WO2007148396A1 - Source d'évaporation par arc et système d'évaporation sous vide - Google Patents

Source d'évaporation par arc et système d'évaporation sous vide Download PDF

Info

Publication number
WO2007148396A1
WO2007148396A1 PCT/JP2006/312489 JP2006312489W WO2007148396A1 WO 2007148396 A1 WO2007148396 A1 WO 2007148396A1 JP 2006312489 W JP2006312489 W JP 2006312489W WO 2007148396 A1 WO2007148396 A1 WO 2007148396A1
Authority
WO
WIPO (PCT)
Prior art keywords
electrode
vacuum
electrodes
power source
anode
Prior art date
Application number
PCT/JP2006/312489
Other languages
English (en)
Japanese (ja)
Inventor
Yasuhiro Koizumi
Kouichi Nose
Original Assignee
Shinmaywa Industries, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinmaywa Industries, Ltd. filed Critical Shinmaywa Industries, Ltd.
Priority to CNA2006800547002A priority Critical patent/CN101448969A/zh
Priority to PCT/JP2006/312489 priority patent/WO2007148396A1/fr
Priority to US12/281,583 priority patent/US20090057144A1/en
Priority to EP06767147A priority patent/EP2031085A1/fr
Priority to TW095122919A priority patent/TW200801210A/zh
Publication of WO2007148396A1 publication Critical patent/WO2007148396A1/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • C23C14/325—Electric arc evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material

Definitions

  • the present invention relates to an arc evaporation source and a vacuum vapor deposition apparatus, and more particularly to an arc evaporation source and a vacuum vapor deposition apparatus with improved recovery performance of the evaporation material in a vacuum arc vapor deposition method.
  • a high-temperature and low-activity cathode spot is usually formed on a cathode (force sword; target), and a high-energy electrode material (for example, a cathode material ion) is in a vacuum from the cathode spot.
  • a high-energy electrode material for example, a cathode material ion
  • a method of forming a film on the workpiece surface using such an electrode material is called a vacuum arc deposition method.
  • This vacuum arc vapor deposition method has various features such as excellent adhesion to the workpiece by obtaining a high energy electrode material directly from solid metal, and the ability to eliminate containers for accumulating electrode materials such as crucibles and boats. It has the advantages of
  • Patent Document 1 provided with the first and second electrodes facing each other, the droplets discharged by the first and second electrode forces move through the gap between the two electrodes. Then, they adhere to each other, and the force can recover the droplets.
  • the present invention has been made in view of such circumstances, and provides an arc evaporation source and a vacuum evaporation apparatus capable of appropriately recovering a vapor deposition material released by a force sword force of vacuum arc discharge. For the purpose.
  • an arc evaporation source includes first and second electrodes facing each other with a gap therebetween, and at least any of the first and second electrodes.
  • One electrode is used as a force sword, and the other electrode force of the first and second electrodes is based on the vacuum arc discharge generated between the force sword and the anode. It is configured to be able to recover the evaporated substance released from the tank.
  • the vacuum vapor deposition apparatus generates electric power that causes a vacuum arc discharge between the vacuum tank in which the arc evaporation source is disposed in a depressurizable interior and the force sword and the anode. And a power supply means for supplying power to the force sword and the anode.
  • the evaporation substance released from the force sword at the time of the vacuum arc discharge is preferably attached to the other electrode and collected.
  • the circuit configuration of vacuum arc discharge can be simplified.
  • the evaporating substances are droplets and ions that also have a material force of the force sword.
  • the first and second electrodes may be arranged with their longitudinal directions aligned, and the workpiece may be arranged at a position facing the gap.
  • a recovery member disposed in the vacuum chamber for recovering the evaporated substance, wherein a surface of the recovery member is curved so as to surround the gap except for a region between the workpiece and the gap. It may be configured.
  • the first and second electrode forces are released in almost all directions facing the gap excluding the region where the workpiece is arranged.
  • the released electrode material force is almost adhered to the inner surface of the recovery member. .
  • the vacuum evaporation apparatus has a first use state in which the first electrode is the force sword and a second use state in which the second electrode is the force sword. Also good.
  • a switching unit that performs switching between the first usage state and the second usage state may be provided.
  • the second electrode is recovered during the first use state.
  • the evaporated material is reused as part of the second electrode that functions as a force sword during the next second use state, and is collected in the first electrode during the second use state.
  • the evaporated material is preferably reused as a part of the first electrode functioning as a force sword during the first use state for the next time.
  • the power supply means is a direct current power source
  • the switching means switches between the first electrode and the second electrode for connection to the cathode side terminal of the direct current power source. It can be a switch to do.
  • the power supply means is an AC power source
  • the switching means is provided between one terminal of the AC power source and the first electrode and between the other terminal of the AC power source and a second terminal.
  • a rectifying element that rectifies the power supplied from the AC power source may be provided between the electrode and the other electrode.
  • the power supply means is connected to the first DC power source having a negative terminal connected to the first electrode and a positive terminal connected to the anode, and to the second electrode.
  • a second DC power source having a negative terminal and a positive terminal connected to the anode.
  • the first DC power source supplies the first electrode with power for vacuum arc discharge and the second DC power source.
  • Power supply for vacuum arc discharge to the second electrode is performed at the same time, and this causes uneven deposition thickness distribution of the coating material on the workpiece due to the first use state and the second use. It is expected that the uneven deposition thickness distribution of the coating material on the workpiece depending on the working conditions will cancel each other out, and the uneven deposition thickness distribution of the coating material on the workpiece can be prevented.
  • FIG. 1 is a cross-sectional view showing a configuration of an arc evaporation source for a vacuum vapor deposition apparatus according to an embodiment of the present invention.
  • FIG. 2 is a cross-sectional view showing a configuration of an arc evaporation source for a vacuum evaporation apparatus according to an embodiment of the present invention.
  • FIG. 3 is a schematic diagram for explaining a configuration example of a vacuum vapor deposition apparatus according to the present embodiment.
  • FIG. 4 is a diagram for explaining the coating material scattering form on the workpiece in the first use state and the coating material scattering form on the workpiece in the second use state.
  • FIG. 5 is a schematic diagram for explaining a configuration example of a vacuum vapor deposition apparatus according to Modification Example 1.
  • FIG. 6 is a schematic diagram for explaining a structural example of a vacuum vapor deposition apparatus according to Modification 2.
  • FIG. 7 is a schematic diagram for explaining a configuration example of a vacuum vapor deposition apparatus according to Modification 3. Explanation of symbols
  • FIG. 1 and 2 are cross-sectional views showing the configuration of an arc evaporation source for a vacuum evaporation apparatus according to an embodiment of the present invention.
  • Fig. 1 is a cross-sectional view along the plane parallel to the flange 15 in the central part of the first and second electrodes 14A, 14B of the arc evaporation units 10A, 10B. It is sectional drawing of the surface along a line.
  • the arc evaporation source 100 includes an arc evaporation unit 10A, 10B via a pair of arc evaporation units 10A, 10B and insulating members 17A, 17B of the arc evaporation units 10A, 10B as shown in FIGS.
  • Disc-shaped metal flange that holds the power supply rod members 16A and 16B 15 And have.
  • the arc evaporation unit 10A includes a first electrode 14A having a columnar shape (rod shape) having a noble metal force as shown in FIG. 1 and a round hole in the center, and the first electrode 14A is inserted into the round hole.
  • the electrode holder 13A In the state where the square plate-like metal electrode holder 13A holding the first electrode 14A and the circular surface SA1 at one end of the first electrode 14A are in contact with each other, the electrode holder 13A is appropriately fixed (screw or the like; And a substantially rectangular metal bracket 12A that is fixedly held by a non-illustrated).
  • the arc evaporation unit 10A extends through the through hole (not shown) of the flange 15 as shown in FIG. 2 so as to straddle the flange 15, and extends to the side surface of the bracket 12A (on the contact surface of the first electrode 14A).
  • a cylindrical metal power supply that is fixed to the orthogonal surface) by appropriate fixing means (screws, etc .; not shown) and configured to supply a predetermined power to the first electrode 14A via the bracket 12A.
  • a cylindrical member that is inserted between the bar member 16A and the peripheral surface of the through hole of the power feed bar member 16A and the flange 15 and makes it possible to maintain electrical insulation between the power feed bar member 16A and the flange 15 It has a through hole that allows the insulating member 17A and the first electrode 14A to pass through the circular surface SA2 at the other end for a predetermined length, and borders the bracket 12A, electrode holder 13A, first electrode 14A, and flange 15.
  • the configuration of the arc evaporation unit 10B is the same as that of the arc evaporation unit 10A, and for the components of the arc evaporation unit 10B corresponding to the components of the arc evaporation unit 10A, the end of the reference symbol is ⁇ It is shown as being changed from “A” to “B”. Therefore, detailed description of each component of the arc evaporation unit 10B is omitted here.
  • the cylindrical first and second electrodes 14A and 14B extend in the axial direction so as to pass through the through holes of the cover members 11A and 11B and come close to each other.
  • the first and second electrodes 14A 14B are arranged opposite to each other so as to maintain a predetermined disc-shaped gap G sandwiched between the circular surfaces SA2 and SB2 at the other end of 14B.
  • the first and second electrodes 14A and 14B serve as a force sword (cathode; target) for vacuum arc discharge. It also serves as a member that collects the evaporated substances released from the power swords of split and vacuum arc discharge.
  • the bracket 12A in a state where the first electrode 14A is held via the electrode holder 13A is formed by rotating the power feed rod member 16A in the circumferential direction. It can rotate over a predetermined rotation range about the axial center PA of 16A.
  • the bracket 12B in a state where the second electrode 14B is held via the electrode holder 13B rotates the power supply rod member 16B in the circumferential direction, so that a predetermined centering on the axial center PB of the power supply rod member 16B is performed. It can be rotated over a range of rotation.
  • the electrode holders 13A and 13B have a protruding portion (not shown) protruding from the side force of the electrode holders 13A and 13B, and the central portion in the width direction of the protruding portion is the diameter of the round hole. A slit hole (not shown) that reaches this round hole is formed along the direction. Then, the first and second electrodes 14A and 14B are fixed to the electrode holders 13A and 13B, respectively, by fastening means (screws or the like; not shown) for fastening the protrusions in the circumferential direction of the round hole. .
  • the electrode holders 13A and 13B are made of a metal (for example, stainless steel) that can withstand heating by vacuum arc discharge through the first and second electrodes 14A and 14B.
