WO2008035581A1 - Ultrasonic cleaning apparatus - Google Patents
Ultrasonic cleaning apparatus Download PDFInfo
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- WO2008035581A1 WO2008035581A1 PCT/JP2007/067581 JP2007067581W WO2008035581A1 WO 2008035581 A1 WO2008035581 A1 WO 2008035581A1 JP 2007067581 W JP2007067581 W JP 2007067581W WO 2008035581 A1 WO2008035581 A1 WO 2008035581A1
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- WIPO (PCT)
- Prior art keywords
- oscillators
- ultrasonic cleaning
- output
- cleaning apparatus
- signal
- Prior art date
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- 238000004506 ultrasonic cleaning Methods 0.000 title claims abstract description 92
- 238000004140 cleaning Methods 0.000 claims abstract description 82
- 230000010355 oscillation Effects 0.000 claims abstract description 20
- 230000007274 generation of a signal involved in cell-cell signaling Effects 0.000 claims description 30
- 239000007788 liquid Substances 0.000 claims description 15
- 230000001360 synchronised effect Effects 0.000 claims description 15
- 239000002245 particle Substances 0.000 abstract description 3
- 239000012530 fluid Substances 0.000 abstract 1
- 230000001939 inductive effect Effects 0.000 abstract 1
- 239000010419 fine particle Substances 0.000 description 10
- 230000003321 amplification Effects 0.000 description 7
- 238000003199 nucleic acid amplification method Methods 0.000 description 7
- 230000004048 modification Effects 0.000 description 6
- 238000012986 modification Methods 0.000 description 6
- 229910001220 stainless steel Inorganic materials 0.000 description 6
- 239000010935 stainless steel Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 230000005284 excitation Effects 0.000 description 4
- -1 polytetrafluoroethylene Polymers 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 230000003247 decreasing effect Effects 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- 239000002033 PVDF binder Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000003111 delayed effect Effects 0.000 description 2
- 239000013013 elastic material Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 2
- 208000018583 New-onset refractory status epilepticus Diseases 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/0207—Driving circuits
- B06B1/0223—Driving circuits for generating signals continuous in time
- B06B1/0238—Driving circuits for generating signals continuous in time of a single frequency, e.g. a sine-wave
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S134/00—Cleaning and liquid contact with solids
- Y10S134/902—Semiconductor wafer
Definitions
- the present invention relates to an ultrasonic cleaning apparatus that cleans an object to be cleaned contained in a cleaning tank by vibrating a plurality of vibration elements.
- FIG. 8 is a partial cross-sectional view showing a configuration of a conventional ultrasonic cleaning apparatus.
- the ultrasonic cleaning apparatus 410 includes a cleaning tank 420a that stores a cleaning liquid 421, and a plurality of oscillators 431, 432, and 433 that are attached to a vibration plate 420b that is bonded to the bottom surface of the cleaning tank 420a. 441, 442, and 443 are connected.
- Oscillators 441, 442, and 443 (also connected to power sources 451, 452, and 453 for supplying electric power, respectively.
- vibration is generated by oscillators 441, 442, and 443.
- the elements 431, 432, and 433 can be excited to remove fine particles adhering to the object to be cleaned immersed in the cleaning liquid 421 of the cleaning tank 420a.
- Patent Document 1 Japanese Utility Model Publication No. 2-4688
- Patent Document 2 Japanese Utility Model Publication No. 61-143685
- an object of the present invention is to provide an ultrasonic cleaning apparatus that eliminates uneven sound pressure between a plurality of vibration elements, improves the removal rate of fine particles, and has no cleaning unevenness.
- a cleaning tank that contains an object to be cleaned and a cleaning liquid, a plurality of vibration elements attached to the cleaning tank, and a plurality of vibrations
- a plurality of oscillators connected to each element to excite a plurality of vibration elements, and a plurality of oscillators connected to a plurality of oscillators, so that the plurality of oscillators output signals of the same phase to the plurality of vibration elements.
- a control unit that controls the oscillator.
- the plurality of oscillators output signals of the same phase that are timed according to the synchronization noise output from the control unit.
- the plurality of oscillators output signals of the same phase that are timed according to the synchronization noise output from the control unit, regardless of their operating states. .
- the plurality of oscillators are provided with a frequency control circuit, and the frequency control circuit has an oscillation frequency value that the control unit outputs to the plurality of oscillators.
- a signal having the same frequency is generated, and this signal is output to each of a plurality of vibration elements as a signal of the same phase, which is synchronized in timing by a synchronization node that the control unit outputs to the plurality of oscillators. It is characterized by that.
