US20070246957A1 - Loading device of loading a substrate capable of eliminating electrostatic charges - Google Patents
Loading device of loading a substrate capable of eliminating electrostatic charges Download PDFInfo
- Publication number
- US20070246957A1 US20070246957A1 US11/380,205 US38020506A US2007246957A1 US 20070246957 A1 US20070246957 A1 US 20070246957A1 US 38020506 A US38020506 A US 38020506A US 2007246957 A1 US2007246957 A1 US 2007246957A1
- Authority
- US
- United States
- Prior art keywords
- substrate
- loading device
- contact region
- loading
- glass substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Definitions
- the invention relates to a loading device of loading a substrate, and more particularly, to a loading device capable of eliminating electrostatic charges.
- each substrate also commonly referred to as a wafer, is processed through multiple manufacturing processes to produce a variety of electronic products.
- a glass substrate is processed through various complex manufacturing processes. These processes include: exposure, development, and deposition processes such that the LCD can be formed.
- the above-mentioned complex processes should be performed by different machines. Therefore, in the entire flow of manufacturing processes that are necessary to generate the LCD, the glass substrate must be moved to a specific machine to perform current manufacturing processes according to the required manufacturing flow.
- electrostatic charges are formed on the glass substrate. This is especially apparent during the moving process.
- the electrostatic charges form regardless of steps taken such as placing the glass substrate in a cassette or placing it in a moving/loading device such as a vacuum robot or an operating machine. Regardless of these prevention efforts, the electrostatic charges are formed on the glass substrate because the glass substrate still has frictions with surrounding environments. Therefore, the electrostatic discharge (ESD) effect occurs.
- ESD electrostatic discharge
- the electrostatic charges are accumulated between the glass substrate 150 and pads 140 . If the electrostatic charges are accumulated to be larger than a threshold, the above-mentioned ESD effect occurs between the glass substrate 150 and the pads 140 . Therefore, the above-mentioned ESD effect occurs in the areas 160 , 170 . It is well known that the ESD effect changes the electric fields in the areas 160 , 170 . The manufacturing processes are influenced by unstable electric fields resulting in errors. This directly decreases the yield of the LCD.
- the present invention discloses a loading device for loading a substrate.
- the loading device comprises a support module and a conductive media.
- the support module comprises at least one contact region contacted with the substrate for providing a supporting force to load the substrate.
- ESD effect may occurs on the contact region. Therefore, the conductive media is electrically connected to the contact region and a voltage level for eliminating electrostatic charges between the contact region and the substrate.
- the present invention robot forklift comprises a conductive media to eliminate the electrostatic charges between the pads and the glass substrate. Therefore, the interferences by the electrostatic charges can be reduced and the yield of the LCD can be increased.
- FIG. 1 is a diagram of a conventional robot forklift.
- each of the support modules 210 , 220 further comprises a conductive media 280 .
- One end of the conductive media 280 is electrically connected to the above-mentioned pads 240 , and the other end of the conductive media 280 is electrically connected to a ground voltage. Therefore, the aforementioned electrostatic charges in the areas 260 , 270 are removed by the ground voltage through the conductive media 280 . Therefore, the above-mentioned ESD effect can be sufficiently eliminated.
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- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A loading device for loading a substrate includes: a support module having at least a contact region contacted with the substrate for providing a supporting force to load the substrate; and a conductive media, electrically connected to the contact region and a voltage level, for eliminating electrostatic discharges between the contact region and the substrate.
Description
- 1. Field of the Invention
- The invention relates to a loading device of loading a substrate, and more particularly, to a loading device capable of eliminating electrostatic charges.
- 2. Description of the Prior Art
- In the fields of semiconductor manufacturing processes, each substrate, also commonly referred to as a wafer, is processed through multiple manufacturing processes to produce a variety of electronic products. Taking the liquid crystal display (LCD) as an example, a glass substrate is processed through various complex manufacturing processes. These processes include: exposure, development, and deposition processes such that the LCD can be formed. The above-mentioned complex processes should be performed by different machines. Therefore, in the entire flow of manufacturing processes that are necessary to generate the LCD, the glass substrate must be moved to a specific machine to perform current manufacturing processes according to the required manufacturing flow.
