direction of the belt-shaped concave groove 2e in which the image sensor 4 is accommodated are inclined surfaces 2m and 2m that extend toward the opening side, and the inclined surfaces 2m and 2m are made of copper or the like.
  • the reflection surface of the light is formed by performing the plating process.
  • the image sensor 4 can acquire image information for a wider range by providing the inclined surfaces 2m and 2m as the reflecting portions, and accordingly, the vein pattern can be obtained accordingly. Since personal characteristics are easy to appear, the accuracy of identity verification can be improved. In addition, there is an advantage that the imaging element 4 and the main body 2 can be downsized!
  • FIG. 6 is an external view of a vein pattern acquisition device according to a fourth embodiment of the present invention, where (a) is a plan view and (b) is a side view.
  • the vein pattern acquisition device 1D according to the present embodiment has the same components as the vein pattern acquisition device 1 according to the first embodiment. Therefore, the same reference numerals are given to the same constituent elements, and redundant description is omitted below. In FIG. 6, the conductor pattern is not shown.
  • the vein pattern acquisition device 1D which is effective in the present embodiment, has a main body 2D having a configuration similar to that of the main body 2, 2A, 2B, 2C of the first to second embodiments (however, the circuit element 5 is included). And a circuit board portion 7D on which an arithmetic processing circuit (including the circuit element 5; not shown as a whole) for performing predetermined arithmetic processing on the image information acquired by the image sensor 4 is mounted. Equipped with an integrally molded substrate unit 8D!
  • the circuit board portion 7D has a substantially rectangular flat plate-like appearance.
  • a protruding portion having a large thickness (a high height) is formed on a portion of the upper surface 7a, and the protruding portion serves as a main body portion 2D. It is configured.
  • an arithmetic processing circuit (not shown) is mounted in the mounting area 11 on the upper surface 7a side.
  • the main body 2D and the circuit board 7D are provided separately, and the main body 2D and the circuit board 7D are separately configured to be mutually connected. Compared to connecting to, the entire vein pattern acquisition device 1D can be downsized. In addition, since there is no need to set a connector between the main body 2D and the circuit board 7D, there is an advantage that it contributes to a reduction in manufacturing cost.
  • FIG. 7 is an external view (front view) of a device for acquiring a vein pattern that is effective in a modification of the present embodiment.
  • (A) is a plan view from below (Vila-Vila cross-sectional view of (b)), and (b) is a side view.
  • the board unit 8E of the vein pattern acquisition device 1E which is powerful in this modification, the position and orientation (orientation) of the main body 2E with respect to the circuit board 7E are different, and the main body 2E of the circuit board 7E is projected. Except for the point that the surface (lower surface) 7b is different from the surface (upper surface) 7a on which circuit components and the like are mounted, this embodiment is exactly the same as the vein pattern acquisition device 1D.
  • the conductor pattern is not shown, and the same components are denoted by the same reference numerals.
  • FIG. 8 is an external view of a vein pattern acquisition device according to a fifth embodiment of the present invention, in which (a) is a side view of a state where the main body is folded, and (b). Is a side view with the main body extended, (c) is a side view from another angle with the main body extended (arrow B in (b)), and FIG. It is a figure which shows the conductor pattern formed in the surface of (a), (a) is a side view, (b) is a side view from another angle (arrow D in (a)).
  • the vein pattern acquisition device 1F which focuses on the present embodiment, has the same components as the vein pattern acquisition device 1 according to the first embodiment. Therefore, common reference numerals are given to those similar components, and redundant description is omitted below. In FIG. 8, the conductor pattern is not shown.
  • the vein pattern acquisition device 1F that exerts a force on the present embodiment has a position where the main body 2F is in an upright posture with respect to the circuit board 7F by providing the board mechanism 8F with the hinge mechanism 9. It is characterized in that it can be rotated between a position substantially parallel to the circuit board portion 7F.
  • the hinge mechanism 9 can be configured as a hinge mechanism in which two members rotate relative to each other around the shaft 9c. In this part, the hinge mechanism 9 contacts the circumferential surface 9a that is in sliding contact with each other. By forming the conductor pattern 6 on both the contact surface 9b, electrical connection between the main body 2F side and the circuit board 7F side can be ensured at least during use.