- control unit outputs an oscillation start timing pulse for starting output of a signal to the vibration element to the oscillator.
- the ultrasonic cleaning apparatus of the present invention is characterized in that the phases of the signals output in synchronization with the synchronization noise are the same at zero degrees.
- the vibration element is a piezoelectric element.
- the ultrasonic cleaning apparatus contains a vibration propagation medium and at least a cleaning tank disposed so as to be in contact with the medium, and a plurality of vibration elements are attached. Indirect tank is provided.
- the plurality of oscillators include a power amplifier circuit, and the power amplifier circuit uses a power set value signal output from the control unit to the plurality of oscillators. And amplifying the amplitude of the output signal for each of the plurality of vibration elements.
- the ultrasonic cleaning apparatus of the present invention includes a cleaning tank that contains an object to be cleaned and a cleaning liquid, a plurality of vibration elements attached to the cleaning tank, and a plurality of vibration elements that are respectively connected to the plurality of vibration elements.
- the plurality of oscillators outputs a signal having a phase adjusted according to the synchronization noise output from the control unit, and the phase difference between the signals output by the plurality of oscillators is It is in the range of 45 to +45 degrees.
- each of the plurality of oscillators includes a signal generation circuit, and a phase difference between signals generated by each of the signal generation circuits is within a range of 5 degrees to +5 degrees.
- the signal generated by the signal generation circuit is an FM modulated wave.
- the FM modulated wave is synchronized with the synchronization nore output from the control unit at the lowest frequency.
- the signal generated by the signal generation circuit is an AM modulated wave.
- the AM modulated wave is synchronized with the synchronization nore output from the control unit at the smallest amplitude.
- control unit controls the plurality of oscillators to output signals having the same phase or substantially the same phase to the plurality of vibration elements.
- the ultrasonic wave can be emitted, thereby eliminating the unevenness of the sound pressure, and the fine particles adhering to the object to be cleaned can be surely removed, and as a result, the occurrence of unevenness in the ultrasonic cleaning can be prevented. it can.
- the control unit has a frequency value (for example, data of frequencies of 100 kHz and 1 MHz), power setting. It outputs a constant value signal, oscillation start timing pulse, and synchronization pulse to the oscillator, and does not have an oscillator function that requires more power than these signals.
- the control unit and the oscillator are separated. For this reason, when the number of vibration elements is increased or decreased, it is not necessary to increase or decrease in accordance with the number of vibration elements, and a plurality of oscillators after increase and decrease can be controlled by one control circuit 60 to excite a plurality of vibration elements.
- control unit is provided separately from the main body of the ultrasonic cleaning apparatus, for example, it is possible to control the ultrasonic cleaning apparatus disposed in the clean room by the control unit disposed in a room outside the clean room. This is preferable in terms of managing the manufacturing environment in a clean room. Furthermore, the control unit can also control the oscillators of the plurality of ultrasonic cleaning devices, which can further improve the work efficiency.
- control unit can output a synchronization noise regardless of the operating state of the oscillator. For this reason, when multiple oscillators can be operated at the start of operation and the phases of the output signals of these oscillators can be aligned, the multiple oscillators are already in operation or are stopped with the active oscillator. When two or more oscillators are mixed, synchronization pulses can be output to these oscillators so that the phases of the output signals are aligned. As a result, while a plurality of oscillators are operating, the output signals of these oscillators can always have the same phase or substantially the same phase, thereby more reliably preventing cleaning unevenness. That's the power S.
- the vibration element and the oscillator have a one-to-one correspondence, even if the cleaning conditions are changed (for example, changing the ultrasonic wave to be excited, changing the cleaning time), the vibration element is always sufficiently provided. The power of exciting.
- the ultrasonic cleaning apparatus 10 includes a cleaning tank 20a ′ diaphragm 20b, piezoelectric elements (vibrating elements) 31, 32, 33, oscillators 41, 42, 43, And a control circuit (control unit) 60.
- the phase of the signals output from the oscillators 41, 42, and 43 to synchronize the piezoelectric elements 31, 32, and 33 can be synchronized under the control of the control circuit 60.
- the piezoelectric elements 31, 32, and 33 It is possible to make the ultrasonic waves uniform and remove the fine particles adhering to the object to be cleaned.
- FIG. 1 is a partial cross-sectional view showing the configuration of the ultrasonic cleaning apparatus 10 according to the first embodiment.
- the cleaning tank 20a for example, a well-known one made of quartz can be used.
- a cleaning liquid 21 for example, pure water or a chemical solution
- a holding means (not shown) is stored in the cleaning liquid 21.
- the object to be cleaned held in () is immersed.