- However, in the process of locating the glass substrate inside the clean room, electrostatic charges are formed on the glass substrate. This is especially apparent during the moving process. The electrostatic charges form regardless of steps taken such as placing the glass substrate in a cassette or placing it in a moving/loading device such as a vacuum robot or an operating machine. Regardless of these prevention efforts, the electrostatic charges are formed on the glass substrate because the glass substrate still has frictions with surrounding environments. Therefore, the electrostatic discharge (ESD) effect occurs.
- For some specific machines, for example, the ULVAC PVD machine, the vacuum robot forklift is firstly utilized to move the glass substrate to the sputter chamber. Then the PVD process is performed on the glass substrate to form the thin film of semiconductor and protection layer on the surface of the glass substrate.
- Please refer to
FIG. 1 , which is a diagram of a conventional robot forklift 100. As shown inFIG. 1 , therobot forklift 100 comprisessupport modules connect module 130. Theconnect module 130 is connected to the body of the robot. Thesupport modules connect module 130 such that the connecting force between thesupport modules connect module 130 can be utilized to provide a support force to thesupport modules support modules glass substrate 150 such that theglass substrate 150 can be moved to different machines by the robot forklift 100. - In addition, each of the
support modules pads 140. When thesupport modules glass substrate 150, thepads 140 provide theglass substrate 150 with a plurality of contact regions such that thepads 140 can provide needed supporting force for loading theglass substrate 150 through these contact regions. Furthermore, thepads 140 can also provide friction to theglass substrate 150 in order to prevent theglass substrate 150 from sliding. - Because these pads 140 rub against the
glass substrate 150, the electrostatic charges are accumulated between theglass substrate 150 andpads 140. If the electrostatic charges are accumulated to be larger than a threshold, the above-mentioned ESD effect occurs between theglass substrate 150 and thepads 140. Therefore, the above-mentioned ESD effect occurs in theareas areas - It is therefore one of the primary objectives of the invention to provide a loading device capable of eliminating electrostatic charges, to solve the above-mentioned problem.
- The present invention discloses a loading device for loading a substrate. The loading device comprises a support module and a conductive media. The support module comprises at least one contact region contacted with the substrate for providing a supporting force to load the substrate. As mentioned previously, ESD effect may occurs on the contact region. Therefore, the conductive media is electrically connected to the contact region and a voltage level for eliminating electrostatic charges between the contact region and the substrate.
- In addition, the present invention further discloses a method for utilizing a loading device to load a substrate. The method comprises: utilizing at least a contact region on a support module to contact the substrate such that a supporting force is provided to the substrate to load the substrate; and electrically connecting the contact region to a voltage level such that electrostatic charges between the contact region and the substrate are eliminated.
- The present invention robot forklift comprises a conductive media to eliminate the electrostatic charges between the pads and the glass substrate. Therefore, the interferences by the electrostatic charges can be reduced and the yield of the LCD can be increased.
