WO2008015868A1 - Broche de contrôle - Google Patents

Broche de contrôle Download PDF

Info

Publication number
WO2008015868A1
WO2008015868A1 PCT/JP2007/063475 JP2007063475W WO2008015868A1 WO 2008015868 A1 WO2008015868 A1 WO 2008015868A1 JP 2007063475 W JP2007063475 W JP 2007063475W WO 2008015868 A1 WO2008015868 A1 WO 2008015868A1
Authority
WO
WIPO (PCT)
Prior art keywords
probe pin
contacts
probe
wafer
contact
Prior art date
Application number
PCT/JP2007/063475
Other languages
English (en)
Japanese (ja)
Inventor
Kiyoshi Takekoshi
Original Assignee
Tokyo Electron Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Limited filed Critical Tokyo Electron Limited
Publication of WO2008015868A1 publication Critical patent/WO2008015868A1/fr

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06727—Cantilever beams

Definitions

  • the present invention relates to a probe pin for contacting an object to be inspected and inspecting electrical characteristics of the object to be inspected.
  • the probe device has a probe card, and a large number of probe pins are supported on the lower surface side of the probe card.
  • the electrical characteristics of the wafer are inspected by bringing a large number of these probe pins into contact with multiple electrode nodes of an electronic device and transferring electrical signals between the probe pins and the electrode pads. .
  • Patent Document 1 Japanese Patent Laid-Open No. 2001-50979
  • Patent Document 2 JP-A-2006-119024
  • the present invention has been made in view of the points to be applied, and an object thereof is to sufficiently and stably perform electrical contact between an object to be inspected such as a wafer and probe pins.
  • the present invention provides a probe pin for inspecting the electrical characteristics of an object to be inspected by making contact with the object to be inspected.
  • a plurality of contacts are formed, and when the plurality of contacts are pressed against the object to be inspected, the contacts are held inward and the tips thereof move in a direction approaching each other.
  • the oxide film can be removed with sufficient stability and contact with the probe pin.
  • the contact resistance between the child can be sufficiently and stably reduced.
  • the reliability of contact between the probe pin and the object to be inspected can be greatly improved.
  • the tip end portion of the probe pin has a base portion, and the plurality of contacts are formed such that rear ends thereof are connected to the base portion, and the tip end side approaches each other as the base force is separated. May be.
  • a stagger for maintaining the distance between the tips of the plurality of contacts may be formed inside the contact. /.
  • a vertical surface may be formed inside the tip of each contact, and a concave portion may be formed on the vertical surface.
  • the probe pin may be a vertical type.
  • the contact resistance between the probe pin and the object to be inspected is sufficiently and stably maintained low, so that the electrical characteristics of the object to be inspected can be inspected with high accuracy and stability.
  • FIG. 1 is a side view schematically showing the configuration of a probe device.
  • FIG. 2 is a plan view of the support plate.
  • FIG. 3 is a longitudinal sectional view of a support plate showing a state where probe pins are inserted into guide holes.
  • FIG. 4 is an enlarged view of the tip of the probe pin.
  • FIG. 5 is an enlarged view of the tip of the probe pin when the wafer comes into contact.
  • FIG. 6 is an enlarged view of the tip of the probe pin when pressed against the wafer.
  • FIG. 7 is a side view of a cantilever type probe pin.
  • FIG. 8 is a perspective view of the tip of a probe pin when three contactors are provided.
  • FIG. 1 is a side view showing an outline of the configuration of a probe apparatus 1 in which a probe pin according to the present invention is used.
  • the probe device 1 is provided with, for example, a probe card 2 and a mounting table 3 on which a wafer W as an object to be inspected is mounted.
  • the mounting table 3 is movable in the vertical and horizontal directions.
  • the probe card 2 includes, for example, a support plate 11 that supports a plurality of probe pins 10 and a circuit board 12 that sends and receives electrical signals to the probe pins 10.
  • the support plate 11 is formed in a disk shape, for example, and faces the mounting table 3 below.
  • a plurality of guide holes 20 having a rectangular horizontal cross section are formed as shown in FIG.
  • Each guide hole 20 penetrates the support plate 11 in the vertical direction as shown in FIG. 3, and the vertical probe pin 10 is inserted into each guide hole 20 in the vertical direction! Being!
  • the probe pin 10 includes, for example, a lower end portion 30, a spring portion 31 connected to the upper portion, and a rear end portion 32 on the upper portion.
  • the rear end portion 32 of the probe pin 10 is disposed on the upper end surface of the guide hole 20 and is formed larger than the diameter of the guide hole 20.
  • the upper surface of the rear end portion 32 is formed flat, is in contact with the lower surface terminal 12a of the circuit board 12, and is electrically connected to the circuit board 12.
  • a stepped portion 32a is formed on the lower peripheral side of the rear end portion 32, and the stepped portion 32a is locked to the upper end surface of the guide hole 20, whereby the probe pin 10 is supported by the support plate 11.
  • the spring portion 31 has, for example, a strip-like corrugated shape that is continuous in the vertical direction, and has elasticity in the vertical direction.
  • the upper end of the spring portion 31 is connected to the lower surface of the rear end portion 32, and the tip portion 30 is connected to the lower end of the spring portion 31.
  • the distal end portion 30 includes, for example, a base portion 40 and two contactors 41 and 42.
  • the base 40 has a substantially rectangular flat plate shape, and the horizontal width of the base 40 is slightly smaller than the diameter of the guide hole 20. Accordingly, the base 40 moves up and down along the inner wall of the guide hole 20 and functions as a guide for the probe pin 10 in the guide hole 20.
