WO2008007521A1 - Élément de support de réticule, étage de réticule, appareil d'exposition, procédé d'exposition par projection et procédé de fabrication de dispositif - Google Patents

Élément de support de réticule, étage de réticule, appareil d'exposition, procédé d'exposition par projection et procédé de fabrication de dispositif Download PDF

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Publication number
WO2008007521A1
WO2008007521A1 PCT/JP2007/062229 JP2007062229W WO2008007521A1 WO 2008007521 A1 WO2008007521 A1 WO 2008007521A1 JP 2007062229 W JP2007062229 W JP 2007062229W WO 2008007521 A1 WO2008007521 A1 WO 2008007521A1
Authority
WO
WIPO (PCT)
Prior art keywords
reticle
holding member
stage
member according
reticle holding
Prior art date
Application number
PCT/JP2007/062229
Other languages
English (en)
Japanese (ja)
Inventor
Noriyuki Hirayanagi
Original Assignee
Nikon Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corporation filed Critical Nikon Corporation
Priority to JP2008524743A priority Critical patent/JPWO2008007521A1/ja
Publication of WO2008007521A1 publication Critical patent/WO2008007521A1/fr

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/70741—Handling masks outside exposure position, e.g. reticle libraries
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks

Definitions

  • the present invention relates to a reticle holding member, a reticle stage that uses the reticle holding member, an exposure apparatus, a projection exposure method, and a device manufacturing method.
  • the present invention relates to a reticle holding member that holds a reticle so as to cover a surface on which a reticle pattern is not formed, a reticle'stage that uses the reticle holding member, an exposure apparatus, a projection exposure method, and a device manufacturing method.
  • the imaginary part k of this refractive index represents absorption of extreme ultraviolet rays. Since ⁇ and k are very small compared to 1, the refractive index in this region is very close to 1. Therefore, a transmission / refraction type optical element such as a conventional lens cannot be used, and an optical system utilizing reflection is used.
  • a reticle (also referred to as a mask) is a reflective reticle, which is different from a conventional transmissive reticle.
  • a cover for protecting the surface may be attached (for example, US Patent US6239863 Bl).
  • FIG. 9 shows a reticle 100 transferred to reticle stage 201a by transfer arm 301 and a reticle 10 attached to reticle 'stage 201a by a conventional method.
  • FIG. Reticle 'stage 201a includes an electrostatic chuck and attracts reticle 100.
  • a reticle holding member is a reticle holding member that is disposed on a surface on which a reticle pattern is not formed and holds the reticle, and at least a part of the peripheral edge protrudes from the reticle, and the protruding peripheral edge
  • the portion is configured to be supported and attached by the reticle stage of the exposure apparatus.
  • the protruding peripheral portion force of the reticle holding member is supported by the reticle 'stage of the exposure apparatus rather than holding the reticle on the reticle' stage only by the electrostatic chuck.
  • the reticle is not dropped from the reticle stage even during a power outage.
  • a reticle holding member that does not drop the reticle from the reticle'stage even during a power failure, a reticle'stage that uses the reticle holding member, an exposure apparatus, and an exposure method are obtained.
  • FIG. 1 is a diagram showing a configuration of a reticle holding member according to an embodiment of the present invention.
  • FIG. 2 is a view showing a reticle holding member for holding a reticle according to an embodiment of the present invention, which is attached to a reticle ′ stage of the exposure apparatus.
  • FIG. 3 is a view showing a reticle holding member provided with an electrostatic chuck electrode for attracting a reticle according to another embodiment of the present invention.
  • FIG. 4 is a view showing a reticle holding member including a pellicle frame including a pellicle according to still another embodiment of the present invention.
  • FIG. 5 is a view showing a reticle holding member provided with a removable ′ cover according to still another embodiment of the present invention.
  • FIG. 6 is a flowchart showing a projection exposure method according to an embodiment of the present invention.
  • FIG. 7 is a view showing the relationship between a reticle holding member, a clean filter pod, a reticle and a carrier.
  • FIG. 8 is a diagram showing a configuration of an EUV exposure apparatus.
