WO2008026169A1 - Appareil de saisie d'image d'empreinte digitale - Google Patents

Appareil de saisie d'image d'empreinte digitale Download PDF

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Publication number
WO2008026169A1
WO2008026169A1 PCT/IB2007/053467 IB2007053467W WO2008026169A1 WO 2008026169 A1 WO2008026169 A1 WO 2008026169A1 IB 2007053467 W IB2007053467 W IB 2007053467W WO 2008026169 A1 WO2008026169 A1 WO 2008026169A1
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WO
WIPO (PCT)
Prior art keywords
led chip
finger
imaging device
solid state
state imaging
Prior art date
Application number
PCT/IB2007/053467
Other languages
English (en)
Inventor
Junji Imai
Mitsuru Kobayashi
Original Assignee
Panasonic Electric Works Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Electric Works Co., Ltd. filed Critical Panasonic Electric Works Co., Ltd.
Publication of WO2008026169A1 publication Critical patent/WO2008026169A1/fr

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/10—Image acquisition
    • G06V10/12—Details of acquisition arrangements; Constructional details thereof
    • G06V10/14—Optical characteristics of the device performing the acquisition or on the illumination arrangements
    • G06V10/145—Illumination specially adapted for pattern recognition, e.g. using gratings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards

Definitions

  • This invention relates to fingerprint image input apparatus to input the fingerprint image for fingerprint authentication.
  • Fingerprint is a pattern formed by many structures that the skin called ridge protrude in lines. Fingerprint is a form of concentric circle generally, but each ridge is bifurcated or ended here and there so as to form a complicated pattern. The bifurcation or ending parts of the ridge are called minutiae, and the comparison of position, type and direction of this minutiae is the fundamental principle of fingerprint authentication.
  • fingerprint image input method to extract the minutiae there are many methods including optical methods and electrostatic capacity methods. And each method has a strength and weakness.
  • optical method it is forced to use optical components like lens to have a focusing distance and also miniaturize it. But, it has an advantage that it can input a wider range of a fingerprint image compared with electrostatic capacity method.
  • patent literature 1 As an optical fingerprint image input apparatus like this, there are apparatuses disclosed in patent literature 1 and patent literature 2.
  • the prior art written in patent literature 1 is related to an apparatus wherein LED emits light from the side direction to the finger placed on the trigonal prism, the light is reflected on the surface of finger through the prism, and CCD camera receives this light to shoot the fingerprint image and to input it.
  • the prior art written in patent literature 2 is related to an apparatus wherein LED chip as a light source is mounted on semiconductor board having solid state imaging device like CCD or CMOS, and the solid state imaging device receives the light that is emitted from the LED chip to the inner part of the finger and is scattered in the inner part of the finger. And it can be made in smaller size than the prior art written in patent literature 1.
  • This invention was invented considering these circumstances, and the purpose of this invention is to provide the fingerprint image input apparatus wherein the degree of freedom in arrangement of LED chip is increased and illuminating the proper position of finger is easy.
  • the invention of claim 1 provides a two dimensional solid state imaging device, a cover made of light-transmittable plate, installed in the position confronting the solid state imaging device and on which finger is placed, a plurality of LED chips illuminating the finger placed on the cover, and a three dimensional circuit board in which conducting pattern is formed, the solid state imaging device and LED are mounted on the interior, and the cover is installed in the surface, wherein the plurality of LED chips are mounted on the three dimensional circuit board so that the optical axis of each LED chip crosses the optical axis of light-receiving surface of the solid state imaging device.
  • the invention of claim 2 provides a one dimensional solid state imaging device, a cover made of light-transmittable plate, installed in the position confronting the solid state imaging device and through which finger is scanned, a plurality of LED chips illuminating the finger contacted with the cover, and a three dimensional circuit board in which conducting pattern is formed, the solid state imaging device and LED are mounted on the interior, and the cover is installed in the surface, wherein the a plurality of LED chips are mounted on the three dimensional circuit board so that the chips are positioned symmetrically holding the solid state imaging device between them along the scan direction of finger.