  • the range in which the conductor pattern 6 is formed on the peripheral surface 9a or the contact surface 9b is appropriately adjusted, and only when the movable part of the main body 2F is raised, the peripheral surface 9a If the contact surface 9b is electrically connected, and the peripheral surface 9a and the contact surface 9b are not electrically connected in the folded state, the power S of the vein pattern acquisition device can be turned on at this portion.
  • the movable part itself of the main body 2F becomes a force S switch, it is not necessary to provide a separate power switch or the like, so that the configuration can be simplified and the power can be forgotten to be forgotten.
  • FIG. 10 is an external view of a vein pattern acquisition device according to a sixth embodiment of the present invention, where (a) is a top view, (b) is a side view, and (c) ) Is a front view, FIG. 11 is an exploded side view in which part B in FIG. 10 is enlarged, and FIG. 12 is an exploded side view in which part C in FIG. 10 is enlarged.
  • FIG. 10 (b) is defined as the front.
  • the vein pattern acquisition device 21, which is a force applied to the present embodiment, includes a main body 22, a light source mounting member 23, and an image sensor mounting member 26 configured as a three-dimensional circuit component (MID).
  • a light source 24 is mounted on the light source mounting member 23, and an image sensor 27 is mounted on the image sensor mounting member 26.
  • the semiconductor element 25 that controls each part is directly mounted on the main body part 22.
  • Each of the main body 22, the light source mounting member 23, and the image sensor mounting member 26 can be obtained by forming a resin material into a predetermined shape by, for example, injection molding and forming a conductor pattern 28 on the surface.
  • a resin material for example, UV exposure method (subtractive method, semi-additive method, additive method, etc.), laser imaging method (contour removal method, etc.), IVOND method, etc., one-time molding method, SKW method, etc. 2).
  • MID for example, UV exposure method (subtractive method, semi-additive method, additive method, etc.), laser imaging method (contour removal method, etc.), IVOND method, etc., one-time molding method, SKW method, etc. 2).
  • a base material what added various fillers to the aromatic polyamide resin material can be used, for example.
  • the main body 22, the light source mounting member 23, and the image sensor mounting member 26 are three-dimensional circuit components, the light source and the image sensor are attached to a simple housing or a flat substrate for wiring.
  • the vein pattern acquisition device 21 can be obtained easily, and the wiring (lead wire) and connectors can be reduced or omitted, making it smaller and lighter. There is a merit that it can be configured.
  • the main body 22 has a through hole 22a having a substantially circular cross section as a finger insertion portion, and is formed in a substantially annular shape (ring shape).
  • a conductive pattern 28 is formed on the surface (outer surface) such as the upper surface 22b, the lower surface 22e, and the side surface 22g, and the light source 24, the image sensor 27, and the semiconductor element 25 are electrically connected to operate. It is used as wiring for
  • the cylindrical through hole 22c passing vertically between the inner peripheral surface of the through hole 22a and the upper surface 22b is provided in the main body portion 22.
  • the light source mounting member 23 is fitted into the through hole 22c from the upper surface 22b side.
  • the light source mounting member 23 corresponds to a mounting member
  • the through hole 22c corresponds to a mounting member mounting portion.
  • the light source mounting member 23 includes a flange portion 23a and a substantially cylindrical insertion portion 23b.
  • the end surface (lower surface) 3c of the inserted portion 23b is In addition to being exposed in the through hole 22a, a part of the substantially cylindrical inner wall surface of the through hole 22a is formed.
  • a substantially mortar-shaped recess 23d is formed on the end surface 23c, and a light source (for example, a near infrared LED bare chip having an output wavelength of 850 nm) 24 is mounted on the bottom surface.
  • the concave portion 23d (especially the side surface) may be appropriately treated with gold or the like to form a reflecting surface that directs the light from the light source 24 in a predetermined direction (downward in the present embodiment).
  • concave grooves 23f, 23f extending in the vertical direction (the axial direction of the inserted portion 23b) are formed on the side surface of the inserted portion 23b.