  • FIG. 9 is a view showing a reticle transported to a reticle ′ stage by a transport arm and a reticle attached to the reticle ′ stage.
  • FIG. 10 is a view showing a reticle holding member according to another embodiment.
  • FIG. 11 is a diagram showing an example of a configuration of an end effector that conveys a reticle and a support portion of a reticle ′ stage.
  • FIG. 12 is a flowchart showing an example of a microdevice manufacturing process.
  • FIG. 8 is a diagram showing the configuration of the EUV exposure apparatus.
  • the EUV light 32 emitted from the EUV light source 31 is incident on the illumination optical system 33 and becomes a substantially parallel light beam through a concave reflecting mirror 34 that acts as a collimator mirror, and a pair of fly-eye mirrors 35a and 35b It enters the optical integrator 35 consisting of
  • a substantial surface light source having a predetermined shape is formed in the vicinity of the reflection surface of the fly-eye mirror 35a, that is, in the vicinity of the emission surface of the optical integrator 35.
  • Substantially surface Light from the light source is deflected by the flat reflector 36 and then elongated on the reticle R in the form of an elongated arc.
  • the aperture plate for forming the arcuate illumination area is not shown).
  • the light from the pattern of the illuminated reticle R is reflected on the wafer W via the projection optical system 37 which also has a force of a plurality of reflecting mirrors (in FIG. 8, for example, six reflecting mirrors M1 to M6). Form an image.
  • the reticle R is held on the reticle'stage, the wafer W is held on the wafer and the stage, and the pattern image on the reticle R surface is transferred to the wafer W.
  • the illustration of the reticle 'stage, Ueno,' stage is omitted.
  • the reticle on which various patterns are formed is stored in the reticle warehouse.
  • the reticle When used, the reticle is taken out from the reticle warehouse, transported to the exposure apparatus, and attached to the reticle 'stage of the exposure apparatus. .
  • To move the reticle from the air atmosphere to the vacuum atmosphere store the reticle in the load lock chamber and switch from the air atmosphere to the vacuum atmosphere in the load lock chamber.
  • Reticles are transported in a double storage device called a clean filter pod and reticle carrier in an air atmosphere. Further, in order to protect the surface on which the reticle pattern is formed, a pellicle for protecting the surface may be attached.
  • a reticle with a pellicle may be stored in a vacuum pod.
  • the vacuum pod can keep the internal space in a vacuum.
  • the reticle with pellicle is stored in a vacuum pod in the air atmosphere, and the vacuum pod has an internal space. After that, the vacuum pod is transferred into the vacuum chamber of the exposure apparatus, and the reticle with the pellicle is taken out of the vacuum pod and used for exposure.
  • the reticle with pellicle After exposure, the reticle with pellicle is transported to the vacuum pod while maintaining the vacuum atmosphere, and the reticle with pellicle is stored in the vacuum pod. Only when taking out a reticle with a pellicle into the atmosphere, remove the reticle with a pellicle using the atmosphere inside the vacuum pod as the atmosphere.
  • the atmosphere in the vacuum pod changes to vacuum force air or air force vacuum when the reticle is put in and out of the vacuum pod. Since the pellicle may be damaged by the pressure change based on this atmospheric change, the time required to change the atmosphere tends to be long. However, the reticle can be taken in and out of the vacuum pod outside the exposure system. Therefore, it can be performed slowly over time regardless of the operation status of the exposure apparatus.
  • Reticles are typically removed from the reticle carrier force in an air atmosphere and removed from a clean 'filter' pod in a vacuum atmosphere. Thereafter, for example, a reticle pattern of the reticle 'stage of the exposure apparatus is formed, and the reticle is attached to the reticle' stage by adsorbing the surface.
  • FIG. 1 is a diagram showing a configuration of reticle holding member 101 according to an embodiment.
  • Reticle 100 is held by reticle holding member 101 such that the surface opposite to the surface on which the pattern is formed (hereinafter also referred to as the back surface of reticle 100) is in contact with the surface of the reticle holding member.
  • the surface of the reticle holding member 101 that contacts the back surface of the reticle 100 is wider than the back surface of the reticle 100, and the peripheral edge of the reticle holding member 101 protrudes from the reticle.
  • the reticle holding member 101 includes a reticle presser 103, and the reticle presser 103 mechanically presses the reticle 100.
  • the reticle holding member 101 is made of ceramic, low thermal expansion glass, or the like.
  • the reticle presser 103 is formed of metal, plastic, or the like, and is fixed to the reticle holding member 101 by screwing or the like. Note that the reticle presser 103 is not limited to a mechanical one as long as the reticle can be fixed, and other methods can be used. Moreover, it is preferable that the reticle presser 103 is configured to fix the reticle in a detachable manner. With this configuration, the reticle can be removed when cleaning or inspecting the reticle.
  • FIG. 2 is an illustration of an embodiment of an exposure apparatus attached to a reticle 'stage 201
  • FIG. 2 is a diagram showing a reticle holding member 101 that holds a reticle 100.
  • FIG. The reticle 'stage 201 has a space for mounting the reticle holding member 101 that is opened in the direction in which the exposure light is irradiated, and a support portion 203 that supports a portion of the reticle holding member 101 that protrudes from the periphery of the reticle 100.
  • the reticle 100 is held by the reticle holding member 101 by the reticle presser 103, and the reticle holding member 101 is supported by the support portion 203.
  • the reticle 100 does not fall even during a power failure.
  • the lower surface of the peripheral edge portion of the reticle holding member 101 is supported by the force that rides on the upper surface of the support portion 203 from the upper side in the heavy direction.
  • projection exposure is performed by irradiating the surface on which the reticle pattern is formed with exposure light.
  • FIG. 3 is a view showing a reticle holding member 101a including an electrostatic chuck electrode 105 for attracting the reticle 100 according to another embodiment.
  • the reticle 100 is held on the reticle holding member 101 by the reticle presser 103, but the back surface of the reticle 100 is attracted to the surface of the reticle holding member 101a by the electrostatic chuck electrode 105.
  • the reticle holding member 101a attracts the reticle 100 by the electrostatic chuck electrode 105, so that the reticle 100 and the reticle holding member 101a can be brought into close contact with each other, and the plane of the surface on which the pattern of the reticle is formed. The degree can be further improved. Even when power is not supplied to the electrostatic chuck electrode 105, the reticle 100 is fixed by the reticle presser 103, so that the reticle 100 does not drop or shift from the reticle holding member 101a.
  • the electrostatic chuck electrode 105 of the reticle holding member 101 a may be supplied with power from an electrostatic chuck power supply line 205 of the support 203 of the reticle stage 201.
  • reticle holding member 101a includes a power receiving contact at a position corresponding to electrostatic chuck power supply line 205 of support 203 of reticle stage 201.
  • a battery is mounted on the reticle holding member 101a so that the reticle holding member 101a can attract the reticle 100 even when power is not supplied from the support portion 203 of the reticle'stage 201. It is good also as a power supply of 105.
  • the reticle holding member 10 la is fixed to the support portion 203 of the reticle 'stage 201 so that the reticle holding member 10 la is fixed to the support portion 203 of the reticle' stage 201.
  • a fixing electrostatic chuck electrode 207 may be provided. Since the reticle holding member 101a is attracted by the electrostatic chuck electrode 207 for fixing the reticle holding member, a change in the relative position between the reticle stage 201 and the reticle holding member 101a is prevented.
  • the reticle holding member fixing electrostatic chuck electrode may be provided in the reticle holding member 101a.
  • FIG. 10 is a view showing a reticle holding member lOlal according to another embodiment.
  • reticle holding member lOlal is attracted to support 203al of reticle stage 201 by a magnetic attraction mechanism.
  • the reticle holding member lOlal is provided with a magnetic body 209, and an electromagnet 211 is embedded in the support portion 203al.
  • the electromagnet 211 is, for example, a coil.
  • the magnetic material and the electromagnet may be arranged in a ring shape so as to surround the force reticle, which is a single location in FIG. 10, or only at predetermined locations (for example, three points). Also good.