  • the invention of claim 4 provides one or a plurality of LED chip, a half mirror installed in the position confronting the LED chip, a solid state imaging device installed in the position confronting the half mirror so that the optical axis of light-receiving surface crosses the optical axis of the LED chip, a cover made of light-transmittable plate, installed in the position confronting the LED chip holding the half mirror between them, and on which finger is placed or through which finger is scanned, and a three dimensional circuit board in which conducting pattern is formed, the solid state imaging device and LED are mounted on the interior, and the cover is installed in the surface.
  • the arrangement position of light emitting diode chip is not restricted by the shape or size of board. And since it is easy to mount LED chip so that the optical axis of LED chip is inclined with respect to that of light-receiving surface of solid state imaging device, it is easy to illuminate the finger in the proper position, and, as a result, the accuracy of fingerprint image input can be enhanced by illuminating the finger uniformly.
  • Fig. 1 shows the embodiment 1 of this invention, (a) is a front view in a state of placing finger, (b) is a right cross section in a state of placing finger, (c) is a upper cross section in a state of placing finger.
  • Fig. 2 shows the embodiment 1 of this invention, (a) is a front view, (b) is a upper view, (c) is a lower cross section, (d) is a right cross section, (e) is a left side view, (f) is a rear side view, (g) is a right side view.
  • Fig. 3 shows the embodiment 2 of this invention, (a) is a front view in a state of placing finger, (b) is a right cross section in a state of placing finger, (c) is a upper cross section in a state of placing finger.
  • Fig. 4 shows the embodiment 2 of this invention, (a) is a front view, (b) is a upper view, (c) is a lower cross section, (d) is a right cross section, (e) is a left side view, (f) is a rear side view, (g) is a right side view.
  • Fig. 5 shows the embodiment 3 of this invention, (a) is a front view in a state of placing finger, (b) is a right cross section in a state of placing finger, (c) is a upper cross section in a state of placing finger.
  • Fig. 6 shows the embodiment 3 of this invention, (a) is a front view, (b) is a upper view, (c) is a right cross section, (d) is a lower side view, (e) is a lower cross section, (f) is a upper cross section, (g) is a left side view, (h) is a rear side view, (i) is a right side view.
  • Fig. 7 shows the embodiment 4 of this invention, (a) is a front view in a state of placing finger, (b) is a right cross section in a state of placing finger, (c) is a upper cross section in a state of placing finger.
  • Fig. 8 shows the embodiment 4 of this invention, (a) is a front view, (b) is a upper view, (c) is a right cross section, (d) is a lower side view, (e) is a lower cross section, (f) is a upper cross section, (g) is a left side view, (h) is a rear side view, (i) is a right side view.
  • Fig. 9 shows the embodiment 5 of this invention, (a) is a front view in a state of placing finger, (b) is a right cross section in a state of placing finger, (c) is a upper cross section in a state of placing finger.
  • Fig. 10 shows the embodiment 5 of this invention, (a) is a front view, (b) is a upper view, (c) is a lower cross section, (d) is a right cross section, (e) is a left side view, (f) is a rear side view, (g) is a right side view, (h) is a lower side view.
  • This embodiment referring to Fig.l and Fig.2, includes two dimensional solid state imaging device(CCD or two dimensional image sensor of MOS type, etc.)(l), lens(2) making image of fingerprint on the light-receiving surface of the solid state imaging device(l), cover(4) made of light- transmittable plate(for example, glass plate), and mounted on the position confronting to the solid state imaging device(l), and contacted with finger(F), a plurality (four in the schematic example) of light emitting diode chips(called I LED chip J hereinafter) (3) illuminating the finger(F) placed on the cover(4), and three dimensional circuit board(5) in which conducting pattern(6) is formed, solid state imaging device(l), lens(2) and LED chip(3) are mounted on the interior, and cover(4) is mounted on the surface. Also, we define the direction of top, bottom, right and left in Fig. 2(c) and define the top in Fig. 2(a) as inner part, the bottom in Fig. 2(a) as front part.