  • the brackets 12A and 12B and the power feed rod members 16A and 16B both have a hollow area (not shown), and water or the like supplied from a coolant supply means (not shown) is provided in the hollow area. Circulating coolant. For this reason, the high temperature of the first and second electrodes 14A and 14B accompanying the vacuum arc discharge is appropriately suppressed by heat exchange with the coolant via the brackets 12A and 12B.
  • the cover members 11 A and 1 IB are grounded via the flange 15 and the vacuum chamber 20 (described later), whereby the power supply rod members 16 A and 16 B and the brackets 12 A and 12 B and the electrode holders 13 A and 13 B and the first and first
  • the discharge area when the power for vacuum arc discharge is applied to the second electrodes 14A and 14B is limited to the circular surfaces SA2 and SB2 at the other ends of the first and second electrodes 14A and 14B. It plays the role of a shield plate that can be prevented.
  • FIG. 3 is a schematic diagram for explaining a configuration example of the vacuum evaporation apparatus according to the present embodiment.
  • the arc evaporation source 100 only the first and second electrodes 14A and 14B of its constituent elements are representatively illustrated.
  • the first and second arc evaporation units 10A and 10B of the arc evaporation source 100 shown in FIGS. 1 and 2 are opened through an opening (not shown) provided in the wall of the vacuum chamber 20 of the apparatus 110.
  • the flange 15 of the arc evaporation source 100 is vacuum-sealed based on a seal member (O ring or the like; not shown), and appropriate fixing means (screws or the like; It is fixed to the wall of the vacuum chamber 20 (not shown) (the same applies to FIGS. 5, 6 and 7) o
  • the vacuum evaporation apparatus 110 includes an arc evaporation source having a vacuum chamber 20 capable of reducing the pressure inside, and first and second electrodes 14A and 14B disposed at appropriate positions inside the vacuum chamber 20.
  • a workpiece 21 arranged at a proper position inside the vacuum chamber 20, and one of the first and second electrodes 14A and 14B and the vacuum chamber 20 (anode; anode)
  • a positive electrode terminal is connected to the vacuum chamber 20 so as to cause a vacuum arc discharge, and it is connected to one of the first and second electrodes 14A and 14B via the switching switch 22.
  • a DC power source (power supply means) 23 to which the negative electrode side terminal is connected. Since the vacuum chamber 20 is grounded, the positive terminal of the DC power source 23 is maintained at the ground potential.
  • the structural member of the vacuum chamber 20 is made of a conductive material and is configured as a part of a circuit (member) for performing vacuum arc discharge, while the first and second electrodes 14A, 14B is a force configured to be insulated from the vacuum chamber 20.
  • a vacuum chamber 20 and a separate anode (metal plate, etc .; not shown) are arranged inside the vacuum chamber 20, and a DC power source is provided there. You may connect the terminal on the positive pole side of 23.
  • the first and second electrodes 14A and 14B are aligned in the longitudinal direction of the first and second electrodes 14A and 14B so that a gap G is formed by the circular surfaces SA2 and SB2 (end surfaces).
  • the first and second electrodes 14 are arranged so that the workpiece 21 can be exposed from the gap G.
  • a and 14B are spaced apart in the radial direction. If the workpiece 21 is arranged in such a direction with respect to the first and second electrodes 14A and 14B, one of the first and second electrodes 14A and 14B and the vacuum chamber 20 It is known that the amount of droplets scattered in the direction of the workpiece 21 generated due to the vacuum arc discharge during the period is small and suitable. Of course, if adhesion of the droplet to the workpiece 21 is confirmed, various existing droplet countermeasure technologies can be introduced inside the vacuum chamber 20 to prevent the droplet from attaching to the workpiece 21. good.
  • the DC power source 23 outputs a voltage of about 10 to 100 V (volt) and a current of about 10 to 500 A (ampere) as DC power.
  • the negative electrode side terminal of the DC power source 23 is connected to the first electrode 14A made of noble metal (gold, silver, etc.) by switching the switching switch 22, and the second
  • the first electrode 14A functions as a power sword (cathode; target) for vacuum arc discharge. "Used state”).
  • the noble metal electrode material that constitutes the first electrode 14A from the circular surface SA2 at the other end of the first electrode 14A.
  • the noble metal droplets constituting the first electrode 14A are mainly emitted in the axial direction of the first electrode 14A from the circular surface SA2 at the other end of the first electrode 14A.
  • the electrode material discharged from the first electrode 14A is placed on the circular surface SB2 on the other end of the second electrode 14B facing the circular surface SA2 on the other end of the first electrode 14A with a gap G therebetween. Part and droplets (evaporation material) are deposited, so that this evaporation material can be efficiently collected on the second electrode 14B.
  • the negative electrode side terminal of the DC power source 23 is connected to the second electrode 14B of the noble metal (gold, silver, etc.) by switching of the switching switch 22, and the first electrode 14A is electrically connected.
  • the second electrode 14B When placed in a floating state, the second electrode 14B is used as a vacuum arc discharge cathode (cathode; target). "Use state of". ) Is realized. Then, based on the vacuum arc discharge generated between the second electrode 14B and the vacuum chamber 20, the electrode material force of the noble metal constituting the second electrode 14B from the circular surface SB2 at the other end of the second electrode 14B.
  • the noble metal droplets constituting the second electrode 14B are emitted mainly from the circular surface SB2 at the other end of the second electrode 14B in the axial direction of the second electrode 14B.
  • the evaporated material from which the second electrode 14B force has also been released adheres to the circular surface SA2 at the other end of the first electrode 14A that faces the circular surface SB2 at the other end of the second electrode 14B with a gap G therebetween.
  • the evaporated substance can be efficiently recovered by the first electrode 14A.
  • the evaporated material collected in the second electrode 14B is reused as a part of the second electrode 14B functioning as a force sword during the next second use state.
  • the evaporated substance collected in the first electrode 14A during this period is preferably reused as a part of the first electrode 14A functioning as a force sword.
  • the vacuum vapor deposition apparatus 110 includes a control device (not shown) that controls the operation thereof, and this control apparatus appropriately controls the vacuum arc discharge in the vacuum vapor deposition apparatus 110. Next, the operation of the vacuum evaporation apparatus 110 according to the present embodiment will be described.
  • both the power supply conditions for generating the vacuum arc discharge and the gas conditions inside the vacuum chamber 20 are based on known techniques, and detailed description thereof will be omitted here.
  • the discharge gas is guided from an appropriate place on the wall of the vacuum chamber 20, and the vacuum chamber 20 has a predetermined degree of vacuum (for example, lPa).
  • the vacuum exhaust device is operated so as to keep the
  • ignition of the vacuum arc discharge is performed by, for example, a contact ignition method. That is, the first and second electrodes 14A and 14B are rotated so as to approach each other around the axial centers PA and PB (see FIG. 1), and the first and second electrodes 14A and 14B are brought into contact with each other.
  • a contact ignition method That is, the first and second electrodes 14A and 14B are rotated so as to approach each other around the axial centers PA and PB (see FIG. 1), and the first and second electrodes 14A and 14B are brought into contact with each other.
  • predetermined power is applied to the first electrode 14A and the vacuum chamber 20 so as to execute the first use state in the vacuum deposition apparatus 110.
  • the noble metal coating material constituting the first electrode 14A is deposited on the work 21, and the second electrode 14B is The evaporated substance released from the electrode 14A of 1 is collected, and the collected evaporated substance is reused in the next second use state.
  • the vacuum of the vacuum vapor deposition apparatus 110 is released to the atmosphere, and the work 21 inside the vacuum chamber 20 is replaced. Then, the same vacuum arc discharge inducing operation is performed again. After that, predetermined power is applied to the second electrode 14B and the vacuum chamber 20 so that the workpiece 21 is used in the second usage state in the vacuum deposition apparatus 110. Then, based on the vacuum arc discharge between the second electrode 14B and the vacuum chamber 20, the noble metal coating material constituting the second electrode 14B is deposited on the work 21 and the first electrode 14B is deposited. The evaporated substance released from the second electrode 14B is collected in the electrode 14A, and the collected evaporated substance is reused in the next first use state.
  • FIG. 5 is a schematic diagram for explaining a configuration example of a vacuum vapor deposition apparatus according to this modification.
  • the vacuum vapor deposition apparatus 120 instead of the direct current power source 23 and the switching switch 22 in the vacuum vapor deposition apparatus 110 (FIG. 3) of the embodiment, the vacuum vapor deposition apparatus 120 according to this modification includes an alternating current power source 32 (power Supply means) and four first to fourth diodes (rectifier elements) 31A, 31B, 31C, and 3 ID.
  • the AC power source 32 outputs a voltage of about 10 to 100 V (volt) and a current of about 10 to 500 A (ampere) as AC power such as a rectangular wave.
  • the first diode 31A is connected between the wiring between the one terminal of the AC power source 32 and the vacuum chamber 20 so that the terminal force of the first diode 31A is also directed toward the vacuum chamber 20 to conduct (forward direction). Inserted.
  • the second diode 31B has a terminal force between the one terminal of the AC power source 32 and the second electrode 14B and does not conduct electricity toward the second electrode 14B. Direction).
  • the third diode 31C is connected between the other terminal of the AC power source 32 and the vacuum chamber 20, and the other terminal force is also directed to the vacuum chamber 20 to conduct in the direction (forward direction). It is inserted so that the fourth diode 31D is not electrically conductive between the other terminal of the AC power source 32 and the first electrode 14A from the other terminal toward the first electrode 14A (reverse) Direction).
  • the first electrode 14A and the second electrode are in accordance with the AC cycle of the AC power source 32 with reference to the potential of the vacuum chamber 20 (actually the ground potential).