  • a conductor pattern (conductor portion) 28c (28) is formed by force from the flange 23a to the bottom surface 23e of the flange portion 23a.
  • the conductor pattern 28c (28) formed on the bottom surface 23e of the flange 23a and the top surface 22b of the main body 22 are formed.
  • the conductor patterns 28a (28) are in contact with each other, and conduction is ensured between them.
  • the light source 24 is electrically connected to the conductor pattern 28c, the light source 24 is electrically connected to the semiconductor element 25 and the like on the main body 22 side via the conductor patterns 28c and 28a. It will be connected spiritually.
  • the conductor pattern 28c is formed on the bottom surface of the concave groove 23f, so that the light source mounting member 23 (the inserted portion 23b) is fitted into the through hole 22c.
  • the force S suppresses the conductor pattern 28c from being damaged by sliding with the inner wall.
  • the main body portion 22 as an image sensor mounting portion for mounting the image sensor mounting member 26, a rectangular cylindrical through hole penetrating vertically between the inner peripheral surface of the through hole 22a and the lower surface 22e. 22f is formed, and the imaging element mounting member 26 is fitted into the through hole 22f from the lower surface 22e side.
  • the imaging element mounting member 26 corresponds to a mounting member
  • the through hole 22f corresponds to a mounting member mounting portion.
  • the imaging element mounting member 26 has a flange portion 26a and a substantially rectangular columnar inserted portion 26b. On the end surface (upper surface) 26c of the inserted portion 26b, the circumferential direction (tangential line) of the through hole 22a.
  • a flat strip-shaped image sensor 27 that is elongated in a straight line substantially along (direction) is mounted.
  • the image pickup element 27 it is possible to use an element in which phototransistors are arranged in a lattice pattern in addition to CCD and CMOS.
  • a part of the side surface of the insertion portion 26b is notched to form a notch 26e, and a conductor pattern (conductor portion) is formed from the notch 26e to the flange 26a. ) 28d (28) is formed!
  • the imaging element mounting member 26 is inserted into the through hole 22f as far as it will go (until the flange portion 26a hits the lower surface 22e of the main body portion 22), the conductor pattern 28d formed on the bottom surface 26d of the flange portion 26a (28) and the conductor pattern 28b (28) formed on the lower surface 22e of the main body portion 22 are in contact with each other, and conduction is ensured between them.
  • the imaging element 27 is electrically connected to the conductor pattern 28d, the imaging element 27 is electrically connected to the semiconductor element 25 and the like on the main body 22 side via the conductor patterns 28d and 28b. Will be connected.
  • the conductor pattern 28d is formed in the notch 26e, so that when the imaging element mounting member 26 (the insertion portion 26b) is fitted into the through hole 22f, the inner wall of the through hole 22f It is possible to suppress the conductor pattern 28d from being damaged by sliding.
  • a semiconductor element an element forming at least a part of an arithmetic processing circuit; for example, an integrated circuit
  • a semiconductor element 25 is mounted in a state of being housed in a recess 22d formed in the upper surface 22b of the main body portion 22.
  • the light source 24 is disposed above the through hole 22a, while the image sensor 27 is disposed below the through hole 22a.
  • the light source 24 and the image sensor 27 face each other vertically. However, it faces the through hole 22a as a finger insertion portion formed in the main body portion 22.
  • the light source 24, the image sensor 27, and the center (axial center) of the force through hole 22a are arranged so as to face each other up and down.
  • the emitted light enters the inside of the finger passed through the through hole 22a and is transmitted therethrough and received by the image sensor 27.
  • the main body 22, the light source mounting member 23, and the image sensor mounting member 26 are solid circuit components, wiring between the light source 24 and the image sensor 27 (lead wire). Compared to the case of wiring, the manufacturing effort can be saved and the throughput can be improved.
  • the main body 22, the light source mounting member 23, and the image sensor mounting member 26 are configured as separate parts, and the light source mounting member 23 and the image sensor mounting member 26 as the mounting members are the light source 24 and the image sensor.
  • the element 27 is attached to the main body 22 so that the element 27 faces the inside of the through-hole 22a as a finger passage portion and is placed opposite to each other.