- the vibration plate 20b is bonded to the bottom surface of the cleaning tank 20a, and the upper surfaces of the plate-like ceramic piezoelectric elements (vibration elements) 31, 32 and 33 are bonded and fixed to the lower surface of the vibration plate 20b. It has been.
- the piezoelectric elements 31, 32, and 33 are spaced apart from each other at an interval that takes into consideration the cleaning effect of the object to be cleaned, for example, 0.2;! To 0.2 mm. It is preferable to consider the force S that can be determined arbitrarily, the size of the cleaning tank 20a, and the amount of vibration necessary for cleaning.
- As the vibration element a piezoelectric element other than a plate or ceramic, or an element other than a piezoelectric element can be used.
- Oscillators 41, 42, and 43 for exciting the piezoelectric elements 31, 32, and 33 at a predetermined frequency are connected to the piezoelectric elements 31, 32, and 33, respectively.
- the oscillators 41, 42, and 43 each include a frequency control circuit and a power amplifier circuit (both not shown).
- the oscillators 41, 42, and 43 are connected to the commercial power sources 51, 52, and 53 for supplying power thereto.
- Oscillators 41, 42, 43 Also, a noise signal having the same frequency, phase, amplitude, and waveform is output to the piezoelectric elements 31, 32, 33.
- the control circuit 60 as a control unit controls the oscillators 41, 42, and 43 so that the oscillators 41, 42, and 43 output signals having the same phase to the piezoelectric elements 31, 32, and 33. is there.
- the control circuit 60 outputs a frequency value, a power setting value signal, an oscillation start timing pulse, and a synchronization noise to the oscillators 41, 42, 43.
- the control circuit 60 does not need to perform any operation when controlling the oscillators 41, 42, and 43 based on the feedback signals from the oscillators 41, 42, and 43! It can also be a control circuit that can be implemented.
- the frequency control circuit of the oscillators 41, 42, and 43 generates a pulse signal having a frequency (for example, 18 kHz to 10 MHz) according to the frequency value output from the control circuit 60 to each oscillator. To do.
- This noise signal is amplified by the power amplification circuit of the oscillators 41, 42, and 43 to an amplitude necessary for exciting the piezoelectric elements 31, 32, and 33 in accordance with the power set value signal, and is supplied to the corresponding piezoelectric element.
- a frequency for example, 18 kHz to 10 MHz
- the oscillators 41, 42, and 43 receive a noise signal having the same phase (for example, zero degrees) at the same time in accordance with the timing. Output.
- the same phase value is stored in the control circuit 60 in advance.
- the cleaning tank 20a is in the processing unit (not shown) of the ultrasonic cleaning device 10, and the oscillators 41, 42, 43 are in the control part (not shown) of the ultrasonic cleaning device 10, respectively.
- the control circuit 60 is arranged separately from the oscillators 41, 42, and 43 in the operation panel section and CPU BOX (not shown) of the ultrasonic cleaning apparatus 10.
- the control circuit 60 outputs a frequency value, a power set value signal, an oscillation start timing pulse, and a synchronization pulse to the oscillators 41, 42, and 43, and has a power larger than these signals.
- the functions of the oscillators 41, 42, and 43 that require are not provided.
- control circuit 60 and the oscillators 41, 42, 43 are separated. For this reason, when the number of piezoelectric elements is increased or decreased, it is not necessary to increase or decrease in accordance with the number of piezoelectric elements. It is possible to control a plurality of oscillators after increase and decrease with one control circuit 60 to excite a plurality of piezoelectric elements. it can.
- the piezoelectric elements 31, 32, and 33 and the oscillators 41, 42, and 43 have a one-to-one correspondence, there are changes in cleaning conditions (for example, changing the ultrasonic wave to be excited, changing the cleaning time). Even so, the piezoelectric elements 31, 32, and 33 can always be sufficiently excited. In contrast, when a plurality of piezoelectric elements are excited by a single oscillator, sufficient excitation becomes difficult as the number of piezoelectric elements increases.
- FIG. 2 is a partial cross-sectional view showing the configuration of the ultrasonic cleaning apparatus 12 according to the second embodiment.
- An ultrasonic cleaning device 12 shown in FIG. 2 includes piezoelectric elements 31, 32, 33, oscillators 41, 42, 43, and a control circuit 60, similar to the ultrasonic cleaning device 10 of the first embodiment. Furthermore, a cleaning tank 22 and an indirect tank 24a are provided. As with the ultrasonic cleaning apparatus 10, for example, a well-known device manufactured by Ishihide can be used as the cleaning tank 22, and a cleaning liquid 21 (for example, pure water or chemical liquid) is contained in the cleaning tank 22. The object to be cleaned held by the holding means (not shown) is immersed
- the indirect tank 24a contains a vibration propagation medium (for example, water, elastic material, SUS (stainless steel), P VDF (polyvinylidene fluoride), polytetrafluoroethylene (tetrafluoroethylene resin)) 25. Accommodate.