  • a negative potential is alternately applied to 14B.
  • the first usage state (the coating material scattering pattern of the A pattern in FIG. 4) and the second usage state (the coating pattern of the B pattern in FIG. 4) in the vacuum deposition apparatus 120.
  • the material scattering mode is automatically switched over many times at a single interval during the period of one batch corresponding to the AC frequency of the AC power source 32. For this reason, by adjusting the AC frequency of the AC power source 32 appropriately, uneven deposition thickness distribution of the coating material on the work 21 in the first use state and the film on the work 21 in the second use state It is expected that the uneven film thickness distribution of the material will offset each other, and the uneven film thickness distribution of the coating material on the workpiece 21 can be prevented.
  • FIG. 6 is a schematic diagram for explaining a configuration example of a vacuum vapor deposition apparatus equipped with an arc evaporation source according to this modification.
  • the vacuum vapor deposition apparatus 130 in place of the DC power source 23 and the switching switch 22 in the vacuum vapor deposition apparatus 110 (FIG. 3) of the embodiment, includes the first electrode 14A A first DC power source 41 (power supply means) capable of supplying power to the second electrode 14B, and a second DC power source 42 (power supply means) capable of supplying power to the second electrode 14B. ing.
  • the vacuum chamber 20 has a first arc discharge so that a vacuum arc discharge is generated between the first electrode 14A (force sword; target) and the vacuum chamber 20 (positive electrode; anode).
  • the terminal on the positive electrode side of the DC power source 41 is connected, and the terminal on the negative electrode side is connected to the first electrode 14A. Since the vacuum chamber 20 is grounded, the positive terminal of the first DC power source 41 is maintained at the ground potential.
  • a vacuum chamber is formed so that a vacuum arc discharge is generated between the second electrode 14B (force sword; target) and the vacuum chamber 20 (anode; anode).
  • the terminal on the positive side of the second DC power source 42 is connected to 20 and the terminal on the negative side is connected to the second electrode 14B. Since the vacuum chamber 20 is grounded, the terminal on the positive electrode side of the second direct current power source 42 is kept at the ground potential.
  • the first DC power source 41 supplies the first electrode 14A with power for vacuum arc discharge and the second DC power source 42 uses the second electrode 14B.
  • Power supply for vacuum arc discharge is performed at the same time, which results in uneven film thickness distribution of the coating material on the workpiece 21 due to the first use condition and the second use condition. It is expected that the uneven film thickness distribution of the coating material on the workpiece 21 and the force cancel each other, and the uneven deposition thickness distribution of the coating material on the workpiece 21 can be prevented.
  • the first electrode 14A has a circular arc SA generated between the first electrode 14A and the vacuum chamber 20, and the second surface SA2 of the other end of the first electrode 14A
  • the noble metal electrode material composing one electrode 14A is uniformly emitted in each direction facing the circular surface SA2.
  • the second use state of the vacuum deposition apparatus 120 based on the vacuum arc discharge generated between the second electrode 14B and the vacuum chamber 20, the circular surface SB2 at the other end of the second electrode 14B.
  • the noble metal electrode material constituting the second electrode 14B is uniformly emitted in each direction facing the circular surface SB2.
  • the electrode material that has also released the first and second electrodes 14A and 14B in each direction facing the gap G (circular surfaces SA2 and SB2) excluding the area where the workpiece 21 is disposed is not recovered. It adheres to the wall of the vacuum chamber 20 and the internal structure of the vacuum chamber 20.
  • FIG. 7 is a schematic diagram for explaining a configuration example of the vacuum vapor deposition apparatus according to this modification, and is a view of the axial force of the first and second electrodes 14A and 14B.
  • the vacuum vapor deposition device 140 is provided with a collection member 51 that is disposed inside the vacuum chamber 20 and is substantially divided into half cylindrical members.
  • the recovery member 51 is arranged with the longitudinal direction of the recovery member 51 (direction orthogonal to the width direction) parallel to the axial direction of the first and second electrodes 14A and 14B, and the recovery member 51
  • the inner surface 52 is curved so as to surround the gap G except for the region between the workpiece 21 and the gap G.
  • the electrode material discharged from the first and second electrodes 14A and 14B is exposed in each direction facing the gap G (circular surfaces SA2 and SB2) excluding the region where the workpiece 21 is disposed. Almost all adhere to the inner surface 52 of the recovery member 51.
  • the electrode material is recovered by an appropriate peeling method. The electrode material can be reliably recovered by peeling from the collecting member 51.
  • the arc evaporation source and the vacuum evaporation apparatus according to the present invention are useful, for example, as an apparatus for forming a film on a workpiece by vacuum arc discharge.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