  • the magnetic body may be disposed on the support portion 203al, and the electromagnet may be disposed on the reticle holding member lOlal side.
  • a current source that is passed through the electromagnet 211 that is a magnetic field generating means is not shown, but its arrangement is obvious to those skilled in the art.
  • the magnetic adsorption mechanism can increase the desorption response of the adsorbate. That is, when the current flowing through the electromagnet is turned off, the reticle holding member lOlal can be detached from the support portion 203al at a relatively high speed. Therefore, the time required for reticle replacement can be shortened, and the throughput of the exposure apparatus can be improved.
  • the reticle 100 is adsorbed to the reticle holding unit lOlal by electrostatic adsorption. This is the same as the embodiment shown in FIG. 3, and can be handled in the same manner as the above embodiment.
  • FIG. 4 is a view showing a reticle holding member 101b configured to be able to attach and detach a pellicle frame 123 including a pellicle 121 according to still another embodiment.
  • the pellicle frame 123 may be attached to and detached from the reticle holding member 101b with a magnet or a pair of metal fittings.
  • the pellicle is a dust-proof thin film that protects the surface on which the reticle pattern is formed.
  • the pellicle frame 123 is provided with a filter 125 for reducing the pressure difference between the two sides of the pellicle.
  • the filter 125 prevents fine foreign substances from entering, the conductance is low. Therefore, the pressure difference between both sides of the pellicle may not be sufficiently relaxed only by the filter 125 of the pellicle frame 123. In such a case, as shown in FIG. 4, by providing the same filter 109 on the reticle holding member 101b, the pressure difference between both sides of the particles is further alleviated.
  • FIG. 5 is a view showing a reticle holding member 101c configured to be able to attach and detach the removable cover 131 according to still another embodiment.
  • the removable 'cover 131 protects the surface on which the pattern of the reticle 100 is formed when the reticle 100 is not used, and is removed when the reticle 100 is used.
  • the removable cover 131 may be attached to and detached from the reticle holding member 101c with a magnet or a pair of metal fittings.
  • US Patent Publication No. 2006-0087638 is incorporated herein by reference.
  • the removable cover 131 is attached to the reticle holding member 101c instead of the reticle 100 itself. Therefore, the removable 'cover 131 that does not touch the reticle 100 can be attached and detached. Generation of foreign matter due to the removable 'cover 131 touching the reticle 100 is prevented.
  • the removable cover 131 is removed before or after the reticle is placed on the reticle stage, and during exposure, the exposure light is illuminated on the reticle 100 with the removable cover 131 removed.
  • the exposed surface of the reticle is fixed to the reticle stage, and a certain V is removed from the reticle stage, and then covered with a removable cover again to protect the pattern surface.
  • FIG. 8 shows an exposure apparatus according to an embodiment.
  • the reticle stage 201 is a space in which the reticle holding member 101 is opened in the direction in which the exposure light is irradiated.
  • a support portion 203 that supports a portion of the reticle holding member 101 that protrudes from the periphery of the reticle 100.
  • the reticle does not fall on the reticle stage even during a power failure. Therefore, the throughput is improved. In addition, foreign matter between the reticle's stage and the back surface of the reticle may cause the surface of the reticle where the pattern is formed. Since the flatness is not impaired, the exposure apparatus is maintained at a high resolution.
  • FIG. 6 is a flowchart illustrating a projection exposure method according to an embodiment.
  • step S010 of FIG. 6 reticle 100 is attached to reticle holding member 101.
  • reticle 100 is held by reticle holder 103 of reticle holding member 101.
  • step S020 of FIG. 6 reticle holding member 101 to which reticle 100 is attached is conveyed to the exposure apparatus.
  • FIG. 7 is a diagram showing the relationship between the reticle holding member, the clean “filter” pod, and the reticle “carrier”.
  • the reticle holding member 101 to which the reticle 100 is attached is housed in a clean 'filter' pod 151 (upper cover 151a and lower cover 151b), and further in the reticle 'carrier 153 (cover 153a and base 153b). It may be stored and transported.