  • the two contactors 41 and 42 are formed in, for example, a flexible elongated needle shape.
  • the contacts 41 and 42 are connected to the lower surface of the base 40.
  • Contacts 41 and 42 are located on the bottom surface of the base 40. It is formed from both ends toward a diagonally downward direction on the center side. That is, the contacts 41 and 42 are formed such that the rear ends are connected to both end portions of the lower surface of the base portion 40 and the tip ends gradually approach as they move away from the base portion 40. These contacts 41 and 42 protrude below the guide hole 20.
  • the tips of the contactor 41 and the contactor 42 face each other with a predetermined distance therebetween.
  • a vertical surface 41a is formed on the inner side of the tip of the contact 41, and a concave portion 41b is formed on the upper portion of the vertical surface 4la.
  • a stagger 41c protruding inward from the vertical surface 41a is formed.
  • the tip of the contact 42 is also provided with a vertical surface 42a, a recess 42b, and a stopper 42c.
  • the vertical surface 42a, the concave portion 42b, and the stopper 42c of the contact 42 are opposed to the vertical surface 41a, the concave portion 41b, and the stopper 41c of the contact 41, respectively.
  • the probe pin 10 which is effective in the present embodiment is formed by, for example, a LIGA process (a process for manufacturing a fine part by X-ray lithography, electric plating, or molding).
  • the contacts 41 and 42 are squeezed inward as shown in FIG. Moves inward while rubbing the surface of the electrode node P. At this time, the oxide film on the surface of the electrode pad P is scrubbed and removed by the contacts 41 and 42.
  • the stoppers 41c and 42c come into contact with each other, and the movement of the contacts 41 and 42 to the inside is stopped. At this time, the distance between the vertical portion 41a of the contact 41 and the vertical portion 42a of the contact 42 is maintained at, for example, 10 / zm or more, and a space H is formed between the recesses 41b and 42b.
  • the two ends facing each other at the tip 30 of the probe pin 10 The contacts 41 and 42 are formed.
  • the contacts 41 and 42 are pressed against the electrode pad P of the wafer W, the contacts 41 and 42 are squeezed inward and the tip moves inward on the surface of the electrode pad P.
  • the vertical probe pin 10 can be used to scrub the oxide film on the surface of the electrode node P using the two contacts 41 and 42, and the probe pin 10 and the electrode pad P The contact resistance can be reduced sufficiently and stably. Also, since electrical signals are sent through the two contacts 41 and 42 of each probe pin 10 during inspection, the reliability of electrical continuity between the probe pin 10 and the electrode pad P is increased, and inspection is performed. Can significantly improve the reliability.
  • stoppers 41c and 42c are formed inside the tips of the contacts 41 and 42, and the distance between the tips of the contacts 41 and 42 is maintained, between the tips of the contacts 41 and 42, It is possible to prevent the scraps of the oxide film from being caught during scrubbing. As a result, it is possible to prevent the contact resistance of the probe pin 10 from increasing due to, for example, oxides adhering to the contacts 41 and 42. In addition, contamination of the wafer W by particles can be prevented. Further, the stoppers 41c and 42c make the distance (slip width) that the contacts 41 and 42 move on the surface of the electrode pad P constant during scrubbing, so that the slip width is accurately defined.
  • the gap width should be 5 ⁇ m or more.
  • a vertical type probe pin does not require a mounting space as compared with a so-called cantilever type probe pin, so that it is possible to reduce the pitch and increase the number of pins in the probe card 2. Therefore, according to the vertical probe pin 10 of the present embodiment, the number of pins can be increased while ensuring sufficient and stable electrical contact between the probe pin 10 and the electrode pad P as described above. The pitch can be reduced.
  • the present invention is applied to a vertical probe pin.
  • the present invention is a cantilever type probe pin 10 of a cantilever type as shown in FIG. You may apply to. Even in this case, scrub removal is performed by the two contacts 41 and 42, and electrical conduction is achieved by the two contacts 41 and 42. Therefore, the electrical connection between the contacts 41 and 42 and the electrode node P is achieved. The certainty of contact. Further, since the gap width of each contact 41, 42 can be reduced, the wear of the contacts 41, 42 is reduced, and the life of the probe pin 10 can be extended.
  • the number of contacts of the probe pin 10 is not limited to two, but may be three or more.
  • the base 50 at the tip of the probe pin is formed in a three-dimensional cylindrical shape, for example, and a plurality of (three in FIG. But let's form.
  • the force stoppers 41c and 42c which are examples in which the stoppers 41c and 42c are formed on the contacts 41 and 42, may be omitted.
  • the contacts 41 and 42 are brought into contact with each other at the time of scrubbing and serve as a stopper. Therefore, the gap width of the contacts 41 and 42 is limited to an appropriate distance, and generation of extra particles can be suppressed, for example.
  • the life of the probe pin 10 can be extended.
  • the contacts of the probe pins 10 may have other shapes as long as they are squeezed inward when they are pressed against the wafer W and the tips are displaced in a direction approaching each other.
  • the portions other than the contacts of the probe pin 10 may have other shapes.
  • the present invention can also be applied to the case where the object to be inspected is another substrate such as an FPD (flat panel display) other than the wafer W.
  • the present invention is useful for sufficiently and stably reducing the contact resistance between an object to be inspected and a probe pin.