L'invention concerne une source d'évaporation par arc et un système d'évaporation sous vide dans lequel des substances d'évaporation émises par la cathode de décharge en arc sous vide peuvent être recueillies de façon appropriée. La source d'évaporation par arc (100) comporte une première et une seconde électrode (14A, 14B) montées l'une en face de l'autre dans un espace (G) ; au moins la première ou la seconde électrode (14A, 14B) sert de cathode et l'autre peut recueillir des substances d'évaporation émises par la cathode selon la décharge en arc sous vide générée entre la cathode et l'anode.
PCT/JP2006/312489 2006-06-22 2006-06-22 Source d'évaporation par arc et système d'évaporation sous vide WO2007148396A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CNA2006800547002A CN101448969A (zh) 2006-06-22 2006-06-22 电弧蒸发源及真空蒸镀装置
PCT/JP2006/312489 WO2007148396A1 (fr) 2006-06-22 2006-06-22 Source d'évaporation par arc et système d'évaporation sous vide
US12/281,583 US20090057144A1 (en) 2006-06-22 2006-06-22 Arc Evaporation Source and Vacuum Deposition System
EP06767147A EP2031085A1 (fr) 2006-06-22 2006-06-22 Source d'évaporation par arc et système d'évaporation sous vide
TW095122919A TW200801210A (en) 2006-06-22 2006-06-26 Arc evaporation source and vacuum evaporation system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2006/312489 WO2007148396A1 (fr) 2006-06-22 2006-06-22 Source d'évaporation par arc et système d'évaporation sous vide