  • the reticle 'carrier 153 and clean filter pod 151 are removed while the reticle holding member 101 to which the reticle 100 is attached is being conveyed to the exposure apparatus.
  • step S030 of FIG. 6 reticle holding member 101 to which reticle 100 is attached is attached to reticle stage 201 of the exposure apparatus.
  • the mounting method has already been explained using Fig. 2 and Fig. 3. Note that there is a possibility that the end effector of the robot that transports the force reticle that is not shown in Figs. 2 and 3 will collide with the reticle stage when the reticle is installed. In such a case, it is preferable to provide a groove or an opening so that the end effector does not collide with the reticle stage. It is also possible to arrange a dedicated device for attaching the reticle to the reticle stage.
  • FIG. 11 is a diagram showing an example of the configuration of the end effector 300 that conveys the reticle and the support unit 203 of the reticle stage 201.
  • the end effector 300 has two transfer arms 301a and 301b, and a base 303 to which the two transfer arms are rotatably fixed.
  • the two transfer arms 301a and 301b are provided with three support portions 301al, 301bl and 301b2, and a reticle holding member 101 shown by a dotted line is supported thereon.
  • the supporting portions 301al, 301bl and 301b2 may be provided with an adsorption means such as electrostatic adsorption.
  • the support 203 of the reticle'stage 201 has a notch 2 so that the three supports 301al, 301bl and 301b2 do not interfere mechanically when the reticle holding member 101 is placed. 03al, 203bl and 203b2 forces are provided.
  • the reticle holder 101 When the reticle holder 101 is placed on the reticle stage, it is transported to the position of the reticle 'stage 201, and then the end-effector 300 is moved downward (or the reticle' stage upward). Then, the three support parts 301al, 301bl and 301b2 enter the force notch parts 203al, 203bl and 203b2. Thereafter, the two transfer arms 301a and 301 are opened outward, and the end effector 300 moves upward.
  • the three support portions 301al, 301bl and 30 lb2 do not mechanically interfere with the reticle holding member 101.
  • reticle 100 fixed to reticle holding member 101 is placed on reticle stage 201. When removing the reticle, it can be removed in the reverse order of the above procedure.
  • the end effector 300 may be of a type having a plurality of (for example, four) transfer arms on which a plurality of reticles can be placed.
  • step S040 of FIG. 6 projection exposure is performed by irradiating the surface on which the pattern of reticle 100 is formed. It should be noted that the reticle holding member does not have to be removed every time if the reticle after projection exposure is not required to be cleaned or inspected. In other words, while another reticle is used for exposure, the reticle with the reticle holding member can be kept waiting in a vacuum or atmospheric environment, and when it is used next time, it can be performed from step S020 in FIG. It is.
  • the reticle does not fall on the reticle stage even during a power failure. Therefore, the throughput is improved. In addition, foreign matter between the reticle stage and the back surface of the reticle does not impair the flatness of the surface of the reticle on which the pattern is formed, so the exposure apparatus can be maintained at high resolution. .
  • the reticle holding member 101 may be configured to cover a part of the back surface of the reticle that is configured to cover the entire back surface of the reticle.
  • the electrode of the electrostatic chuck may be disposed only on the portion covering the back surface.
  • the reticle holding member 101 can be arranged in a frame shape only on the side surface of the reticle without placing the reticle holding member 101 on the back side of the reticle. is there.
  • FIG. 12 is a flowchart showing an example of a manufacturing process of a micro device. [0046] In step S1010, the function design of the microdevice is performed.
  • step S1020 a mask (reticle) is manufactured based on the design result in step S1010.
  • step S1030 a substrate which is a base material of the device is manufactured.
  • step S1040 substrate processing is performed.
  • Substrate processing includes exposing the substrate with exposure light through a reticle and developing the exposed substrate according to the above-described embodiment.
  • step S1050 a microdevice is assembled.
  • the assembly of the microdevice includes processing steps such as a dicing step, a bonding step, and a knocking step.
  • step S1060 the micro device is inspected.