  • the desired layout of the light source 24 and the image sensor 27 can be easily obtained.
  • the light source 24 and the imaging device 27 are mounted so as to face the through hole 22a formed in the main body 22, so that the light source sandwiched between the fingers inserted into the through hole 22a.
  • 24 and the imaging element 27 are easily arranged opposite to each other to construct a so-called transmissive device, and it is not necessary to provide a partition wall between the light source 24 and the imaging element 27.
  • the acquisition device 21 can be configured more compactly. That is, when the light source and the image sensor are arranged on one side of the finger, or when the image sensor is arranged below the finger by arranging the light source on the side of the finger, the light from the light source is applied to the image sensor. In order to prevent direct incidence, it is necessary to place a partition wall between the light source and the image sensor, or to place the light source or the image sensor in the back of the recess. In this respect, it can be said that the layout of the present embodiment is advantageous.
  • the through hole 22a functions as a guide part for guiding the insertion of a finger, there is an advantage that the finger placement accuracy is increased and the ratio of obtaining an effective vein pattern is increased.
  • the light source mounting member 23 as the mounting member is fitted into the through hole 22c as the mounting member mounting portion formed in the main body portion 22, and the imaging element as the mounting member
  • the mounting member 26 By fitting the mounting member 26 into a through hole 22f as a mounting member mounting portion formed in the main body portion 22, the light source mounting member 23 and the image sensor mounting member 26 can be easily attached to the main body portion 22.
  • the mounting position accuracy can be maintained relatively high because the positional deviation can be suppressed by fitting.
  • the mounting member (the light source mounting member 23, the imaging element mounting member 26) is inserted into the through holes 22c, 22f from the outer surface (upper surface 22b, lower surface 22e) side and attached. Since the conductor portions (conductor patterns 28c, 28d) on the mounting member and the conductor patterns 28a, 28b formed on the outer surface of the main body portion 22 are electrically connected, the mounting member can be easily attached to the main body portion 22. In addition, it is possible to perform the process of electrically connecting the conductor portions (conductor patterns 28c, 28d) of the mounting member and the conductor patterns 28a, 28b of the main body 22 on the outer surface of the main body 22. There is an advantage.
  • the thickness of the main body portion 22 is set to the thickness of the through hole 22a.
  • Axial direction The body part 22 can be formed thin, and the vein pattern acquisition device 21 can be further miniaturized.
  • the vein pattern acquisition device of Patent Document 1 has a configuration in which a light source and a camera are attached to a housing.
  • wiring (lead) between the light source, the imaging device, the semiconductor device, and the substrate is used. If the wire is routed, the manufacturing labor force S reduces the throughput and increases the manufacturing cost.
  • the manufacturing effort is reduced by using the three-dimensional circuit components. In addition to being able to save, a light source and an image sensor can be more easily mounted.
  • the power source mounting member or the image sensor mounting member is illustrated as a configuration in which the image sensor mounting member is mounted in the radial direction of the finger passage portion.
  • the members may be bonded to each other more firmly by bonding or welding appropriately after the fitting.
  • either the light source or the image sensor may be directly mounted on the main body.
  • the present invention can be used for a device that acquires a vein pattern.

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  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Surgery (AREA)
  • Public Health (AREA)
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Abstract

La présente invention concerne un dispositif permettant d'obtenir un réseau veineux, qui comprend une partie corps (2) comprenant un composant de circuit tridimensionnel formé par obtention d'un motif conducteur (6) sur la surface d'une structure tridimensionnelle. Un trou traversant (2), correspondant à une partie insertion de doigt par laquelle un doigt est inséré, est formé dans la partie corps (2). Une source lumineuse (3), destinée à exposer un doigt inséré dans le trou traversant (2a) à un rayonnement à l'aide d'une lumière, et un élément d'imagerie (4), destiné à former une image de la lumière transmise par rapport à la lumière émise par la source lumineuse (3) et transmise à travers le doigt, sont directement montés sur une surface de paroi interne (2b) du trou traversant (2a). La précision de la position de l'installation de la source lumineuse et de l'élément d'imagerie ne cesse de s'améliorer.
