WO2007126767A3 - Système de mandrin comprenant un réseau de chambres à fluide - Google Patents

Système de mandrin comprenant un réseau de chambres à fluide Download PDF

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Publication number
WO2007126767A3
WO2007126767A3 PCT/US2007/007487 US2007007487W WO2007126767A3 WO 2007126767 A3 WO2007126767 A3 WO 2007126767A3 US 2007007487 W US2007007487 W US 2007007487W WO 2007126767 A3 WO2007126767 A3 WO 2007126767A3
Authority
WO
WIPO (PCT)
Prior art keywords
fluid
chambers
substrate
array
recess
Prior art date
Application number
PCT/US2007/007487
Other languages
English (en)
Other versions
WO2007126767A2 (fr
Inventor
Anshuman Cherala
Byung-Jin Choi
Pankaj B Lad
Steven C Shackleton
Original Assignee
Molecular Imprints Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Molecular Imprints Inc filed Critical Molecular Imprints Inc
Priority to EP07754062A priority Critical patent/EP2007566A4/fr
Priority to JP2009504203A priority patent/JP4667524B2/ja
Publication of WO2007126767A2 publication Critical patent/WO2007126767A2/fr
Publication of WO2007126767A3 publication Critical patent/WO2007126767A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Nanotechnology (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

La présente invention concerne un système de mandrin pour maintenir un substrat. Ce système comprend notamment un corps de mandrin présentant un premier et un second côté opposés, le premier côté comportant un réseau de chambres à fluide disposées en rangées et en colonnes. Lesdites chambres à fluide comprennent chacune un premier et un second évidement espacés définissant une première et une seconde région de support espacées, la première région de support entourant la seconde région de support et le premier et le second évidement, la seconde région de support entourant le second évidement et le substrat reposant contre la première et la seconde région de support. Le premier évidement et une partie du substrat superposée à celui-ci définissent une première chambre et le second évidement et une partie du substrat superposée à celui-ci définissent une seconde chambre. Chaque colonne de premières chambres et chaque rangée de secondes chambres sont en communication fluidique avec une source de fluide différente pour réguler un écoulement de fluide dans le réseau de chambres à fluide.
PCT/US2007/007487 2006-04-03 2007-03-26 Système de mandrin comprenant un réseau de chambres à fluide WO2007126767A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP07754062A EP2007566A4 (fr) 2006-04-03 2007-03-26 Système de mandrin comprenant un réseau de chambres à fluide
JP2009504203A JP4667524B2 (ja) 2006-04-03 2007-03-26 流体チャンバのアレイを備えるチャック・システム

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US78877706P 2006-04-03 2006-04-03
US60/788,777 2006-04-03

Publications (2)

Publication Number Publication Date
WO2007126767A2 WO2007126767A2 (fr) 2007-11-08
WO2007126767A3 true WO2007126767A3 (fr) 2008-07-31

Family

ID=38656006

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/007487 WO2007126767A2 (fr) 2006-04-03 2007-03-26 Système de mandrin comprenant un réseau de chambres à fluide

Country Status (6)

Country Link
EP (1) EP2007566A4 (fr)
JP (2) JP4667524B2 (fr)
KR (1) KR20090004910A (fr)
CN (1) CN101415535A (fr)
TW (1) TWI352874B (fr)
WO (1) WO2007126767A2 (fr)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4854383B2 (ja) * 2006-05-15 2012-01-18 アピックヤマダ株式会社 インプリント方法およびナノ・インプリント装置
US8215946B2 (en) * 2006-05-18 2012-07-10 Molecular Imprints, Inc. Imprint lithography system and method
US8652393B2 (en) * 2008-10-24 2014-02-18 Molecular Imprints, Inc. Strain and kinetics control during separation phase of imprint process
US8309008B2 (en) * 2008-10-30 2012-11-13 Molecular Imprints, Inc. Separation in an imprint lithography process
US8913230B2 (en) * 2009-07-02 2014-12-16 Canon Nanotechnologies, Inc. Chucking system with recessed support feature
JP5875250B2 (ja) * 2011-04-28 2016-03-02 キヤノン株式会社 インプリント装置、インプリント方法及びデバイス製造方法
JP5893303B2 (ja) * 2011-09-07 2016-03-23 キヤノン株式会社 インプリント装置、それを用いた物品の製造方法
JP5887469B2 (ja) * 2013-12-03 2016-03-16 株式会社ハーモテック 保持装置、保持システム、制御方法及び搬送装置
JP6333031B2 (ja) * 2014-04-09 2018-05-30 キヤノン株式会社 インプリント装置および物品の製造方法
US10620532B2 (en) 2014-11-11 2020-04-14 Canon Kabushiki Kaisha Imprint method, imprint apparatus, mold, and article manufacturing method
JP6647027B2 (ja) 2015-12-03 2020-02-14 キヤノン株式会社 インプリント装置および物品製造方法
JP6940944B2 (ja) * 2016-12-06 2021-09-29 キヤノン株式会社 インプリント装置、及び物品製造方法
JP7132739B2 (ja) 2018-04-06 2022-09-07 キヤノン株式会社 インプリント装置、インプリント方法および物品製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5534073A (en) * 1992-09-07 1996-07-09 Mitsubishi Denki Kabushiki Kaisha Semiconductor producing apparatus comprising wafer vacuum chucking device
US6762826B2 (en) * 1999-08-19 2004-07-13 Canon Kabushiki Kaisha Substrate attracting and holding system for use in exposure apparatus

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000195927A (ja) * 1998-12-28 2000-07-14 Sony Corp 真空チャック装置
JP2001127144A (ja) * 1999-08-19 2001-05-11 Canon Inc 基板吸着保持方法、基板吸着保持装置および該基板吸着保持装置を用いた露光装置ならびにデバイス製造方法
JP2001127145A (ja) * 1999-08-19 2001-05-11 Canon Inc 基板吸着保持方法、基板吸着保持装置および該基板吸着保持装置を用いた露光装置ならびにデバイス製造方法
ATE549743T1 (de) * 2002-11-13 2012-03-15 Molecular Imprints Inc Ein lithographiesystem mit einem halterungssystem

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5534073A (en) * 1992-09-07 1996-07-09 Mitsubishi Denki Kabushiki Kaisha Semiconductor producing apparatus comprising wafer vacuum chucking device
US6762826B2 (en) * 1999-08-19 2004-07-13 Canon Kabushiki Kaisha Substrate attracting and holding system for use in exposure apparatus
US6809802B1 (en) * 1999-08-19 2004-10-26 Canon Kabushiki Kaisha Substrate attracting and holding system for use in exposure apparatus

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2007566A4 *

Also Published As

Publication number Publication date
TWI352874B (en) 2011-11-21
EP2007566A4 (fr) 2010-10-13
EP2007566A2 (fr) 2008-12-31
CN101415535A (zh) 2009-04-22
WO2007126767A2 (fr) 2007-11-08
KR20090004910A (ko) 2009-01-12
JP2009532899A (ja) 2009-09-10
TW200813619A (en) 2008-03-16
JP4667524B2 (ja) 2011-04-13
JP2011077529A (ja) 2011-04-14

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