WO2007134569A3 - Keramisches material, gesinterte keramik und bauelement daraus, verfahren zur herstellung und verwendung der keramik - Google Patents

Keramisches material, gesinterte keramik und bauelement daraus, verfahren zur herstellung und verwendung der keramik Download PDF

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Publication number
WO2007134569A3
WO2007134569A3 PCT/DE2007/000847 DE2007000847W WO2007134569A3 WO 2007134569 A3 WO2007134569 A3 WO 2007134569A3 DE 2007000847 W DE2007000847 W DE 2007000847W WO 2007134569 A3 WO2007134569 A3 WO 2007134569A3
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Prior art keywords
ceramics
made therefrom
production method
ceramic material
component made
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PCT/DE2007/000847
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English (en)
French (fr)
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WO2007134569A2 (de
Inventor
Pavol Dudesek
Christian Hoffmann
Matjaz Valant
Danilo Suvorov
Original Assignee
Epcos Ag
Pavol Dudesek
Christian Hoffmann
Matjaz Valant
Danilo Suvorov
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Application filed by Epcos Ag, Pavol Dudesek, Christian Hoffmann, Matjaz Valant, Danilo Suvorov filed Critical Epcos Ag
Priority to KR1020087031126A priority Critical patent/KR101339090B1/ko
Priority to JP2009511329A priority patent/JP5647412B2/ja
Priority to CN200780018655XA priority patent/CN101448759B/zh
Publication of WO2007134569A2 publication Critical patent/WO2007134569A2/de
Publication of WO2007134569A3 publication Critical patent/WO2007134569A3/de
Priority to US12/275,645 priority patent/US7816293B2/en

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Abstract

Es wird ein keramisches Mischsystem vorgeschlagen, bestehend aus einem Zwei-Phasengemisch der Reinkomponenten A und B, wobei die Phase A auf der kubischen bis tetragonalen Modifikation von Bi3NbO7 und die Phase B auf der monoklinen Pyrochlormodifikation von Bi2(Zn2/3Nb4/3)O7 beruht. Die elektrischen Eigenschaften daraus hergestellter keramischer Körper machen das Material für Bauelemente geeignet, die Mehrschichtstruktur aufweisen, in die Kapazitäten und Induktivitäten integriert sind und die in der Datenverarbeitung oder Signalverarbeitung eingesetzt werden können.
PCT/DE2007/000847 2006-05-23 2007-05-09 Keramisches material, gesinterte keramik und bauelement daraus, verfahren zur herstellung und verwendung der keramik WO2007134569A2 (de)

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KR1020087031126A KR101339090B1 (ko) 2006-05-23 2007-05-09 세라믹 재료, 소결 세라믹, 이로부터 제조된 부품, 세라믹의 제조 방법 및 용도
JP2009511329A JP5647412B2 (ja) 2006-05-23 2007-05-09 セラミック材料、焼結セラミック、電気部品、セラミック材料の製造方法、及び電気部品の使用法
CN200780018655XA CN101448759B (zh) 2006-05-23 2007-05-09 陶瓷材料、烧结陶瓷和由其制成的元件、制造方法和陶瓷的应用
US12/275,645 US7816293B2 (en) 2006-05-23 2008-11-21 Ceramic material, sintered ceramic and component made therefrom, production method and use of the ceramic

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DE102006024231.9 2006-05-23
DE102006024231A DE102006024231B4 (de) 2006-05-23 2006-05-23 Keramisches Material, gesinterte Keramik, Verfahren zur Herstellung und Verwendung der Keramik

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EP1990328B1 (de) * 2007-05-07 2011-10-26 Siemens Aktiengesellschaft Keramisches Pulver, keramische Schicht sowie Schichtsystem aus zwei Pyrochlorphasen und Oxiden
US7939941B2 (en) 2007-06-27 2011-05-10 Taiwan Semiconductor Manufacturing Company, Ltd. Formation of through via before contact processing
NO20080452L (no) * 2008-01-24 2009-07-27 Well Technology As A method and an apparatus for controlling a well barrier
US8853830B2 (en) 2008-05-14 2014-10-07 Taiwan Semiconductor Manufacturing Company, Ltd. System, structure, and method of manufacturing a semiconductor substrate stack
CN101362084B (zh) * 2008-09-18 2010-10-13 武汉理工大学 可见光响应纳米Bi3NbO7光催化剂的制备方法及其应用
DE102009014542B3 (de) * 2009-02-12 2010-12-02 Epcos Ag Mehrschichtbauelement und Verfahren zur Herstellung
US8691664B2 (en) * 2009-04-20 2014-04-08 Taiwan Semiconductor Manufacturing Company, Ltd. Backside process for a substrate
DE102009041952B4 (de) * 2009-09-17 2017-03-30 Airbus Defence and Space GmbH Verfahren zur Herstellung eines mehrlagigen Keramiksubstrats und mehrlagiges Keramiksubstrat und dessen Verwendung
CN102389825B (zh) * 2011-09-02 2013-10-02 武汉理工大学 一种具有可见光响应的纳米复合光催化剂的制备方法
JP5812035B2 (ja) * 2013-04-04 2015-11-11 Tdk株式会社 誘電体磁器組成物、誘電体磁器および電子部品
CN107004596A (zh) * 2014-12-24 2017-08-01 国立大学法人北陆先端科学技术大学院大学 氧化物介电体及其制造方法、氧化物介电体的前体以及固体电子装置及其制造方法
DE102015120640A1 (de) 2015-11-27 2017-06-01 Epcos Ag Vielschichtbauelement und Verfahren zur Herstellung eines Vielschichtbauelements
CN111902883B (zh) 2018-03-28 2022-04-08 Tdk株式会社 电介质组合物及电子部件
JP7211182B2 (ja) * 2019-03-15 2023-01-24 Tdk株式会社 誘電体組成物および電子部品
CN111689776B (zh) 2019-03-15 2022-07-01 Tdk株式会社 电介质组合物和电子部件
JP7363535B2 (ja) 2019-03-15 2023-10-18 Tdk株式会社 誘電体組成物および電子部品
CN110171965B (zh) * 2019-04-26 2021-07-06 武汉理工大学 一种npo电容器介质材料及其制备方法
CN110372377A (zh) * 2019-07-24 2019-10-25 天津大学 一种巨介电常数电介质材料的制备方法
CN111540604B (zh) * 2020-05-07 2022-05-31 无锡太湖学院 一种多层片状陶瓷电子元器件的制备方法
CN114956816B (zh) * 2022-06-07 2023-03-24 清华大学 一种高性能烧绿石储能陶瓷材料及其制备方法与应用

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DE102006024231B4 (de) 2010-01-28
JP5647412B2 (ja) 2014-12-24
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US20090155624A1 (en) 2009-06-18
US7816293B2 (en) 2010-10-19
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CN101448759A (zh) 2009-06-03

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