  • Three dimensional circuit board(5) is made of synthetic resin molding formed by a body part(50) having a flat polyhedron shape, a protruding support part(51,51) that is protruded from the inside wall surface of inner part and front part among the pair of inside wall surface of a body part(50) in parallel with said inside wall, and that has an inclined surface inclined from the upper end to the lower end of inside wall, and protruding plate part(52,52) that is protruded from the inside wall surface of both right and left side in parallel with said inside wall, and that is smaller than protruding support part(51) in thickness of top and bottom direction.
  • the conducting pattern(6) is formed on the required position in the body part(50), protruding support part(51,51) and protruding plate part(52,52) respectively(refer to Fig. X).
  • a synthetic resin material forming a three dimensional circuit board(5) for example, PEEK(poly ether ether ketone) mixed with glass is used.
  • three dimensional board(5) is not limited to a synthetic resin molding body, and ceramic board formed with ceramics like alumina, or metal core board where the insulating layer is formed on the surface of metal board may be used.
  • solid state imaging device(l) is placed on the lower side of protruding plate part(52) in the form that the light-receiving surface faces the window hole(53), and the lens (2) is placed on the upper side of protruding plate part(52) so as to cover the window hole(53).
  • the lens(2) is formed in the center of a rectangular plate in a single body with said plate, and confronts said solid state imaging device(l) holding the window hole(53) between them.
  • the optical axis of lens(2) is set to be coincident with the optical axis of light-receiving surface of the solid state imaging device(l)(refer to Fig. l(b) dashed line a).
  • LED chip(3) emits light such as visible light, infrared light, near infrared light, etc. According to the characteristics of light-receiving sensitivity LED chip(3) is mounted on a bowl shaped mounting part(51a) formed in a upper surface (inclined surface) of a pair of intruding support part(51,51), and said LED chip(3) is inclined so that the optical axis of LED chip(refer to Fig. l(b) dashed line b) crosses the optical axis of lens (2) and light-receiving surface of solid state imaging device(l) in the upper direction of the lens(2). On the inner surface of said mounting part(51a), the material with high reflectivity is coated so as to form a reflection mirror. And LED chip (3) is sealed by light-transmittable synthetic resin, which is not drawn.
  • FIG. 4(c) top, bottom, right and left direction is defined, and in Fig. 4(a), the top is defined as inner part and the bottom is defined as front part.
  • Three dimensional circuit board(5) has a body part(50) formed with a polyhedron pillar shape and a open upper surface. In the center of inside bottom surface to downward direction in the body part(50), containing concave part(54) with narrow width is formed, and the width of longitudinal direction of the containing concave part(54) is set to be coincident with the width of the lateral direction.
  • Solid state imaging device(l) is a one dimensional (line) image censor that the pixel number in width direction is small enough in comparison with that in length direction, and is contained in the containing concave part(54) of three dimensional circuit board(5).
  • LED chips(3) emitting red light are placed in the both end of the inside bottom surface of body part(50), having a certain distance in lateral direction, holding containing concave part(54) between the LED chips(3). And it is mounted in the state of being inclined so that the optical axis of LED chips(3)(refer to Fig. 3(b) dashed line b) includes the optical axis of light-receiving surface of solid state imaging device(l) and the optical axis of LED chip(3) crosses the plane(refer to Fig. 3(b) dashed line a) parallel to the longitudinal direction of solid state imaging device(l).
  • the optical axis of LED chip(3) includes the optical axis of light-receiving surface of solid state imaging device(l) and crosses with plane parallel to the longitudinal direction of solid state imaging device(l) in the upper direction of cover(4), it can be possible to illuminate the finger(F) uniformly, so that accuracy of fingerprint image input is enhanced. It is preferable to incline the LED chip(3) so that the cross point of the optical axis of each LED chip(3) and said plane is placed in the position near the surface of cover (4).
  • the board mounting LED chip(3) is also three dimensional circuit board(5) like embodiment 1, the arrangement position of LED chip(3) is not restricted by the shape or size of the board in comparison with two dimensional(plane) board. So the degree of freedom in arrangement of LED chip(3) is increased, LED chip(3) can be easily mounted so that the optical axis of LED chip(3) is inclined with respect to the optical axis of light-receiving surface of solid state imaging device(l), and the finger(F) is easily illuminated in the proper position. And it can be possible to set the relative position of solid state imaging device(l), lens(2) and LED chip(3) with high accuracy by using three dimensional circuit board(5). As a result, this invention has the advantage to enhance the accuracy of fingerprint image input since it enables the finger to be illuminated uniformly.
  • FIG. 6(f) top, bottom, right and left direction is defined, and in Fig. 6(a), the top is defined as inner part and the bottom is defined as front part.
  • solid state imaging device(l) and lens(2) are mounted on the window hole(53) which is formed in the center of body part(50) of three dimensional circuit board(5), the window hole(53) is closed by cover(4), and the protruding support part(55,55) which protrudes to front and inner side in the body part(50) is formed in a single body with body part(50).
  • a groove(55a) of which the cross sectional shape is nearly V is formed in the lateral direction, and in the inclined surface of the outside of each groove(55a), two mounting parts(55b) shaped like a bowl are provided respectively at the center in the lateral direction, and LED chip(3) is mounted on each mounting part(55b).
  • each LED chip(3) is mounted on the mounting part(55b) in the state of being inclined so that the optical axis(refer to Fig. 5(b) dashed line b) crosses with the optical axis of lens (2) and light-receiving surface of solid state imaging device(l) in the upper direction of lens(2). And on the inner surface of mounting part(55b), the material with relatively high reflectivity is coated so as to form a reflection mirror.
  • the average skin thickness of human finger is about 4mm, it is preferable to incline LED chip(3) so that the cross point of the optical axis of each LED chip(3), the optical axis of lens(2) and the optical axis of light-receiving surface of solid state imaging device(l) is in the position near the center of the finger(F)(about 2mm in the upper surface of cover(4)) being placed on the cover(4).
  • the board mounting LED chip(3) is also three dimensional circuit board(5) like embodiment 1 or 2, the arrangement position of LED chip(3) is not restricted by the shape or size of the board in comparison with two dimensional(plane) board. So the degree of freedom in ar- rangement of LED chip(3) is increased, LED chip(3) can be easily mounted so that the optical axis of LED chip(3) is inclined with respect to the optical axis of light- receiving surface of solid state imaging device(l), and the finger(F) is easily illuminated in the proper position. Also it can be possible to set the relative position of solid state imaging device(l), lens(2) and LED chip(3) with high accuracy by using three dimensional circuit board(5). As a result, this invention has the advantage to enhance the accuracy of fingerprint image input since it enables the finger to be illuminated uniformly.
  • FIG. 7 and Fig. 8 this embodiment is explained.
  • This embodiment is a combination of embodiment 2 and 3.
  • As fundamental structure of this embodiment is almost in common with embodiment 1-3, even if the shape or size are different, identical number is given to the component having identical function, and the explanation is omitted.
  • Fig. 8(f) top, bottom, right and left direction is defined, and in Fig. 8(a), the top is defined as inner part and the bottom is defined as front part.
  • each two LED chip(3) is arranged in the symmetrical position holding the solid state imaging device(l) between them along the scanning direction of finger(F), the optical axis of LED chip(3) includes the optical axis of light-receiving surface of solid state imaging device(l) and crosses with plane parallel to the length direction of solid state imaging device(l) in the upper direction of cover(4), it can be possible to illuminate the finger(F) uniformly, so that accuracy of fingerprint image input is enhanced.
  • the board mounting LED chip(3) is also three dimensional circuit board(5) like embodiment 1-3, the arrangement position of LED chip(3) is not restricted by the shape or size of the board in comparison with two dimensional(plane) board.
  • LED chip(3) can be easily mounted so that the optical axis of LED chip(3) is inclined with respect to the optical axis of light-receiving surface of solid state imaging device(l), and the finger(F) is easily illuminated in the proper position.
  • it can be possible to set the relative position of solid state imaging device(l), lens(2) and LED chip(3) with high accuracy by using three dimensional circuit board(5).
  • this invention has the advantage to enhance the accuracy of fingerprint image input since it enables the finger to be illuminated uniformly.
  • This embodiment includes one or a plurality of LED chip (10) (four in the figure), half mirror(l 1) arranged to confront LED chip(l ⁇ ), two dimensional solid state imaging device(12), cover(13), and three dimensional circuit board(14).
  • Said two dimensional solid state imaging device(12) is arranged to confront half mirror(l 1), so that the optical axis of the light-receiving surface is crossed with the optical axis of LED chip(l ⁇ ).
  • Said cover(13) is made of light-transmittable plate(for example, glass plate), arranged to confront to LED chip(l ⁇ ) holding half mirror(l 1) between them, and contacted with finger(F).
  • Said three dimensional circuit board(14) is made of synthetic resin molding body in which conducting pattern(15) is formed, LED chip(l ⁇ ), half mirror(l 1) and lens(16) are mounted inside the board, and solid state imaging device(12) and cover(13) are mounted on the surface thereof.
  • FIG. 10(c) top, bottom, right and left direction is defined, and in Fig. 10(a), the top is defined as inner part and the bottom is defined as front part hereinafter.
  • Three dimensional circuit board(14) has the shape of box in which rectangular window hole(20) is formed in the upper surface.
  • Concave part(21) shaped like a truncated cone is formed in the center of the inside bottom surface of three dimensional circuit board(14) confronted to window hole(20), and four LED chip(l ⁇ ) are mounted on 2 row, 2 column in the center of the bottom surface of concave part(21).
  • three dimensional circuit board(14) In the side surface of front part of three dimensional circuit board(14), circular hole(22) is penetrated, and the solid state imaging device(12) is mounted on the outside wall surface of three dimensional circuit board(14) in the form of covering said circular hole(22), also, the lens(16) is mounted on the inside wall surface of three dimensional circuit board(14) in the form of covering said circular hole(22). Said lens(16) is identical with the lens(2) of embodiment 1, the optical axis of it is in common with that of light-receiving surface of solid state imaging device(12).
  • Three dimensional circuit board(14) is not restricted to synthetic resin molding body, and ceramic board formed with ceramics like alumina, or metal core board where the insulating layer is formed on the surface of metal board may be used.
  • Half mirror(l 1) is fixed in the interior of three dimensional circuit board(14) in a state of being tilted by 45° with respect to the optical axis of solid state imaging device(12), lens(16) and the optical axis of LED chip(l ⁇ ) respectively.
  • assembling groove(14a) in which lower end of half mirror(l 1) is fitted is formed in the inside wall surface of the lower side of three dimensional circuit board(14).
  • support part(14b) that is contacted with the upper end of half mirror to support it, is formed.
  • the assembling groove(14a) and the support part(14b) enable the half mirror(l 1) to be easily positioned and fitted in the three dimensional circuit board(14).
  • Each LED chip(l ⁇ ) is mounted on the bottom surface of the concave part(21) so that the optical axis of each LED chip(l ⁇ ) cross with the optical axis of lens(16) at the half mirror (11), and nearly the center correspond to of the cover(4).
  • the number of LED chip(l ⁇ ) is not restricted to four, and being 3 and below or 5 and above is also acceptable in condition that the adequate amount of light can be obtained.
  • cutting part(14c) is formed in the inside wall surface around the window hole(20).
  • the cover(13) is bonded in the three dimensional circuit board(14) in a state of placing the end on the cutting part(14c).
  • IC(7) for controlling the light-emitting of LED is mounted to be buried. Said IC(7) is connected electrically to each LED chip(l ⁇ ) through the conducting pattern(15) which is formed in the outside wall surface or inside wall surface of three dimensional circuit board(14), and is mounted on the printed wiring board by other conducting pattern(15) formed in the lower surface of three dimensional circuit board( 14) (refer to Fig. 10(f)).
  • the board mounting LED chip (10) is three dimensional circuit board(14)
  • the arrangement position of LED chip(l ⁇ ) is not restricted by the shape or size of board in comparison with two dimensional board. So the degree of freedom in arrangement of LED chip(l ⁇ ) is enhanced, it is easy to set the position of the optical axis of LED chip(l ⁇ ), half mirror(l 1), lens(16) and light-receiving surface of solid state imaging device(12).
  • this invention has the advantage to enhance the accuracy of fingerprint image input since it enables the finger to be illuminated uniformly.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Multimedia (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Artificial Intelligence (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
  • Image Input (AREA)

Abstract

L'invention concerne un appareil de saisie d'image d'empreinte digitale, qui augmente le degré de liberté de configuration d'une puce DEL et facilite l'éclairage de la position idoine du doigt. Puisque la carte comportant la puce DEL (3) est une carte à circuit tridimensionnelle (5), la position de configuration de la puce DEL (3) n'est pas limitée par la forme ou la taille de la carte par comparaison avec une carte bidimensionnelle de la technique antérieure, ce qui augmente le degré de liberté de configuration de la puce DEL. Le procédé de l'invention facilite également l'installation de la puce DEL (3), si bien que l'axe optique de la puce est inclinée par rapport à l'axe optique d'une surface de réception de lumière d'un dispositif d'imagerie à semiconducteurs (1) pour éclairer la position idoine du doigt. Il est également possible de déterminer la position relative du dispositif d'imagerie à semiconducteurs (1), de la lentille (2) et de la puce DEL (3) avec une précision fine, grâce à la carte à circuit tridimensionnelle (5), ce qui permet donc d'éclairer de manière uniforme l'empreinte digitale et d'augmenter la précision de saisie de l'image de ladite empreinte.
PCT/IB2007/053467 2006-08-30 2007-08-29 Appareil de saisie d'image d'empreinte digitale WO2008026169A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006234392A JP4389911B2 (ja) 2006-08-30 2006-08-30 指紋像入力装置
JP2006-234392 2006-08-30

Publications (1)

Publication Number Publication Date
WO2008026169A1 true WO2008026169A1 (fr) 2008-03-06

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CN105528568A (zh) * 2015-06-19 2016-04-27 宸鸿科技(厦门)有限公司 指纹辨识装置及其制造方法
WO2017024437A1 (fr) * 2015-08-07 2017-02-16 Shanghai Oxi Technology Co., Ltd Système d'imagerie d'empreinte digitale optique et ensemble optique associé
CN109753908A (zh) * 2018-12-27 2019-05-14 维沃移动通信有限公司 一种终端设备和发光器件的控制方法
WO2019090935A1 (fr) * 2017-11-09 2019-05-16 深圳市汇顶科技股份有限公司 Module optique et procédé de traitement associé, et dispositif terminal
US11676416B1 (en) 2022-09-05 2023-06-13 Pixart Imaging Inc. Optical identification device

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JP2011253333A (ja) * 2010-06-02 2011-12-15 Hitachi Media Electoronics Co Ltd 生体認証装置
KR101293779B1 (ko) * 2011-10-06 2013-08-07 주식회사 엔투에이 광학장치
JP2013145174A (ja) 2012-01-13 2013-07-25 Panasonic Corp 近接センサ
KR20200035954A (ko) * 2017-08-01 2020-04-06 난징 이스트하우스 인포메이션 테크놀로지 컴퍼니 리미티드 손가락 정맥 화상 취득 장치

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CN105528568A (zh) * 2015-06-19 2016-04-27 宸鸿科技(厦门)有限公司 指纹辨识装置及其制造方法
WO2017024437A1 (fr) * 2015-08-07 2017-02-16 Shanghai Oxi Technology Co., Ltd Système d'imagerie d'empreinte digitale optique et ensemble optique associé
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CN109753908A (zh) * 2018-12-27 2019-05-14 维沃移动通信有限公司 一种终端设备和发光器件的控制方法
CN109753908B (zh) * 2018-12-27 2024-04-05 维沃移动通信有限公司 一种终端设备和发光器件的控制方法
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