- a cleaning tank 22 supported by a support means (not shown) is disposed so that at least the bottom surface is in contact with the medium 25.
- the indirect tank 24a is formed, for example, by molding polypropylene into a rectangular frame shape, and a stainless steel diaphragm 24b is bonded to the bottom surface thereof. Piezoelectric elements 31, 32, and 33 are bonded to the lower surface of the diaphragm 24b. It is.
- the indirect tank 24 is arranged between the cleaning tank 22 and the piezoelectric elements 31, 32, 33, the diaphragm 24b is damaged, the diaphragm 24b is contaminated, and the cleaning tank 22 is In the case of deterioration, it is possible to prevent the object to be cleaned from being contaminated by the diaphragm 24b itself or the atmosphere.
- Other operations, effects, and modifications are the same as those in the first embodiment.
- the ultrasonic cleaning apparatus 210 includes a cleaning tank 220 & ⁇ a vibration plate 220b, piezoelectric elements (vibrating elements) 231, 232, 233, and oscillators 241, 242, 243, A control circuit (control unit) 260.
- the control of the control circuit 260 allows the timing of the signals output from the oscillators 241, 242, and 243 to excite the piezoelectric elements 231, 232, and 233, As a result, the ultrasonic waves emitted from the piezoelectric elements 231, 232 and 233 to the object to be cleaned can be made uniform, and the fine particles adhering to the object to be cleaned can be surely removed.
- FIG. 3 is a partial cross-sectional view showing the configuration of the ultrasonic cleaning apparatus 210 according to the third embodiment.
- the cleaning tank 220a for example, a well-known one made of quartz can be used, and a cleaning liquid 221 (for example, pure water, chemical liquid) is accommodated in the cleaning tank 220a.
- a cleaning liquid 221 for example, pure water, chemical liquid
- the object to be cleaned held in the figure is immersed.
- the vibration plate 220b is bonded to the bottom surface of the cleaning tank 220a, and the upper surfaces of plate-like ceramic piezoelectric elements (vibration elements) 231, 232, and 233 are bonded and fixed to the lower surface of the vibration plate 220b.
- the piezoelectric elements 231, 232, and 233 are spaced apart from each other at intervals that consider the cleaning effect of the object to be cleaned, for example, 0.;! To 0.2 mm.
- the type and number of piezoelectric elements can be arbitrarily determined. It is preferable to consider the size of the washing tank 220a and the amount of vibration necessary for washing.
- As the vibration element a piezoelectric element other than a plate or ceramic, or an element other than a piezoelectric element can be used.
- Oscillators 241, 242, and 243 for exciting the piezoelectric elements 231, 232, and 233 at a predetermined frequency are connected to the piezoelectric elements 231, 232, and 233, respectively.
- the oscillators 241, 242, and 243 include signal generation circuits 241a, 242a, 243a, and power amplification. Circuits 241b, 242b, and 243b are provided, respectively. In addition, oscillators 241, 242, 243, and commercial power supplies 251, 252, and 253 for supplying power to these are respectively connected. Oscillators 241, 242, and 243 (also piezoelectric elements 231, and 232) For this, a pulse signal having the same frequency and amplitude and substantially the same phase is output.
- the control circuit 260 as the control unit controls the oscillators 241, 242, and 243 so that the oscillators 241, 242, and 243 output signals having substantially the same phase to the piezoelectric elements 231, 232, and 233. Is.
- the control circuit 260 outputs a frequency value, a power setting value signal, an oscillation start timing pulse, and a synchronization noise to the oscillators 241, 242, and 243.
- the control circuit 260 does not need to perform the operation of controlling the oscillators 241, 242, and 243 based on the feedback signals from the oscillators 241, 242, and 243. It will be a wholesale circuit.
- the signal generation circuits 241a, 242a, and 243a of the oscillators 241, 242, and 243 are pulses having a frequency (for example, 18 kHz to 10 MHz) according to the frequency value output to each oscillator from the force of the control circuit 260. Generate a signal. This noise signal is amplified to an amplitude necessary for exciting the piezoelectric elements 231, 232, and 233 according to the power set value signal by the power amplification circuits 241 b, 242 b, and 243 b of the oscillators 241, 242, and 243, Output to corresponding piezoelectric elements 231, 232, and 233, respectively.