Abstract

La présente invention concerne un élément de support de réticule, qui ne fait pas tomber le réticule d'un étage de réticule même lorsque l'alimentation en énergie est interrompue et qui maintient la planarité d'une surface sur laquelle est tracé un motif. L'élément de support de réticule (101) servant à supporter un réticule (100) est caractérisé en ce qu'au moins une partie de la portion périphérique dépasse du réticule et l'élément de support de réticule est fixé de façon à ce que la portion périphérique protubérante soit supportée par les étages de réticule (201, 203) d'un appareil d'exposition.
PCT/JP2007/062229 2006-07-11 2007-06-18 Élément de support de réticule, étage de réticule, appareil d'exposition, procédé d'exposition par projection et procédé de fabrication de dispositif WO2008007521A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008524743A JPWO2008007521A1 (ja) 2006-07-11 2007-06-18 レチクル保持部材、レチクル・ステージ、露光装置、投影露光方法およびデバイス製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006190639 2006-07-11
JP2006-190639 2006-07-11

Publications (1)

Publication Number Publication Date
WO2008007521A1 true WO2008007521A1 (fr) 2008-01-17

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Country Link
US (1) US20080024751A1 (fr)
JP (1) JPWO2008007521A1 (fr)
TW (1) TW200811591A (fr)
WO (1) WO2008007521A1 (fr)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010541267A (ja) * 2007-10-02 2010-12-24 カール・ツァイス・エスエムティー・ゲーエムベーハー 光学薄膜素子
WO2011125407A1 (fr) * 2010-04-02 2011-10-13 信越化学工業株式会社 Unité de photomasque et son procédé de fabrication
JP2012151218A (ja) * 2011-01-18 2012-08-09 Asahi Glass Co Ltd ガラス基板保持手段、およびそれを用いたｅｕｖマスクブランクスの製造方法
JP2013205515A (ja) * 2012-03-27 2013-10-07 Dainippon Printing Co Ltd 原版設置装置及び複製機
KR20170054630A (ko) * 2015-11-09 2017-05-18 삼성전자주식회사 레티클 및 그를 포함하는 노광 장치
WO2019188445A1 (fr) * 2018-03-27 2019-10-03 三井化学株式会社 Cadre de support pour pellicule, pellicule, son procédé de fabrication, matrice d'exposition l'utilisant et procédé de fabrication de dispositif à semi-conducteur
KR20200052276A (ko) * 2018-10-29 2020-05-14 구뎅 프리시젼 인더스트리얼 코포레이션 리미티드 레티클 유지 시스템
JP2021179595A (ja) * 2020-05-14 2021-11-18 家登精密工業股▲ふん▼有限公司Gudeng Precision Industrial Co., Ltd 有効気密封止状態で基板を受け入れる容器

Families Citing this family (7)

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TWI461856B (zh) * 2008-09-24 2014-11-21 Univ Ming Chi Technology With a precise alignment of the tilt exposure mechanism
TW201015230A (en) 2008-10-03 2010-04-16 Univ Nat Chiao Tung Immersion inclined lithography apparatus and tank thereof
EP2397905A1 (fr) 2010-06-15 2011-12-21 Applied Materials, Inc. Dispositif de fixation magnétique et procédé de fixation d'un substrat
US10459353B2 (en) 2013-03-15 2019-10-29 Taiwan Semiconductor Manufacturing Company, Ltd. Lithography system with an embedded cleaning module
US20150131071A1 (en) * 2013-11-08 2015-05-14 Samsung Electronics Co., Ltd. Semiconductor device manufacturing apparatus
CN104749874A (zh) * 2015-03-26 2015-07-01 京东方科技集团股份有限公司 一种掩膜板、掩膜曝光设备及掩膜曝光方法
US10714371B2 (en) * 2017-11-16 2020-07-14 Taiwan Semiconductor Manufacturing Co., Ltd. Method and apparatus for lithography in semiconductor fabrication

