Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
  • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
  • H01L21/67766—Mechanical parts of transfer devices
• • G—PHYSICS
  • G05—CONTROLLING; REGULATING
  • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
  • G05B19/00—Programme-control systems
  • G05B19/02—Programme-control systems electric
  • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
  • G05B19/402—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by control arrangements for positioning, e.g. centring a tool relative to a hole in the workpiece, additional detection means to correct position
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
  • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
  • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
  • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
  • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
  • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
• • G—PHYSICS
  • G05—CONTROLLING; REGULATING
  • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
  • G05B2219/00—Program-control systems
  • G05B2219/30—Nc systems
  • G05B2219/40—Robotics, robotics mapping to robotics vision
  • G05B2219/40562—Position and orientation of end effector, teach probe, track them
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10S414/00—Material or article handling
  • Y10S414/135—Associated with semiconductor wafer handling
  • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

Definitions

• the invention relates to a transport device for disk-shaped workpieces, in particular for semiconductor wafers, according to claim 1.
• FIG. 1 shows a disk-shaped workpiece, such as a semiconductor wafer, in plan view and in various cross-sections with different examples of deflections.
• 3a shows a cassette in cross-section with a plurality of partially bent workpieces stored therein;
• FIG. 4c shows a workpiece in top view with the resulting permissible handling zones
• Fig. 8a in cross-section workpieces stored in a cassette which are bent discarded;
• Fig. 8c is a plan view of a workpiece with warp deposited on support elements
• Vacuum process equipment may also include multiple process stations operated by one or more handling robots.
• two linear supports 1, which form the support elements 26, 27, are preferably provided, as shown schematically in FIG.
• the linear pads 1 are aligned substantially parallel to each other and spaced from each other such that the disc-shaped workpiece 7 is supported on both sides along the support line 6 on the supports 1 in the edge region.
• These two supports 1 are preferably designed as rod-shaped support elements 26, 27.
• the system tolerance range 8 is determinative in the vertical direction, as shown in cross section in FIG. 2a. If now the maximum possible deflections of the workpiece upwards 9 and down 10 are taken into account, results in a deviating from the horizontal angle of the workpiece surface, the upward angle 9 and the downward angle 10 relative to the support 1, resulting in the maximum Define handling zone width 11 defining the handling zones 12, 13 on the workpiece on both sides. This results in virtually two spaced parallel strip-shaped handling zones 12, 13, which lie in the peripheral area of the disk-shaped workpiece, as shown in the plan view in FIG. 2b.
• the apparent thickness 36 in the area of the tilted scanning beam 35 must be greater than the maximum possible distance d in the laser beam area from an upwardly bent wafer 4 and between a downwardly bent wafer 3, when in the same slot of the cassette 20 would lie.
• the actual actual handling zone width 39 for the measuring system lies within the maximum imaging zone width 38.
• the two imaging zones 40, 41 which lie on both sides of the wafer near the comb structures 18 ', 18 of the cassette 20, result from the thus determined handling zone width 39.

Landscapes

• Engineering & Computer Science (AREA)
• General Physics & Mathematics (AREA)
• Manufacturing & Machinery (AREA)
• Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Robotics (AREA)
• Automation & Control Theory (AREA)
• Human Computer Interaction (AREA)
• Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
• Warehouses Or Storage Devices (AREA)
• Manufacturing Of Magnetic Record Carriers (AREA)
• Apparatuses For Bulk Treatment Of Fruits And Vegetables And Apparatuses For Preparing Feeds (AREA)

Priority Applications (5)

Applications Claiming Priority (2)

Publications (1)

Family

ID=35953842

Family Applications (1)

Country Status (9)

Families Citing this family (5)

Citations (4)

Family Cites Families (23)

• 2006
  • 2006-09-15 KR KR1020087012802A patent/KR101341270B1/ko active IP Right Grant
  • 2006-09-15 JP JP2008540421A patent/JP5134546B2/ja active Active
  • 2006-09-15 EP EP06775191A patent/EP1952437B1/de active Active
  • 2006-09-15 WO PCT/CH2006/000498 patent/WO2007056875A1/de active Application Filing
  • 2006-09-15 DE DE502006003294T patent/DE502006003294D1/de active Active
  • 2006-09-15 CN CN200680042607XA patent/CN101310377B/zh active Active
  • 2006-09-15 AT AT06775191T patent/ATE426917T1/de not_active IP Right Cessation
  • 2006-10-26 US US11/588,165 patent/US20070107659A1/en not_active Abandoned
  • 2006-11-03 TW TW095140710A patent/TWI402934B/zh active
• 2010
  • 2010-08-02 US US12/848,746 patent/US8491252B2/en active Active

Patent Citations (4)

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