PCT/JP2007/069733 2006-10-11 2007-10-10 Dispositif permettant d'obtenir un réseau veineux WO2008044697A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2006277489A JP2008093143A (ja) 2006-10-11 2006-10-11 静脈パターン取得デバイス
JP2006-277489 2006-10-11
JP2006-304079 2006-11-09
JP2006304079A JP2008123099A (ja) 2006-11-09 2006-11-09 静脈パターン取得デバイス

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WO2008044697A1 true WO2008044697A1 (fr) 2008-04-17

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2186467A1 (fr) * 2008-11-18 2010-05-19 UMC Utrecht Holding B.V. Appareil et procédé pour déterminer la position d'une veine ou d'une artère
WO2017026446A1 (fr) * 2015-08-10 2017-02-16 日本電気株式会社 Support, dispositif d'authentification, procédé d'authentification et programme
WO2023223950A1 (fr) * 2022-05-17 2023-11-23 株式会社ジャパンディスプレイ Dispositif de détection

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JP2003058509A (ja) * 2001-08-15 2003-02-28 Sony Corp 認証処理システム、認証処理方法、および認証デバイス、並びにコンピュータ・プログラム
JP2003093368A (ja) * 2001-09-20 2003-04-02 Sony Corp リング型認証デバイス、認証システム
JP2004241752A (ja) * 2002-05-14 2004-08-26 Canon Inc 指紋入力装置及びその製造方法
WO2005017828A1 (fr) * 2003-08-13 2005-02-24 Hitachi, Ltd. Dispositif d'identification personnelle
JP2005242907A (ja) * 2004-02-27 2005-09-08 Casio Comput Co Ltd リング型読み取り装置
JP2006165987A (ja) * 2004-12-07 2006-06-22 Casio Comput Co Ltd 電子カメラ

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Publication number Priority date Publication date Assignee Title
JP2003058509A (ja) * 2001-08-15 2003-02-28 Sony Corp 認証処理システム、認証処理方法、および認証デバイス、並びにコンピュータ・プログラム
JP2003093368A (ja) * 2001-09-20 2003-04-02 Sony Corp リング型認証デバイス、認証システム
JP2004241752A (ja) * 2002-05-14 2004-08-26 Canon Inc 指紋入力装置及びその製造方法
WO2005017828A1 (fr) * 2003-08-13 2005-02-24 Hitachi, Ltd. Dispositif d'identification personnelle
JP2005242907A (ja) * 2004-02-27 2005-09-08 Casio Comput Co Ltd リング型読み取り装置
JP2006165987A (ja) * 2004-12-07 2006-06-22 Casio Comput Co Ltd 電子カメラ

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2186467A1 (fr) * 2008-11-18 2010-05-19 UMC Utrecht Holding B.V. Appareil et procédé pour déterminer la position d'une veine ou d'une artère
WO2017026446A1 (fr) * 2015-08-10 2017-02-16 日本電気株式会社 Support, dispositif d'authentification, procédé d'authentification et programme
JPWO2017026446A1 (ja) * 2015-08-10 2018-07-05 日本電気株式会社 装着体、認証装置、認証方法およびプログラム
US10567378B2 (en) 2015-08-10 2020-02-18 Nec Corporation Mount, authentication device, authentication method, and program
US11032276B2 (en) 2015-08-10 2021-06-08 Nec Corporation Mount, authentication device, authentication method, and program
JP2021108232A (ja) * 2015-08-10 2021-07-29 日本電気株式会社 装着体、認証装置、認証方法およびプログラム
JP2022101578A (ja) * 2015-08-10 2022-07-06 日本電気株式会社 装着体、認証方法およびプログラム
US11601424B2 (en) 2015-08-10 2023-03-07 Nec Corporation Mount, authentication device, authentication method, and program
JP7371720B2 (ja) 2015-08-10 2023-10-31 日本電気株式会社 装着体、認証方法およびプログラム
WO2023223950A1 (fr) * 2022-05-17 2023-11-23 株式会社ジャパンディスプレイ Dispositif de détection

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