- a frequency for example, 18 kHz to 10 MHz
- the oscillators 241, 242, and 243 output signals having substantially the same phase by the control circuit 260.
- the signals having substantially the same phase mentioned here may mean that the output from each signal generation circuit 241a, 242a, 243a has a phase difference in the range of ⁇ 5 degrees to +5 degrees as shown in FIG. preferable. By allowing this range, there is an error in the signal output timing between the signal generation circuits 241a, 242a, and 243a, and the error is also caused in the phase of the signal applied to the piezoelectric elements 231, 232, and 233 by being dragged by the error.
- the piezo-electric elements 231, 232, 233 The phase difference between the ultrasonic waves does not affect the ultrasonic cleaning, and the ultrasonic waves can be released without unevenness in the sound pressure, so that the fine particles adhering to the object to be cleaned can be reliably removed. As a result, the occurrence of unevenness in ultrasonic cleaning can be prevented. Cleaning unevenness in ultrasonic cleaning The occurrence is caused by the fact that the ultrasonic waves cancel each other and the sound pressure unevenness S is generated by the collision of the ultrasonic waves having opposite phases.
- the occurrence of the cleaning unevenness is likely to occur when the phase difference between the ultrasonic waves is 90 degrees or more and 270 degrees or less, and when the phase difference between the ultrasonic waves is 180 degrees, it is completely opposite to the phase. Therefore, the occurrence of uneven cleaning is the largest.
- the phase difference can be within the range of 45 degrees to +45 degrees, and the phase difference between the ultrasonic waves can be within 90 degrees (within the range of -45 degrees to +45 degrees).
- FIG. 4 is a timing chart showing the phase difference range of the output signals from the signal generation circuits 241a, 242a, and 243a that can be allowed for the synchronization noise from the control circuit 260. Time is plotted on the vertical axis and amplitude on the vertical axis.
- Fig. 4 (a) shows the waveform of the sync pulse output from the control circuit 260
- Figs. 4 (b) to (d) show examples of the output signal phases of the signal generation circuits 241a, 242a, and 243a, respectively. Show.
- Figure 4 (b) is the phase in sync with the rising edge of the synchronization noise S (dotted line), (c) is the phase advanced by +5 degrees with respect to the synchronization noise, and (d) is the synchronization noise. Phases delayed by 5 degrees (phase of 15 degrees) are shown.
- the signals with substantially the same phase output from the oscillators 241, 242, and 243 are the power amplification circuits 241b, 242b, and 243b, and the output of these is as shown in FIG. Preferably within the range of +45 degrees. Within this range, even if there is a signal output timing error (phase difference) between the power amplifier circuits 241b, 242b, and 243b, the phase difference between the ultrasonic waves emitted from the piezoelectric elements 231, 232, and 233 Ultrasonic waves can be emitted without sound pressure unevenness that does not affect ultrasonic cleaning, and it is possible to reliably remove fine particles adhering to the object to be cleaned. Unevenness in ultrasonic cleaning can be prevented.
- phase difference phase difference
- the occurrence of cleaning unevenness in ultrasonic cleaning is caused by the fact that the ultrasonic waves cancel each other and the sound pressure unevenness S is generated due to the collision of ultrasonic waves in opposite phases.
- the occurrence of the cleaning unevenness is likely to occur when the phase difference between the ultrasonic waves is 90 degrees or more and 270 degrees or less, and when the phase difference between the ultrasonic waves is 180 degrees, it is completely opposite to the phase.
- FIG. 5 is a timing chart showing the phase difference range of the output signals from the power amplifier circuits 241b, 242b, and 243b that can be allowed for the synchronous noise from the control circuit 260. Time and amplitude are plotted on the vertical axis.
- Fig. 5 (a) shows the waveform of the sync pulse output from the control circuit 260, and Figs.
- FIG. 5 (b) to (d) show examples of the power amplification circuits 241b, 242b, 243b force, and the phase of the output signal. Show. Fig. 5 (b) is the phase in sync with the rising edge of the synchronization noise S (dotted line), (c) is the phase advanced by +45 degrees with respect to the synchronization noise, and (d) is the synchronization noise. Phases delayed by 45 degrees (phase of 15 degrees) are shown.
- the oscillators 241, 242, and 243 When an oscillation start timing pulse is input from the control circuit 260 in the stop state, the oscillators 241, 242, and 243 generate pulse signals for excitation to the piezoelectric elements 231, 232, and 233 in accordance with the timing. Start output. As a result, the pulse signals output from the oscillators 241, 242, and 243 have substantially the same phase. For this reason, uniform ultrasonic waves can be emitted from the piezoelectric elements 231, 232 and 233 to the cleaning tank 220a, and the sound pressure generated thereby is surely removed from the fine particles adhering to the object to be cleaned. As a result, the occurrence of unevenness in ultrasonic cleaning can be prevented. Until the oscillation start timing noise is input, the oscillators 241, 242, and 243 are in a standby state in which the output of the Norse signal according to the frequency value and the power set value signal can be started.