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1050584A (ja) * 1996-08-07 1998-02-20 Nikon Corp マスク保持装置
JPH10209018A (ja) * 1997-01-24 1998-08-07 Nippon Telegr & Teleph Corp <Ntt> Ｘ線マスクフレームおよびｘ線マスクの保持方法
JP2001176791A (ja) * 1999-12-21 2001-06-29 Shin Etsu Chem Co Ltd 露光方法、露光装置およびペリクル
JP2005150759A (ja) * 2004-12-15 2005-06-09 Nikon Corp 走査型露光装置
JP2005148741A (ja) * 2003-11-12 2005-06-09 Asml Holding Nv レチクルの運動学的位置合わせのための方法及び装置
JP2006153899A (ja) * 2004-10-29 2006-06-15 Nikon Corp レチクル保護部材、レチクル搬送装置、露光装置、及びレチクルの搬送方法。

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0722112B2 (ja) * 1987-07-30 1995-03-08 キヤノン株式会社 マスクホルダ並びにそれを用いたマスクの搬送方法
JP3224157B2 (ja) * 1992-03-31 2001-10-29 キヤノン株式会社 Ｘ線マスクとその製造方法、並びに該ｘ線マスクを用いたデバイス製造方法とｘ線露光装置
US6136168A (en) * 1993-01-21 2000-10-24 Tdk Corporation Clean transfer method and apparatus therefor
JP3243168B2 (ja) * 1996-02-06 2002-01-07 キヤノン株式会社 原版保持装置およびこれを用いた露光装置
JP2001023886A (ja) * 1999-07-08 2001-01-26 Nikon Corp 試料保持装置及び露光装置
US6239863B1 (en) * 1999-10-08 2001-05-29 Silicon Valley Group, Inc. Removable cover for protecting a reticle, system including and method of using the same
US6639650B2 (en) * 1999-12-21 2003-10-28 Shin-Etsu Chemical Co., Ltd. Light exposure method, light exposure apparatus, pellicle and method for relieving warpage of pellicle membrane
JP3960820B2 (ja) * 2001-03-01 2007-08-15 エーエスエムエル ネザーランズ ビー．ブイ． マスク引継ぎ方法およびデバイス製造方法
JP2002313713A (ja) * 2001-04-19 2002-10-25 Nikon Corp レチクル、それを用いた露光装置及び露光方法
TWI319123B (en) * 2002-02-22 2010-01-01 Asml Holding Nv System and method for using a two part cover for protecting a reticle
JP2004153122A (ja) * 2002-10-31 2004-05-27 Nikon Corp 露光装置
TWI245170B (en) * 2003-07-22 2005-12-11 Asml Netherlands Bv Lithographic apparatus, device manufacturing method, and device manufactured thereby
US7236233B2 (en) * 2003-10-27 2007-06-26 Asml Netherlands B.V. Assembly of a reticle holder and a reticle
JP2006005240A (ja) * 2004-06-18 2006-01-05 Nikon Corp 基板搬送装置、基板搬送方法および露光装置
JP2006013208A (ja) * 2004-06-28 2006-01-12 Canon Inc 露光装置
JP2006128188A (ja) * 2004-10-26 2006-05-18 Nikon Corp 基板搬送装置、基板搬送方法および露光装置
TWI447840B (zh) * 2004-11-15 2014-08-01 尼康股份有限公司 基板搬運裝置、基板搬運方法以及曝光裝置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1050584A (ja) * 1996-08-07 1998-02-20 Nikon Corp マスク保持装置
JPH10209018A (ja) * 1997-01-24 1998-08-07 Nippon Telegr & Teleph Corp <Ntt> Ｘ線マスクフレームおよびｘ線マスクの保持方法
JP2001176791A (ja) * 1999-12-21 2001-06-29 Shin Etsu Chem Co Ltd 露光方法、露光装置およびペリクル
JP2005148741A (ja) * 2003-11-12 2005-06-09 Asml Holding Nv レチクルの運動学的位置合わせのための方法及び装置
JP2006153899A (ja) * 2004-10-29 2006-06-15 Nikon Corp レチクル保護部材、レチクル搬送装置、露光装置、及びレチクルの搬送方法。
JP2005150759A (ja) * 2004-12-15 2005-06-09 Nikon Corp 走査型露光装置