-
FIG. 1 is a diagram of a conventional robot forklift. -
FIG. 2 is a diagram of a robot forklift according to the present invention. -
FIG. 3 is a diagram of a conductive media shown inFIG. 2 of an embodiment according to the preset invention. - Please refer to
FIG. 2 , which is a diagram of a robot forklift 200 according to the present invention. As shown inFIG. 2 , therobot forklift 200 also comprisessupport modules connect module 230. The connectmodule 230 is connected to the body of the robot. Thesupport modules connect module 230 such that the connecting force between thesupport modules connect module 230 can be utilized to provide a support force to thesupport modules support modules glass substrate 250 such that theglass substrate 250 can be moved to different machines by the robot forklift 200. - Similar to the robot forklift 100, each of the
support modules pads 240. When thesupport modules glass substrate 250, thepads 240 provide theglass substrate 250 with a plurality of contact regions such that thepads 240 can provide the needed support force for loading theglass substrate 250 through these contact regions. Furthermore, thepads 240 can also provide frictions to theglass substrate 250 in order to prevent theglass substrate 250 from sliding. - In this embodiment, each of the
support modules conductive media 280. One end of theconductive media 280 is electrically connected to the above-mentionedpads 240, and the other end of theconductive media 280 is electrically connected to a ground voltage. Therefore, the aforementioned electrostatic charges in theareas conductive media 280. Therefore, the above-mentioned ESD effect can be sufficiently eliminated. - Please refer to
FIG. 3 , which is a diagram of theconductive media 280 shown inFIG. 2 of an embodiment according to the present invention. As shown inFIG. 3 , theconductive media 280 is a tree-shaped copper film conductive line. Moreover, each branch of theconductive media 280 is contacted to thepads 240 of thesupport modules conductive media 280 is electrically connected to the ground voltage. Therefore, the electrostatic charges can be removed by the ground voltage. Please note the tree-shaped copper filmconductive line 280 is only utilized as a preferred embodiment; this is not a limitation of the present invention. In other words, theconductive media 280 can have various shapes or can be manufactured utilizing other conducting materials. This change also obeys the spirit of the present invention. - However, in the preferred embodiment of the present invention, sufficiently removes the electrostatic charges between the
pads 240 and theglass substrate 250 by utilizing some components that are refined to optimize the removing operation of the electrostatic charges. For example, thepads 240 are manufactured by tiny electricity-conducting materials. Therefore, the electrostatic charges can be smoothly conducted throughpads 240 andconductive media 280. Please note, thepads 240 can also be manufactured utilizing other materials. The above-mentioned tiny electricity-conducting materials are only utilized as a preferred embodiment; this is not a limitation of the preset invention. - Furthermore, please refer to
FIG. 2 andFIG. 3 again. Theconductive media 280 is pasted on thesupport modules robot forklift 200 and for preventing theconductive media 280 from influencing the original manufacturing processes, in the preferred embodiment, is the glue. The glue is capable of bearing high temperature. Therefore, the glue does not vaporize thus producing unwanted gas that might influence the manufacturing processes. Furthermore, the thickness of the copperthin film 280 is made as thin as possible such that the influence of the copperthin film 280 can be minimized. For example, the thickness of the copperthin film 280 can be 0.1 mm. However, the 0.1 mm thickness and the glue capable of bearing high temperature are also utilized as an embodiment of the present invention. In other words, designers can select various glues and thickness according to various manufacturing procedure and cost requirements. This change also obeys the spirit of the present invention. - Please note, in the above disclosure, the manufacturing process of the LCD is utilized to illustrate the technique of the present invention, however, the preset invention can be utilized in the manufacturing processes of other electronic devices. In other words, the present invention robot forklift is not limited to the task of loading the glass substrate, in fact, the present invention robot forklift can be utilized to load and move all kinds of substrates or wafers.
- In addition, the present invention is not limited to be utilized in the above-mentioned robot forklift. In the actual implementation, all loading devices for loading substrates can utilize the present invention method and related structure to remove the electrostatic charges of the substrate. This change also obeys the spirit of the present invention.
- In contrast to the prior art, the present invention robot forklift comprises a conductive media to eliminate the electrostatic charges that are formed between the pads and the glass substrate. Therefore, the interference caused by the electrostatic charges can be reduced and the yield of the LCD can be increased.
- Those skilled in the art will readily observe that numerous modifications and alterations of the device and method may be made while retaining the teachings of the invention. Accordingly, the above disclosure should be construed as limited only by the metes and bounds of the appended claims.
Claims (14)
1. A loading device for loading a substrate comprising:
a support module having at least one contact region contacted with the substrate for providing a support force to load the substrate; and
a conductive media, electrically connected to the contact region and a voltage level, for eliminating electrostatic charges between the contact region and the substrate.
2. The loading device of claim 1 , wherein the support module comprises a plurality of pads, and each of the pads provides a contact region to contact the substrate.
3. The loading device of claim 2 , wherein the pads are manufactured utilizing tiny electricity-conducting material.
4. The loading device of claim 1 , being utilized in a robot forklift.
5. The loading device of claim 1 , wherein the conductive media comprises a metal thin film connected to the contact region.