Landscapes

  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

La présente invention vise à réduire suffisamment et de façon stable la résistance de contact entre une plaquette et une broche de contrôle. Une section de base et deux contacts face à face sont réalisés à l'extrémité avant d'une broche de contrôle. Les extrémités arrière des deux contacts sont connectées à une extrémité inférieure de la section de base, et sont réalisées de façon se rapprocher l'une de l'autre lorsque le côté de l'extrémité avant se sépare de la section de base. Les deux contacts se déplacent dans une direction leur permettant de se rapprocher l'un de l'autre en se courbant vers l'intérieur lorsqu'ils sont comprimés par une plaquette, et une pellicule d'oxyde sur une pastille d'électrode de la plaquette est retirée par frottement. Cela permet de réduire de façon stable et suffisante la résistance de contact entre la plaquette et la broche de contrôle.
PCT/JP2007/063475 2006-07-31 2007-07-05 Broche de contrôle WO2008015868A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006-208123 2006-07-31
JP2006208123A JP2008032620A (ja) 2006-07-31 2006-07-31 プローブピン

Publications (1)

Publication Number Publication Date
WO2008015868A1 true WO2008015868A1 (fr) 2008-02-07

Family

ID=38997050

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/063475 WO2008015868A1 (fr) 2006-07-31 2007-07-05 Broche de contrôle

Country Status (3)

Country Link
JP (1) JP2008032620A (fr)
TW (1) TW200819752A (fr)
WO (1) WO2008015868A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017223629A (ja) * 2016-06-17 2017-12-21 オムロン株式会社 プローブピン
EP3156806A4 (fr) * 2014-06-16 2018-01-24 Omron Corporation Broche de sonde
WO2024032967A1 (fr) * 2022-08-08 2024-02-15 Ingun Prüfmittelbau Gmbh Dispositif d'aiguille de mesure

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120043987A1 (en) * 2010-08-23 2012-02-23 Star Technologies Inc. Probe Card for Testing Semiconductor Devices and Vertical Probe Thereof
JP5870762B2 (ja) * 2012-03-01 2016-03-01 三菱電機株式会社 電気特性測定方法、コンタクトプローブ
JP2013205191A (ja) * 2012-03-28 2013-10-07 Nidai Seiko:Kk スプリングプローブおよびスプリングプローブの製造方法
JP2020180889A (ja) * 2019-04-25 2020-11-05 オムロン株式会社 プローブピン、検査治具および検査ユニット

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000121673A (ja) * 1998-08-12 2000-04-28 Tokyo Electron Ltd コンタクタ
JP2001052827A (ja) * 1999-08-06 2001-02-23 Mitsubishi Electric Corp テスト用ソケット、その製造方法、テスト用ソケットを用いたテスト方法、及び被テスト部材

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000121673A (ja) * 1998-08-12 2000-04-28 Tokyo Electron Ltd コンタクタ
JP2001052827A (ja) * 1999-08-06 2001-02-23 Mitsubishi Electric Corp テスト用ソケット、その製造方法、テスト用ソケットを用いたテスト方法、及び被テスト部材

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3156806A4 (fr) * 2014-06-16 2018-01-24 Omron Corporation Broche de sonde
JP2017223629A (ja) * 2016-06-17 2017-12-21 オムロン株式会社 プローブピン
WO2017217042A1 (fr) * 2016-06-17 2017-12-21 オムロン株式会社 Broche de sonde
WO2024032967A1 (fr) * 2022-08-08 2024-02-15 Ingun Prüfmittelbau Gmbh Dispositif d'aiguille de mesure

Also Published As

Publication number Publication date
TWI341389B (fr) 2011-05-01
JP2008032620A (ja) 2008-02-14
TW200819752A (en) 2008-05-01

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