Publications (1)

Publication Number Publication Date
WO2007148396A1 true WO2007148396A1 (fr) 2007-12-27

Family

ID=38833148

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2006/312489 WO2007148396A1 (fr) 2006-06-22 2006-06-22 Source d'évaporation par arc et système d'évaporation sous vide

Country Status (5)

Country Link
US (1) US20090057144A1 (fr)
EP (1) EP2031085A1 (fr)
CN (1) CN101448969A (fr)
TW (1) TW200801210A (fr)
WO (1) WO2007148396A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105745546B (zh) 2013-03-15 2017-10-13 雅培制药有限公司 具有后面可进入轨道系统的自动化诊断分析仪及相关方法
ES2934684T3 (es) 2013-03-15 2023-02-24 Abbott Lab Analizadores de diagnóstico automatizados que tienen carruseles dispuestos verticalmente y métodos relacionados
CN104362064B (zh) * 2014-11-21 2016-08-17 厦门福纳新材料科技有限公司 一种真空电弧放电的电极结构
CN110284109B (zh) * 2019-05-16 2021-09-21 兰州空间技术物理研究所 径向等离子体射流脉冲真空电弧蒸发源及薄膜沉积装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02170968A (ja) * 1988-12-21 1990-07-02 Kobe Steel Ltd 真空アーク蒸着装置及び真空アーク蒸着方法
JP2002069664A (ja) 2000-08-28 2002-03-08 Hiroshi Takigawa プラズマ加工方法及びプラズマ加工装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3465205A (en) * 1968-02-12 1969-09-02 Gen Electric Vacuum gap devices with metal ionizable species evolving trigger assemblies
US5451308A (en) * 1991-04-29 1995-09-19 Novatech Electric arc metal evaporator

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02170968A (ja) * 1988-12-21 1990-07-02 Kobe Steel Ltd 真空アーク蒸着装置及び真空アーク蒸着方法
JP2002069664A (ja) 2000-08-28 2002-03-08 Hiroshi Takigawa プラズマ加工方法及びプラズマ加工装置

Also Published As

Publication number Publication date
EP2031085A1 (fr) 2009-03-04
CN101448969A (zh) 2009-06-03
US20090057144A1 (en) 2009-03-05
TW200801210A (en) 2008-01-01

Similar Documents

Publication Publication Date Title
JP3652702B2 (ja) プラズマ処理用線形アーク放電発生装置
KR0165851B1 (ko) 판상체 지지테이블 및 그것을 이용한 처리장치
JP5291086B2 (ja) 真空アーク蒸発源、及び真空アーク蒸発源を有するアーク蒸発チャンバ
JP2002025794A (ja) リアルタイムパーティクルフィルタを具備したプラズマ処理装置
JP2011179120A (ja) 多点クランプを用いた物理蒸着装置及び方法
WO2007148396A1 (fr) Source d'évaporation par arc et système d'évaporation sous vide
KR101698717B1 (ko) 대상물 가공 장치
RU2425173C2 (ru) Установка для комбинированной ионно-плазменной обработки
CN101946022B (zh) 卷绕式真空成膜装置
TW200830390A (en) Method and apparatus for manufacturing cleaned substrates or clean substrates which are further processed
JPH11140630A (ja) カソードアーク気相堆積装置
KR20130058625A (ko) 이온 봄바드먼트 장치 및 이 장치를 사용한 기재 표면의 클리닝 방법
RU2496913C2 (ru) Установка для ионно-лучевой и плазменной обработки
EP2482303B1 (fr) Appareil de dépôt et procédés
JP7159487B2 (ja) マスク構造及びｆｃｖａ装置
EP2037001B1 (fr) Dispositif de déposition en phase vapeur sous vide de type à enroulement
JP6577804B2 (ja) マグネトロンスパッタ法による成膜装置および成膜方法
JP2006328438A (ja) アーク蒸発源および真空蒸着装置
JP2009120925A (ja) スパッタリング装置
JP3772192B2 (ja) 位相制御多電極型交流放電装置における壁密着型電極
KR20080106410A (ko) 아크 증발원 및 진공증착장치
US5859500A (en) Metal ion plasma generator having rotatable anode plate
JP2004076160A (ja) シールド装置
JP2010251014A (ja) ホローカソード型放電管
KR20150133820A (ko) 이온빔 처리 장치, 전극 어셈블리 및 전극 어셈블리의 세정 방법

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200680054700.2

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 06767147

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2006767147

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 1020087020014

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 12281583

Country of ref document: US

NENP Non-entry into the national phase

Ref country code: DE