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010541267A (ja) * 2007-10-02 2010-12-24 カール・ツァイス・エスエムティー・ゲーエムベーハー 光学薄膜素子
WO2011125407A1 (fr) * 2010-04-02 2011-10-13 信越化学工業株式会社 Unité de photomasque et son procédé de fabrication
JP5285185B2 (ja) * 2010-04-02 2013-09-11 信越化学工業株式会社 フォトマスクユニット及びその製造方法
JP2012151218A (ja) * 2011-01-18 2012-08-09 Asahi Glass Co Ltd ガラス基板保持手段、およびそれを用いたｅｕｖマスクブランクスの製造方法
US8967608B2 (en) 2011-01-18 2015-03-03 Asahi Glass Company, Limited Glass substrate-holding tool and method for producing an EUV mask blank by employing the same
JP2013205515A (ja) * 2012-03-27 2013-10-07 Dainippon Printing Co Ltd 原版設置装置及び複製機
KR20170054630A (ko) * 2015-11-09 2017-05-18 삼성전자주식회사 레티클 및 그를 포함하는 노광 장치
KR102502727B1 (ko) * 2015-11-09 2023-02-23 삼성전자주식회사 레티클 및 그를 포함하는 노광 장치
US11243463B2 (en) 2018-03-27 2022-02-08 Mitsui Chemicals, Inc. Supporting frame for pellicle, pellicle, method for manufacturing same, exposure master using same, and method for manufacturing semiconductor device
WO2019188445A1 (fr) * 2018-03-27 2019-10-03 三井化学株式会社 Cadre de support pour pellicule, pellicule, son procédé de fabrication, matrice d'exposition l'utilisant et procédé de fabrication de dispositif à semi-conducteur
JPWO2019188445A1 (ja) * 2018-03-27 2021-03-11 三井化学株式会社 ペリクル用支持枠、ペリクル、及びその製造方法、並びにこれらを用いた露光原版、半導体装置の製造方法
JP2021510209A (ja) * 2018-10-29 2021-04-15 家登精密工業股▲ふん▼有限公司Ｇｕｄｅｎｇ Ｐｒｅｃｉｓｉｏｎ Ｉｎｄｕｓｔｒｉａｌ Ｃｏ．，Ｌｔｄ レチクル保持システム
JP2021167966A (ja) * 2018-10-29 2021-10-21 家登精密工業股▲ふん▼有限公司Gudeng Precision Industrial Co., Ltd レチクル保持システム
JP2022051846A (ja) * 2018-10-29 2022-04-01 家登精密工業股▲ふん▼有限公司 レチクル保持システム
KR102408849B1 (ko) * 2018-10-29 2022-06-13 구뎅 프리시젼 인더스트리얼 코포레이션 리미티드 레티클 유지 시스템
US11508592B2 (en) 2018-10-29 2022-11-22 Gudeng Precision Industrial Co., Ltd Reticle retaining system
KR20200052276A (ko) * 2018-10-29 2020-05-14 구뎅 프리시젼 인더스트리얼 코포레이션 리미티드 레티클 유지 시스템
JP7291684B2 (ja) 2018-10-29 2023-06-21 家登精密工業股▲ふん▼有限公司 レチクル保持システム
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JP2021179595A (ja) * 2020-05-14 2021-11-18 家登精密工業股▲ふん▼有限公司Gudeng Precision Industrial Co., Ltd 有効気密封止状態で基板を受け入れる容器

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