- the oscillators 241, 242, and 243 When a synchronization pulse is input from the control circuit 260, the oscillators 241, 242, and 243 output a pulse signal having substantially the same phase all at once according to the timing when the synchronization pulse is input from the control circuit 260. .
- the substantially identical phase values are stored in the control circuit 260 in advance. As a result, uniform ultrasonic waves can be emitted to the washing tub 220a through the piezoelectric elements 231, 232, 233, and the vibration plate 220b, and the generated sound pressure unevenness is eliminated. Since the particles can be removed reliably, the force S prevents the occurrence of unevenness in ultrasonic cleaning.
- the phase is adjusted with a synchronous noise at regular intervals after oscillation starts, it occurs due to errors between crystal oscillators that generate noise in each oscillator.
- the phase difference between the output cannula signals can be corrected, it is possible to always suppress the unevenness of the sound pressure, thereby more reliably preventing the occurrence of the unevenness in the ultrasonic cleaning. It is also possible to output a synchronization noise at the start of the operation of the oscillators 241, 242, and 243 to align the phases of the output signals of these oscillators.
- the cleaning tank 220a is in the processing unit (not shown) of the ultrasonic cleaning device 210, and the vibrators 241, 242, and 243 are in the control part (not shown) of the ultrasonic cleaning device 210.
- the control circuit 260 is arranged separately from the oscillators 241, 242, and 243 in the operation panel unit and CPU BOX (not shown) of the ultrasonic cleaning device 210.
- the control circuit 260 outputs a frequency value, a power setting value signal, an oscillation start timing pulse, and a synchronization pulse to the oscillators 241, 242, and 243.
- the control circuit 260 generates a larger amount of power than these signals.
- the functions of the required oscillators 241, 242, and 243 are not provided.
- the control circuit 260 and the oscillators 241, 242, and 243 are separated. For this reason, when the number of piezoelectric elements is increased or decreased, it is not necessary to increase or decrease in accordance with the number of piezoelectric elements. It is possible to control a plurality of oscillators after increase and decrease by one control circuit 260 to excite a plurality of piezoelectric elements. it can.
- the piezoelectric elements 231, 232, 233 and the oscillators 241, 242, 243 have a one-to-one correspondence, there are changes in the cleaning conditions (for example, changing the ultrasonic wave to be excited, changing the cleaning time). Even so, the piezoelectric elements 231, 232, 233 can always be sufficiently excited. In contrast, when a plurality of piezoelectric elements are excited by a single oscillator, sufficient excitation becomes difficult as the number of piezoelectric elements increases.
- FIG. 6 is a timing chart showing a synchronization node from the control circuit 260 and an output signal from the signal generation circuit according to a modification of the third embodiment.
- Fig. 6 (a) is the waveform of the sync pulse output from the control circuit 260, (b) is the signal generation circuit with FM modulation, output signals from 241a, 242a and 243a, and (c) is with AM modulation Output signals from the signal generation circuits 241a, 242a, and 243a.
- a modulated signal is output from the signal generation circuits 241a, 242a, and 243a.
- the modulation is shown in Fig. 6 (b).
- FM modulation frequency modulation
- AM modulation amplitude modulation
- the signals output from the signal generation circuits 241a, 242a, and 243a are synchronized with the synchronization noise from the control circuit 260 at an appropriate timing according to the type of modulation.
- FM modulation for example, as shown in Fig. 6 (b)
- by synchronizing at an appropriate timing according to the type of modulation such as when synchronizing at the lowest frequency, even when the phase is approximately the same, by synchronizing at a different frequency, Eventually, it is possible to prevent the occurrence of uneven cleaning.
- phase difference range allowed for each signal generation circuit 241a, 242a, 243a force, and their outputs may be 5 degrees to +5 degrees as in the third embodiment. preferable.
- the phase difference range allowed for the output from each power amplifier circuit 241b, 242b, 243b is preferably -45 degrees to +45 degrees.
- the signal When the output from the signal generation circuits 241a, 242a, and 243a is AM-modulated, for example, as shown in FIG. 6 (c), the signal must be synchronized with the synchronization pulse from the control circuit 260 at the smallest amplitude. Can be synchronized with other force S. For example, by synchronizing at an appropriate timing according to the type of modulation as in the case of synchronization at the smallest amplitude, even when the phases are approximately the same, by synchronizing at a timing with different amplitudes, Eventually, it is possible to prevent the occurrence of uneven cleaning.