6. The loading device of claim 5 , wherein the metal thin film is a copper thin film.
7. The loading device of claim 6 , wherein the copper thin film is pasted onto the support module.
8. The loading device of claim 7 , wherein the copper thin film is pasted onto the support module utilizing a glue.
9. The loading device of claim 8 , wherein the glue is a glue capable of bearing high temperature.
10. The loading device of claim 1 , wherein the substrate is a glass substrate.
11. The loading device of claim 1 , wherein the voltage level is a ground voltage level.
12. A method for utilizing a loading device to load a substrate, the method comprising:
utilizing at least a contact region on a support module to contact the substrate such that a support force is provided to the substrate to load the substrate; and
electrically connecting the contact region to a voltage level such that electrostatic charges between the contact region and the substrate are eliminated.
13. The method of claim 12 , being utilized in a robot forklift.
14. The method of claim 12 , wherein the substrate is a glass substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/380,205 US20070246957A1 (en) | 2006-04-25 | 2006-04-25 | Loading device of loading a substrate capable of eliminating electrostatic charges |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/380,205 US20070246957A1 (en) | 2006-04-25 | 2006-04-25 | Loading device of loading a substrate capable of eliminating electrostatic charges |
Publications (1)
Publication Number | Publication Date |
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US20070246957A1 true US20070246957A1 (en) | 2007-10-25 |
Family
ID=38618792
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US11/380,205 Abandoned US20070246957A1 (en) | 2006-04-25 | 2006-04-25 | Loading device of loading a substrate capable of eliminating electrostatic charges |
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Country | Link |
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US (1) | US20070246957A1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100316483A1 (en) * | 2005-11-17 | 2010-12-16 | Oc Oerlikon Balzers Ltd. | Transport method for disk-shaped workpieces |
US20190035670A1 (en) * | 2016-01-29 | 2019-01-31 | Daihen Corporation | Substrate transfer hand |
US11798818B2 (en) * | 2018-12-03 | 2023-10-24 | Canon Kabushiki Kaisha | Container, processing apparatus, particle removing method, and method of manufacturing article |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5880924A (en) * | 1997-12-01 | 1999-03-09 | Applied Materials, Inc. | Electrostatic chuck capable of rapidly dechucking a substrate |
US6709218B1 (en) * | 1997-02-14 | 2004-03-23 | Applied Materials, Inc. | Robot blade for semiconductor processing equipment |
US20050001438A1 (en) * | 2003-07-02 | 2005-01-06 | Yu-Chou Lee | Robotic arm for preventing electrostatic damage |
-
2006
- 2006-04-25 US US11/380,205 patent/US20070246957A1/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6709218B1 (en) * | 1997-02-14 | 2004-03-23 | Applied Materials, Inc. | Robot blade for semiconductor processing equipment |
US5880924A (en) * | 1997-12-01 | 1999-03-09 | Applied Materials, Inc. | Electrostatic chuck capable of rapidly dechucking a substrate |
US20050001438A1 (en) * | 2003-07-02 | 2005-01-06 | Yu-Chou Lee | Robotic arm for preventing electrostatic damage |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100316483A1 (en) * | 2005-11-17 | 2010-12-16 | Oc Oerlikon Balzers Ltd. | Transport method for disk-shaped workpieces |
US8491252B2 (en) * | 2005-11-17 | 2013-07-23 | Oc Oerlikon Balzers Ltd. | Transport method for disk-shaped workpieces |
US20190035670A1 (en) * | 2016-01-29 | 2019-01-31 | Daihen Corporation | Substrate transfer hand |
US10515842B2 (en) * | 2016-01-29 | 2019-12-24 | Daihen Corporation | Substrate transfer hand with transverse hand supports |
US11798818B2 (en) * | 2018-12-03 | 2023-10-24 | Canon Kabushiki Kaisha | Container, processing apparatus, particle removing method, and method of manufacturing article |
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Legal Events
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AS | Assignment |
Owner name: CHUNGHWA PICTURE TUBES, LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LIU, YI-CHENG;WANG, HSIN-HSIUNG;HUANG, MING-KANG;REEL/FRAME:017526/0993 Effective date: 20060420 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |