JP2009120925A - スパッタリング装置 - Google Patents
スパッタリング装置 Download PDFInfo
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- JP2009120925A JP2009120925A JP2007299137A JP2007299137A JP2009120925A JP 2009120925 A JP2009120925 A JP 2009120925A JP 2007299137 A JP2007299137 A JP 2007299137A JP 2007299137 A JP2007299137 A JP 2007299137A JP 2009120925 A JP2009120925 A JP 2009120925A
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- sputtered particles
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- sputtering apparatus
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- 238000004544 sputter deposition Methods 0.000 title claims abstract description 50
- 239000002245 particle Substances 0.000 claims abstract description 70
- 150000002500 ions Chemical class 0.000 claims abstract description 26
- 238000000151 deposition Methods 0.000 claims abstract description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 17
- 238000007599 discharging Methods 0.000 claims 2
- 230000007935 neutral effect Effects 0.000 abstract description 4
- 230000008021 deposition Effects 0.000 abstract 1
- 239000010408 film Substances 0.000 description 30
- 239000007789 gas Substances 0.000 description 16
- 239000010409 thin film Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 239000012212 insulator Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000000498 cooling water Substances 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 229910001882 dioxygen Inorganic materials 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000001755 magnetron sputter deposition Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000005546 reactive sputtering Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000000752 ionisation method Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3435—Applying energy to the substrate during sputtering
- C23C14/345—Applying energy to the substrate during sputtering using substrate bias
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3471—Introduction of auxiliary energy into the plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Plasma & Fusion (AREA)
- Physical Vapour Deposition (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
【解決手段】ターゲット11とワークWとの間には、RFコイル23が配され、ターゲット11からワークWに向けて飛散するスパッタ粒子は、RFコイル23に高周波電力が供給されるとによってプラスイオンにイオン化される。ワークWまたはワークWを保持するワークホルダ8には、バイアス電源26によってマイナスのバイアスが与えられ、イオン化されたスパッタ粒子を吸着する。バイアス電源26に流れる電流は、付着したスパッタ粒子が直ちに電気的に中性とならないように制限される。
【選択図】図1
Description
3 真空槽
8 ワークホルダ
8a 保持部
10 ターゲットユニット
11 ターゲット
23 RFコイル
24 高周波電源
26 バイアス電源
W ワーク
Claims (7)
- 真空槽内に配されたターゲットを一方の電極として放電を行って、ターゲットからスパッタ粒子を放出し、放出したスパッタ粒子を成膜対象のワークに堆積させることにより成膜を行うスパッタリング装置において、
前記ターゲットから前記ワークに向けて飛散するスパッタ粒子をイオン化するイオン化手段と、
前記ワークまたは前記ワークの背面側に近接して設けた導電性を有するバイアス電極板にマイナスのバイアスを与えるバイアス電源と、
前記バイアス電源に流れる電流を、単位時間当たりに前記イオン化手段で発生するスパッタ粒子のプラスイオンの電荷量に相当する電流よりも小さく制限する電流制限手段とを備えたことを特徴とするスパッタリング装置。 - 前記イオン化手段は、前記ターゲットと前記ワークとの間に配置された高周波コイルと、この高周波コイルに高周波電力を供給する高周波電源とからなることを特徴とする請求項1記載のスパッタリング装置。
- 前記高周波コイルは、前記ターゲットよりも前記ワークに寄った位置に配置されていることを特徴とする請求項2記載のスパッタリング装置。
- 前記イオン化手段は、前記ターゲットと前記ワークとの間に熱電子を放出する熱電子発生器であることを特徴とする請求項1記載のスパッタリング装置。
- 前記イオン化手段は、前記ターゲットと前記ワークとの間にイオンを照射するイオン銃であることを特徴とする請求項1記載のスパッタリング装置。
- 前記バイアス電極板は、前記ワークの背面側の面形状と略相似形状とされ、前記ワークの背面側の面に沿って配されることを特徴とする請求項1ないし5のいずれか1項に記載のスパッタリング装置。
- 前記バイアス電極は、前記ワークを保持する保持部材に一体に設けられていることを特徴とする請求項1ないし6のいずれか1項に記載のスパッタリング装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007299137A JP5464800B2 (ja) | 2007-11-19 | 2007-11-19 | スパッタリング装置及び成膜方法 |
CN2008801165610A CN101861409B (zh) | 2007-11-19 | 2008-10-30 | 溅射装置以及成膜方法 |
PCT/JP2008/069732 WO2009066551A1 (ja) | 2007-11-19 | 2008-10-30 | スパッタリング装置及び成膜方法 |
KR1020107008698A KR20100080912A (ko) | 2007-11-19 | 2008-10-30 | 스퍼터링 장치 및 성막 방법 |
HK10111009.4A HK1144590A1 (en) | 2007-11-19 | 2010-11-26 | Sputtering apparatus and film forming method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007299137A JP5464800B2 (ja) | 2007-11-19 | 2007-11-19 | スパッタリング装置及び成膜方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009120925A true JP2009120925A (ja) | 2009-06-04 |
JP5464800B2 JP5464800B2 (ja) | 2014-04-09 |
Family
ID=40667377
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007299137A Expired - Fee Related JP5464800B2 (ja) | 2007-11-19 | 2007-11-19 | スパッタリング装置及び成膜方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5464800B2 (ja) |
KR (1) | KR20100080912A (ja) |
CN (1) | CN101861409B (ja) |
HK (1) | HK1144590A1 (ja) |
WO (1) | WO2009066551A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102839352A (zh) * | 2011-06-21 | 2012-12-26 | 无锡尚德太阳能电力有限公司 | 一种薄膜沉积装置及方法 |
CN103060759A (zh) * | 2011-10-21 | 2013-04-24 | 鸿富锦精密工业(深圳)有限公司 | 镀膜装置 |
CN103074584A (zh) * | 2011-10-25 | 2013-05-01 | 鸿富锦精密工业(深圳)有限公司 | 镀膜装置 |
CN104131258B (zh) * | 2014-06-17 | 2017-01-11 | 北京大学深圳研究生院 | 一种离子镀膜装置和离子镀膜方法 |
JP6476261B1 (ja) * | 2017-10-17 | 2019-02-27 | 株式会社神戸製鋼所 | 成膜方法 |
CN115772652A (zh) * | 2022-12-05 | 2023-03-10 | 唐山斯腾光电科技有限公司 | 一种红外窗片加工用溅射镀膜设备 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10229057A (ja) * | 1996-11-21 | 1998-08-25 | Applied Materials Inc | 誘導結合プラズマによるチャンバ内スパッタリングにおいて側壁カバレージを改善する方法及び装置 |
JP2002020861A (ja) * | 2000-07-04 | 2002-01-23 | Canon Inc | 成膜方法及び成膜装置 |
JP2004285383A (ja) * | 2003-03-20 | 2004-10-14 | Japan Science & Technology Agency | 化合物薄膜成膜装置及び化合物薄膜成膜方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6599399B2 (en) * | 1997-03-07 | 2003-07-29 | Applied Materials, Inc. | Sputtering method to generate ionized metal plasma using electron beams and magnetic field |
US6551471B1 (en) * | 1999-11-30 | 2003-04-22 | Canon Kabushiki Kaisha | Ionization film-forming method and apparatus |
JP2002053955A (ja) * | 2000-08-04 | 2002-02-19 | Canon Inc | イオン化成膜装置及びイオン化成膜方法 |
CN2734774Y (zh) * | 2004-07-28 | 2005-10-19 | 雷卫武 | 双离子束共溅射淀积原子层纳米薄膜设备 |
JP2007248562A (ja) * | 2006-03-14 | 2007-09-27 | Shincron:Kk | 光学物品およびその製造方法 |
-
2007
- 2007-11-19 JP JP2007299137A patent/JP5464800B2/ja not_active Expired - Fee Related
-
2008
- 2008-10-30 WO PCT/JP2008/069732 patent/WO2009066551A1/ja active Application Filing
- 2008-10-30 CN CN2008801165610A patent/CN101861409B/zh not_active Expired - Fee Related
- 2008-10-30 KR KR1020107008698A patent/KR20100080912A/ko not_active IP Right Cessation
-
2010
- 2010-11-26 HK HK10111009.4A patent/HK1144590A1/xx not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10229057A (ja) * | 1996-11-21 | 1998-08-25 | Applied Materials Inc | 誘導結合プラズマによるチャンバ内スパッタリングにおいて側壁カバレージを改善する方法及び装置 |
JP2002020861A (ja) * | 2000-07-04 | 2002-01-23 | Canon Inc | 成膜方法及び成膜装置 |
JP2004285383A (ja) * | 2003-03-20 | 2004-10-14 | Japan Science & Technology Agency | 化合物薄膜成膜装置及び化合物薄膜成膜方法 |
Also Published As
Publication number | Publication date |
---|---|
CN101861409A (zh) | 2010-10-13 |
WO2009066551A1 (ja) | 2009-05-28 |
CN101861409B (zh) | 2012-11-28 |
JP5464800B2 (ja) | 2014-04-09 |
KR20100080912A (ko) | 2010-07-13 |
HK1144590A1 (en) | 2011-02-25 |
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