- the phase difference range allowed for the output from each signal generation circuit 241a, 242a, 243a is -5 degrees to +5 degrees, and each power
- the phase difference range allowed for the outputs from the amplifier circuits 241b, 242b, and 243b is preferably 45 degrees to +45 degrees.
- FIG. 7 is a partial cross-sectional view showing the configuration of the ultrasonic cleaning apparatus 212 according to the fourth embodiment.
- An ultrasonic cleaning device 212 shown in FIG. 7 includes piezoelectric elements 231 232 233, an oscillator 241 242 243, and a control circuit 260 in the same manner as the ultrasonic cleaning device 210 of the third embodiment, and further performs cleaning.
- a tank 222 and an indirect tank 224a are provided.
- the cleaning tank 222 can use a well-known one made of quartz, for example, and contains a cleaning liquid 221 (for example, pure water, chemical liquid) in the cleaning tank 221.
- a cleaning liquid 221 for example, pure water, chemical liquid
- the object to be cleaned held in the holding means (not shown) is immersed.
- the oscillator 241 242 243 includes signal generation circuits 241a 242a and 243a, and power amplification circuits 241b 242b and 243b, respectively.
- the indirect tank 224a contains a medium for vibration propagation (for example, water, elastic material, SUS (stainless steel), PVDF (polyvinylidene fluoride), polytetrafluoroethylene (tetrafluoroethylene resin)) 2 25 Accommodate.
- a cleaning tank 222 supported by support means (not shown) is disposed so that at least the bottom surface is in contact with the medium 225.
- the indirect tank 224a is formed, for example, by molding polypropylene into a rectangular frame shape, and a stainless steel diaphragm 224b is bonded to the bottom surface thereof.
- the piezoelectric elements 231 23 2 233 are bonded to the lower surface of the diaphragm 224b.
- the indirect tank 224 is disposed between the cleaning tank 222 and the piezoelectric elements 231 232 233, the diaphragm 224b is damaged, the diaphragm 224b is contaminated, and the cleaning tank 222 is deteriorated.
- the object to be cleaned can be prevented from being contaminated by the diaphragm 224b itself or the atmosphere.
- Other operations, effects, and modifications are the same as in the third embodiment.
- FIG. 1 is a partial cross-sectional view showing a configuration of an ultrasonic cleaning apparatus according to a first embodiment of the present invention.
- FIG. 2 is a partial cross-sectional view showing a configuration of an ultrasonic cleaning apparatus according to a second embodiment of the present invention.
- FIG. 3 is a partial cross-sectional view showing a configuration of an ultrasonic cleaning apparatus according to a third embodiment of the present invention.
- 4 A timing chart showing the phase difference range of the output signal from the signal generation circuit that can be allowed for the synchronous noise from the control circuit according to the third embodiment of the present invention.
- FIG. 5 is a timing chart showing a phase difference range of an output signal from a power amplifier circuit that can be allowed for a synchronization pulse from a control circuit according to a third embodiment of the present invention.
- 6 A timing chart showing a synchronization node from the control circuit and an output signal from the signal generation circuit according to a modification of the third embodiment of the present invention.
- FIG. 7 is a partial cross-sectional view showing a configuration of an ultrasonic cleaning apparatus according to a fourth embodiment of the present invention.
- FIG. 8 is a partial cross-sectional view showing a configuration of a conventional ultrasonic cleaning apparatus.
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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JP2008535319A JP4776689B2 (ja) | 2006-09-22 | 2007-09-10 | 超音波洗浄装置 |
US12/225,760 US8899247B2 (en) | 2006-09-22 | 2007-09-10 | Ultrasonic cleaning apparatus |
CN2007800075059A CN101395704B (zh) | 2006-09-22 | 2007-09-10 | 超声波清洗装置 |
KR1020087022205A KR101049300B1 (ko) | 2006-09-22 | 2007-09-10 | 초음파 세정장치 |
Applications Claiming Priority (2)
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JP2006257411 | 2006-09-22 | ||
JP2006-257411 | 2006-09-22 |
Publications (1)
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WO2008035581A1 true WO2008035581A1 (en) | 2008-03-27 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/JP2007/067581 WO2008035581A1 (en) | 2006-09-22 | 2007-09-10 | Ultrasonic cleaning apparatus |
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US (1) | US8899247B2 (ja) |
JP (1) | JP4776689B2 (ja) |
KR (1) | KR101049300B1 (ja) |
CN (1) | CN101395704B (ja) |
MY (1) | MY147253A (ja) |
TW (1) | TW200815116A (ja) |
WO (1) | WO2008035581A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010089037A (ja) * | 2008-10-10 | 2010-04-22 | Tiyoda Electric Co Ltd | 超音波洗浄装置 |
KR20190026538A (ko) | 2016-07-06 | 2019-03-13 | 미우라고교 가부시키카이샤 | 초음파 세정기 |
Families Citing this family (12)
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JP2010267340A (ja) * | 2009-05-15 | 2010-11-25 | Showa Denko Kk | 流水式洗浄方法及び流水式洗浄装置 |
CN101884986A (zh) * | 2010-07-16 | 2010-11-17 | 上海集成电路研发中心有限公司 | 半导体器件清洗装置及方法 |
JP5303741B1 (ja) * | 2011-12-28 | 2013-10-02 | コニカミノルタ株式会社 | 情報記録媒体用ガラス基板の製造方法 |
JP5226141B1 (ja) * | 2012-01-30 | 2013-07-03 | 株式会社カイジョー | 超音波洗浄装置及びその電力制御方法 |
JP5453487B2 (ja) * | 2012-05-24 | 2014-03-26 | ジルトロニック アクチエンゲゼルシャフト | 超音波洗浄方法および超音波洗浄装置 |
JP5734394B2 (ja) * | 2013-11-11 | 2015-06-17 | 株式会社カイジョー | 超音波洗浄装置及び超音波洗浄方法 |
CN104576455A (zh) * | 2014-12-19 | 2015-04-29 | 无锡德鑫太阳能电力有限公司 | 一种清洗黑硅电池片的装置 |
CN108620375B (zh) * | 2018-04-24 | 2020-03-10 | 南通大学 | 一种倾斜设置的太阳能电池的清洗系统装置及工作方法 |
KR102065067B1 (ko) * | 2018-07-06 | 2020-02-11 | 주식회사 듀라소닉 | 다중 주파수 동시 구동형 멀티진동자 기반 초음파세척장치 |
US10867594B1 (en) * | 2019-10-02 | 2020-12-15 | xMEMS Labs, Inc. | Audio apparatus and audio method thereof |
KR102369303B1 (ko) * | 2020-11-23 | 2022-03-03 | (주)고도기연 | 주파수 동기화 장치 및 그를 이용한 초음파 발진 장치 |
CN114700322A (zh) * | 2022-02-21 | 2022-07-05 | 江苏太平洋石英股份有限公司 | 清洗槽、石英管清洗机及石英管清洗方法 |
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- 2007-09-10 JP JP2008535319A patent/JP4776689B2/ja active Active
- 2007-09-10 CN CN2007800075059A patent/CN101395704B/zh active Active
- 2007-09-10 WO PCT/JP2007/067581 patent/WO2008035581A1/ja active Application Filing
- 2007-09-10 KR KR1020087022205A patent/KR101049300B1/ko active IP Right Grant
- 2007-09-10 US US12/225,760 patent/US8899247B2/en active Active
- 2007-09-13 TW TW096134140A patent/TW200815116A/zh unknown
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- 2008-09-25 MY MYPI20083788A patent/MY147253A/en unknown
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JPH10135176A (ja) * | 1996-09-04 | 1998-05-22 | Tokyo Electron Ltd | 超音波洗浄装置 |
JP2003320328A (ja) * | 2002-05-01 | 2003-11-11 | Kaijo Corp | 超音波洗浄装置 |
JP2006007066A (ja) * | 2004-06-24 | 2006-01-12 | Toshiba Corp | 超音波洗浄装置 |
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Publication number | Priority date | Publication date | Assignee | Title |
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JP2010089037A (ja) * | 2008-10-10 | 2010-04-22 | Tiyoda Electric Co Ltd | 超音波洗浄装置 |
KR20190026538A (ko) | 2016-07-06 | 2019-03-13 | 미우라고교 가부시키카이샤 | 초음파 세정기 |
Also Published As
Publication number | Publication date |
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KR20080112225A (ko) | 2008-12-24 |
MY147253A (en) | 2012-11-14 |
JP4776689B2 (ja) | 2011-09-21 |
CN101395704B (zh) | 2012-03-07 |
US8899247B2 (en) | 2014-12-02 |
KR101049300B1 (ko) | 2011-07-13 |
CN101395704A (zh) | 2009-03-25 |
TW200815116A (en) | 2008-04-01 |
US20110079253A1 (en) | 2011-04-07 |
TWI357834B (ja) | 2012-02-11 |
JPWO2008035581A1 (ja) | 2010-01-28 |
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